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FR2489592A1 - CERAMIC MICRO-BOX FOR ELECTRONIC CIRCUIT ENCAPSULATION - Google Patents

CERAMIC MICRO-BOX FOR ELECTRONIC CIRCUIT ENCAPSULATION Download PDF

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Publication number
FR2489592A1
FR2489592A1 FR8018927A FR8018927A FR2489592A1 FR 2489592 A1 FR2489592 A1 FR 2489592A1 FR 8018927 A FR8018927 A FR 8018927A FR 8018927 A FR8018927 A FR 8018927A FR 2489592 A1 FR2489592 A1 FR 2489592A1
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France
Prior art keywords
micro
base
capacitor
box
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8018927A
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French (fr)
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FR2489592B1 (en
Inventor
Christian Val
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Thales SA
Original Assignee
Thomson CSF SA
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Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8018927A priority Critical patent/FR2489592A1/en
Priority to DE19813134680 priority patent/DE3134680A1/en
Publication of FR2489592A1 publication Critical patent/FR2489592A1/en
Application granted granted Critical
Publication of FR2489592B1 publication Critical patent/FR2489592B1/fr
Granted legal-status Critical Current

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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention relates to a micro-encapsulation housing for electronic circuits and, in particular, to the cap (base), consisting of a ceramic material, of such a housing. Electronic circuits frequently contain coupling or decoupling capacitors which cannot be integrated on a semiconductor platelet (substrate) and which, as a consequence of this fact, occupy a larger area than an integrated circuit. In order to increase the packing density of the components, according to the invention, the monolithic cap of the micro-encapsulation housing is formed in a ceramic material having a low dielectric constant, such as aluminium oxide, which allows the dielectric to form at least one capacitor therefrom. The structure of this material additionally makes it possible to fit output connections to it without any parasitic capacitances. The micro-encapsulation housing is used in hybrid circuits.

Description

L'invention concerne un micro-boitier céramique d'encapsulation de circuits électroniques, dont l'embase, réalisée dans un matériau à faible constante diélectrique, intègre dans une seule pièce au moins un condensateur de liaison et les métallisations de connexions du circuit électronique. The invention relates to a ceramic micro-casing for encapsulating electronic circuits, the base of which, made of a material with low dielectric constant, integrates in a single piece at least one connecting capacitor and the connection metallizations of the electronic circuit.

L'intérêt de ce boitier d'encapsulation est de réaliser un gain de place important dans la réalisation de circuits hybrides, puisque les condensateurs de liaison ou de découplage, qui figurent ordinafrement sur les schémas de cablage à l'entrée et à la sortie des étages du circuit électronique, et qui sont ordinairement disposés sur le circuit hybride à coté des autres composants constituant le circuit électronique, sont désormais intégrés dans son boitier de protection. Le circuit hybride, comme le nom l'indique utilise en partie des composants intégrés tels que les circuits intégrés, sous forme de pastille, et des composants discrets tels que des condensateurs ou des résistances. The advantage of this encapsulation unit is to save a significant amount of space in the production of hybrid circuits, since the capacitors for connection or decoupling, which are usually shown on the wiring diagrams at the input and output of stages of the electronic circuit, and which are usually arranged on the hybrid circuit next to the other components constituting the electronic circuit, are now integrated in its protective casing. The hybrid circuit, as the name suggests, partly uses integrated components such as integrated circuits, in the form of a chip, and discrete components such as capacitors or resistors.

Les dimensions des condensateurs de liaison ou de découplage d'un circuit intégré sont telles que les condensateurs de liaison ou de découplage ont un volume à peu près égal, pour chacun, au volume du circuit intégré encapsulé, et occupent à la surface du substrat du circuit hybride une surface égale à celle du circuit intégré. C'est donc un grand intérêt dans le sens de la densité d'intégration que de pouvoir supprimer au moins les condensateurs de liaison des circuits électroniques en les intégrant dans le boitier d'encapsulation de ces circuits. The dimensions of the connection or decoupling capacitors of an integrated circuit are such that the connection or decoupling capacitors have a volume roughly equal, for each one, to the volume of the encapsulated integrated circuit, and occupy the surface of the substrate of the hybrid circuit an area equal to that of the integrated circuit. It is therefore of great interest in the sense of the integration density to be able to remove at least the connecting capacitors from the electronic circuits by integrating them into the encapsulation box of these circuits.

