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ES349652A1 - Un metodo de proporcionar una conexion electrica sobre una superficie de un dispositivo electronico. - Google Patents

Un metodo de proporcionar una conexion electrica sobre una superficie de un dispositivo electronico.

Info

Publication number
ES349652A1
ES349652A1 ES349652A ES349652A ES349652A1 ES 349652 A1 ES349652 A1 ES 349652A1 ES 349652 A ES349652 A ES 349652A ES 349652 A ES349652 A ES 349652A ES 349652 A1 ES349652 A1 ES 349652A1
Authority
ES
Spain
Prior art keywords
layer
mask
metal
adheres
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES349652A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES349652A1 publication Critical patent/ES349652A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05639—Silver [Ag] as principal constituent
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    • H01L2224/1302—Disposition
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13147—Copper [Cu] as principal constituent
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2924/0001—Technical content checked by a classifier
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
ES349652A 1967-01-25 1968-01-23 Un metodo de proporcionar una conexion electrica sobre una superficie de un dispositivo electronico. Expired ES349652A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701136A NL6701136A (es) 1967-01-25 1967-01-25

Publications (1)

Publication Number Publication Date
ES349652A1 true ES349652A1 (es) 1969-04-01

Family

ID=19799110

Family Applications (1)

Application Number Title Priority Date Filing Date
ES349652A Expired ES349652A1 (es) 1967-01-25 1968-01-23 Un metodo de proporcionar una conexion electrica sobre una superficie de un dispositivo electronico.

Country Status (10)

Country Link
US (1) US3528090A (es)
AT (1) AT275609B (es)
BE (1) BE709772A (es)
CH (1) CH479162A (es)
DE (1) DE1614306C3 (es)
ES (1) ES349652A1 (es)
FR (1) FR1555930A (es)
GB (1) GB1204263A (es)
NL (1) NL6701136A (es)
SE (1) SE350648B (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3638304A (en) * 1969-11-06 1972-02-01 Gen Motors Corp Semiconductive chip attachment method
BE790652A (fr) * 1971-10-28 1973-02-15 Siemens Ag Composant a semi-conducteurs a connexions portantes
US3911474A (en) * 1972-01-03 1975-10-07 Signetics Corp Semiconductor structure and method
US3740619A (en) * 1972-01-03 1973-06-19 Signetics Corp Semiconductor structure with yieldable bonding pads having flexible links and method
DE3806287A1 (de) * 1988-02-27 1989-09-07 Asea Brown Boveri Aetzverfahren zur strukturierung einer mehrschicht-metallisierung
US6758958B1 (en) 1998-07-24 2004-07-06 Interuniversitair Micro-Elektronica Centrum System and a method for plating of a conductive pattern
WO2000007229A1 (en) * 1998-07-24 2000-02-10 Interuniversitair Micro-Elektronica Centrum A system and a method for plating of a conductive pattern
US9524945B2 (en) 2010-05-18 2016-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with L-shaped non-metal sidewall protection structure
US8377816B2 (en) * 2009-07-30 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming electrical connections
US8841766B2 (en) 2009-07-30 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall protection structure
US8324738B2 (en) 2009-09-01 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Self-aligned protection layer for copper post structure
US8659155B2 (en) 2009-11-05 2014-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps
US8610270B2 (en) 2010-02-09 2013-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and semiconductor assembly with lead-free solder
US8441124B2 (en) 2010-04-29 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall protection structure
US8546254B2 (en) * 2010-08-19 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for forming copper pillar bumps using patterned anodes
KR102458034B1 (ko) 2015-10-16 2022-10-25 삼성전자주식회사 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3386894A (en) * 1964-09-28 1968-06-04 Northern Electric Co Formation of metallic contacts
US3408271A (en) * 1965-03-01 1968-10-29 Hughes Aircraft Co Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates

Also Published As

Publication number Publication date
GB1204263A (en) 1970-09-03
DE1614306B2 (de) 1974-05-16
AT275609B (de) 1969-10-27
NL6701136A (es) 1968-07-26
DE1614306C3 (de) 1974-12-19
SE350648B (es) 1972-10-30
DE1614306A1 (de) 1970-08-20
BE709772A (es) 1968-07-23
FR1555930A (es) 1969-01-31
US3528090A (en) 1970-09-08
CH479162A (de) 1969-09-30

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