FR3057396B1 - Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat - Google Patents
Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat Download PDFInfo
- Publication number
- FR3057396B1 FR3057396B1 FR1659763A FR1659763A FR3057396B1 FR 3057396 B1 FR3057396 B1 FR 3057396B1 FR 1659763 A FR1659763 A FR 1659763A FR 1659763 A FR1659763 A FR 1659763A FR 3057396 B1 FR3057396 B1 FR 3057396B1
- Authority
- FR
- France
- Prior art keywords
- substrate
- image sensor
- manufacturing
- type image
- side type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Abstract
La présente invention concerne un substrat pour un capteur d'image de type face avant, comprenant successivement un substrat support (1) semi-conducteur dopé de type P-, une couche électriquement isolante (2) et une couche (3) semi-conductrice dite couche active, caractérisé en ce qu'il comprend, entre le substrat support (1) et la couche électriquement isolante (2), une couche épitaxiale (4) semi-conductrice dopée de type P+. L'invention concerne également un capteur d'image comprenant un tel substrat, ainsi qu'un procédé de fabrication dudit substrat.
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1659763A FR3057396B1 (fr) | 2016-10-10 | 2016-10-10 | Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat |
TW106134583A TWI737833B (zh) | 2016-10-10 | 2017-10-06 | 前側型影像感測器及用於製造該感測器之方法 |
EP17780436.6A EP3523826B1 (fr) | 2016-10-10 | 2017-10-10 | Capteur d'image de type frontal et procédé de fabrication d'un tel capteur d'image de type frontal |
KR1020197013421A KR102457269B1 (ko) | 2016-10-10 | 2017-10-10 | 전면형 이미지 센서 및 그 센서를 제조하는 방법 |
CN201780061756.9A CN109791938B (zh) | 2016-10-10 | 2017-10-10 | 正面型图像传感器和用于制造这种传感器的方法 |
US16/340,879 US10903263B2 (en) | 2016-10-10 | 2017-10-10 | Front-side type image sensor and method for manufacturing such a sensor |
PCT/EP2017/075797 WO2018069310A1 (fr) | 2016-10-10 | 2017-10-10 | Capteur d'image de type frontal et procédé de fabrication d'un tel capteur d'image de type frontal |
JP2019519328A JP7051836B2 (ja) | 2016-10-10 | 2017-10-10 | 表側面型撮像素子およびその素子の製造方法 |
US17/133,316 US11552123B2 (en) | 2016-10-10 | 2020-12-23 | Front-side type image sensors |
US18/145,976 US20230127950A1 (en) | 2016-10-10 | 2022-12-23 | Front-side type image sensors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1659763A FR3057396B1 (fr) | 2016-10-10 | 2016-10-10 | Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat |
FR1659763 | 2016-10-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3057396A1 FR3057396A1 (fr) | 2018-04-13 |
FR3057396B1 true FR3057396B1 (fr) | 2018-12-14 |
Family
ID=57396731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1659763A Active FR3057396B1 (fr) | 2016-10-10 | 2016-10-10 | Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat |
Country Status (8)
Country | Link |
---|---|
US (3) | US10903263B2 (fr) |
EP (1) | EP3523826B1 (fr) |
JP (1) | JP7051836B2 (fr) |
KR (1) | KR102457269B1 (fr) |
CN (1) | CN109791938B (fr) |
FR (1) | FR3057396B1 (fr) |
TW (1) | TWI737833B (fr) |
WO (1) | WO2018069310A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3045677B1 (fr) * | 2015-12-22 | 2019-07-19 | Soitec | Procede de fabrication d'une couche monocristalline, notamment piezoelectrique |
FR3077923B1 (fr) * | 2018-02-12 | 2021-07-16 | Soitec Silicon On Insulator | Procede de fabrication d'une structure de type semi-conducteur sur isolant par transfert de couche |
US11676983B2 (en) | 2020-01-07 | 2023-06-13 | Powertech Technology Inc. | Sensor with dam structure and method for manufacturing the same |
TWI741903B (zh) * | 2020-01-07 | 2021-10-01 | 力成科技股份有限公司 | 感測器及其製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4235787B2 (ja) * | 2001-10-03 | 2009-03-11 | ソニー株式会社 | 固体撮像素子の製造方法 |
JP4123415B2 (ja) * | 2002-05-20 | 2008-07-23 | ソニー株式会社 | 固体撮像装置 |
JP2004134672A (ja) * | 2002-10-11 | 2004-04-30 | Sony Corp | 超薄型半導体装置の製造方法および製造装置、並びに超薄型の裏面照射型固体撮像装置の製造方法および製造装置 |
JP2005333070A (ja) * | 2004-05-21 | 2005-12-02 | Sony Corp | 半導体装置の製造方法及び縦型オーバーフロードレイン構造及び電子シャッタ機能を有する表面照射型固体撮像装置並びにその製造方法 |
JP4211696B2 (ja) * | 2004-06-30 | 2009-01-21 | ソニー株式会社 | 固体撮像装置の製造方法 |
US20070045668A1 (en) * | 2005-08-26 | 2007-03-01 | Micron Technology, Inc. | Vertical anti-blooming control and cross-talk reduction for imagers |
US8049256B2 (en) * | 2006-10-05 | 2011-11-01 | Omnivision Technologies, Inc. | Active pixel sensor having a sensor wafer connected to a support circuit wafer |
FR2935067B1 (fr) | 2008-08-14 | 2011-02-25 | Commissariat Energie Atomique | Procede de fabrication d'une structure semi-conductrice plan de masse enterre |
EP2200084A1 (fr) * | 2008-12-22 | 2010-06-23 | S.O.I. TEC Silicon | Procédé de fabrication d'un capteur d'image rétro-éclairé |
JP2011014673A (ja) | 2009-07-01 | 2011-01-20 | Panasonic Corp | Soi基板とその製造方法およびそれを用いた固体撮像装置の製造方法 |
EP2282332B1 (fr) * | 2009-08-04 | 2012-06-27 | S.O.I. TEC Silicon | Methode de fabrication d'un substrat semiconducteur |
FR3002812B1 (fr) * | 2013-03-01 | 2016-08-05 | St Microelectronics Crolles 2 Sas | Procede de transfert de couche |
FR3027731B1 (fr) * | 2014-10-24 | 2018-01-05 | Stmicroelectronics Sa | Capteur d'image face avant a courant d'obscurite reduit sur substrat soi |
-
2016
- 2016-10-10 FR FR1659763A patent/FR3057396B1/fr active Active
-
2017
- 2017-10-06 TW TW106134583A patent/TWI737833B/zh active
- 2017-10-10 EP EP17780436.6A patent/EP3523826B1/fr active Active
- 2017-10-10 CN CN201780061756.9A patent/CN109791938B/zh active Active
- 2017-10-10 WO PCT/EP2017/075797 patent/WO2018069310A1/fr active Application Filing
- 2017-10-10 KR KR1020197013421A patent/KR102457269B1/ko active IP Right Grant
- 2017-10-10 JP JP2019519328A patent/JP7051836B2/ja active Active
- 2017-10-10 US US16/340,879 patent/US10903263B2/en active Active
-
2020
- 2020-12-23 US US17/133,316 patent/US11552123B2/en active Active
-
2022
- 2022-12-23 US US18/145,976 patent/US20230127950A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN109791938A (zh) | 2019-05-21 |
TWI737833B (zh) | 2021-09-01 |
EP3523826A1 (fr) | 2019-08-14 |
JP7051836B2 (ja) | 2022-04-11 |
US11552123B2 (en) | 2023-01-10 |
US10903263B2 (en) | 2021-01-26 |
CN109791938B (zh) | 2023-04-28 |
JP2019534556A (ja) | 2019-11-28 |
US20230127950A1 (en) | 2023-04-27 |
US20210118936A1 (en) | 2021-04-22 |
KR102457269B1 (ko) | 2022-10-20 |
US20190267425A1 (en) | 2019-08-29 |
KR20190061070A (ko) | 2019-06-04 |
TW201826514A (zh) | 2018-07-16 |
FR3057396A1 (fr) | 2018-04-13 |
EP3523826B1 (fr) | 2021-11-17 |
WO2018069310A1 (fr) | 2018-04-19 |
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