FR2864339B1 - DEVICE AND METHOD FOR OBSERVING A COLLAGE INTERFACE - Google Patents
DEVICE AND METHOD FOR OBSERVING A COLLAGE INTERFACEInfo
- Publication number
- FR2864339B1 FR2864339B1 FR0351181A FR0351181A FR2864339B1 FR 2864339 B1 FR2864339 B1 FR 2864339B1 FR 0351181 A FR0351181 A FR 0351181A FR 0351181 A FR0351181 A FR 0351181A FR 2864339 B1 FR2864339 B1 FR 2864339B1
- Authority
- FR
- France
- Prior art keywords
- observing
- collage
- interface
- collage interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0351181A FR2864339B1 (en) | 2003-12-23 | 2003-12-23 | DEVICE AND METHOD FOR OBSERVING A COLLAGE INTERFACE |
PCT/FR2004/003361 WO2005064320A1 (en) | 2003-12-23 | 2004-12-22 | Device and method for observing a bonding interface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0351181A FR2864339B1 (en) | 2003-12-23 | 2003-12-23 | DEVICE AND METHOD FOR OBSERVING A COLLAGE INTERFACE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2864339A1 FR2864339A1 (en) | 2005-06-24 |
FR2864339B1 true FR2864339B1 (en) | 2006-02-17 |
Family
ID=34630629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0351181A Expired - Fee Related FR2864339B1 (en) | 2003-12-23 | 2003-12-23 | DEVICE AND METHOD FOR OBSERVING A COLLAGE INTERFACE |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2864339B1 (en) |
WO (1) | WO2005064320A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2926671B1 (en) * | 2008-01-17 | 2010-04-02 | Soitec Silicon On Insulator | METHOD FOR TREATING DEFECTS WHEN BONDING PLATES |
CH701418A1 (en) * | 2009-07-10 | 2011-01-14 | 3S Swiss Solar Systems Ag | Laminated layered body testing method for solar modules, involves scanning layered body according to dot matrix, converting extracted signals into digital data, storing data of modules as data record, and performing evaluation of data |
SG188414A1 (en) * | 2010-11-12 | 2013-04-30 | Ev Group E Thallner Gmbh | Measurement means and method for measuring layer thicknesses and voids of a wafer stack |
ES2402506B1 (en) * | 2011-09-28 | 2014-03-11 | Construcciones Biovivienda, S.L. | METHOD FOR DETERMINING THE LACK OF CONTINUITY IN THE INTERSTICIAL CHAMBER OF DOUBLE WALL DEPOSITS. |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962879A (en) * | 1988-12-19 | 1990-10-16 | Duke University | Method for bubble-free bonding of silicon wafers |
FR2686697B1 (en) * | 1992-01-27 | 1994-04-29 | Aerospatiale | DEVICE FOR DETECTING DEFECTS IN TWO - LAYERED PARTS, PARTICULARLY IN SOLAR CELLS. |
DE19525770C1 (en) * | 1995-07-14 | 1996-08-29 | Fraunhofer Ges Forschung | Bonding connections testing system for bonded semiconductor wafers |
JP3500063B2 (en) * | 1998-04-23 | 2004-02-23 | 信越半導体株式会社 | Method for recycling peeled wafer and silicon wafer for reuse |
US6121064A (en) * | 1999-01-04 | 2000-09-19 | International Business Machines Corporation | STI fill for SOI which makes SOI inspectable |
-
2003
- 2003-12-23 FR FR0351181A patent/FR2864339B1/en not_active Expired - Fee Related
-
2004
- 2004-12-22 WO PCT/FR2004/003361 patent/WO2005064320A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2005064320A1 (en) | 2005-07-14 |
FR2864339A1 (en) | 2005-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100831 |