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GB1035714A - Point-contact semiconductor diodes - Google Patents

Point-contact semiconductor diodes

Info

Publication number
GB1035714A
GB1035714A GB34658/64A GB3465864A GB1035714A GB 1035714 A GB1035714 A GB 1035714A GB 34658/64 A GB34658/64 A GB 34658/64A GB 3465864 A GB3465864 A GB 3465864A GB 1035714 A GB1035714 A GB 1035714A
Authority
GB
United Kingdom
Prior art keywords
point
alloy
electrode
wafer
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34658/64A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Publication of GB1035714A publication Critical patent/GB1035714A/en
Expired legal-status Critical Current

Links

Classifications

    • H01L29/43
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H01L29/00
    • H01L29/417
    • H01L29/86

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrotherapy Devices (AREA)

Abstract

1,035,714. Semi-conductor devices. SIEMENS & HALSKE A.G. Aug. 25, 1964 [Aug. 28, 1963], No. 34658/64. Heading H1K. A point contact electrode comprises a molybdenum or tungsten wire having a sharp point which is coated with a gold alloy having platinum as the main secondary constituent. As shown, a wafer 1 of N-type germanium is contacted with an electrode 4 according to the invention and the device is electroformed to weld the point 5 of electrode 4 to wafer 1 and to produce a P-type region 2 by thermal conversion. The device is then mounted on a copper housing plinth which forms both a heat sink and a base contact. The whole of electrode 4 may be coated with the gold-platinum alloy or the coating may be limited to the sharpened point 5. The alloy may contain 3 to 10% platinum and doping impurities such as indium or gallium and/or recombination centre materials such as nickel or copper may be included. The wafer may be of P-type germanium and the alloy may contain N-type impurities. The semiconductor material may also be silicon.
GB34658/64A 1963-08-28 1964-08-25 Point-contact semiconductor diodes Expired GB1035714A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1963S0086953 DE1264618C2 (en) 1963-08-28 1963-08-28 TIP DIODE WITH A SPRING MOLYBDAEN OR TUNGSTEN WIRE AND PROCESS FOR THEIR PRODUCTION

Publications (1)

Publication Number Publication Date
GB1035714A true GB1035714A (en) 1966-07-13

Family

ID=7513397

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34658/64A Expired GB1035714A (en) 1963-08-28 1964-08-25 Point-contact semiconductor diodes

Country Status (6)

Country Link
US (1) US3355638A (en)
CH (1) CH418468A (en)
DE (1) DE1264618C2 (en)
FR (1) FR1405133A (en)
GB (1) GB1035714A (en)
NL (1) NL6409290A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975756A (en) * 1974-06-28 1976-08-17 The United States Of America As Represented By The Secretary Of The Army Gadolinium doped germanium

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1104073A (en) * 1911-06-21 1914-07-21 Wireless Specialty Apparatus Company Detector for wireless telegraphy and telephony.
US2402839A (en) * 1941-03-27 1946-06-25 Bell Telephone Labor Inc Electrical translating device utilizing silicon
US2429222A (en) * 1943-06-05 1947-10-21 Bell Telephone Labor Inc Method of making contact wires
US2818536A (en) * 1952-08-23 1957-12-31 Hughes Aircraft Co Point contact semiconductor devices and methods of making same
US2876400A (en) * 1953-02-27 1959-03-03 Siemens Ag Composite electrodes for directional crystal devices
US2820135A (en) * 1956-09-05 1958-01-14 Pacific Semiconductors Inc Method for producing electrical contact to semiconductor devices
US2984890A (en) * 1956-12-24 1961-05-23 Gahagan Inc Crystal diode rectifier and method of making same
US3254279A (en) * 1963-04-17 1966-05-31 Cohn James Composite alloy electric contact element

Also Published As

Publication number Publication date
NL6409290A (en) 1965-03-01
FR1405133A (en) 1965-07-02
DE1264618B (en) 1968-03-28
US3355638A (en) 1967-11-28
DE1264618C2 (en) 1977-06-02
CH418468A (en) 1966-08-15

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