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FR2752077B1 - INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE - Google Patents

INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE

Info

Publication number
FR2752077B1
FR2752077B1 FR9609802A FR9609802A FR2752077B1 FR 2752077 B1 FR2752077 B1 FR 2752077B1 FR 9609802 A FR9609802 A FR 9609802A FR 9609802 A FR9609802 A FR 9609802A FR 2752077 B1 FR2752077 B1 FR 2752077B1
Authority
FR
France
Prior art keywords
integrated circuit
mixed connection
circuit module
circuit card
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9609802A
Other languages
French (fr)
Other versions
FR2752077A1 (en
Inventor
Pascal Billebaud
Christophe Fletout
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9609802A priority Critical patent/FR2752077B1/en
Application filed by Solaic SA filed Critical Solaic SA
Priority to AU39445/97A priority patent/AU3944597A/en
Priority to ES97936722T priority patent/ES2149000T3/en
Priority to DE69702399T priority patent/DE69702399T2/en
Priority to CN97196976A priority patent/CN1116655C/en
Priority to EP97936722A priority patent/EP0917688B1/en
Priority to AT97936722T priority patent/ATE194242T1/en
Priority to PCT/FR1997/001434 priority patent/WO1998006063A1/en
Priority to US09/230,718 priority patent/US6301119B1/en
Publication of FR2752077A1 publication Critical patent/FR2752077A1/en
Application granted granted Critical
Publication of FR2752077B1 publication Critical patent/FR2752077B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9609802A 1996-08-02 1996-08-02 INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE Expired - Fee Related FR2752077B1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR9609802A FR2752077B1 (en) 1996-08-02 1996-08-02 INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE
ES97936722T ES2149000T3 (en) 1996-08-02 1997-07-31 INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION.
DE69702399T DE69702399T2 (en) 1996-08-02 1997-07-31 COMBINED CHIP CARD
CN97196976A CN1116655C (en) 1996-08-02 1997-07-31 Integrated circuit card with two connection modes
AU39445/97A AU3944597A (en) 1996-08-02 1997-07-31 Integrated circuit card with two connection modes
EP97936722A EP0917688B1 (en) 1996-08-02 1997-07-31 Integrated circuit card with two connection modes
AT97936722T ATE194242T1 (en) 1996-08-02 1997-07-31 COMBINED CHIP CARD
PCT/FR1997/001434 WO1998006063A1 (en) 1996-08-02 1997-07-31 Integrated circuit card with two connection modes
US09/230,718 US6301119B1 (en) 1996-08-02 1997-07-31 Integrated circuit card with two connection modes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9609802A FR2752077B1 (en) 1996-08-02 1996-08-02 INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE

Publications (2)

Publication Number Publication Date
FR2752077A1 FR2752077A1 (en) 1998-02-06
FR2752077B1 true FR2752077B1 (en) 1998-09-18

Family

ID=9494782

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9609802A Expired - Fee Related FR2752077B1 (en) 1996-08-02 1996-08-02 INTEGRATED CIRCUIT CARD WITH MIXED CONNECTION AND CORRESPONDING INTEGRATED CIRCUIT MODULE

Country Status (1)

Country Link
FR (1) FR2752077B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2764414B1 (en) * 1997-06-10 1999-08-06 Gemplus Card Int NON-CONTACT CHIP CARD MANUFACTURING PROCESS
FR2775810B1 (en) * 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
FR2795199B1 (en) * 1999-06-15 2001-10-26 Gemplus Card Int DEVICE AND METHOD FOR MANUFACTURING DEVICES COMPRISING AT LEAST ONE CHIP MOUNTED ON A SUPPORT
FR3026529B1 (en) * 2014-09-30 2017-12-29 Linxens Holding METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (en) * 1994-02-14 1996-05-03 Gemplus Card Int Method of manufacturing a contactless card.
DE4416697A1 (en) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Data carrier with integrated circuit
FR2726106B1 (en) * 1994-10-21 1996-11-29 Solaic Sa ELECTRONIC CARD FOR USE WITH A CONTACTLESS CARD READER AND A CONTACT CARD READER
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card

Also Published As

Publication number Publication date
FR2752077A1 (en) 1998-02-06

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Legal Events

Date Code Title Description
ST Notification of lapse