GB1380143A - - Google Patents
Info
- Publication number
- GB1380143A GB1380143A GB1114772A GB1114772A GB1380143A GB 1380143 A GB1380143 A GB 1380143A GB 1114772 A GB1114772 A GB 1114772A GB 1114772 A GB1114772 A GB 1114772A GB 1380143 A GB1380143 A GB 1380143A
- Authority
- GB
- United Kingdom
- Prior art keywords
- platinum
- silicide
- march
- gold
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 10
- 229910052697 platinum Inorganic materials 0.000 abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 229910021332 silicide Inorganic materials 0.000 abstract 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052719 titanium Inorganic materials 0.000 abstract 2
- 239000010936 titanium Substances 0.000 abstract 2
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 abstract 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000002800 charge carrier Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910021339 platinum silicide Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/221—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities of killers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Thyristors (AREA)
Abstract
1380143 Carrier lifetime in integrated circuits COMMISSARIAT A L'ENERGIE ATOMIQUE 9 March 1972 [9 March 1971] 11147/72 Heading H1K Silicon islands insulated from the substrate in which they are formed are diffused with a metal, leading to reduced charge carrier lifetime. In the part-structure shown an NPN transistor is formed by diffusions through an apertured silica masking layer 5 and the top surface is then coated with platinum by cathode sputtering and the structure then heated at 500‹ C. for up to 1 hour to form platinum silicide 12 in the contact apertures. The remaining free platinum is etched away with aqua regia and the structure heated at 950-1000‹ C. for a few minutes to diffuse platinum throughout the island. A ontact metal such as molybdenum, gold, titanium, platinum, or aluminium is then applied to the silicide areas. Beam leads may be formed by successive deposition on the silicide and silica of titanium, platinum, gold, and solder. The structure may be bonded by its beam leads to a ceramic substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7108025A FR2128164B1 (en) | 1971-03-09 | 1971-03-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1380143A true GB1380143A (en) | 1975-01-08 |
Family
ID=9073164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1114772A Expired GB1380143A (en) | 1971-03-09 | 1972-03-09 |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE780423A (en) |
FR (1) | FR2128164B1 (en) |
GB (1) | GB1380143A (en) |
IT (1) | IT952930B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5262336A (en) * | 1986-03-21 | 1993-11-16 | Advanced Power Technology, Inc. | IGBT process to produce platinum lifetime control |
EP0675527B1 (en) * | 1994-03-30 | 1999-11-10 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno | Manufacturing process for obtaining bipolar transistors with controlled storage time |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3590471A (en) * | 1969-02-04 | 1971-07-06 | Bell Telephone Labor Inc | Fabrication of insulated gate field-effect transistors involving ion implantation |
-
1971
- 1971-03-09 FR FR7108025A patent/FR2128164B1/fr not_active Expired
-
1972
- 1972-03-08 IT IT6772972A patent/IT952930B/en active
- 1972-03-09 BE BE780423A patent/BE780423A/en unknown
- 1972-03-09 GB GB1114772A patent/GB1380143A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IT952930B (en) | 1973-07-30 |
FR2128164A1 (en) | 1972-10-20 |
BE780423A (en) | 1972-07-03 |
FR2128164B1 (en) | 1973-11-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |