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FR2067218A1 - - Google Patents

Info

Publication number
FR2067218A1
FR2067218A1 FR6940739A FR6940739A FR2067218A1 FR 2067218 A1 FR2067218 A1 FR 2067218A1 FR 6940739 A FR6940739 A FR 6940739A FR 6940739 A FR6940739 A FR 6940739A FR 2067218 A1 FR2067218 A1 FR 2067218A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6940739A
Other languages
French (fr)
Other versions
FR2067218B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR6940739A priority Critical patent/FR2067218B1/fr
Publication of FR2067218A1 publication Critical patent/FR2067218A1/fr
Application granted granted Critical
Publication of FR2067218B1 publication Critical patent/FR2067218B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
FR6940739A 1969-11-26 1969-11-26 Expired FR2067218B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR6940739A FR2067218B1 (en) 1969-11-26 1969-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR6940739A FR2067218B1 (en) 1969-11-26 1969-11-26

Publications (2)

Publication Number Publication Date
FR2067218A1 true FR2067218A1 (en) 1971-08-20
FR2067218B1 FR2067218B1 (en) 1974-09-06

Family

ID=9043654

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6940739A Expired FR2067218B1 (en) 1969-11-26 1969-11-26

Country Status (1)

Country Link
FR (1) FR2067218B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2588121A1 (en) * 1985-10-02 1987-04-03 Bull Sa METHOD AND DEVICE FOR WELDING ELEMENTS ON THE CORRESPONDING PLOTS OF A WAFER SUCH AS IN PARTICULAR A WAFER OF HIGH DENSITY INTEGRATED CIRCUITS

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733813A (en) * 1985-10-01 1988-03-29 Bull S.A. Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits
FR2588121A1 (en) * 1985-10-02 1987-04-03 Bull Sa METHOD AND DEVICE FOR WELDING ELEMENTS ON THE CORRESPONDING PLOTS OF A WAFER SUCH AS IN PARTICULAR A WAFER OF HIGH DENSITY INTEGRATED CIRCUITS
EP0219408A1 (en) * 1985-10-02 1987-04-22 Bull S.A. Process and device for welding elements on the corresponding spots of a substrate, such as a high-density integrated-circuit substrate

Also Published As

Publication number Publication date
FR2067218B1 (en) 1974-09-06

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Legal Events

Date Code Title Description
ST Notification of lapse