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FR2840730B1 - Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees - Google Patents

Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees

Info

Publication number
FR2840730B1
FR2840730B1 FR0207132A FR0207132A FR2840730B1 FR 2840730 B1 FR2840730 B1 FR 2840730B1 FR 0207132 A FR0207132 A FR 0207132A FR 0207132 A FR0207132 A FR 0207132A FR 2840730 B1 FR2840730 B1 FR 2840730B1
Authority
FR
France
Prior art keywords
substrate
manufacturing
semiconductor material
improved properties
monocrystalline semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0207132A
Other languages
English (en)
Other versions
FR2840730A1 (fr
Inventor
Fabrice Letertre
Bruno Ghyselen
Olivier Rayssac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR0207132A priority Critical patent/FR2840730B1/fr
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR0300780A priority patent/FR2840731B3/fr
Priority to US10/458,471 priority patent/US20030232487A1/en
Priority to TW092115616A priority patent/TW200407972A/zh
Priority to PCT/IB2003/003068 priority patent/WO2003105219A1/fr
Publication of FR2840730A1 publication Critical patent/FR2840730A1/fr
Priority to US10/883,437 priority patent/US7265029B2/en
Application granted granted Critical
Publication of FR2840730B1 publication Critical patent/FR2840730B1/fr
Priority to US11/831,484 priority patent/US7888235B2/en
Priority to US11/840,696 priority patent/US7615468B2/en
Priority to US12/536,082 priority patent/US7839001B2/en
Priority to US12/914,194 priority patent/US7939428B2/en
Priority to US12/984,895 priority patent/US8507361B2/en
Priority to US13/246,316 priority patent/US8252664B2/en
Priority to US13/291,468 priority patent/US10002763B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/7605—Making of isolation regions between components between components manufactured in an active substrate comprising AIII BV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00—Special growth methods for semiconductor lasers
    • H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR0207132A 2000-11-27 2002-06-11 Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees Expired - Fee Related FR2840730B1 (fr)

Priority Applications (13)

Application Number Priority Date Filing Date Title
FR0207132A FR2840730B1 (fr) 2002-06-11 2002-06-11 Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees
FR0300780A FR2840731B3 (fr) 2002-06-11 2003-01-24 Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees
US10/458,471 US20030232487A1 (en) 2002-06-11 2003-06-09 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
TW092115616A TW200407972A (en) 2002-06-11 2003-06-10 A method of fabricating a substrate comprising a useful layer of a monocrystalline semiconductor material with improved properties
PCT/IB2003/003068 WO2003105219A1 (fr) 2002-06-11 2003-06-11 Procede de production d'un substrat comprenant une couche utile de materiau semi-conducteur monocristallin
US10/883,437 US7265029B2 (en) 2000-11-27 2004-07-01 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US11/831,484 US7888235B2 (en) 2000-11-27 2007-07-31 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US11/840,696 US7615468B2 (en) 2000-11-27 2007-08-17 Methods for making substrates and substrates formed therefrom
US12/536,082 US7839001B2 (en) 2000-11-27 2009-08-05 Methods for making substrates and substrates formed therefrom
US12/914,194 US7939428B2 (en) 2000-11-27 2010-10-28 Methods for making substrates and substrates formed therefrom
US12/984,895 US8507361B2 (en) 2000-11-27 2011-01-05 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US13/246,316 US8252664B2 (en) 2000-11-27 2011-09-27 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
US13/291,468 US10002763B2 (en) 2000-11-27 2011-11-08 Fabrication of substrates with a useful layer of monocrystalline semiconductor material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0207132A FR2840730B1 (fr) 2002-06-11 2002-06-11 Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees

Publications (2)

Publication Number Publication Date
FR2840730A1 FR2840730A1 (fr) 2003-12-12
FR2840730B1 true FR2840730B1 (fr) 2005-05-27

Family

ID=29559110

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0207132A Expired - Fee Related FR2840730B1 (fr) 2000-11-27 2002-06-11 Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees

Country Status (1)

Country Link
FR (1) FR2840730B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2894990B1 (fr) 2005-12-21 2008-02-22 Soitec Silicon On Insulator Procede de fabrication de substrats, notamment pour l'optique,l'electronique ou l'optoelectronique et substrat obtenu selon ledit procede
US9011598B2 (en) 2004-06-03 2015-04-21 Soitec Method for making a composite substrate and composite substrate according to the method
FR2871172B1 (fr) * 2004-06-03 2006-09-22 Soitec Silicon On Insulator Support d'epitaxie hybride et son procede de fabrication
JP5042506B2 (ja) * 2006-02-16 2012-10-03 信越化学工業株式会社 半導体基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5759908A (en) * 1995-05-16 1998-06-02 University Of Cincinnati Method for forming SiC-SOI structures
FR2787919B1 (fr) * 1998-12-23 2001-03-09 Thomson Csf Procede de realisation d'un substrat destine a faire croitre un compose nitrure
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
FR2817395B1 (fr) * 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
FR2817394B1 (fr) * 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede

Also Published As

Publication number Publication date
FR2840730A1 (fr) 2003-12-12

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100226