Dans la demande de brevet français enregistrée sous le numéro 7911852, la société demanderesse décrit un micro-boitier d'encapsulation dans l'embase duquel un condensateur au moins est incorporé. Cependant, ce condensateur est réalisé dans un matériau à forte constante diélectrique, ce qui rend obligatoire, dans les applications, que le condensateur soit entouré par un cadre, lui même réalisé dans un matériau diélectrique, et qui supporte les connexions externes du circuit électronique. S'il n'y avait pas ce cadre, il y aurait formation de condensateurs parasites entre les connexions, prises deux à deux, et le matériau constituant l'embase. Le ou les condensateurs de l'embase sont donc incrustés dans un cadre de nature différente, et il n'est pas possible de dire que l'embase du micro-boitier est monolithique. In the French patent application registered under number 7911852, the applicant company describes an encapsulation micro-box in the base of which at least one capacitor is incorporated. However, this capacitor is made of a material with a high dielectric constant, which makes it mandatory, in applications, that the capacitor is surrounded by a frame, itself made of a dielectric material, and which supports the external connections of the electronic circuit. If this frame were not present, parasitic capacitors would form between the connections, taken two by two, and the material constituting the base. The capacitor (s) of the base are therefore embedded in a frame of a different nature, and it is not possible to say that the base of the micro-housing is monolithic.

Le micro-boitier selon l'invention comporte une embase dont la nature est telle qu'elle permet d'intégrer dans une seule pièce au moins un condensateur et les métallisations de connexions, sans formation de condensateurs parasites. Ce résultat est obtenu par l'emploi d'un matériau unique à faible constante diélectrique, telle que l'alumine ou un mélange de titanate de calcium et de terres rares. The micro-box according to the invention comprises a base whose nature is such that it makes it possible to integrate in a single piece at least one capacitor and the metallizations of connections, without the formation of parasitic capacitors. This result is obtained by using a single material with a low dielectric constant, such as alumina or a mixture of calcium titanate and rare earths.

De façon plus précise, l'invention consiste en un micro-boitier céramique d'encapsulation de circuit électronique comportant au moins un condensateur de liaison, ce micro-boitier étant formé à partir d'une embase qui supporte le circuit et une pluralité de connexions extérieures, et étant caractérisé en ce que l'embase est constituée par une unique plaque d'un matériau céramique à faible constante diélectrique, dont la partie centrale forme, avec au moins deux métallisations, au moins un condensateur, et dont le périmètre supporte les connexions extérieures du circuit électronique. More specifically, the invention consists of a ceramic micro-box for encapsulating an electronic circuit comprising at least one connecting capacitor, this micro-box being formed from a base which supports the circuit and a plurality of connections. external, and being characterized in that the base is constituted by a single plate of a ceramic material with low dielectric constant, the central part of which forms, with at least two metallizations, at least one capacitor, and whose perimeter supports the external connections of the electronic circuit.

L'invention sera mieux comprise grace à la description qui suit, laquelle s'appuit sur un exemple d'application et sur les figures annexes qui représentent:
figure 1 : une embase de micro-boitier suivant l'art connu
figure 2 : une embase de micro-boitier selon l'invention
figures 3 et 4: des embases de micro-boitier selon l'invention dans deux variantes d'application.The invention will be better understood thanks to the description which follows, which is based on an example of application and on the annexed figures which represent:
Figure 1: a micro-box base according to the known art
Figure 2: a micro-box base according to the invention
Figures 3 and 4: micro-housing bases according to the invention in two application variants.

La figure 1 représente une embase de micro-boitier selon l'art connu tel que révélée par la demande de brevet français enregistrée sous le numéro 79 11 852, au nom de la société demanderesse.  Figure 1 shows a micro-housing base according to the known art as revealed by the French patent application registered under number 79 11 852, in the name of the applicant company.

Cette embase, qui n'est représentée que schématiquement sur la figure 1, et ne comporte que les éléments nécessaires à la compréhension, est essentiellement constituée par une plaque 1 d'un matériau céramique à forte constante diélectrique c 1 Cette plaque est métallisée sur ses deux faces principales par deux métallisations 2 et 3 qui constituent des armatures d'un condensateur.L'embase est complétée par un cadre 4 qui entoure la plaque du condensateur 1, cadre réalisé dans un matériau à faible constante diélectrique s2. il est complété par un second cadre 5 également réalisé par un matériau diélectrique à faible constante 2. L'ensemble des deux cadres 4 et 5 supportent les métallisations 6 qui constituent les connexions entre le circuit électronique encapsulé dans ce boitier et les liaisons extérieures. Le cadre 5 n'est pas indispensable mais le cadre 4 au moins est nécessaire pour éviter que des condensateurs parasites ne se forment entre les connexions 6 prises deux à deux et le matériau à forte constante diélectrique de la plaque 1. This base, which is only shown diagrammatically in FIG. 1, and comprises only the elements necessary for understanding, is essentially constituted by a plate 1 of a ceramic material with a high dielectric constant c 1 This plate is metallized on its two main faces by two metallizations 2 and 3 which constitute reinforcements of a capacitor. The base is completed by a frame 4 which surrounds the plate of the capacitor 1, frame made of a material with low dielectric constant s2. it is completed by a second frame 5 also produced by a dielectric material with a low constant 2. The set of two frames 4 and 5 support the metallizations 6 which constitute the connections between the electronic circuit encapsulated in this case and the external connections. The frame 5 is not essential but the frame 4 at least is necessary to prevent parasitic capacitors from forming between the connections 6 taken two by two and the material with high dielectric constant of the plate 1.

