FR3014227A1 - MULTI INTERFACE MICROCIRCUIT CARD - Google Patents

Abstract

Card (1) comprising a microcircuit (2) having n contacts (3), a first contact interface (10) comprising p1 outside contacts (11), at least one of said p1 outside contacts (11) of the first interface (10) ) being electrically connected to one of said n contacts (3) of the microcircuit (2), and a second contact interface (20) having p2 outside contacts (21), at least one of said p2 outside contacts (21) of the second interface (20) being electrically connected to one of said n contacts (3) of the microcircuit (2), wherein at least one of said at least one of said p1 outer contacts (11) of the first interface (10) , connected, is still electrically connected with one of said at least one of said p2 external contacts (21) of the second interface (20), connected. Adapter (40) for such a card (1).

Description

The present invention relates to a card comprising a microcircuit and at least two contact interfaces for this microcircuit. A microcircuit card comprises a thin plastic plate 5 incorporating a microcircuit and an access interface to the microcircuit, for example a contact interface. It is known to use a microcircuit card, for example, to materialize and support a mobile phone subscription. The microcircuit then comprises all the data relating to said subscription and to its implementation. The microcircuit and its cabling are then defined by the SIM standard. The shape, thickness and outer contour of the plastic plate is defined by the SIM standard specified in ISO / IEC 7816 which includes several sizes: SIM, microSIM, nanoSIM, etc. The contact interface is defined by the ISO-SIM standard which includes several specifications: M2, M3, M4. In all cases the contact interface is substantially rectangular. It has 6 or 8 contacts. For each contact C1-C8, a specification 20 details the electrical and functional characteristics and in particular to which contact of the microcircuit it must be connected. The position of the contact plate relative to the thin plastic plate is still defined by the SIM standard and completes the definition of the card, called SIM card. Logically, SIM readers, able to read such a SIM card are present in the devices provided for telephone: mobile phones, smartphones, PDAs, or tablets for the most recent. It is still known to use a microcircuit card, for example to constitute a portable data storage means. The data is accessed via the microcircuit and stored in a memory managed by the microcircuit. The microcircuit is connected externally by means of a contact interface. Many standards have been developed for such a memory function. The SD standard is a common example. One of its declensions, in reduced size, is the standard microSD. The shape, thickness and outer contour of the plastic plate is defined by the microSD standard. Advantageously, said thickness is less than the thickness of the different SIM formats. Advantageously, the outer contour is writable in the outer contour of the SIM card.

