FR2757682B1 - METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS - Google Patents

METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Info

Publication number: FR2757682B1
Authority: FR; France
Prior art keywords: conductors; semiconductor component; substrate provided; substrate; semiconductor
Prior art date: 1996-12-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

FR9615747A

Other languages

French (fr)

Other versions

FR2757682A1 (en

Inventor

Serge Salavin

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thales Electron Devices SA

Original Assignee

Thomson Tubes Electroniques

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1996-12-20

Filing date

1996-12-20

Publication date

1999-03-12

1996-12-20 Application filed by Thomson Tubes Electroniques filed Critical Thomson Tubes Electroniques

1996-12-20 Priority to FR9615747A priority Critical patent/FR2757682B1/en

1997-12-16 Priority to PCT/FR1997/002317 priority patent/WO1998028791A1/en

1998-06-26 Publication of FR2757682A1 publication Critical patent/FR2757682A1/en

1999-03-12 Application granted granted Critical

1999-03-12 Publication of FR2757682B1 publication Critical patent/FR2757682B1/en

2016-12-20 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Metallurgy (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Wire Bonding (AREA)

FR9615747A 1996-12-20 1996-12-20 METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS Expired - Fee Related FR2757682B1 (en)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
FR9615747A FR2757682B1 (en)	1996-12-20	1996-12-20	METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS
PCT/FR1997/002317 WO1998028791A1 (en)	1996-12-20	1997-12-16	Method and device for connecting a semiconductor component on a substrate provided with conductors

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR9615747A FR2757682B1 (en)	1996-12-20	1996-12-20	METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Publications (2)

Publication Number	Publication Date
FR2757682A1 FR2757682A1 (en)	1998-06-26
FR2757682B1 true FR2757682B1 (en)	1999-03-12

Family

ID=9498924

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR9615747A Expired - Fee Related FR2757682B1 (en)	1996-12-20	1996-12-20	METHOD AND DEVICE FOR CONNECTING A SEMICONDUCTOR COMPONENT TO A SUBSTRATE PROVIDED WITH CONDUCTORS

Country Status (2)

Country	Link
FR (1)	FR2757682B1 (en)
WO (1)	WO1998028791A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6810304B1 (en) *	1997-09-26	2004-10-26	Gilbarco Inc.	Multistage ordering system for a fueling and retail environment
DE10245398B3 (en)	2002-09-28	2004-06-03	Mühlbauer Ag	Device and method for applying semiconductor chips to carriers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
IT1112620B (en) *	1977-04-15	1986-01-20	Ibm	PERFECTED ELECTRIC CONNECTOR
JPS59210654A (en) *	1983-05-16	1984-11-29	Toshiba Corp	Semiconductor device and manufacture thereof
JPS61198769A (en) *	1985-02-28	1986-09-03	Nec Corp	Hybrid integrated circuit
US4647959A (en) *	1985-05-20	1987-03-03	Tektronix, Inc.	Integrated circuit package, and method of forming an integrated circuit package
US5345365A (en) *	1992-05-05	1994-09-06	Massachusetts Institute Of Technology	Interconnection system for high performance electronic hybrids
US5517752A (en) *	1992-05-13	1996-05-21	Fujitsu Limited	Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5313368A (en) *	1993-02-02	1994-05-17	The Whitaker Corporation	Electrical connections between printed circuit boards and integrated circuits surface mounted thereon
NL9400508A (en) *	1994-03-30	1995-11-01	Hans Peter Peloschek	Method for mounting electronic components by solder bumper and applications and products thereof.

1996
- 1996-12-20 FR FR9615747A patent/FR2757682B1/en not_active Expired - Fee Related
1997
- 1997-12-16 WO PCT/FR1997/002317 patent/WO1998028791A1/en active Application Filing

Also Published As

Publication number	Publication date
WO1998028791A1 (en)	1998-07-02
FR2757682A1 (en)	1998-06-26

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Legal Events

Date	Code	Title	Description
2002-09-27	ST	Notification of lapse