Dans ce type de micro-boitier selon l'art connu, la pastille de circuit électronique est soudée sur l'armature 3 du condensateur; elle est reliée aux connexions extérieures par l'intermédiaire de fils métalliques soudés dune par sur les plots du circuit électronique, d'autre part sur l'extrémité des métallisations de connexions 6. Le micro-boitier est fermé par un couvercle, qui n'est pas représenté sur la figure 1, et qui prend appui sur un cadre 7, en matériau isolant, de façon à éviter que la plaque métallique qui constitue le couvercle ne court-circuite entre elles les connexions 6. In this type of micro-box according to the known art, the electronic circuit chip is soldered to the armature 3 of the capacitor; it is connected to the external connections by means of metallic wires welded dune by on the studs of the electronic circuit, on the other hand on the end of the metallizations of connections 6. The micro-box is closed by a cover, which does not is not shown in FIG. 1, and which is supported on a frame 7, made of insulating material, so as to prevent the metal plate which constitutes the cover from short-circuiting between them the connections 6.

Sur cette figure 1, un seul condensateur constitué par les armatures 2 et 3 est représenté: cependant appartient au domaine de l'art connu le cas où deux condensateurs seraient constitués côte à côte sur la même plaque de diélectrique 1, par exemple un condensateur d'entrée et un condensateur de sortie pour assurer le découplage. In this figure 1, a single capacitor constituted by the reinforcements 2 and 3 is shown: however belongs to the field of known art the case where two capacitors would be formed side by side on the same dielectric plate 1, for example a capacitor d input and an output capacitor to ensure decoupling.

Le raisonnement qui a amené à la création de ce micro-boitier selon l'art connu consiste à utiliser la paroi de céramique du micro-boitier, bien souvent en titanate de barium, de la métalliser sur ces deux faces pour faire un condensateur. Il est alors nécessaire de rajouter au moins un cadre 4 dont le matériau soit différent pour éviter la formation de condensateurs parasites. The reasoning which led to the creation of this micro-case according to the known art consists in using the ceramic wall of the micro-case, very often in barium titanate, to metallize it on these two faces to make a capacitor. It is then necessary to add at least one frame 4 whose material is different to avoid the formation of parasitic capacitors.

Le micro-boitier selon l'invention procède d'un raisonnement inverse et partant d'un condensateur, de préférence un condensateur multi-couches, le modifie et l'adapte pour en faire l'embase d'un micro-boitier d'encapsulation. The micro-box according to the invention proceeds from reverse reasoning and starting from a capacitor, preferably a multi-layer capacitor, modifies and adapts it to make it the base of a micro-encapsulation box. .

La figure 2 représente une vue en coupe d'une embase d'un micro boitier selon l'invention.  2 shows a sectional view of a base of a micro box according to the invention.

L'embase de ce micro-boitier est constituée par un condensateur, représenté sur cette figure 2 sous la forme d'un condensateur multicouches, obtenu par l'empilement alterné d'électrodes 8 et d'électrodes 9 et de feuilles de céramique 10. Les séries d'électrodes 8 et 9, sont réunies entre elles de façon à obtenir deux bornes de connexions pour ce condensateur, l'une des bornes étant constituée par l'électrode supérieure du condensateur multicouches, sur laquelle est brasée ou soudée par tout autre moyen connu de l'homme de l'art, un circuit électronique Il. L'autre borne qui n'est pas représentée sur la figure est prise par l'intermédiaire, par exemple, de l'une des métallisations de connexions externes 13 du circuit hybride. The base of this micro-box is constituted by a capacitor, represented in this FIG. 2 in the form of a multilayer capacitor, obtained by the alternating stack of electrodes 8 and of electrodes 9 and of ceramic sheets 10. The series of electrodes 8 and 9 are joined together so as to obtain two connection terminals for this capacitor, one of the terminals being constituted by the upper electrode of the multilayer capacitor, on which is soldered or soldered by any other means known to those skilled in the art, an electronic circuit II. The other terminal which is not shown in the figure is taken via, for example, one of the metallizations of external connections 13 of the hybrid circuit.

