GB0802944D0 - Apparatus for laser processing the opposite sides of thin panels - Google Patents
Apparatus for laser processing the opposite sides of thin panelsInfo
- Publication number
- GB0802944D0 GB0802944D0 GBGB0802944.9A GB0802944A GB0802944D0 GB 0802944 D0 GB0802944 D0 GB 0802944D0 GB 0802944 A GB0802944 A GB 0802944A GB 0802944 D0 GB0802944 D0 GB 0802944D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- opposite sides
- laser processing
- thin panels
- panels
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0802944.9A GB0802944D0 (en) | 2008-02-19 | 2008-02-19 | Apparatus for laser processing the opposite sides of thin panels |
EP09712126.3A EP2250534B1 (en) | 2008-02-19 | 2009-02-18 | Laser processing a multi-device panel |
US12/918,187 US8710403B2 (en) | 2008-02-19 | 2009-02-18 | Laser processing a multi-device panel |
CN200980105445.3A CN101971099B (en) | 2008-02-19 | 2009-02-18 | Laser processing a multi-device panel |
PCT/GB2009/000436 WO2009103964A1 (en) | 2008-02-19 | 2009-02-18 | Laser processing a multi-device panel |
TW098105202A TWI448809B (en) | 2008-02-19 | 2009-02-19 | Laser processing a multi-device panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0802944.9A GB0802944D0 (en) | 2008-02-19 | 2008-02-19 | Apparatus for laser processing the opposite sides of thin panels |
Publications (1)
Publication Number | Publication Date |
---|---|
GB0802944D0 true GB0802944D0 (en) | 2008-03-26 |
Family
ID=39271877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0802944.9A Pending GB0802944D0 (en) | 2008-02-19 | 2008-02-19 | Apparatus for laser processing the opposite sides of thin panels |
Country Status (6)
Country | Link |
---|---|
US (1) | US8710403B2 (en) |
EP (1) | EP2250534B1 (en) |
CN (1) | CN101971099B (en) |
GB (1) | GB0802944D0 (en) |
TW (1) | TWI448809B (en) |
WO (1) | WO2009103964A1 (en) |
Families Citing this family (27)
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---|---|---|---|---|
EP2352617B1 (en) | 2008-10-10 | 2019-06-19 | IPG Microsystems LLC | Laser machining systems and methods with vision correction and/or tracking |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
US20110132885A1 (en) * | 2009-12-07 | 2011-06-09 | J.P. Sercel Associates, Inc. | Laser machining and scribing systems and methods |
EP2754524B1 (en) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line |
EP2781296B1 (en) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Device and method for cutting out contours from flat substrates using a laser |
US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
CA2937354C (en) | 2014-01-20 | 2020-04-14 | Smart Wave Technologies Corp. | Methods of laser trace post processing and depaneling of assembled printed circuit boards |
KR102445217B1 (en) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | Methods and apparatuses for laser processing materials |
WO2016010954A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
CN104216241B (en) * | 2014-09-15 | 2017-01-18 | 江苏影速光电技术有限公司 | Real-time focusing method and device based on Keyence |
KR102546692B1 (en) | 2015-03-24 | 2023-06-22 | 코닝 인코포레이티드 | Laser Cutting and Processing of Display Glass Compositions |
JP6647888B2 (en) * | 2016-01-29 | 2020-02-14 | ビアメカニクス株式会社 | Laser processing method and laser processing apparatus |
DE102016104318B3 (en) * | 2016-03-09 | 2017-04-13 | Trumpf Laser- Und Systemtechnik Gmbh | Method for determining a deviation of a spatial orientation of a beam axis of a beam processing machine from its desired spatial orientation and beam processing machine for machining a workpiece |
WO2018064409A1 (en) | 2016-09-30 | 2018-04-05 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
AT519177B1 (en) * | 2016-10-06 | 2019-04-15 | Trotec Laser Gmbh | Method for engraving, marking and / or inscribing a workpiece with |
KR102428350B1 (en) * | 2016-10-24 | 2022-08-02 | 코닝 인코포레이티드 | Substrate processing station for laser-based machining of sheet-like glass substrates |
CN106647184B (en) * | 2016-12-31 | 2019-06-14 | 江苏九迪激光装备科技有限公司 | A kind of exposure method of write-through screen printing equipment |
DE102017102320A1 (en) | 2017-02-07 | 2018-08-09 | Manz Ag | processing plant |
CN108508031A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备(集团)股份有限公司 | A kind of double-side detecting device and detection method |
CN106802538B (en) * | 2017-03-16 | 2019-01-29 | 无锡影速半导体科技有限公司 | Super large plate direct-write type lithography machine scanning exposure method |
CN113146054A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
CN113146053A (en) * | 2020-01-23 | 2021-07-23 | 上海新微技术研发中心有限公司 | Laser processing device and laser processing method |
CN111708253A (en) * | 2020-05-20 | 2020-09-25 | 中山新诺科技股份有限公司 | Roll-to-roll double-sided exposure device and double-sided digital direct-writing exposure method |
DE102022109021A1 (en) | 2022-04-13 | 2023-10-19 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Method and device for forming a structure on a workpiece |
CN114939737A (en) * | 2022-06-10 | 2022-08-26 | 苏州迈为科技股份有限公司 | Laser processing device, method, storage medium and electronic equipment |
