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ES375824A1 - Copper electrodeposition electrolytes and method - Google Patents

Copper electrodeposition electrolytes and method

Info

Publication number
ES375824A1
ES375824A1 ES375824A ES375824A ES375824A1 ES 375824 A1 ES375824 A1 ES 375824A1 ES 375824 A ES375824 A ES 375824A ES 375824 A ES375824 A ES 375824A ES 375824 A1 ES375824 A1 ES 375824A1
Authority
ES
Spain
Prior art keywords
copper
compound
electrolyte
copper electrodeposition
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES375824A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of ES375824A1 publication Critical patent/ES375824A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Electrolytic copper deposition improvements characterized by the example of an electrolyte for the electrodeposition of copper that provides copper electrolytic deposits that are smooth, dense and essentially free of protrusions and that contain as essential ingredients a compound that supplies the electrolyte with copper ions, a compound that provides hydrogen ions and a mixture or combination of a nitrogenous organic compound of cationic nature and a product containing lignosulfonate. (Machine-translation by Google Translate, not legally binding)
ES375824A 1969-01-23 1970-01-23 Copper electrodeposition electrolytes and method Expired ES375824A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US79358269A 1969-01-23 1969-01-23

Publications (1)

Publication Number Publication Date
ES375824A1 true ES375824A1 (en) 1972-04-16

Family

ID=25160262

Family Applications (1)

Application Number Title Priority Date Filing Date
ES375824A Expired ES375824A1 (en) 1969-01-23 1970-01-23 Copper electrodeposition electrolytes and method

Country Status (3)

Country Link
US (1) US3650915A (en)
ES (1) ES375824A1 (en)
ZM (1) ZM17469A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4604175A (en) * 1982-12-07 1986-08-05 Naumov Jury I Process for regeneration of iron-copper chloride etching solution

Also Published As

Publication number Publication date
ZM17469A1 (en) 1970-05-18
US3650915A (en) 1972-03-21

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