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FR3091932B1 - Système photonique et son procédé de fabrication - Google Patents

Système photonique et son procédé de fabrication Download PDF

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Publication number
FR3091932B1
FR3091932B1 FR1900532A FR1900532A FR3091932B1 FR 3091932 B1 FR3091932 B1 FR 3091932B1 FR 1900532 A FR1900532 A FR 1900532A FR 1900532 A FR1900532 A FR 1900532A FR 3091932 B1 FR3091932 B1 FR 3091932B1
Authority
FR
France
Prior art keywords
face
waveguide
photonic
waveguides
photonic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1900532A
Other languages
English (en)
Other versions
FR3091932A1 (fr
Inventor
Jean-François Carpentier
Charles Baudot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
Original Assignee
STMicroelectronics Crolles 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Crolles 2 SAS filed Critical STMicroelectronics Crolles 2 SAS
Priority to FR1900532A priority Critical patent/FR3091932B1/fr
Priority to CN202020139843.0U priority patent/CN211741637U/zh
Priority to US16/748,696 priority patent/US11474317B2/en
Priority to CN202210855718.3A priority patent/CN115113349B/zh
Priority to CN202010071881.1A priority patent/CN111458809B/zh
Publication of FR3091932A1 publication Critical patent/FR3091932A1/fr
Application granted granted Critical
Publication of FR3091932B1 publication Critical patent/FR3091932B1/fr
Priority to US17/932,623 priority patent/US12019293B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4234—Passive alignment along the optical axis and active alignment perpendicular to the optical axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12121—Laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12147—Coupler
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Système photonique et son procédé de fabrication La présente description concerne un système photonique comprenant un premier circuit photonique (LIC) ayant une première face (52) et un deuxième circuit photonique (PIC) ayant une deuxième face (62). Le premier circuit photonique comprend des premiers guides d'ondes (54), et, pour chaque premier guide d'ondes, un deuxième guide d'ondes (56) recouvrant le premier guide d'ondes, les deuxièmes guides d'ondes étant au contact de la première face et interposés entre la première face et la deuxième face, les premiers guides d'ondes étant situés du côté de la première face opposé aux deuxièmes guides d'ondes. Le deuxième circuit photonique comprend, pour chaque deuxième guide d'ondes, un troisième guide d'ondes (64) recouvrant le deuxième guide d'ondes. Le premier circuit photonique comprend des premiers dispositifs de positionnement (70) se projetant depuis la première face et le deuxième circuit photonique comprend des deuxièmes dispositifs de positionnement (80) se projetant depuis la deuxième face, au moins l'un des premiers dispositifs de positionnement étant en butée contre l'un des deuxièmes dispositifs de positionnement selon une première direction (Ox). Figure pour l'abrégé : Fig. 10
FR1900532A 2019-01-22 2019-01-22 Système photonique et son procédé de fabrication Active FR3091932B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR1900532A FR3091932B1 (fr) 2019-01-22 2019-01-22 Système photonique et son procédé de fabrication
CN202020139843.0U CN211741637U (zh) 2019-01-22 2020-01-21 光子系统
US16/748,696 US11474317B2 (en) 2019-01-22 2020-01-21 Photonic system and method for its manufacture
CN202210855718.3A CN115113349B (zh) 2019-01-22 2020-01-21 光子系统及其制造方法
CN202010071881.1A CN111458809B (zh) 2019-01-22 2020-01-21 光子系统及其制造方法
US17/932,623 US12019293B2 (en) 2019-01-22 2022-09-15 Photonic system and method for its manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1900532 2019-01-22
FR1900532A FR3091932B1 (fr) 2019-01-22 2019-01-22 Système photonique et son procédé de fabrication

Publications (2)

Publication Number Publication Date
FR3091932A1 FR3091932A1 (fr) 2020-07-24
FR3091932B1 true FR3091932B1 (fr) 2021-02-12

Family

ID=68072466

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1900532A Active FR3091932B1 (fr) 2019-01-22 2019-01-22 Système photonique et son procédé de fabrication

Country Status (3)

Country Link
US (2) US11474317B2 (fr)
CN (3) CN211741637U (fr)
FR (1) FR3091932B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230258871A1 (en) * 2022-02-16 2023-08-17 Honeywell International Inc. Fiber-to-chip coupling methods using flowable index matching materials
WO2024184004A1 (fr) * 2023-03-06 2024-09-12 Ams-Osram International Gmbh Dispositif laser et procédé de fabrication d'un dispositif laser

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US6118075A (en) * 1999-02-17 2000-09-12 Lucent Technologies Inc. Stackable universal pitch cable trough system
EP1168011A1 (fr) * 2000-06-21 2002-01-02 Corning Incorporated Alignement hybride de composants optiques utilisant des substrats calibrés
US6888989B1 (en) 2001-12-11 2005-05-03 Phosistor Technologies, Inc. Photonic chip mounting in a recess for waveguide alignment and connection
US7131658B2 (en) * 2005-03-11 2006-11-07 Mackarvich Charles J Trailer hitch guide
JP4499773B2 (ja) * 2007-10-22 2010-07-07 ソニー株式会社 液晶表示素子
US8111730B2 (en) * 2009-08-20 2012-02-07 International Business Machines Corporation 3D optoelectronic packaging
US9229169B2 (en) * 2011-08-16 2016-01-05 International Business Machines Corporation Lens array optical coupling to photonic chip
US8548288B2 (en) * 2011-12-20 2013-10-01 Oracle International Corporation Efficient inter-chip optical coupling
EP2802914A4 (fr) * 2012-01-09 2016-01-13 Hewlett Packard Development Co Connexions optiques
US20160274318A1 (en) * 2012-03-05 2016-09-22 Nanoprecision Products, Inc. Optical bench subassembly having integrated photonic device
US8722467B2 (en) 2012-06-30 2014-05-13 Alpha & Omega Semiconductor, Inc. Method of using bonding ball array as height keeper and paste holder in semiconductor device package
CN105556363B (zh) * 2013-09-16 2017-06-30 3M创新有限公司 光通信组件
JP6581195B2 (ja) * 2014-11-11 2019-09-25 フィニサー コーポレイション ２段の断熱結合されたフォトニック・システム
US9621264B2 (en) * 2015-01-29 2017-04-11 Huawei Technologies Co., Ltd. Bi-directional tap-monitor for optical add-drop photonic chip
US10620377B1 (en) * 2015-04-01 2020-04-14 National Technology & Engineering Solutions Of Sandia, Llc Kinematic chip to chip bonding
EP3091379B1 (fr) * 2015-05-05 2020-12-02 Huawei Technologies Co., Ltd. Schéma de couplage optique
WO2017143264A1 (fr) * 2016-02-19 2017-08-24 Macom Technology Solutions Holdings, Inc. Techniques d'alignement laser utilisées dans des circuits intégrés photoniques
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Also Published As

Publication number Publication date
CN115113349B (zh) 2024-04-12
US11474317B2 (en) 2022-10-18
CN111458809A (zh) 2020-07-28
CN211741637U (zh) 2020-10-23
CN111458809B (zh) 2022-07-26
US20200233164A1 (en) 2020-07-23
FR3091932A1 (fr) 2020-07-24
CN115113349A (zh) 2022-09-27
US12019293B2 (en) 2024-06-25
US20230015854A1 (en) 2023-01-19

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