SD, miniSD or microSD readers, capable of reading such a microSD card are conventionally present in information processing devices: computer, microcomputer, or tablets. However, such devices are increasingly demanding a SIM card interface, for calling, but especially for accessing data networks via a telephone type subscription, supported by a SIM card. The invention relates to the production of a card presenting the functions of a SIM card in a microSD format, able to be inserted and read in an SD, miniSD or microSD reader and still able to be inserted and read in a reader SIM according to ISO / IEC7816. In order not to duplicate the media for a telephone subscription, it is advantageous that a same microcircuit card, having the functions of a SIM card, can be used both in a standard SD reader, miniSD or microSD or in a reader to one of the SIM standards. For reasons of cost and simplification, such a card advantageously comprises a single microcircuit, and has in terms of form and contact interface compatibility with a SIM reader and compatibility with a microSD reader. The invention relates to a card comprising a microcircuit having n contacts, a first contact interface comprising pl external contacts disposed on at least one of a first face or a second face of the card, at least one of said outer contacts pl of the first interface being electrically connected to one of said n contacts of the microcircuit, and a second contact interface comprising p2 external contacts disposed on at least one of a first face or a second face of the card, at least one of said p2 external contacts the second interface being electrically connected to one of said n contacts of the microcircuit, characterized in that at least one of said at least one of said outer contacts pl of the first interface, connected, is still electrically connected with one of said at least one of said p2 external contacts of the second interface, connected .. With these provisions we di spose a card comprising a body provided with two separate interfaces 10 connected to the microcircuit and implemented according to the same functions. According to another characteristic, the first interface also comprises a plurality of internal contacts, each respectively connected to one of the outer contacts of the first interface, where p1 is at most equal to p1, the second interface also comprises p2 'internal contacts, respectively each connected to one of the p2 outer contacts of the second interface, p2 'being at most equal to p2, each disposed facing one of the pl' inner contacts of the first interface, p2 'being equal to pl', the card further comprising connection means comprising a conductive ball disposed between an inner contact of the first interface and the inner contact of the second facing interface. According to another feature, the connection means further comprises an elastic conductive material arranged to be compressed between a ball and one of the internal contacts. According to another characteristic, the conductive material 30 is still adhesive. According to another characteristic, the conductive material is an anisotropic conductive material and is shaped as a layer shared by at least two balls. According to another characteristic, said conductive ball 35 is melted at low temperature. According to another characteristic, the pl external contacts of the first interface are arranged on a first face of the card and the p2 outer contacts of the second interface are arranged on a second face of the card opposite to the first face. According to another characteristic, at least one of the first interface or the second interface comprises a printed circuit providing the connections between the external contacts and the internal contacts. According to another characteristic, a single interface among the first interface or the second interface comprises a printed circuit. According to another feature, at least one of the first interface or the second interface comprises a contact plate comprising a first face having the outer contacts and a second opposite face having the inner contacts, each inner contact being arranged opposite. an outside contact. According to another characteristic, the microcircuit conforms to the SIM standard, the outer contacts of the first interface conform to a first ISOSIM standard, the outer contacts of the second interface conform to a second different ISO-SIM standard, and each contact the first interface is connected to an equivalent contact of the second interface and the corresponding contact of the microcircuit. According to another characteristic, the microcircuit conforms to the SIM standard, the outer contacts of the first interface conform to an ISO-SIM standard, the outer contacts of the second interface conform to the microSD standard, and the contacts of the first interface are connected to the contacts of the second interface and to the contacts of the microcircuit according to the following interconnection: C7 - Pin1 - 10, C1 - Pin4 - VDD, C3 - Pin5 - CLK, C5 - Pin6 - GND and C2 - Pin8 - RST. According to another characteristic, the card has an outer shape conforming to the microSD standard. The invention further relates to an adapter for such a card, said adapter comprising a thin plastic plate, of thickness in accordance with a SIM standard, limited by a substantially rectangular outer contour conforming to said SIM standard, further comprising a limited internal cutout by an inner contour of complementary shape of an outer shape conforming to the microSD standard and of depth substantially equal to a thickness in accordance with the microSD standard, said inner cutout being arranged relative to the outer contour so that the outer contacts of a board interfaces are positioned relative to the outer contour according to the specifications of the SIM standard and are flush with the cut surface of the board. Other characteristics, details and advantages of the invention will emerge more clearly from the detailed description given below as an indication in relation to drawings in which: FIG. 1 illustrates a microcircuit card comprising at least two interfaces of FIG. FIG. 2 illustrates, in one embodiment, the principle of connection between contact interfaces, in sectional view, FIG. 3 illustrates a microcircuit card comprising at least one interface. SIM contact on one side and a microSD contact interface on the other side, in transparent front view, - Figure 4 illustrates, the embodiment of Figure 3, in sectional view according to BB, - Figure 5 FIG. 6 illustrates a microSD format card comprising a first SIM contact interface on its first face, said first face being appa. FIG. 7 illustrates the microSD format map of FIG. 6, further comprising a second microSD contact interface on its second face, said second face being apparent in perspective view; FIG. an adapter capable of conforming a microSD format card to a SIM format; FIG. 8 illustrates the adapter of FIG. 8 equipped with a microSD format card.

As illustrated in FIG. 1, a microcircuit card 1 comprises a support 6 formed by a thin plastic card. The outer shape of such a support 6 is substantially flat, of small thickness in front of its other dimensions and typically has a substantially rectangular outer contour. The exact thicknesses and dimensions depend on the standard considered. The present one focuses more particularly on the standards SIM and SD, illustrative of the subject, but the invention is applicable to other standards.