Le circuit électronique 11 est réuni aux métallisations de connexions 13 par l'intermédiaire de fils d'or, d'argent, ou d'aluminium 14. Les métallisations de connexions extérieures sont en fait et celà ressort sur la figure, déposées à la surface du bloc céramique qui constitue l'embase dans le fond de cannelures pratiquées sur les côtés du bloc, cannelures qui ont pour fonction d'éviter que ces métallisations ne soient rayées ou arrachées: c'est pourquoi les métallisations 13 semblent sur la figure passées à l'intérieur du bloc céramique. The electronic circuit 11 is joined to the metallizations of connections 13 by means of wires of gold, silver, or aluminum 14. The metallizations of external connections are in fact and this appears in the figure, deposited on the surface of the ceramic block which constitutes the base in the bottom of grooves made on the sides of the block, grooves which have the function of preventing these metallizations from being scratched or torn off: this is why the metallizations 13 appear in the figure passed to inside the ceramic block.

Dans ce premier exemple de réalisation d'un micro-boitier selon l'invention, l'embase supporte en outre un cadre céramique 15 sur lequel sont déposées les métallisations 13 ; ce cadre a pour fonction de faciliter l'opération de raccordement par fils entre le circuit électronique 11 et les connexions externes 13. In this first embodiment of a micro-housing according to the invention, the base further supports a ceramic frame 15 on which the metallizations 13 are deposited; the purpose of this frame is to facilitate the connection operation by wires between the electronic circuit 11 and the external connections 13.

Il comporte également un second cadre 16 déposé par dessus le premier cadre 15: ce second cadre, métallisé en 17 sur sa surface libre, a pour fonction de recevoir le couvercle de fermeture, qui est fréquemment une plaquette métallique soudée en 17, le matériau du cadre étant l'isolant qui empêche le couvercle et la métallisation 17 de court-circuiter les connexions externes 13. It also includes a second frame 16 deposited over the first frame 15: this second frame, metallized at 17 on its free surface, has the function of receiving the closure cover, which is frequently a metal plate welded at 17, the material of the frame being the insulator which prevents the cover and the metallization 17 from short-circuiting the external connections 13.

L'embase à proprement parler du micro-boitier est ainsi constituée par un condensateur qui peut être un condensateur à deux électrodes ou de préférence, en raison de la faible constante diélectrique du matériau choisi, un condensateur multicouches. Si le condensateur est un condensateur à deux électrodes, son diélectrique s'étend à l'extérieur de la région du condensateur lui-même et constitue le support des connexions extérieures 13 : l'embase est bien monolithique. Si le condensateur est un condensateur multicouches, il est obtenu par empilement de feuilles crues de céramique métallisée sur une face, cet empilement donnant un condensateur multicouches, mais l'embase est néanmoins monolithique car l'empilement des feuilles crues donne un bloc monolithique après cuisson. The base itself of the micro-housing is thus constituted by a capacitor which can be a capacitor with two electrodes or preferably, because of the low dielectric constant of the material chosen, a multilayer capacitor. If the capacitor is a two-electrode capacitor, its dielectric extends outside the region of the capacitor itself and constitutes the support for the external connections 13: the base is indeed monolithic. If the capacitor is a multilayer capacitor, it is obtained by stacking raw sheets of metallized ceramic on one face, this stack giving a multilayer capacitor, but the base is nevertheless monolithic because the stack of raw sheets gives a monolithic block after firing. .

Le matériau céramique préférable dans une application de l'invention est l'alumine qui a une constante diélectrique de l'ordre de 9,4 à 9,7, c'est à dire peu élevée, et d'une façon générale inférieure à 15. The preferable ceramic material in an application of the invention is alumina which has a dielectric constant of the order of 9.4 to 9.7, that is to say low, and generally less than 15 .

L'alumine présente l'avantage d'avoir un coefficient de dilatation linéaire, 6 à 7.10 6 par degré, voisin de celui du silicium, ce qui évite les problèmes de dilatation entre pastille de circuit intégré et boitier, au cours de l'échauffement en fonctionnement. En outre l'alumine a une conduction thermique acceptable, dix fois moins élevée que pour l'oxyde de bérylium mais plus élevée que celle de diélectrique à base de titanate de baryum. Alumina has the advantage of having a coefficient of linear expansion, 6 to 7.10 6 per degree, close to that of silicon, which avoids the problems of expansion between the integrated circuit chip and the case, during heating. Operating. In addition alumina has an acceptable thermal conduction, ten times lower than for berylium oxide but higher than that of dielectric based on barium titanate.

A titre d'illustration de l'invention, on sait actuellement réaliser des feuilles d'alumine crues d'épaisseur comprise entre 15 et 25 microns, sur lesquelles sont déposées des électrodes par métallisation épaisse de deux à trois microns. Pour un micro-boitier normalisé à quarante sorties distantes entre elles de 1,27 mm, on dispose en limitant la zone capacitive à la partie centrale du micro-boitier, de façon à éviter tout couplage capacitif entre les conducteurs et les électrodes, d'une surface utile permettant de constituer le condensateur dans une zone de 45 mm2.Etant donné la surface utile la constante diélectrique de l'alumine et l'épaisseur totale d'une couche diélectrique plus électrodes arrondie à 25 microns, la capacité correspondante à chaque couche est de 180 pF, ce qui permet pour rester dans les normes internationales d'épaisseur de l'embase du micro-boitier, un nombre de couches égal à 20 et une capacité totale de 3600 pF pour le condensateur intégré dans l'embase du micro-boitier. By way of illustration of the invention, it is currently known to produce raw alumina sheets with a thickness of between 15 and 25 microns, on which electrodes are deposited by thick metallization of two to three microns. For a standardized micro-box with forty outputs 1.27 mm apart, by limiting the capacitive zone to the central part of the micro-box, in order to avoid any capacitive coupling between the conductors and the electrodes, a useful surface making it possible to constitute the capacitor in a zone of 45 mm 2. Given the useful surface the dielectric constant of the alumina and the total thickness of a dielectric layer plus electrodes rounded to 25 microns, the capacity corresponding to each layer is 180 pF, which allows to stay in international standards of thickness of the base of the micro-box, a number of layers equal to 20 and a total capacity of 3600 pF for the capacitor integrated in the base of the microphone -housing.

Cette valeur de 3600 pF est en général suffisante pour assurer le découplage des circuits intégrés à grande échelle mais s'il est utile de l'accroître, il est possible:
- soit d'accroitre l'épaisseur de l'embase du micro-boitier, ce qui permet 7200 pF pour un millimètre d'épaisseur,
- soit d'accroitre la constante diélectrique, en remplaçant par exemple l'aluminè par un mélange de titanate de calcium et de terres rares de la constante diélectrique 15, ce qui permet encore de doubler la capacité du condensateur inclus dans l'embase du micro-boitier.This value of 3600 pF is generally sufficient to ensure decoupling of large-scale integrated circuits, but if it is useful to increase it, it is possible:
- either to increase the thickness of the micro-housing base, which allows 7200 pF for a millimeter of thickness,
- or to increase the dielectric constant, by replacing for example the aluminé by a mixture of calcium titanate and rare earths of the dielectric constant 15, which still makes it possible to double the capacity of the condenser included in the base of the microphone -housing.

La pastille de circuit électronique 11 est représentée sur la figure 2 soudée sur une électrode du condensateur par l'intermédiaire d'une brasure 12. Cette brasure peut avantageusement être réalisée au moyen d'un eutectique or-silicium qui fond à 3700C. Cependant la pastille de circuit 11 peut avantageusement être fixée par d'autres procédés qu'une brasure directe, qui en rende sa face postérieure électriquement indépendante de l'électrode 8 du condensateur. Ceci peut avoir plusieurs avantages:
- laisser la face arrière de la pastille électriquement flottante et raccorder le condensateur par cablage filaire entre deux plots d'alimentation et de masse du circuit intégré,
- permettre un traitement spécial de métallisation supérieure de l'embase du micro-boitier de façon à assurer une fixation meilleure ou différente de la pastille sur le fond du boitier.The electronic circuit pad 11 is shown in FIG. 2 welded to an electrode of the capacitor by means of a solder 12. This solder can advantageously be produced by means of a gold-silicon eutectic which melts at 3700C. However, the circuit pad 11 can advantageously be fixed by other methods than a direct solder, which makes its rear face electrically independent of the electrode 8 of the capacitor. This can have several advantages:
- leave the rear face of the pad electrically floating and connect the capacitor by wire wiring between two supply and ground pads of the integrated circuit,
- Allow a special upper metallization treatment of the base of the micro-housing so as to ensure better or different fixing of the patch on the bottom of the housing.

