Nothing Special   »   [go: up one dir, main page]

FI20135712A - CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELEROMETER - Google Patents

CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELEROMETER Download PDF

Info

Publication number
FI20135712A
FI20135712A FI20135712A FI20135712A FI20135712A FI 20135712 A FI20135712 A FI 20135712A FI 20135712 A FI20135712 A FI 20135712A FI 20135712 A FI20135712 A FI 20135712A FI 20135712 A FI20135712 A FI 20135712A
Authority
FI
Finland
Prior art keywords
micromechanical
sensor structure
accelerometer
capacitive
micromechanical sensor
Prior art date
Application number
FI20135712A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI126199B (en
Inventor
Matti Liukku
Ville-Pekka Rytkönen
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Priority to FI20135712A priority Critical patent/FI126199B/en
Priority to TW103121684A priority patent/TWI570053B/en
Priority to US14/314,243 priority patent/US9547020B2/en
Priority to PCT/IB2014/062650 priority patent/WO2014207710A1/en
Priority to EP14753156.0A priority patent/EP3014285B1/en
Publication of FI20135712A publication Critical patent/FI20135712A/en
Application granted granted Critical
Publication of FI126199B publication Critical patent/FI126199B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/13—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
    • G01P15/131—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position with electrostatic counterbalancing means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
    • G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
FI20135712A 2013-06-28 2013-06-28 CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR FI126199B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20135712A FI126199B (en) 2013-06-28 2013-06-28 CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR
TW103121684A TWI570053B (en) 2013-06-28 2014-06-24 Capacitive micromechanical sensor structure and micromechanical accelerometer
US14/314,243 US9547020B2 (en) 2013-06-28 2014-06-25 Capacitive micromechanical sensor structure and micromechanical accelerometer
PCT/IB2014/062650 WO2014207710A1 (en) 2013-06-28 2014-06-27 Capacitive micromechanical sensor structure and micromechanical accelerometer
EP14753156.0A EP3014285B1 (en) 2013-06-28 2014-06-27 Capacitive micromechanical sensor structure and micromechanical accelerometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20135712A FI126199B (en) 2013-06-28 2013-06-28 CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR

Publications (2)

Publication Number Publication Date
FI20135712A true FI20135712A (en) 2015-01-07
FI126199B FI126199B (en) 2016-08-15

Family

ID=51383907

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20135712A FI126199B (en) 2013-06-28 2013-06-28 CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR

Country Status (5)

Country Link
US (1) US9547020B2 (en)
EP (1) EP3014285B1 (en)
FI (1) FI126199B (en)
TW (1) TWI570053B (en)
WO (1) WO2014207710A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI126199B (en) * 2013-06-28 2016-08-15 Murata Manufacturing Co CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR
FI127229B (en) * 2015-03-09 2018-02-15 Murata Manufacturing Co Microelectromechanical structure and device
JP6657626B2 (en) * 2015-07-10 2020-03-04 セイコーエプソン株式会社 Physical quantity sensors, electronic devices and moving objects
US10190938B2 (en) 2015-09-22 2019-01-29 Murata Manufacturing Co., Ltd. Semi-flexible proof-mass
JP6583547B2 (en) 2015-09-25 2019-10-02 株式会社村田製作所 Improved microelectromechanical accelerometer
US10352960B1 (en) * 2015-10-30 2019-07-16 Garmin International, Inc. Free mass MEMS accelerometer
JP2018032848A (en) * 2016-08-25 2018-03-01 株式会社村田製作所 Semiconductor device
CN107064555B (en) * 2017-03-10 2020-09-04 中国科学院地质与地球物理研究所 MEMS accelerometer and manufacturing process thereof
JP6558466B2 (en) * 2017-05-08 2019-08-14 株式会社村田製作所 Capacitive microelectromechanical accelerometer
CN108519498B (en) * 2018-03-08 2020-09-18 北京航天控制仪器研究所 Self-adaptive closed-loop measurement system of resonant accelerometer
CN109490576A (en) * 2018-12-19 2019-03-19 成都力创云科技有限公司 Based on a kind of fully differential capacitor MEMS acceleration by SOI
JP7188311B2 (en) 2019-07-31 2022-12-13 セイコーエプソン株式会社 Gyro sensors, electronic devices, and mobile objects
CN111732070B (en) * 2020-06-05 2023-01-17 东南大学 PT symmetrical lateral movement micro-electro-mechanical system

