GB0221463D0 - Heat-dissipating device - Google Patents

Heat-dissipating device

Info

Publication number: GB0221463D0
Authority: GB; United Kingdom
Prior art keywords: heat; dissipating device; dissipating
Prior art date: 2002-07-01
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

GBGB0221463.3A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-01

Filing date

2002-09-16

Publication date

2002-10-23

2002-09-16 Application filed by Individual filed Critical Individual

2002-10-23 Publication of GB0221463D0 publication Critical patent/GB0221463D0/en

2004-01-07 Publication of GB2390482A publication Critical patent/GB2390482A/en

Status Withdrawn legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

GB0221463A 2002-07-01 2002-09-16 Heat dissipating device Withdrawn GB2390482A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW91114537		2002-07-01

Publications (2)

Publication Number	Publication Date
GB0221463D0 true GB0221463D0 (en)	2002-10-23
GB2390482A GB2390482A (en)	2004-01-07

Family

ID=21688314

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB0221463A Withdrawn GB2390482A (en)	2002-07-01	2002-09-16	Heat dissipating device

Country Status (4)

Country	Link
US (1)	US20040000394A1 (en)
JP (1)	JP2004040069A (en)
DE (1)	DE10244625A1 (en)
GB (1)	GB2390482A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6911231B2 (en) *	1996-10-25	2005-06-28	New Qu Energy Limited	Method for producing a heat transfer medium and device
KR101087861B1 (en) *	2004-03-15	2011-11-30	엘지전자 주식회사	Computer's heat source cooling device
US7878232B2 (en) *	2004-07-09	2011-02-01	GE Lighting Solutions, LLC	Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
KR101273359B1 (en) *	2011-05-09	2013-06-11	강준수	a generator for hot wind with field of buffer
TW201339513A (en) *	2012-03-16	2013-10-01	Hon Hai Prec Ind Co Ltd	Cooling system
JP6104380B2 (en) *	2013-06-20	2017-03-29	三菱電機株式会社	Power conversion device for vehicle
WO2016116172A1 (en) *	2015-01-23	2016-07-28	Quantum Technologie (Deutschland) Gmbh	Quantum medium formula and preparation process for heat transfer
CN106163154B (en) *	2016-07-20	2019-04-09	广东网域科技有限公司	A kind of high intensity interchanger
CN107613732B (en) *	2017-09-28	2024-06-07	深圳兴奇宏科技有限公司	Heat dissipation structure of chassis
CN108925107B (en) *	2018-07-11	2020-04-10	佛山市众盈电子有限公司	Load and temperature double-control power supply device
CN112197429A (en) *	2020-10-10	2021-01-08	江苏九州电器有限公司	Ventilation structure of electric heater

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4520425A (en) *	1982-08-12	1985-05-28	Mitsubishi Denki Kabushiki Kaisha	Control apparatus with improved structure for cooling circuit elements
WO1995025255A1 (en) *	1992-09-28	1995-09-21	Aavid Engineering, Inc.	Apparatus and method for cooling heat generating electronic components in a cabinet
BR9713274A (en) *	1996-10-25	2000-03-21	Yuzhi Qu	Superconducting heat transfer medium
US6062302A (en) *	1997-09-30	2000-05-16	Lucent Technologies Inc.	Composite heat sink
US5917697A (en) *	1998-01-27	1999-06-29	Wang; Daniel	CPU cooling arrangement
KR20010007146A (en) *	1999-06-01	2001-01-26	안자이 이치로	Heat sinks for cpus for use in personal computers
US6410982B1 (en) *	1999-11-12	2002-06-25	Intel Corporation	Heatpipesink having integrated heat pipe and heat sink
DE20010663U1 (en) *	2000-06-15	2000-10-26	Schlomka, Georg, 21640 Neuenkirchen	Cooling element and cooling device
GB2364179A (en) *	2000-06-30	2002-01-16	Jern Ru Ind Co Ltd	A heat dissipation device
US6408935B1 (en) *	2000-08-16	2002-06-25	Thermal Corp.	Heat sink assembly with over-molded cooling fins

2002
- 2002-09-12 JP JP2002266350A patent/JP2004040069A/en active Pending
- 2002-09-12 US US10/242,108 patent/US20040000394A1/en not_active Abandoned
- 2002-09-16 GB GB0221463A patent/GB2390482A/en not_active Withdrawn
- 2002-09-25 DE DE10244625A patent/DE10244625A1/en not_active Ceased

Also Published As

Publication number	Publication date
GB2390482A (en)	2004-01-07
US20040000394A1 (en)	2004-01-01
DE10244625A1 (en)	2004-01-22
JP2004040069A (en)	2004-02-05

Publication	Publication Date	Title
HK1053581A2 (en)	2003-10-10	Suction-adhesive device
AU2003260760A8 (en)	2004-03-11	Device
TW587768U (en)	2004-05-11	Heat-dissipating device
AU2003245720A8 (en)	2004-02-02	Electroptic device
TW577585U (en)	2004-02-21	Multi-level heat-dissipating device
GB0222559D0 (en)	2002-11-06	Device
GB0216290D0 (en)	2002-08-21	Device
GB0221463D0 (en)	2002-10-23	Heat-dissipating device
PL372216A1 (en)	2005-07-11	Squeeze-spray device
GB2385398B (en)	2005-06-29	Device
GB0224980D0 (en)	2002-12-04	Laptop-PC-tagging device
GB0225491D0 (en)	2002-12-11	Device
GB0210296D0 (en)	2002-06-12	Device
GB0200485D0 (en)	2002-02-27	Strap-securing device
TW566605U (en)	2003-12-11	Heat-dissipating device
TW532758U (en)	2003-05-11	Heat-dissipating device
AU2003304212A8 (en)	2005-01-04	Explosive-activated safe-arm device
EP1557831A4 (en)	2006-07-12	Disk-loading device
GB0207378D0 (en)	2002-05-08	Device
GB0210315D0 (en)	2002-06-12	Device
GB0219243D0 (en)	2002-09-25	Device
TW545869U (en)	2003-08-01	Heat-dissipating set
GB0226221D0 (en)	2002-12-18	Cooling device
GB0212363D0 (en)	2002-07-10	Cooling device
GB0211514D0 (en)	2002-06-26	Cooling device

Legal Events

Date	Code	Title	Description
2007-04-25	WAP	Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)