Les métallisations 13 des connexions de sortie, qui sont déposées sur les quatre faces latérales de l'embase de micro-boitier, sont constituées des matériaux habituellement utilisés, tels que le molybdène, le tungstène, le nickel ou l'or. The metallizations 13 of the output connections, which are deposited on the four lateral faces of the micro-housing base, are made of the materials usually used, such as molybdenum, tungsten, nickel or gold.

La disposition des bornes de sorties du condensateur, par rapport aux connexions de sortie du micro-boitier, est à définir en tenant compte de l'implantation du circuit électronique à l'intérieur du micro-boitier et des règles et possibilités de cablage habituelles. The arrangement of the output terminals of the capacitor, with respect to the output connections of the micro-box, must be defined taking into account the location of the electronic circuit inside the micro-box and the usual rules and possibilities of wiring.

Il a été dit qu'appartient au domaine de l'invention le cas où le condensateur intégré dans l'embase monolithique du micro-boitier est un condensateur à deux électrodes, mais appartient également au domaine de l'invention le cas où plus d'un seul condensateur serait intégré, c'est à dire au moins deux condensateurs côte à côte, que ces deux condensateurs soient à deux électrodes ou multicouches. It has been said that the field of the invention belongs to the case where the capacitor integrated in the monolithic base of the micro-housing is a capacitor with two electrodes, but also belongs to the field of the invention the case where more than a single capacitor would be integrated, that is to say at least two capacitors side by side, whether these two capacitors are with two electrodes or multilayers.

La figure 3 représente une embase de micro-boitier selon l'invention dans une première variante d'application. FIG. 3 represents a micro-box base according to the invention in a first application variant.

Il a été dit, au sujet de la figure 2, que le cadre 15 qui entoure le circuit électronique a pour fonction essentielle de faciliter le cablage par des fils 14 entre les plots du circuit 11 et les métallisations de connexions 13, ceci en réalisant un cablage sensiblement sur le même plan. It has been said, with regard to FIG. 2, that the frame 15 which surrounds the electronic circuit has the essential function of facilitating the wiring by wires 14 between the pads of the circuit 11 and the connection metallizations 13, this by making a wiring substantially on the same plane.

La figure 3 montre qu'il est possible, et que c'est une simplification favorable à la réalisation industrielle, de supprimer ce premier cadre 15, ce qui oblige alors à souder les fils de connexion 14 entre le plan supérieur de la surface du circuit 11 et le plan supérieur de l'embase, sur laquelle sont directement déposées les métallisations 13. Cependant, la différence entre les deux niveaux sur lesquels sont effectuées les soudures des fils de connexion 14 est peu importante puisque le circuit électronique li est en général un circuit intégré sur une plaquette de silicium de faible épaisseur. Figure 3 shows that it is possible, and this is a favorable simplification for industrial production, to remove this first frame 15, which then requires soldering the connection wires 14 between the upper plane of the surface of the circuit 11 and the upper plane of the base, on which the metallizations are directly deposited 13. However, the difference between the two levels on which the soldering of the connection wires 14 is carried out is not significant since the electronic circuit li is generally a integrated circuit on a thin silicon wafer.

Ainsi le boitier selon l'invention tel que représenté sur la figure 3 est constitué par un nombre minimum de pièces, c'est à dire le ou les condensateurs de découplage qui constituent l'embase du boitier, un unique cadre céramique 16, métallisé en 17 sur sa face supérieure pour recevoir une plaquette métallique 18 qui sert de couvercle. Thus the housing according to the invention as shown in FIG. 3 is constituted by a minimum number of parts, that is to say the decoupling capacitor or capacitors which constitute the base of the housing, a single ceramic frame 16, metallized in 17 on its upper face to receive a metal plate 18 which serves as a cover.

Dans cette forme d'application, un cadre 16 céramique est encore nécessaire de façon à éviter que la plaquette métallique 18 qui sert de couvercle ne court-circuite entre elles les connexions de sortie 13. Le cadre 16 apporte donc à la fois l'isolant entre les sorties et l'épaisseur nécessaire pour former un boitier. In this form of application, a ceramic frame 16 is still necessary so as to prevent the metal plate 18 which serves as a cover short-circuiting between them the outlet connections 13. The frame 16 therefore provides both the insulation between the outlets and the thickness required to form a housing.

La figure 4 représente une seconde variante d'application de l'embase du micro-boitier selon l'invention.  FIG. 4 shows a second variant of application of the base of the micro-box according to the invention.

Comme la figure précédente, elle est schématisée et ne représente que ce qui est strictement nécessaire à la compréhension de l'invention. Like the previous figure, it is shown schematically and represents only what is strictly necessary for understanding the invention.

