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GB1477780A - Assembly incorporating electrically conductive adhesive - Google Patents

Assembly incorporating electrically conductive adhesive

Info

Publication number
GB1477780A
GB1477780A GB3190675A GB3190675A GB1477780A GB 1477780 A GB1477780 A GB 1477780A GB 3190675 A GB3190675 A GB 3190675A GB 3190675 A GB3190675 A GB 3190675A GB 1477780 A GB1477780 A GB 1477780A
Authority
GB
United Kingdom
Prior art keywords
particles
connecting means
members
electrically
adhesive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3190675A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9308074A external-priority patent/JPS5120941A/en
Priority claimed from JP9308274A external-priority patent/JPS5121192A/en
Application filed by Seikosha KK filed Critical Seikosha KK
Publication of GB1477780A publication Critical patent/GB1477780A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

1477780 Electrical connections SEIKOSHA KK 30 July 1975 [14 Aug 1974 (2)] 31906/75 Heading H2E An assembly comprises a pair of members 1, 2 having portions in superposed spaced apart relationship, each member having an array 4a, 5a of electric conductors, terminal portions of one array facing those of the other member, and connecting means which adhers the members together so as to electrically connect facing terminal portions and electrically insulate adjacent portions. The connecting means comprises an electrically non-conductive adhesive material 7 having incorporated and mixed therein electrically conductive particles 8. The particles 8 are disposed in substantially a single layer and have a size sufficiently large with respect to the spacing of the members to connect the facing terminals and are spaced sufficiently by the adhesive material so as to electrically insulate adjacent terminals. As described, the particles 8 have substantially the same spherical shape and diameter and constitute less than 60% by volume of the connecting means. Insulating particles and/or electrically conductive fine particles may also be incorporated in the material 7, these particles having a size smaller than that of particles 8. The conducting particles may be one or more of the following powders: carbon, silicon carbide, reduced silver,-gold, palladium/silver, nickel and indium. The insulating particles may be one or more of: aluminium oxide, yittrium oxide, calcium carbonate, glass and plastics. The connecting means may be formed as a tape (Figs. 5 and 6, not shown) when the adhesive material may be of the type that is molten when heated, for example polyethylene terephthalate, polyethylene fluoride and polyamide (nylon), and the members being connected may be a printed circuit and a flat cable or a printing plate and a large size integrated circuit.
GB3190675A 1974-08-14 1975-07-30 Assembly incorporating electrically conductive adhesive Expired GB1477780A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9308074A JPS5120941A (en) 1974-08-14 1974-08-14 DODENSEISETSUCHAKUZAI
JP9308274A JPS5121192A (en) 1974-08-14 1974-08-14 DODENSEISETSU CHAKUSHIITO

Publications (1)

Publication Number Publication Date
GB1477780A true GB1477780A (en) 1977-06-29

Family

ID=26434523

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3190675A Expired GB1477780A (en) 1974-08-14 1975-07-30 Assembly incorporating electrically conductive adhesive

Country Status (6)