The SIM standard includes several formats. The formats 2FF (standard SIM) and 3FF (micro SIM) have a thickness of 0.76 mm. The 4FF (nano SIM) format has a thickness of 0.67 mm. All these formats are substantially rectangular, with rounded corners and have a cut corner at 45 °, serving as a key. They have dimensions of 2FF: 25x15mm; 3FF: 15x12mm; 4FF: 12,3x8,8mm. The SD standard includes several formats: standard, mini and microSD. The microSD format, which interests us more particularly for its proximity to SIM formats 2FF and 3FF, has a thickness of 0.7mm. The outer contour, as shown in Figure 1, is substantially inscribed in a rectangle of dimensions 15x11mm and further comprises two cuts on one of its long sides. It should be noted that these dimensions may fit into the volume of a 2FF SIM format. Such a card 1 according to the invention comprises a microcircuit 2, conferring information processing and storage functions. Said microcircuit 2 is typically integrated in the thickness of the support 6. In order to connect to the outside world, the microcircuit 2 has a number n of contacts 3. At least one contact interface 10 enables the contacts 3 of the microcircuit 2 to be transferred to an outer face 4,5 of the support 6 of the card 1, so that these contacts 3 can connect with counter contacts of a card reader. Also the card 1 comprises at least a first contact interface 10 having a number pl of external contacts 11. These contacts 11 are called "outside" in that they are oriented towards the outside of the card 1 and are accessible from said outside. At least one of these external contacts 11 is electrically connected to one of the n contacts 3 of the microcircuit 2, in order to make said contact 3 accessible from outside the card 1. Advantageously, each of the n contacts 3 of the microcircuit 2 is thus transferred to an external contact 11 of the first interface 10. The card 1 further comprises at least a second contact interface 20 having a number p2 of external contacts 21. At least one of these p2 external contacts 21 is electrically connected to one of the n contacts 3 of the microcircuit 2. Thus the microcircuit 2 can be connected to the outside world via the first interface 10 or via the second interface 20. The first interface 10 can be in accordance with a first standard and thus adapted to a first type of reader, while the second interface 20 may conform to a second standard and thus adapted to a second type of reader, offering to connect the card 1, the possibility of inserting it in a reader of the first standard or in a reader of the second standard. So that the two contact interfaces 10, 20 are both connected to the microcircuit 2, according to one embodiment, an external contact 11 of the first interface 10 that is electrically connected to a contact 3 of the microcircuit 2 may be electrically connected with one of the outer contacts 21 of the second interface 20, itself connected to this contact 3 of the microcircuit 2. Thus, as illustrated in FIG. 1, a contact 11 of the first interface 10, for example the second from left to right, can be connected live with a contact 3, for example the first from top to bottom, of the microcircuit 2. Similarly a contact 21 of the second interface 20, for example the first, respectively the third left to right, can be connected directly with a contact 3, for example the fourth or the third, of the microcircuit 2.

However, according to a preferred embodiment, a contact 11 of the first interface 10, for example the third from left to right, can be directly connected with a contact 3, for example the second from top to bottom, of the microcircuit 2. A contact 21 of the second interface 20, for example the fourth from left to right, is then advantageously connected to said contact 11 of the first interface 10, here the third from left to right, so as to be also connected with said contact 3, here the second from top to bottom, of the microcircuit 2.

Such a connection between a contact 11 of the first interface 10 and a contact 21 of the second interface 20 is provided via a connection means 30. The invention proposes advantageous embodiments of such a connection means 30.