La troisième forme de réalisation d'un boîtier, tel que représentée en figure 4, ne comporte plus trois niveaux, c'est à dire une embase et deux cadres 15 et 16, comme représenté en figure 2, ni deux niveaux, une embase et un cadre 16, comme représenté en figure 3: elle ne comporte exclusive ment qu'un seul niveau, c'est à dire le condensateur qui constitue l'embase et il n'y a plus aucun cadre pour former un boitier. The third embodiment of a housing, as shown in FIG. 4, no longer comprises three levels, that is to say a base and two frames 15 and 16, as shown in FIG. 2, nor two levels, a base and a frame 16, as shown in FIG. 3: it has only one level, that is to say the capacitor which constitutes the base and there is no longer any frame for forming a box.

A partir des deux seuls éléments, circuit électronique 11 et condensateur de liaison ou de découplage qui constitue l'embase, un boitier complet de circuit hybride est formé par l'une des deux solutions représentées en pointillés sur cette figure 4. From the only two elements, electronic circuit 11 and connection or decoupling capacitor which constitutes the base, a complete hybrid circuit box is formed by one of the two solutions shown in dotted lines in this FIG. 4.

Dans un premier cas, l'épaisseur nécessaire pour former un boitier à partir d'une embase est apportée par le couvercle du boîtier représenté en 19, ce couvercle n'étant pas comme dans les cas précédents une plaque métallique mais étant une pièce céramique ou plastique qui possède un fond et des bords. Ce couvercle céramique ou plastique peut être selon le cas brasé ou collé sur l'embase du micro-boitier. In a first case, the thickness necessary to form a case from a base is provided by the cover of the case shown in 19, this cover not being as in the previous cases a metal plate but being a ceramic piece or plastic which has a bottom and edges. This ceramic or plastic cover can be brazed or glued to the base of the micro-box, as the case may be.

Dans un second cas, et si les normes d'utilisation du circuit hybride le permettent, si ce circuit hybride est destiné par exemple à un usage grand public, la partie sensible du circuit hybride# Cest à dire essentiellement le circuit électronique 1 1 et les fils de liaison 14, peuvent être simplement protégés par coulée d'une résine ou d'un polymère durcissable qui constitue un deme de protection solide par dessus le circuit et par dessus l'embase sur lequel le dôme est directement fixé.  In a second case, and if the standards for the use of the hybrid circuit allow it, if this hybrid circuit is intended for example for general public use, the sensitive part of the hybrid circuit # That is to say essentially the electronic circuit 1 1 and the connecting wires 14, can be simply protected by pouring a resin or a curable polymer which constitutes a solid protection deme over the circuit and over the base on which the dome is directly fixed.

Claims (7)

REVENDICATIONS 1. Micro-boitier céramique d'encapsulation de circuit électronique com portant au moins un condensateur de liaison, ce microboitier étant formé à partir d'une embase qui supporte le circuit (11) et une pluralité de connexions extérieures (13), et étant caractérisé en ce que l'embase est constituée par une unique plaque d'un matériau céramique (10) à faible constante diélectrique ( < 15), dont la partie centrale forme, avec au moins deux métallisations (8 et 9), au moins un condensateur, et dont le périmètre supporte les connexions extérieures (13) du circuit électronique (11). 1. Ceramic micro-box for encapsulating electronic circuit com carrying at least one connecting capacitor, this micro-box being formed from a base which supports the circuit (11) and a plurality of external connections (13), and being characterized in that the base is constituted by a single plate of a ceramic material (10) with low dielectric constant (<15), the central part of which forms, with at least two metallizations (8 and 9), at least one capacitor, and the perimeter of which supports the external connections (13) of the electronic circuit (11). 2. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que l'embase comporte au moins un condensateur multicouches (8 et 9). 2. Micro-encapsulation box according to claim 1, characterized in that the base comprises at least one multilayer capacitor (8 and 9). 3. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que les connexions extérieures (13) sont réalisées par des métallisations déposées sur les parties extérieures de la plaque constituant l'embase. 3. Encapsulation micro-box according to claim 1, characterized in that the external connections (13) are made by metallizations deposited on the external parts of the plate constituting the base. 4. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que l'embase supporte un premier cadre (15), réalisé en matériau céramique à faible constante diélectrique ( < 15), qui porte la partie des connexions (13) sur lesquelles sont soudées les connexions intérieures (14) avec le circuit électronique (11). 4. Micro-encapsulation box according to claim 1, characterized in that the base supports a first frame (15), made of ceramic material with low dielectric constant (<15), which carries the part of the connections (13) on which are welded the internal connections (14) with the electronic circuit (11). 5. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que l'embase supporte un second cadre (16), réalisé en matériau céramique à faible constante diélectrique ( < 15), métallisé (en 17) sur la face supérieure, sur laquelle est fixé le couvercle (18) du micro-boitier. 5. Encapsulation micro-box according to claim 1, characterized in that the base supports a second frame (16), made of ceramic material with low dielectric constant (<15), metallized (at 17) on the upper face , on which is fixed the cover (18) of the micro-box. 6. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que le matériau de l'embase est l'alumine A12 03. 6. Micro-encapsulation box according to claim 1, characterized in that the base material is alumina A12 03. 7. Micro-boitier d'encapsulation selon la revendication 1, caractérisé en ce que le matériau de l'embase est un titanate de calcium et de terres rares.  7. Micro-encapsulation box according to claim 1, characterized in that the material of the base is a titanate of calcium and rare earths.
FR8018927A 1980-09-02 1980-09-02 CERAMIC MICRO-BOX FOR ELECTRONIC CIRCUIT ENCAPSULATION Granted FR2489592A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8018927A FR2489592A1 (en) 1980-09-02 1980-09-02 CERAMIC MICRO-BOX FOR ELECTRONIC CIRCUIT ENCAPSULATION
DE19813134680 DE3134680A1 (en) 1980-09-02 1981-09-02 Ceramic micro-encapsulation housing for electronic circuits

