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FI117590B - Jäähdytyselementti - Google Patents

Jäähdytyselementti Download PDF

Info

Publication number
FI117590B
FI117590B FI20045216A FI20045216A FI117590B FI 117590 B FI117590 B FI 117590B FI 20045216 A FI20045216 A FI 20045216A FI 20045216 A FI20045216 A FI 20045216A FI 117590 B FI117590 B FI 117590B
Authority
FI
Finland
Prior art keywords
flow channel
cooling element
channel
inlet
cooling
Prior art date
Application number
FI20045216A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20045216A (fi
FI20045216A0 (fi
Inventor
Risto Laurila
Jukka Sikanen
Erkki Ukkola
Original Assignee
Abb Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Oy filed Critical Abb Oy
Priority to FI20045216A priority Critical patent/FI117590B/fi
Publication of FI20045216A0 publication Critical patent/FI20045216A0/fi
Priority to EP05103688A priority patent/EP1605741B1/de
Priority to AT05103688T priority patent/ATE377349T1/de
Priority to US11/120,192 priority patent/US7059390B2/en
Priority to DE602005003058T priority patent/DE602005003058T2/de
Publication of FI20045216A publication Critical patent/FI20045216A/fi
Application granted granted Critical
Publication of FI117590B publication Critical patent/FI117590B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Resistance Heating (AREA)
FI20045216A 2004-06-11 2004-06-11 Jäähdytyselementti FI117590B (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20045216A FI117590B (fi) 2004-06-11 2004-06-11 Jäähdytyselementti
EP05103688A EP1605741B1 (de) 2004-06-11 2005-05-03 Kühlkörper
AT05103688T ATE377349T1 (de) 2004-06-11 2005-05-03 Kühlkörper
US11/120,192 US7059390B2 (en) 2004-06-11 2005-05-03 Cooling element
DE602005003058T DE602005003058T2 (de) 2004-06-11 2005-05-03 Kühlkörper

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20045216 2004-06-11
FI20045216A FI117590B (fi) 2004-06-11 2004-06-11 Jäähdytyselementti

Publications (3)

Publication Number Publication Date
FI20045216A0 FI20045216A0 (fi) 2004-06-11
FI20045216A FI20045216A (fi) 2005-12-12
FI117590B true FI117590B (fi) 2006-11-30

Family

ID=32524590

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045216A FI117590B (fi) 2004-06-11 2004-06-11 Jäähdytyselementti

Country Status (5)

Country Link
US (1) US7059390B2 (de)
EP (1) EP1605741B1 (de)
AT (1) ATE377349T1 (de)
DE (1) DE602005003058T2 (de)
FI (1) FI117590B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7450384B2 (en) 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US7802636B2 (en) 2007-02-23 2010-09-28 Atwood Oceanics, Inc. Simultaneous tubular handling system and method
DE102007038510B4 (de) 2007-08-14 2020-01-16 Rauch Landmaschinenfabrik Gmbh Vorrichtung zum Dosieren und Verteilen von landwirtschaftlichen und kommunalen Schüttgütern
FI121863B (fi) * 2007-09-07 2011-05-13 Abb Oy Elektroniikkalaitteen kuristin
EP2131641A1 (de) * 2008-06-04 2009-12-09 ABB Oy Kühlelement für eine elektrische Schaltung
SE533224C2 (sv) * 2008-09-16 2010-07-27 Sapa Profiler Ab Kylkropp för kretskortkomponenter
IT1401386B1 (it) * 2010-07-30 2013-07-18 Eurotech S P A Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni
US8869877B2 (en) 2010-10-11 2014-10-28 Hamilton Sundstrand Space Systems International, Inc. Monolithic cold plate configuration
US20120138281A1 (en) * 2010-12-06 2012-06-07 Transistor Devices, Inc. D/B/A Tdi Power Heat Exchanger for Electronic Assemblies
EP2629594A1 (de) * 2012-02-14 2013-08-21 ABB Oy Elektronische Vorrichtung
GB2527338B (en) * 2014-06-19 2018-11-07 ECONOTHERM UK Ltd Heat transfer apparatus
US20180328285A1 (en) * 2017-05-11 2018-11-15 Unison Industries, Llc Heat exchanger
DE102018129160B4 (de) * 2018-11-20 2022-11-24 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Verfahren zur Herstellung eines Kühlkörpers

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1905653A (en) * 1931-05-08 1933-04-25 Walter Wood Plug for steam platens and other metallic articles
NL127098C (de) * 1963-09-06
US3327776A (en) * 1965-10-24 1967-06-27 Trane Co Heat exchanger
US3437132A (en) * 1967-08-30 1969-04-08 Vemaline Products Co Inc Water cooled heat sink
US3887004A (en) * 1972-06-19 1975-06-03 Hayden Trans Cooler Inc Heat exchange apparatus
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4268850A (en) * 1979-05-11 1981-05-19 Electric Power Research Institute Forced vaporization heat sink for semiconductor devices
JPS61222242A (ja) * 1985-03-28 1986-10-02 Fujitsu Ltd 冷却装置
DE3717649A1 (de) * 1987-05-26 1988-12-15 Held Kurt Doppelbandpresse mit erwaerm- oder kuehlbaren teilen und verfahren zu deren herstellung
FR2729044B1 (fr) * 1994-12-30 1997-01-24 Atherm Element refroisisseur et connecteur pour un composant electronique de puissance refroidi par un fluide electriquement isole du composant
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6058010A (en) * 1998-11-06 2000-05-02 International Business Machines Corporation Enhanced test head liquid cooled cold plate
EP1056323A1 (de) 1999-05-25 2000-11-29 Lucent Technologies Inc. Kühleinheit mittels eines Differenzdrucks
GB2354062A (en) * 1999-09-13 2001-03-14 British Broadcasting Corp Cooling system for use in cooling electronic equipment
US6796372B2 (en) * 2001-06-12 2004-09-28 Liebert Corporation Single or dual buss thermal transfer system
US6615911B1 (en) * 2002-03-07 2003-09-09 Delphi Technologies, Inc. High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling
DE10227008B4 (de) * 2002-06-18 2012-10-18 Robert Bosch Gmbh Kühlvorrichtung für Halbleitermodule und Elektronikanordnung

Also Published As

Publication number Publication date
EP1605741B1 (de) 2007-10-31
DE602005003058D1 (de) 2007-12-13
EP1605741A1 (de) 2005-12-14
FI20045216A (fi) 2005-12-12
DE602005003058T2 (de) 2008-02-28
ATE377349T1 (de) 2007-11-15
FI20045216A0 (fi) 2004-06-11
US7059390B2 (en) 2006-06-13
US20050274505A1 (en) 2005-12-15

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