Nothing Special   »   [go: up one dir, main page]

FR3045028B1 - Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant - Google Patents

Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant

Info

Publication number
FR3045028B1
FR3045028B1 FR1562174A FR1562174A FR3045028B1 FR 3045028 B1 FR3045028 B1 FR 3045028B1 FR 1562174 A FR1562174 A FR 1562174A FR 1562174 A FR1562174 A FR 1562174A FR 3045028 B1 FR3045028 B1 FR 3045028B1
Authority
FR
France
Prior art keywords
manufacturing
micro electromechanical
corresponding device
electromechanical device
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1562174A
Other languages
English (en)
Other versions
FR3045028A1 (fr
Inventor
Joel Collet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tronics Microsystems SA
Original Assignee
Tronics Microsystems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tronics Microsystems SA filed Critical Tronics Microsystems SA
Priority to FR1562174A priority Critical patent/FR3045028B1/fr
Priority to JP2018530097A priority patent/JP2018536551A/ja
Priority to US15/780,478 priority patent/US20180346325A1/en
Priority to EP16812983.1A priority patent/EP3386910A1/fr
Priority to PCT/FR2016/052963 priority patent/WO2017098101A1/fr
Publication of FR3045028A1 publication Critical patent/FR3045028A1/fr
Application granted granted Critical
Publication of FR3045028B1 publication Critical patent/FR3045028B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
FR1562174A 2015-12-11 2015-12-11 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant Expired - Fee Related FR3045028B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1562174A FR3045028B1 (fr) 2015-12-11 2015-12-11 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant
JP2018530097A JP2018536551A (ja) 2015-12-11 2016-11-15 マイクロ電気機械デバイスおよび対応するデバイスの製造方法
US15/780,478 US20180346325A1 (en) 2015-12-11 2016-11-15 Method for manufacturing a microelectromechanical device and corresponding device
EP16812983.1A EP3386910A1 (fr) 2015-12-11 2016-11-15 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant
PCT/FR2016/052963 WO2017098101A1 (fr) 2015-12-11 2016-11-15 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1562174A FR3045028B1 (fr) 2015-12-11 2015-12-11 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant

Publications (2)

Publication Number Publication Date
FR3045028A1 FR3045028A1 (fr) 2017-06-16
FR3045028B1 true FR3045028B1 (fr) 2018-01-05

Family

ID=55806460

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1562174A Expired - Fee Related FR3045028B1 (fr) 2015-12-11 2015-12-11 Procede de fabrication d'un dispositif micro electromecanique et dispositif correspondant

Country Status (5)

Country Link
US (1) US20180346325A1 (fr)
EP (1) EP3386910A1 (fr)
JP (1) JP2018536551A (fr)
FR (1) FR3045028B1 (fr)
WO (1) WO2017098101A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4353039B2 (ja) * 2003-09-22 2009-10-28 パナソニック電工株式会社 半導体構造の製造方法
US20050095814A1 (en) * 2003-11-05 2005-05-05 Xu Zhu Ultrathin form factor MEMS microphones and microspeakers
US20070170528A1 (en) * 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
FR2898884B1 (fr) 2006-03-27 2008-05-02 Commissariat Energie Atomique Micro-capteur inertiel resonant a epaisseur variable realise en technologies de surface
US8012785B2 (en) * 2009-04-24 2011-09-06 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating an integrated CMOS-MEMS device
DE102010039293B4 (de) * 2010-08-13 2018-05-24 Robert Bosch Gmbh Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil
FR2972263B1 (fr) * 2011-03-03 2013-09-27 Tronics Microsystems Capteur inertiel et procede de fabrication correspondant
FR2983189B1 (fr) * 2011-11-30 2014-02-07 Commissariat Energie Atomique Procede de realisation d'une structure comportant au moins une partie active presentant des zones d'epaisseurs differentes
US8802473B1 (en) * 2013-03-14 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS integrated pressure sensor devices having isotropic cavities and methods of forming same
KR102106074B1 (ko) * 2013-12-05 2020-05-28 삼성전자주식회사 전기 음향 변환기 및 그 제조방법
US9522822B2 (en) * 2014-05-13 2016-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Sensor integration with an outgassing barrier and a stable electrical signal path
FR3028257A1 (fr) * 2014-11-10 2016-05-13 Tronic's Microsystems Procede de fabrication d'un dispositif electromecanique et dispositif correspondant

Also Published As

Publication number Publication date
FR3045028A1 (fr) 2017-06-16
EP3386910A1 (fr) 2018-10-17
US20180346325A1 (en) 2018-12-06
WO2017098101A1 (fr) 2017-06-15
JP2018536551A (ja) 2018-12-13

Similar Documents

Publication Publication Date Title
EP3407817A4 (fr) Procédé et système de conception et de fabrication d'un dispositif personnalisé
EP3343885A4 (fr) Dispositif électronique, et procédé de fabrication de boîtier correspondant
FR3043852B1 (fr) Dispositif laser et procede de fabrication d’un tel dispositif laser
FR3028639B1 (fr) Procede de securisation d'un jeton de paiement
EP3444929A4 (fr) Dispositif de fabrication et procédé de fabrication d'un noyau à aimant incorporé
FR3025056B1 (fr) Dispositif laser et procede de fabrication d'un tel dispositif laser
EP3422410A4 (fr) Dispositif d'imagerie et procédé de fabrication de dispositif d'imagerie
FR3032064B1 (fr) Dispositif optoelectronique et son procede de fabrication
FR3019613B1 (fr) Procede de commande d'un actionneur de passage de vitesses et actionneur de passage correspondant
EP3435150A4 (fr) Dispositif d'électromouillage et procédé de fabrication d'un dispositif d'électromouillage
FR3043376B1 (fr) Volant et procede de fabrication d'un tel volant.
FR3013510B1 (fr) Procede de fabrication d'un dispositif pyroelectrique et/ou piezoelectrique
FR3057252B1 (fr) Dispositif de conditionnement d'objet et procede d'extraction correspondant
FR3006108B1 (fr) Procede de fabrication d'un dispositif photosensible
EP3375924A4 (fr) Dispositif de fabrication de feuille et procédé de fabrication de feuille
FR3020987B1 (fr) Procede de fabrication d'un element de securite.
FR3016325B1 (fr) Procede de surveillance d`un organe de blocage, et actionneur electromecanique.
FR3012124B1 (fr) Dispositif de detection electromecanique, pour la detection gravimetrique, et procede de fabrication du dispositif
FR3037859B1 (fr) Dispositif et procede de production d'un element multicouche
FR3046559B1 (fr) Procede et installation de fabrication d'un objet tridimensionnel
EP3356289A4 (fr) Procédé de fabrication de dispositif mems simplifié
EP3299096A4 (fr) Dispositif et procédé de fabrication d'un vilebrequin forgé
FR3036671B1 (fr) Procede de fabrication d'un habillage et habillage correspondant
FR3037613B1 (fr) Dispositif et procede de fabrication d’un voussoir de tunnel
FR3040822B1 (fr) Procede de fabrication d'un dispositif a jonction electronique et dispositif associe

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Search report ready

Effective date: 20170616

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

ST Notification of lapse

Effective date: 20200910