CN116652413B (en) * | 2023-07-28 | 2023-09-19 | 四川富乐华半导体科技有限公司 | Ceramic copper-clad carrier plate cutting and coding integrated equipment |
Family Cites Families (30)
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JPS6186087A (en) * | 1984-10-05 | 1986-05-01 | Mitsubishi Electric Corp | Laser working device |
JP2706983B2 (en) | 1989-05-19 | 1998-01-28 | キヤノン株式会社 | Scanning optical device with focus adjustment mechanism |
US5063280A (en) * | 1989-07-24 | 1991-11-05 | Canon Kabushiki Kaisha | Method and apparatus for forming holes into printed circuit board |
ATE138004T1 (en) * | 1991-09-09 | 1996-06-15 | Inpro Innovations Gmbh | METHOD AND DEVICE FOR POSITIONING AND CONTROLLING A HIGH POWER ENERGY SOURCE, IN PARTICULAR A LASER, RELATIVE TO A WORKPIECE |
JPH06186087A (en) * | 1992-12-16 | 1994-07-08 | Fuji Electric Co Ltd | Thermocouple fixture |
US6373026B1 (en) * | 1996-07-31 | 2002-04-16 | Mitsubishi Denki Kabushiki Kaisha | Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
US7062845B2 (en) * | 1996-06-05 | 2006-06-20 | Laservia Corporation | Conveyorized blind microvia laser drilling system |
JPH10314972A (en) * | 1997-05-20 | 1998-12-02 | Sumitomo Heavy Ind Ltd | Laser beam machine |
SE9800665D0 (en) * | 1998-03-02 | 1998-03-02 | Micronic Laser Systems Ab | Improved method for projection printing using a micromirror SLM |
US6396561B1 (en) * | 1998-11-10 | 2002-05-28 | Maniabarco N.V. | Method and device for exposing both sides of a sheet |
US6252241B1 (en) | 1998-12-28 | 2001-06-26 | Creo, Ltd. | Rotational scanning image recording system having both a large format and high resolution |
US6433303B1 (en) * | 2000-03-31 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
US6483071B1 (en) * | 2000-05-16 | 2002-11-19 | General Scanning Inc. | Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
US6649861B2 (en) * | 2000-05-24 | 2003-11-18 | Potomac Photonics, Inc. | Method and apparatus for fabrication of miniature structures |
US6422082B1 (en) * | 2000-11-27 | 2002-07-23 | General Electric Company | Laser shock peening quality assurance by ultrasonic analysis |
US6835426B2 (en) * | 2001-01-19 | 2004-12-28 | Potomac Photonics, Inc. | Method and apparatus for pulse-position synchronization in miniature structures manufacturing processes |
US6720567B2 (en) * | 2001-01-30 | 2004-04-13 | Gsi Lumonics Corporation | Apparatus and method for focal point control for laser machining |
ATE508398T1 (en) * | 2001-03-29 | 2011-05-15 | Lasx Ind Inc | CONTROL FOR A LASER USING PREDICTIVE MODELS OF THE LASER BEAM MOTION SYSTEM |
JP2002333721A (en) * | 2001-05-10 | 2002-11-22 | Adtec Engineeng Co Ltd | Exposure device |
US6864460B2 (en) * | 2001-07-02 | 2005-03-08 | Virtek Laser Systems, Inc. | Method of ablating an opening in a hard, non-metallic substrate |
JP2003225787A (en) * | 2002-01-30 | 2003-08-12 | Amada Eng Center Co Ltd | Method and device for centering nozzle in laser beam machine |
JP2004035315A (en) * | 2002-07-02 | 2004-02-05 | Mitsuboshi Diamond Industrial Co Ltd | Method and apparatus for dividing brittle material substrates |
US6787734B2 (en) * | 2002-07-25 | 2004-09-07 | Matsushita Electric Industrial Co., Ltd. | System and method of laser drilling using a continuously optimized depth of focus |
JP2004243383A (en) * | 2003-02-14 | 2004-09-02 | Sumitomo Heavy Ind Ltd | Laser beam machine, and laser beam machining method |
US7772523B2 (en) * | 2004-07-30 | 2010-08-10 | Semiconductor Energy Laboratory Co., Ltd | Laser irradiation apparatus and laser irradiation method |
EP1770443B1 (en) * | 2005-09-28 | 2016-01-20 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and exposure method |
US8122846B2 (en) * | 2005-10-26 | 2012-02-28 | Micronic Mydata AB | Platforms, apparatuses, systems and methods for processing and analyzing substrates |
KR100707860B1 (en) * | 2005-12-21 | 2007-04-17 | 주식회사 이오테크닉스 | Method of forming via hole using laser beam |
TWI431380B (en) * | 2006-05-12 | 2014-03-21 | Photon Dynamics Inc | Deposition repair apparatus and methods |
JP2008203434A (en) * | 2007-02-19 | 2008-09-04 | Fujitsu Ltd | Scanning mechanism, method of machining material to be machined and machining apparatus |
-
2008
- 2008-02-19 GB GBGB0802944.9A patent/GB0802944D0/en active Pending
-
2009
- 2009-02-18 WO PCT/GB2009/000436 patent/WO2009103964A1/en active Application Filing
- 2009-02-18 US US12/918,187 patent/US8710403B2/en not_active Expired - Fee Related
- 2009-02-18 EP EP09712126.3A patent/EP2250534B1/en not_active Not-in-force
- 2009-02-18 CN CN200980105445.3A patent/CN101971099B/en active Active
- 2009-02-19 TW TW098105202A patent/TWI448809B/en active
Also Published As
Publication number | Publication date |
---|---|
CN101971099B (en) | 2013-05-08 |
TWI448809B (en) | 2014-08-11 |
US8710403B2 (en) | 2014-04-29 |
EP2250534A1 (en) | 2010-11-17 |
TW200942957A (en) | 2009-10-16 |
US20110017716A1 (en) | 2011-01-27 |
EP2250534B1 (en) | 2018-06-27 |
WO2009103964A1 (en) | 2009-08-27 |
CN101971099A (en) | 2011-02-09 |
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