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19938206A1 (en) * 1999-08-12 2001-02-15 Bosch Gmbh Robert Micro-mechanical rotational acceleration sensor has an oscillating mass fixed at its center with an array of differential measurement capacitors for determination of acceleration directly rather than using time differentiation
US20040231420A1 (en) * 2003-02-24 2004-11-25 Huikai Xie Integrated monolithic tri-axial micromachined accelerometer
FR2858853B1 (en) * 2003-08-13 2006-01-13 Sercel Rech Const Elect ACCELEROMETER WITH REDUCED PARASITE VIBRATION BY IMPROVED ELECTRODE FORM
FR2858854B1 (en) * 2003-08-13 2005-12-16 Sercel Rech Const Elect ACCELEROMETER WITH VIBRATION PARASITES REDUCED BY IMPROVED REMINDER
US6910379B2 (en) * 2003-10-29 2005-06-28 Honeywell International, Inc. Out-of-plane compensation suspension for an accelerometer
US7013730B2 (en) * 2003-12-15 2006-03-21 Honeywell International, Inc. Internally shock caged serpentine flexure for micro-machined accelerometer
KR100513346B1 (en) * 2003-12-20 2005-09-07 삼성전기주식회사 A capacitance accelerometer having a compensation elctrode
US7279761B2 (en) * 2004-09-15 2007-10-09 The Regents Of The University Of California Post-release capacitance enhancement in micromachined devices and a method of performing the same
FR2880127B1 (en) * 2004-12-29 2007-03-02 Commissariat Energie Atomique MICRO-FACTORY ACCELEROMETER WITH CAPACITIVE FEEDERS
FR2881568B1 (en) * 2005-02-03 2011-01-14 Commissariat Energie Atomique CAPACITOR WITH VARIABLE CAPACITY AND SPECIFIC SHAPE, GYROMETER COMPRISING SUCH CAPACITOR AND ACCELEROMETER COMPRISING SUCH CAPACITOR
US7258010B2 (en) * 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
US7337671B2 (en) * 2005-06-03 2008-03-04 Georgia Tech Research Corp. Capacitive microaccelerometers and fabrication methods
US7258011B2 (en) * 2005-11-21 2007-08-21 Invensense Inc. Multiple axis accelerometer
TWI284203B (en) * 2005-12-23 2007-07-21 Delta Electronics Inc Accelerometer
US7617729B2 (en) * 2006-02-21 2009-11-17 Physical Logic Ag Accelerometer
DE102006020521A1 (en) 2006-05-03 2007-11-08 Robert Bosch Gmbh Air pressure measurement arrangement for use in motor vehicle`s tire, has electronic controlling/measuring device determining movement absorption along predetermined distance, where absorption indicates measure for ambient pressure
KR100899812B1 (en) * 2006-12-05 2009-05-27 한국전자통신연구원 Capacitive accelerometer
DE102006059928A1 (en) * 2006-12-19 2008-08-21 Robert Bosch Gmbh Accelerometer with comb electrodes
FI122397B (en) 2008-04-16 2011-12-30 Vti Technologies Oy A vibrating micromechanical angular velocity sensor
US8205498B2 (en) * 2008-11-18 2012-06-26 Industrial Technology Research Institute Multi-axis capacitive accelerometer
US8418555B2 (en) * 2009-06-26 2013-04-16 Honeywell International Inc. Bidirectional, out-of-plane, comb drive accelerometer
FR2954505B1 (en) * 2009-12-22 2012-08-03 Commissariat Energie Atomique MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME
US8549922B2 (en) * 2010-03-10 2013-10-08 Taiwan Semiconductor Manufacturing Co., Ltd. Motion detection using capacitor having different work function materials
US8584522B2 (en) * 2010-04-30 2013-11-19 Qualcomm Mems Technologies, Inc. Micromachined piezoelectric x-axis gyroscope
ITTO20130174A1 (en) * 2013-03-05 2014-09-06 St Microelectronics Srl MEMS AND RELATIVE MICROMECHANICAL STRUCTURE WITH INTEGRATED COMPENSATION OF THERMO-MECHANICAL DEFORMATIONS
FI126199B (en) * 2013-06-28 2016-08-15 Murata Manufacturing Co CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR
FI20135714L (en) * 2013-06-28 2014-12-29 Murata Manufacturing Co Capacitive micromechanical accelerometer

Also Published As

Publication number Publication date
FI126199B (en) 2016-08-15
WO2014207710A1 (en) 2014-12-31
EP3014285B1 (en) 2019-01-30
US20150316581A1 (en) 2015-11-05
EP3014285A1 (en) 2016-05-04
US9547020B2 (en) 2017-01-17
TW201524888A (en) 2015-07-01
TWI570053B (en) 2017-02-11

Similar Documents

Publication Publication Date Title
FI20135712A (en) CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELEROMETER
EP2989433A4 (en) Capacitive mems sensor devices
DK3001862T3 (en) MEMS pressure sensors with integrated screens
GB2535086B (en) Distributed acoustic sensing for passive ranging
FI20135714L (en) Capacitive micromechanical accelerometer
BR112015032363A2 (en) therapeutic device including acoustic sensor
LU92149B1 (en) Capacitive sensor
LU92179B1 (en) Capacitive sensing device
FI20135915A (en) Improved gyroscope construction and gyroscope
DE102013212915A8 (en) inertial sensor
GB201307773D0 (en) MEMS sensors
GB201517357D0 (en) Sensors for passive electroseismic and seismoelectric surveying
DE102014106645A8 (en) Virtual automobile humidity sensor
LU92178B1 (en) Capacitive sensing device
FI20145894A (en) Capacitive microelectromechanical sensor with self-testing capability
FI20136139A (en) rain sensor
SG10201400597SA (en) Fully differential capacitive architecture for mems accelerometer
FI20155015A (en) Continuous self-testing in a capacitive sensor
EP2972263A4 (en) Trench based capacitive humidity sensor
DK2984463T3 (en) SOUND SENSOR
DK3000133T3 (en) PIEZOELECTRIC SENSOR
FI20135618A (en) Improved pressure sensor
SG10201404634WA (en) Piezoelectric accelerometer
FI20155508A (en) MEMS sensor
BR112014009888A2 (en) micromechanical structure and differential pressure sensor

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: MURATA MANUFACTURING CO., LTD.

FG Patent granted

Ref document number: 126199

Country of ref document: FI

Kind code of ref document: B