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GB1409793A - Light emissive diode to optical fibre coupling - Google Patents

Light emissive diode to optical fibre coupling

Info

Publication number
GB1409793A
GB1409793A GB2676772A GB2676772A GB1409793A GB 1409793 A GB1409793 A GB 1409793A GB 2676772 A GB2676772 A GB 2676772A GB 2676772 A GB2676772 A GB 2676772A GB 1409793 A GB1409793 A GB 1409793A
Authority
GB
United Kingdom
Prior art keywords
fibre
optical fibre
tapered
gaas
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2676772A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB2676772A priority Critical patent/GB1409793A/en
Priority to AU56579/73A priority patent/AU479561B2/en
Publication of GB1409793A publication Critical patent/GB1409793A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/0006—Coupling light into the fibre
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

1409793 Electroluminescence STANDARD TELEPHONES & CABLES Ltd 24 May 1973 [8 June 1972] 26767/72 Heading C4S [Also in Division F4] A non-coherent P-N diode lamp 2 (e.g. GaAs) is secured to the smaller end face of a tapered region of an optical fibre. Emission may be infra red as well as visible. In Fig. 1, tapered optical fibre 5 of arsenic trisulphide couples core 3 of parallel sided multi-mode fibre, contact 6 is Au adjacent electrically conductive heat sink 7, and annular silica layer 8 confines current flow to a small area. The other contact is Au ring 10, flying lead 11, and pin 12 with insulator 13. The device is encapsulated in resin 14 which may be raised to broken line 14A to partially incorporate fibre 4. The central GaAs region is etched to bring coupler 4 close to the P-N junction. Dimensions are given, and refractive index and critical angles considered. Fig. 3 (not shown), includes parallel sided fibre (20) with tapered end regions (21).
GB2676772A 1972-06-08 1972-06-08 Light emissive diode to optical fibre coupling Expired GB1409793A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2676772A GB1409793A (en) 1972-06-08 1972-06-08 Light emissive diode to optical fibre coupling
AU56579/73A AU479561B2 (en) 1972-06-08 1973-06-06 Light emissive diode to optical fibre coupling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2676772A GB1409793A (en) 1972-06-08 1972-06-08 Light emissive diode to optical fibre coupling

Publications (1)

Publication Number Publication Date
GB1409793A true GB1409793A (en) 1975-10-15

Family

ID=10248870

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2676772A Expired GB1409793A (en) 1972-06-08 1972-06-08 Light emissive diode to optical fibre coupling

Country Status (1)

Country Link
GB (1) GB1409793A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2329935A1 (en) * 1975-10-28 1977-05-27 Magnavox Co REMOTE CONTROL SYSTEM
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
FR2786573A1 (en) * 1998-12-01 2000-06-02 Eastman Kodak Co Indicator light using light emitting diode includes coupling with plane input surface on optical fibre bundle used to convey light to remote location
WO2001035136A1 (en) * 1999-11-09 2001-05-17 Corning Incorporated Mode adaption for multimode optical fiber systems
US6330382B1 (en) 2000-01-19 2001-12-11 Corning Incorporated Mode conditioning for multimode fiber systems
WO2006049757A2 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Led package with front surface heat extractor
WO2007026292A1 (en) * 2005-08-29 2007-03-08 Koninklijke Philips Electronics N.V. Light source and method of providing a bundle of light
US7304425B2 (en) 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
EP1873566A2 (en) * 2006-06-26 2008-01-02 Osram Sylvania, Inc. Light emitting diode with light guide assembly
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
WO2008071698A1 (en) * 2006-12-11 2008-06-19 Schleifring Und Apparatebau Gmbh Receiving unit for an optical rotary transformer
EP1971888A1 (en) 2005-12-30 2008-09-24 Optim, Inc. Illumination device
WO2010085516A1 (en) * 2009-01-26 2010-07-29 Optim Inc. Detachable illumination system
US8033704B2 (en) 2003-03-26 2011-10-11 Optim, Inc. Compact, high efficiency, high power solid state light source using a solid state light-emitting device
WO2012173515A1 (en) * 2011-06-14 2012-12-20 Общество С Ограниченной Ответственностью "Айсберг" Lighting device
WO2015118131A1 (en) 2014-02-07 2015-08-13 Cnam - Conservatoire National Des Arts Et Metiers Method for manufacturing vertical optical coupling structures
US9601672B2 (en) 2004-10-29 2017-03-21 3M Innovative Properties Company High brightness LED package