Applications Claiming Priority (1)

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FR8018927A FR2489592A1 (en) 1980-09-02 1980-09-02 CERAMIC MICRO-BOX FOR ELECTRONIC CIRCUIT ENCAPSULATION

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FR2489592A1 true FR2489592A1 (en) 1982-03-05
FR2489592B1 FR2489592B1 (en) 1984-02-17

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518811A1 (en) * 1981-12-22 1983-06-24 Avx Corp INTEGRATED CIRCUIT DEVICE IN CERAMIC CONTAINER
EP0087590A2 (en) * 1982-02-27 1983-09-07 VARTA Batterie Aktiengesellschaft Electrochemical cell having solid electrodes and an intermediate ion-conductive ceramic solid electrolyte
EP0239494A1 (en) * 1986-03-28 1987-09-30 Bull S.A. Integrated circuit housing
FR2681187A1 (en) * 1991-09-06 1993-03-12 Eurofarad Capacitive substrate for an integrated circuit
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

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JPS57210688A (en) * 1981-06-19 1982-12-24 Hitachi Ltd Multilayer circuit board
DE4429289A1 (en) * 1994-08-18 1996-02-22 Telefunken Microelectron Integrated circuit for e.g. suppressing high frequency interference signal
EP1968188B1 (en) 2007-03-09 2012-08-08 HÜTTINGER Elektronik GmbH + Co. KG Class D amplifier assembly

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FR2263606A1 (en) * 1974-03-06 1975-10-03 Rca Corp

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GB1163434A (en) * 1966-08-11 1969-09-04 Telegraph Condenser Co Ltd Improvements in or relating to Ceramic Electrical Components
GB1195149A (en) * 1967-12-07 1970-06-17 Vitramon Inc Microminiature Electronic Substrate for Microcircuits.

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Cited By (8)

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Publication number Priority date Publication date Assignee Title
FR2518811A1 (en) * 1981-12-22 1983-06-24 Avx Corp INTEGRATED CIRCUIT DEVICE IN CERAMIC CONTAINER
EP0087590A2 (en) * 1982-02-27 1983-09-07 VARTA Batterie Aktiengesellschaft Electrochemical cell having solid electrodes and an intermediate ion-conductive ceramic solid electrolyte
EP0087590A3 (en) * 1982-02-27 1985-12-04 Varta Batterie Aktiengesellschaft Ceramic substrate as a support for electronic circuit elements and electronic integrated circuits
EP0239494A1 (en) * 1986-03-28 1987-09-30 Bull S.A. Integrated circuit housing
FR2596607A1 (en) * 1986-03-28 1987-10-02 Bull Sa METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A CIRCUIT BOARD, INTEGRATED CIRCUIT BOX AND INTEGRATED CIRCUIT BOARD FOR IMPLEMENTING THE METHOD
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
FR2681187A1 (en) * 1991-09-06 1993-03-12 Eurofarad Capacitive substrate for an integrated circuit
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
DE3134680A1 (en) 1982-04-08
FR2489592B1 (en) 1984-02-17

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