Country Link
CH (1) CH607666A5 (en)
DE (1) DE2536361A1 (en)
FR (1) FR2282148A1 (en)
GB (1) GB1477780A (en)
HK (1) HK43281A (en)
NL (1) NL172104C (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102728A1 (en) * 1982-07-27 1984-03-14 Luc Technologies Limited Bonding and bonded products
EP0223464A2 (en) * 1985-11-06 1987-05-27 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0232127A2 (en) * 1986-01-31 1987-08-12 Minnesota Mining And Manufacturing Company Anisotropic electrically conductive film connector
FR2620569A1 (en) * 1987-09-11 1989-03-17 Radiotechnique Compelec Process for gauging the thickness of a weld of an electronic component on a substrate
DE3824140A1 (en) * 1988-07-15 1990-01-25 Siemens Ag Fixing and electrical bonding of piezoceramics
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH627031A5 (en) * 1978-08-09 1981-12-15 Portescap
JPS593824A (en) * 1982-06-30 1984-01-10 日本メクトロン株式会社 Panel keyboard
JPS594096A (en) * 1982-06-30 1984-01-10 日本メクトロン株式会社 Method of connecting different type circuit boards to each other
FR2549627B1 (en) * 1983-07-19 1986-02-07 Thomson Csf DEVICE FOR CONNECTING A DISPLAY SCREEN AND DISPLAY SCREEN COMPRISING SUCH A DEVICE
DE3418958A1 (en) * 1984-05-22 1985-12-05 Nippon Mektron, Ltd., Tokio/Tokyo DEVICE AND METHOD FOR ELECTRICALLY AND MECHANICALLY CONNECTING FLEXIBLE PRINTED SWITCHING FILMS
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
JPH07114314B2 (en) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド Circuit panel assembly
JPS62169434A (en) * 1986-01-22 1987-07-25 Sharp Corp Method of lsi mounting
KR900002640Y1 (en) * 1986-02-10 1990-03-31 알프스 덴기 가부시기 가이샤 Variable resistor
DE3627595A1 (en) * 1986-08-14 1988-02-18 Licentia Gmbh Method for fitting and making contact with an electrical circuit
JPS6433808A (en) * 1986-10-18 1989-02-03 Japan Synthetic Rubber Co Ltd Conductive particle and conductive adhesive including it
DE3805851A1 (en) * 1988-02-25 1989-08-31 Standard Elektrik Lorenz Ag CIRCUIT BOARD WITH A COOLING DEVICE
DE3905657A1 (en) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible supporting film
US5243142A (en) * 1990-08-03 1993-09-07 Hitachi Aic Inc. Printed wiring board and process for producing the same
FR2674690B1 (en) * 1991-03-28 1993-06-11 Lambert Francois ELECTRICAL CONNECTION PROCESS.
DE4206700A1 (en) * 1992-03-04 1993-09-16 Vdo Schindling Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other
DE4406418C1 (en) * 1994-02-28 1995-07-13 Bosch Gmbh Robert Anisotropically conductive adhesive
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
US6300566B1 (en) 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
DE19815110B4 (en) * 1998-04-03 2004-12-30 Knürr AG heat dissipation arrangement
DE20000936U1 (en) 2000-01-20 2000-04-06 FER Fahrzeugelektrik GmbH, 99817 Eisenach Assembly arrangement

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2885459A (en) * 1955-11-02 1959-05-05 Pulsifer Verne Sealing and conducting gasket material
US3514326A (en) * 1967-11-17 1970-05-26 Minnesota Mining & Mfg Tape
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102728A1 (en) * 1982-07-27 1984-03-14 Luc Technologies Limited Bonding and bonded products
EP0223464A2 (en) * 1985-11-06 1987-05-27 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0223464A3 (en) * 1985-11-06 1989-02-22 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0232127A2 (en) * 1986-01-31 1987-08-12 Minnesota Mining And Manufacturing Company Anisotropic electrically conductive film connector
EP0232127A3 (en) * 1986-01-31 1988-09-21 Minnesota Mining And Manufacturing Company Anisotropic electrically conductive film connector
FR2620569A1 (en) * 1987-09-11 1989-03-17 Radiotechnique Compelec Process for gauging the thickness of a weld of an electronic component on a substrate
DE3824140A1 (en) * 1988-07-15 1990-01-25 Siemens Ag Fixing and electrical bonding of piezoceramics
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP0996321B1 (en) * 1998-10-22 2007-05-16 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device

Also Published As

Publication number Publication date
DE2536361C2 (en) 1988-10-20
NL172104B (en) 1983-02-01
FR2282148A1 (en) 1976-03-12
HK43281A (en) 1981-09-04
DE2536361A1 (en) 1976-02-26
NL172104C (en) 1983-07-01
NL7509591A (en) 1976-02-17
CH607666A5 (en) 1978-09-29
FR2282148B1 (en) 1981-12-31

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years

Effective date: 19950729