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2329935A1 (en) * 1975-10-28 1977-05-27 Magnavox Co REMOTE CONTROL SYSTEM
GB2230349A (en) * 1989-04-08 1990-10-17 Oxley Dev Co Ltd "fibre optic/led coupling".
EP0392741A2 (en) * 1989-04-08 1990-10-17 Oxley Developments Company Limited Fibre optic/LED coupling
EP0392741A3 (en) * 1989-04-08 1990-11-28 Oxley Developments Company Limited Fibre optic/led coupling
FR2786573A1 (en) * 1998-12-01 2000-06-02 Eastman Kodak Co Indicator light using light emitting diode includes coupling with plane input surface on optical fibre bundle used to convey light to remote location
WO2001035136A1 (en) * 1999-11-09 2001-05-17 Corning Incorporated Mode adaption for multimode optical fiber systems
US6330382B1 (en) 2000-01-19 2001-12-11 Corning Incorporated Mode conditioning for multimode fiber systems
US9022628B2 (en) 2003-03-26 2015-05-05 Optim, Inc. Compact, high efficiency, high power solid state light source using a single solid state light-emitting device
US8033704B2 (en) 2003-03-26 2011-10-11 Optim, Inc. Compact, high efficiency, high power solid state light source using a solid state light-emitting device
US7798692B2 (en) 2003-03-26 2010-09-21 Optim, Inc. Illumination device
US8801253B2 (en) 2003-03-26 2014-08-12 Optim Llc Illumination device
WO2006049757A3 (en) * 2004-10-29 2006-08-03 3M Innovative Properties Co Led package with front surface heat extractor
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
US7304425B2 (en) 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
US9601672B2 (en) 2004-10-29 2017-03-21 3M Innovative Properties Company High brightness LED package
WO2006049757A2 (en) * 2004-10-29 2006-05-11 3M Innovative Properties Company Led package with front surface heat extractor
US8040040B2 (en) 2005-08-29 2011-10-18 Koninklijke Philips Electronics N.V. Light source and method of providing a bundle of light
WO2007026292A1 (en) * 2005-08-29 2007-03-08 Koninklijke Philips Electronics N.V. Light source and method of providing a bundle of light
CN101253435B (en) * 2005-08-29 2010-08-11 皇家飞利浦电子股份有限公司 Light source and method of providing a bundle of light
EP1971888B1 (en) * 2005-12-30 2017-08-30 Optim, Inc. Illumination device
EP1971888A1 (en) 2005-12-30 2008-09-24 Optim, Inc. Illumination device
EP1873566A2 (en) * 2006-06-26 2008-01-02 Osram Sylvania, Inc. Light emitting diode with light guide assembly
US7795632B2 (en) 2006-06-26 2010-09-14 Osram Sylvania Inc. Light emitting diode with direct view optic
EP1873566A3 (en) * 2006-06-26 2009-09-16 Osram Sylvania, Inc. Light emitting diode with light guide assembly
WO2008071698A1 (en) * 2006-12-11 2008-06-19 Schleifring Und Apparatebau Gmbh Receiving unit for an optical rotary transformer
WO2010085516A1 (en) * 2009-01-26 2010-07-29 Optim Inc. Detachable illumination system
WO2012173515A1 (en) * 2011-06-14 2012-12-20 Общество С Ограниченной Ответственностью "Айсберг" Lighting device
WO2015118131A1 (en) 2014-02-07 2015-08-13 Cnam - Conservatoire National Des Arts Et Metiers Method for manufacturing vertical optical coupling structures
CN106461881A (en) * 2014-02-07 2017-02-22 法国国立工艺学院 Method for manufacturing vertical optical coupling structures
US10073228B2 (en) 2014-02-07 2018-09-11 CNAM—Conservatoire National des Arts Et Metiers Process for manufacturing vertical optical coupling structures

Also Published As

Publication number Publication date
AU5657973A (en) 1974-12-12

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee