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FI20085468A0 - Arrangeman för elektrisk krets - Google Patents

Arrangeman för elektrisk krets

Info

Publication number
FI20085468A0
FI20085468A0 FI20085468A FI20085468A FI20085468A0 FI 20085468 A0 FI20085468 A0 FI 20085468A0 FI 20085468 A FI20085468 A FI 20085468A FI 20085468 A FI20085468 A FI 20085468A FI 20085468 A0 FI20085468 A0 FI 20085468A0
Authority
FI
Finland
Prior art keywords
electrical circuit
circuit arrangement
arrangement
electrical
circuit
Prior art date
Application number
FI20085468A
Other languages
English (en)
Finnish (fi)
Inventor
Pekka Rytky
Original Assignee
Polar Electro Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polar Electro Oy filed Critical Polar Electro Oy
Priority to FI20085468A priority Critical patent/FI20085468A0/sv
Publication of FI20085468A0 publication Critical patent/FI20085468A0/sv
Priority to US12/431,038 priority patent/US8125793B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
FI20085468A 2008-05-16 2008-05-16 Arrangeman för elektrisk krets FI20085468A0 (sv)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20085468A FI20085468A0 (sv) 2008-05-16 2008-05-16 Arrangeman för elektrisk krets
US12/431,038 US8125793B2 (en) 2008-05-16 2009-04-28 Electric circuitry arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20085468A FI20085468A0 (sv) 2008-05-16 2008-05-16 Arrangeman för elektrisk krets

Publications (1)

Publication Number Publication Date
FI20085468A0 true FI20085468A0 (sv) 2008-05-16

Family

ID=39523121

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085468A FI20085468A0 (sv) 2008-05-16 2008-05-16 Arrangeman för elektrisk krets

Country Status (2)

Country Link
US (1) US8125793B2 (sv)
FI (1) FI20085468A0 (sv)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5501846B2 (ja) * 2010-05-07 2014-05-28 オリンパス株式会社 電子デバイス、ケーブル接続構造および電子デバイスの製造方法
DE102010056055A1 (de) * 2010-12-23 2012-06-28 Schreiner Group Gmbh & Co. Kg Etikett mit einem elektronischen Funktionselement
US9084368B2 (en) * 2011-06-15 2015-07-14 Novatek Microelectronics Corp. Single FPC board for connecting multiple modules and touch sensitive display module using the same
US9160063B2 (en) 2012-01-19 2015-10-13 Nike, Inc. Wearable device assembly having solder mask
JP6227977B2 (ja) * 2013-10-31 2017-11-08 サンデンホールディングス株式会社 通信装置
GB2526131A (en) * 2014-05-15 2015-11-18 Nokia Technologies Oy An apparatus method and computer program for a wearable device
JP6780422B2 (ja) * 2016-09-30 2020-11-04 オムロン株式会社 電子機器
EP3439438B1 (en) * 2017-08-02 2024-10-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2900580A (en) * 1954-06-04 1959-08-18 Beck S Inc Printed electrical circuit components having integral lead-outs and methods of making same
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
US4567543A (en) * 1983-02-15 1986-01-28 Motorola, Inc. Double-sided flexible electronic circuit module
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
US5097390A (en) * 1986-12-10 1992-03-17 Interflex Corporation Printed circuit and fabrication of same
JP2631287B2 (ja) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 混成多層回路基板の製造法
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
DE4003344C1 (sv) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003345C1 (sv) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5418688A (en) * 1993-03-29 1995-05-23 Motorola, Inc. Cardlike electronic device
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
FR2740582B1 (fr) * 1995-10-26 1997-11-28 Gemplus Sca Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication
US5812387A (en) * 1997-02-21 1998-09-22 International Power Devices, Inc. Multi-deck power converter module
JP4899269B2 (ja) 2001-08-09 2012-03-21 株式会社村田製作所 電子部品ユニットおよびその製造方法
KR100559937B1 (ko) * 2003-01-08 2006-03-13 엘에스전선 주식회사 미세회로의 접속방법 및 그에 의한 접속 구조체
JP2004265929A (ja) 2003-02-13 2004-09-24 Matsushita Electric Ind Co Ltd 高周波多層プリント基板
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
US7321496B2 (en) * 2004-03-19 2008-01-22 Matsushita Electric Industrial Co., Ltd. Flexible substrate, multilayer flexible substrate and process for producing the same
WO2005101934A1 (ja) 2004-04-06 2005-10-27 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
JP2006186136A (ja) * 2004-12-28 2006-07-13 Toshiba Corp 両面部品実装回路基板及びその製造方法
TWM272351U (en) * 2005-01-21 2005-08-01 Innolux Display Corp Display module
JP5108253B2 (ja) 2006-05-09 2012-12-26 大日本印刷株式会社 部品実装モジュール
JP5168838B2 (ja) * 2006-07-28 2013-03-27 大日本印刷株式会社 多層プリント配線板及びその製造方法
JP2009088390A (ja) * 2007-10-02 2009-04-23 Denso Corp プリント基板、プリント基板の製造方法、及び電子装置
JP2010199216A (ja) * 2009-02-24 2010-09-09 Fujitsu Ltd 部品実装構造及び部品実装方法
US8593061B2 (en) * 2009-08-25 2013-11-26 Seiko Epson Corporation Electro-optical device and electronic apparatus

Also Published As

Publication number Publication date
US20090284937A1 (en) 2009-11-19
US8125793B2 (en) 2012-02-28

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Legal Events

Date Code Title Description
FD Application lapsed