With reference to FIG. 2, in order to electrically connect an external contact 11 of the first interface 10, which can be placed anywhere on the card 1, with an external contact 21 of the second interface 20, which can also be arranged anywhere on the board 1, according to one embodiment the first interface 10 further comprises a number pl 'of inner contacts 12 and the second interface 20 further comprises a number p2' of internal contacts 22. These contacts 12,22 are said inner in that they are not necessarily visible and that they typically face the interior of the card 1. Each pl 'inner contacts 12 of the first interface 10 is electrically connected to one of the pl external contacts 11 of the first interface 10. Each inner contact 12 thus allows to deport at most one external contact 11 of the first interface 10. All the internal contacts 12 are advantageously used s and associated with an outer contact 11, while some outside contacts 11 may remain inside contact 12 associated. It follows that pl 'is at most equal to pl. Each of the p2 'inner contacts 22 of the second interface 20 is electrically connected to one of the p2 outside contacts 21 of the second interface 20. Each inner contact 22 thus allows to deport at most one outside contact 21 of the second interface 20. All the internal contacts 22 are advantageously used and associated with an external contact 21, whereas some external contacts 10 21 can remain without associated internal contact 22. It follows that p2 'is at most equal to p2. In addition, according to an advantageous characteristic of the invention, in order to simplify the production of a connection means 30 between a contact 11 of the first interface 10 15 and a contact 21 of the second interface 20, each internal contact 12 of the first interface 10 is arranged opposite an internal contact 22 of the second interface 20, in a direction transverse to the thickness of the card 1. Advantageously, the number pl 'of internal contacts 12 of the first interface 10 is equal to number p2 'of internal contacts 22 of the second interface 20. By virtue of the preceding characteristic, a connection means 30 advantageously comprises a conductive ball 31 disposed between an internal contact 12 of the first interface 10 and the internal contact 22 of the second interface 20 opposite. Such a ball 31 can be made of any conductive material. Advantageously, this conductive material may be a metallic material, such as for example a metal alloy. An advantageous method of producing a ball 31 made of metallic material is a deposit by an electrolytic bath on one of the contacts to be connected. A ball 31 is then obtained by electrolytic growth. Such a ball 31 may have an oblong or spherical shape. The materials which can be used are, for example, alloys made from Sn tin, Ag silver, and Cu copper. They have a compressive strength sufficient not to be deformed under the force applied during certain card making steps and up to 3ookN 500Kn / m2. They have in particular a hardness much greater than that of polymer bumps, for example a hardness greater than or equal to 250HB (Brinell number) which corresponds to the hardness of a steel. FIG. 2 illustrates, in a cut view according to the thickness of the card 1, the principle of such a connection means 30. An inner contact 12 of the first interface 10 is arranged facing, along a perpendicular to the surfaces 4,5 of the card 1, an inner contact 22 of the second interface 20. A ball 31 of conductive material is then advantageously interposed between said inner contacts 12,22 to electrically connect. It should be noted here that a ball 31 can advantageously be made of any diameter and thus adapt to the effective distance between the first interface 10 and the second interface 20. Thus, for illustrative purposes, for a card 1 having a thickness of 0.7 mm, such as a microSD card, if the first interface 10 and the second interface 20 have a typical thickness of 0.20 mm, a ball 31 has a diameter of 0.2 to 0.2) = 0.3 mm. Advantageously, this diameter can be further reduced to a value of 0.25, or more generally to a value of between 0.3 and 0.2 mm, in order to accommodate other interlayers. An interlayer may be a material 32 or a printed circuit layer 23, as described above. According to an advantageous embodiment, a connecting means 30 further comprises at least one elastic conductive adhesive material 32 interposed so as to be compressed between a ball 31 and one of the internal contacts 12, 22. It can thus be arranged such conductive material 32 between a ball 31 and a contact 12 of the first interface 10, between a ball 31 and a contact 22 of the second interface 35 or between the two. Such a material 32 is elastic and its compression performs a catch-up function as well as an immobilization of the ball 31. The thickness of such a material 32 is typically such that a residual thickness of 0.05 mm remains right of a compression. The fact that this material is adhesive contributes still to immobilize the ball 31. According to an advantageous embodiment, the material 32 5 can be shaped, as illustrated in FIG. 2, in a layer, parallel to the plane of the card 1 , and thus be shared by at least two balls 31, or all the balls. In this case, so that the electrical conduction is provided transversely and not longitudinally relative to the plane of the layer, the material 32 is an anisotropic conductive material, only conductive in a direction perpendicular to the plane of the layer. According to another embodiment, the material 32 becomes conductive only locally where it is compressed. According to an alternative embodiment, the electrical contact and the backlash are obtained by melting the ball 31. In this case, no conductive material 32 is used. A ball 31 is placed directly between two contacts. 12,22, if possible with some compression stress. It is then proceeded to a melting of the ball 31. This fusion must not lead to a temperature too high which could be harmful for the neighboring microcircuit 2 or for the plastic support 6 of the card 1. Also this fusion is 25 advantageously carried out at low temperature: less than 250 °. For this it is used metals or low melting temperature alloys, such as alloys of lead, tin, silver or copper. In addition, the heating means used to melt a ball 31 is a localized means such as a narrow infrared beam. In order to prevent the ball 31 from coming, when it is melted, laterally in contact with an undesired conductor, it is advantageously resorted to a varnish. Such a varnish is used to cover the entire surface including the inner contacts 12,22, excluding a saving at the right of each contact 12,22. The varnish then forms a well laterally containing the material of the ball 31. It has been seen previously that the external contacts 11, 21 may be connected to the internal contacts 12, 22 of a contact interface 10, 20. At least two embodiments of such an interconnection between the outer contacts 11,21 and the inner contacts 12,22 are possible and will now be described. Each of these embodiments that is called "double-sided" or "printed circuit" can be used indifferently for each contact individually or for all the contacts of an interface or two interfaces 10,20.

Referring to Figure 2 is illustrated a so-called "double-sided" embodiment for the first interface 10, here arranged in the upper part of the figure. In this embodiment, the contact interface 10 comprises a contact plate 14. This plate 14 is double-sided in that each contact is flush with the two inner and outer faces of the plate 14. Thus, the same contact, the same conductive insert, a metallized hole or any other conductive means passing through, simultaneously forms an external contact 11 by its part that exits through the outer face of the plate 14, here the first face 4 of the card 1, and a corresponding inner contact 12 by its part that comes out of the inner face of the plate 14. Such an embodiment is advantageous in that it is simple and moreover allows an embodiment in a very small thickness. A disadvantage, however, is that the arrangement of the inner contacts 12 mirrors, symmetrically, substantially the arrangement of the outer contacts 11. Still with reference to FIG. 2 is further illustrated an embodiment called "printed circuit" for the second interface 20, here in the lower part of the figure. In this embodiment, the contact interface 20 comprises separate internal and external contacts 22, for example each arranged on a different contact plate. An interconnection means is disposed between the inner contacts 22 and the outer contacts 21 in order to make the electrical connections. This interconnection means is typically a printed circuit 23. Such an embodiment is advantageous in that the printed circuit 23 allows an offset between an internal contact 22 and its associated external contact 21. Thus an external contact 21 can be arranged in any location of the outer surface of the card 1, including on a wafer, or the same face 4,5 of the card 1 as the outer contacts 11 of the other interface 10. This does not prevent the contacts The interiors 22 may be placed facing the internal contacts 12 of the other interface, here the first interface 10. In addition, a printed circuit 23 is advantageous in that it allows, by crossing its conductive tracks, the realization of any plan cabling between the inner contacts 22 and the outer contacts 21 and thus between the first interface 10 and the second interface 20.

It is possible to arrange the contact interfaces 10, 20, such that at least some of the external contacts 11, 21 to be connected are facing each other. It is then possible to make a "double-sided" contact superimposing the external contact 11 and the internal contact 12 of the first interface 10 and the external contact 21 and the internal contact 22 of the second interface 20 and to connect the internal contacts 12, 22 by means of a connecting means 30 comprising a ball 31.

This may not be possible for the other contacts, for which it is then advisable to use a printed circuit 23. Such a circuit board 23 comprises at least one electrical track in order to allow the offset and the interconnection between the internal contacts 12, 22 and the outer contacts 11,21 of a contact interface 10,20. Also, in order to achieve a format adaptation between the first interface 10 and the second interface 20 is it advantageous that at least one of the interfaces 10,20 includes such a printed circuit 23. It is of course possible that each of the two 10.20 interfaces include such a printed circuit 23. However, in order to avoid the disadvantages of a printed circuit 23: its higher cost and here the overthickness it entails, a preferred embodiment comprises a single printed circuit 23 associated at any one of the first interface 10 or the second interface 20. Advantageously in this same preferred embodiment, the other contact interface is made according to the "double-sided" embodiment. According to another characteristic, the outer contacts 11 of the first interface 10 are arranged on a first face 4 of the card 1 and the outer contacts 21 of the second interface 20 are arranged on a second face 5 of the card 1 opposite the first In this configuration, corresponding to FIG. 2, the interconnection of the two interfaces 10, 20 can be made at any internal point on the card 1. If one of the interfaces 10, 20 is made in "double-sided" mode Then, the interconnection is advantageously arranged at the right of this "double-sided" interface, the internal contacts of the other interface being also placed at the right of the "double-sided" interface and connected to the external contacts, which may be in any respect from the surface, via a printed circuit 23 ensuring their offset. The various embodiments of the interconnections between the contacts of different contact interfaces 10,20, connected to the same microcircuit 2, having been described in a functional manner, various illustrative applications will now be described. Figures 3-5 illustrates an application to a card 1. This card 1 has dimensions, thickness and external shape, complying with the microSD standard. This card 1 incorporates a microcircuit 2 according to the SIM standard. This card 1 comprises a first contact interface 10 in accordance with the ISO-SIM standard and more particularly an M3 format. The M3 contact format includes eight contacts named Cl through C8 from top to bottom and from right to left. C4 and C8 contacts for USB are optional. Also in order to reduce the area occupied, there is a variant of the format M3 which comprises only six external contacts C1 to C3 and C5 to C7 which are here arranged on a first face 4 of the card 1.

This card 1 further comprises a second interface 20 compliant with the microSD standard. The eight external contacts Pin1 to Pin8 are arranged according to the microSD standard. They are here on the second face 5 of the card 1 opposite to the first face 4. FIG. 3 shows a card 1 seen in transparency in order to make the C1-C3, C5-C7 normally visible contacts, the Pin-Pin8 contacts appear. normally invisible and show their possible overlays.

Figure 4 shows a section B-B of the map 1 of Figure 3, illustrative of a direct connection. The C5 contact of the first ISO-SIM M3 interface is connected to the pin6 contact of the second microSD interface. Advantageously, the contact C5 has a large surface and a portion of this surface is superimposed with the pin6 contact. Thus it is possible here to make a direct connection by means of a ball 31, marked here 31-B. The contact C5 is here a "double face" whose outer contact 11 is the outer face of a sticker whose inner face forms the corresponding inner contact 12. Pin6 contact here is also a "double face" whose outer contact 21 is the outer face of a sticker whose inner face forms the corresponding inner contact 22. The ball 31-B in its upper part comes into direct contact with the inner contact 12 and in its lower part with the inner contact 22. Between the ball 31-B and the inner contact 22 is interposed a layer of elastic conductive material 32. Thus is connected the contact C5 with the pin6 contact. The corresponding contact 3 of the microcircuit 2, which is here a GND (ground / ground) contact, can optionally be connected to the contact C5 or contact Pin6. In Figure 4 a wire connects it to the inner contact 12 of the contact C5. Figure 5 shows a section A-A of the map 1 of Figure 3, illustrative of a connection with offset. The C2 contact of the first ISO-SIM M3 interface is connected to the Pin8 contact of the second microSD interface. Unlike the previous case, the C2 contact is not superimposed with the Pin8 contact. So it is necessary to make a connection with offset. For this C2 contact could be a "double face". However, in an alternative manner but equivalent to a "double face", the contact C2 comprises an external contact 11 and an inner contact 12 opposite and electrically connected, here via a via 15. The pin8 contact, non-superimposable, can not be a " double sided ". On the contrary, it comprises an external contact 21 connected to an internal contact 22 by a printed circuit track 23, clearly visible in FIG. 3. The internal contact 22 is arranged facing the inside contact 12. The track 23 carries out the offset. This allows a ball 31, identified here 31-A, to perform the interconnection. The ball 31-A in its upper part comes into direct contact with the inner contact 12 and in its lower part with the inner contact 22. Between the ball 31-A and the inner contact 22 is interposed a layer of elastic conductive material 32 This is how the C2 contact is connected to the Pin8 contact. The corresponding contact 3 of the microcircuit 2, which is here an RST contact (reset / reset), can be connected to the C2 contact or the Pin8 contact. In Figure 5 a wire connects it to the inner contact 12 of the contact C2. The complete wiring, all of whose connections are not necessarily shown in FIGS. 3-5, comprises five connections. Thus, five of the n contacts of the microcircuit 2 are connected. These are IO (input-output / input-output), VDD (power), CLK (clock / clock), GND (ground / ground) and RST (reset / reset) contacts, as defined by the SIM standard . Among the six or eight contacts of an ISO-SIM interface, as previously indicated, the contacts C4 and C8 are optional and are not connected here. In addition, the contact C6 is not connected. Let five contacts C1-C3, C5 and C7. Of the eight contacts of a microSD interface, only five are used here to connect this interface to the microcircuit 2. These are Pin1, Pin4, PinS, Pin6, and Pin8 contacts. One of the applications, more particularly illustrated in FIGS. 3-6 and 7, consists in producing a card 1 having a SIM function. For this purpose, said card 1 comprises a microcircuit 2 conforming to the SIM standard and comprising at least the contacts 3: 10, VDD, CLK, GND and RST.

This card 1 has an external form complying with the microSD standard. This card 1 comprises an interface 20 whose external contacts 21 are compliant with the microSD standard. The external contacts 21 are respectively electrically connected to the contacts 3 of the microcircuit 2 according to the following interconnection: IO-Pin1, VDD-Pin4, CLK-Pin5, GND-Pin6 and RST-Pin8. Thus the card 1 can advantageously be inserted in a microSD standard reader. This advantageously makes it possible to confer a SIM function for telephony or access to a wireless data network to equipment that is conventionally not equipped with a reader with the SIM standard, but having an SD or microSD memory card reader. This same card 1, as more particularly visible in FIG. 6, further comprises an interface 10 conforming to an ISO-SIM standard, for example M3 as illustrated. The external contacts 11 of this interface 10 are respectively electrically connected to the external contacts 21 of the interface 20 according to the following interconnection: C7-Pin1, C1-Pin4, C3-Pin5, C5-Pin6 and C2-Pin8. Due to the two previous interconnections, the following interconnection is realized: IO - C7 - Pin1, VDD - C1 Pin4, CLK - C3 - Pin5, GND - C5 - Pin6 and RST - C2 - Pin8. Thus equipped with an interface 10 in the ISO-SIM format, the card 1 is electrically compatible with a SIM reader, provided that the external contacts 11 are correctly arranged. For this, with reference to FIGS. 8 and 9, a dimensional adapter 40 can advantageously be used. Such an adapter 40 consists of a substantially planar thin plate 41, for example, made of plastic. This plate 41 comprises an outer shape conforming to a SIM standard, for example here a 2FF format. Also said plate 41 has a thickness 42 conforming to the SIM standard, and is limited by a substantially rectangular outer contour 43 conforming to the SIM standard, including a truncated corner acting as a polarizer. The plate 41 also includes an inner cutout 44 adapted to accommodate a card 1 microSD standard. Also the inner cutout 44 is limited by an inner contour 45 of complementary shape of an outer shape conforming to the microSD standard and has a depth 46 substantially equal to a thickness in accordance with the microSD standard. This is made possible by the fact that the thickness of the microSD standard is less than the thickness of the SIM 2FF standard. Also the adapter comprises a catch-up piece of thickness 48 so that the outer contacts 11 of the ISO-SIM interface of the card 1 are flush with the surface 47 of the adapter in which the inner cutout 44 is made. the inner cutout 44 is disposed relative to the outer contour 43 so that the outer contacts 11 of the ISO-SIM interface of the card 1 are positioned relative to the outer contour 43 according to the specifications of the SIM standard. Thus the assembly illustrated in Figure 9, formed by an adapter 40 hosting a card 1 in its inner cutout 44, has all the dimensional and functional characteristics of a SIM card.

Advantageously according to the invention, all the functional and connective adaptations being made by the card 1 itself, the adapter 40 is a solely dimensional adapter, particularly simple in that it comprises only a plastic part.

According to another application of the invention, the external contacts 11 of the first interface 10 conform to a first ISO-SIM standard, for example in the M2 format, and the external contacts 21 of the second interface 20 conform to a second standard. ISO-SIM different, for example M3. In this application, each contact 11, 12 of the first interface 10 is connected to an equivalent contact 21, 22 of the second interface 20 and to the corresponding contact 3 of the microcircuit 2. Thus, the card 1 comprises a microcircuit 2 conforming to the standard SIM and comprising at least the contacts 3: IO, VDD, CLK, GND and RST. The contacts 11, 12 of the first interface 10 comprise six or eight contacts comprising at least the five contacts C1-C3, C5, C7. Similarly, the contacts 21, 22 of the second interface 20 comprise six or eight contacts comprising at least the five contacts C1-C3, C5, C7. These contacts being functionally equivalent can be connected by any one of the connection means 30 according to the invention according to the following interconnection: Cl - Cl, C2 - C2, C3 - C3, C5 - C5 and C7 - C7. For each contact, the contact on the first interface side 10 or on the second interface side 20 is still connected to a contact 3 of the microcircuit 2 according to the following interconnection IO-C7, VDD-C1, CLK-C3, GND-C5 and RST-C2. Such a card 1, equipped with a microcircuit 2 and two interfaces 10, 20 can advantageously be used in a reader conforming to the first ISO-SIM standard or in a reader complying with the first ISO-SIM standard, where appropriate using a dimensional adapter, of the type described above with reference to FIGS. 8 and 9.

Claims (13)

REVENDICATIONS1. Card (1) comprising a microcircuit (2) having n contacts (3), a first contact interface (10) comprising pl external contacts (11) arranged on at least one of a first face (4) or a second face (5). ) of the board, at least one of said outer contacts (11) of the first interface (10) being electrically connected to one of said n contacts (3) of the microcircuit (2), and a second contact interface ( 20) comprising p2 external contacts (21) arranged on at least one of a first face (4) or a second face (5) of the card, at least one of said p2 external contacts (21) of the second interface (20) being electrically connected to one of said n contacts (3) of the microcircuit (2), characterized in that at least one of said at least one of said outer contacts (11) of the first interface (10), connected, is still electrically connected with one of said at least one of said p2 external contacts (2 1) of the second interface (20), connected. 2. Card (1) according to claim 1, wherein the first interface (10) further comprises pl 'inner contacts (12), each respectively connected to one of the pl outer contacts (11) of the first interface (10), pl' being at most equal to p1, where the second interface (20) further comprises p2 'inner contacts (22), each respectively connected to one of p2 outside contacts (21) of the second interface (20), p2' being at most equal at p2, each arranged facing one of the pl 'inner contacts (12) of the first interface (10), p2' being equal to pl ', the card (1) further comprising a connection means (30) comprising a conductive ball (31) disposed between an inner contact (12) of the first interface (10) and the inner contact (22) of the second interface (20) facing. The card (1) according to claim 2, wherein the disconnecting means (30) further comprises an adhesive elastic conductive material (32) arranged to be compressed between a ball (31) and one of the internal contacts (12,22). . 4. Card (1) according to any one of claims 2 or 3, wherein the conductive material (32) is an anisotropic conductive material and is shaped as a layer shared by at least two balls (31). 5. Card (1) according to claim 2, wherein said conductive ball (31) is melted at low temperature. 6. Card (1) according to any one of claims 1 to 5, wherein the pl outer contacts (11) of the first interface (10) are arranged on a first face (4) of the card (1) and where the p2 outer contacts (21) of the second interface (20) are arranged on a second face (5) of the card (1) opposite the first face (4). 7. Card (1) according to any one of claims 1 to 6, wherein at least one of the first interface (10) or the second interface (20) comprises a printed circuit (23) ensuring the connections between the contacts outside (11,21) and inside contacts (12,22). The card (1) of claim 7, wherein a single interface of the first interface (10) or the second interface (20) comprises a printed circuit (23). 9. Card (1) according to any one of claims 1 to 8, wherein at least one of the first interface (10) or the second interface (20) comprises a contact plate (14) comprising a first face comprising the outer contacts (11) and a second opposite face having the inner contacts (12), each inner contact (12) being arranged facing an outer contact (11). 10. Card (1) according to any one of claims 1 to 9, wherein the microcircuit (2) conforms to the SIM standard, wherein the outer contacts (11) of the first interface (10) comply with a first ISO standard. SIM, where the outer contacts (21) of the second interface (20) conform to a different second ISO-SIM standard, and each contact (11,12) of the first interface (10) is connected to an equivalent contact ( 21,22) of the second interface (20) and the corresponding contact (3) of the microcircuit (2). 11. Card (1) according to any one of claims 1 to 9, wherein the microcircuit (2) conforms to the SIM standard, wherein the outer contacts (11) of the first interface (10) are in accordance with an ISO standard. SIM, wherein the outer contacts (21) of the second interface (20) conform to the microSD standard, and the contacts (11,12) of the first interface (10) are connected to the contacts of the second interface (20) and to the contacts (3) of the microcircuit (2) according to the following interconnection: C7 - Pin1 - 10, C1 - Pin4 - VDD, C3 - Pin5 - CLK, C5 - Pin6 - GND and C2 - Pin8 - RST. 12. Card (1) according to any one of claims 10 or 11, having an outer shape conforming to microSD standard. 13. Adapter (40) for a card (1) according to claim 12, said adapter comprising a thin plastic plate (41), of thickness (42) conforming to a SIM standard, bounded by a substantially rectangular outer contour (43). according to said SIM standard, further comprising an inner cutout (44), limited by an inner contour (45) of complementary shape to an outer shape conforming to the microSD standard and of depth (46) substantially equal to a thickness in accordance with the microSD standard , said inner cutout (44) being disposed relative to the outer contour (43) so that the outer contacts (11,21) of one of the interfaces (10,20) of the card (1) are positioned relative to the outline external (43) according to the specifications of the SIM standard and are flush with the cut surface (47) of the plate (41).