Nothing Special   »   [go: up one dir, main page]

EP4129026A1 - Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding - Google Patents

Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding

Info

Publication number
EP4129026A1
EP4129026A1 EP21715263.6A EP21715263A EP4129026A1 EP 4129026 A1 EP4129026 A1 EP 4129026A1 EP 21715263 A EP21715263 A EP 21715263A EP 4129026 A1 EP4129026 A1 EP 4129026A1
Authority
EP
European Patent Office
Prior art keywords
overmolding
main
power module
electrical connection
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21715263.6A
Other languages
German (de)
French (fr)
Inventor
Virginie Vercambre
Yavier Alejandro GOMEZ-VASQUEZ
Lyes HADDAD
Luc DEMAREZ
Hicham AYTOUS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Electrification
Original Assignee
Valeo Equipements Electriques Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur SAS filed Critical Valeo Equipements Electriques Moteur SAS
Publication of EP4129026A1 publication Critical patent/EP4129026A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49517Additional leads
    • H01L23/49524Additional leads the additional leads being a tape carrier or flat leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49575Assemblies of semiconductor devices on lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14329Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601Structure
    • H01L2224/0603Bonding areas having different sizes, e.g. different heights or widths
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/37099Material
    • H01L2224/371Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/37124Aluminium [Al] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001Core members of the connector
    • H01L2224/37099Material
    • H01L2224/371Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37144Gold [Au] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401Disposition
    • H01L2224/40151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73221Strap and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/66Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal
    • H02M7/68Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters
    • H02M7/72Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/79Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/797Conversion of ac power input into dc power output; Conversion of dc power input into ac power output with possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only

Definitions

  • the present invention relates to a power module with overmolding, an electronic system and a voltage converter comprising such a power module, as well as a method of manufacturing such a power module with overmolding.
  • the French patent application published under the number FR 3,068,564 A1 describes a power module comprising: electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates.
  • Such a power module can for example be used in a motor vehicle. However, in such an environment, the power module can be subjected to relatively high mechanical vibrations.
  • a drawback of such a power module is that the overmolding risks peeling off over time, for example due to the mechanical vibrations mentioned above.
  • a power module comprising: - electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection parts comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates; characterized in that at least one of the electrical connection parts also has at least one attachment post to the overmolding, distinct from the electrical connector (s) of this electrical connection part if the latter includes any, each attachment pin is projecting only in a direction of projection in the main plane, from a portion of the main plate of this electrical connection part, and in that the overmolding at least partially covers the attachment pin.
  • the contact surface between the overmolding and the connection pieces is increased compared to the case without a tenon, which allows the main plates to be better retained by the overmolding.
  • a power module according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination.
  • the electrical connector projects from the main plate into the main plane.
  • the transistor has a lower face pressed against the upper face of one of the main plates to which the transistor is connected.
  • the fastening pin and the main plate carrying it are made in one piece by continuity of material.
  • the electrical connector and the main plate carrying it are made in one piece by continuity of material.
  • the power module comprises two transistors, for example having plated lower faces respectively against upper faces of the main plates of two different connection pieces or against the upper face of the main plate of the same connection piece.
  • At least one of the electrical connector (s) projects at least in part along the main plane.
  • each of the electrical connection parts comprises at least one electrical connector projecting from its main plate.
  • the overmolding is integral in one piece.
  • each transistor on the one hand, has a lower face pressed against one of the two upper faces to which this transistor is electrically connected and, on the other hand, is electrically connected, for example by a or more ribbons or threads, on the other of the two upper faces.
  • at least one of the main plates has, on a lower face, at least a first cavity filled by the overmolding, and the overmolding has, in this cavity, a lower face flush with the lower face of the plate main.
  • each first cavity is open on the edge of the main plate having this cavity.
  • each electrical connector has a fixed end fixed to the main plate, this fixed end having a lower face entirely uncovered by overmolding.
  • the overmolding has a stud projecting downwards
  • the main plates are separated from each other along the main plane by at least one gap and the overmolding fills each gap and has, in each gap, a lower face flush with the lower faces of the main plates.
  • the stud projects from the underside of the overmolding present in the interstice.
  • the direction of projection of the attachment post is substantially perpendicular to the edge of the main plate from which the attachment post projects.
  • the hooking pin has a length, depending on its direction of projection, less than or equal to 5 mm
  • the electrical connection parts are obtained by cutting a metal plate.
  • the attachment pin is formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
  • the hooking pin is located on a portion of the outer edge of the main plate.
  • each of at least one of the attachment stud (s) has a thickness, as well as a width greater than or equal to its thickness.
  • the gripping pin is entirely covered by the overmolding.
  • each fastening pin has: - a fixed end fixed to the edge of the main plate, an upper face, a lower face, two side faces, and a front face, and the overmolding covers the less partially one or more of: the lower face, the upper face, the side faces and the front face of each hooking pin.
  • the overmolding leaves at least partially uncovered the underside of at least one of the attachment tenons. According to another characteristic, the overmolding has at least one second cavity leaving at least partially uncovered the upper face of at least one of the attachment tenons.
  • the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity.
  • the center of the circular base is located vertically over a middle of the width of the gripping post.
  • the overmolding has a peripheral protuberance along at least part of an outer edge of the overmolding according to the main plane and projecting downwards lower than the underside of the main plate (s), this peripheral protuberance at least partially covering the underside of at least one of the attachment tenons.
  • the peripheral protuberance covers the gripping post at the front of its fixed end so as to leave the underside of the gripping post uncovered at its fixed end.
  • the front face of at least one of the attachment stud (s), the lower face of which is covered by the peripheral protuberance is entirely covered by the overmolding, for example by the peripheral protuberance of the overmolding.
  • the front face of at least one of the attachment stud (s) is completely covered by the overmolding.
  • At least one of the attachment stud (s) protrudes from the overmolding in its direction of projection by a distance of less than 2 mm.
  • the power module comprises two hooking pins projecting from the edge of the same main plate, and the overmolding covers, on the one hand, at least partially a part of the extending edge. between the two attachment tenons and, on the other hand, at least partially the side faces facing these two attachment tenons.
  • the overmolding leaves visible at least part of a lower face of the main plate of at least one electrical connection part, this part left visible being designed to be pressed against a heat sink.
  • a transistor is pressed against the main plate, part of the lower face of which is left visible by the overmolding to be pressed against the heat sink.
  • An electronic system comprising a heat sink and a power module according to the invention, and in which the heat sink is in thermal contact with at least one underside left exposed by the overmolding.
  • the heat sink is in thermal contact with at least part of the lower face left visible by the overmolding via an electrically insulating thermal connection element.
  • the pad comes into contact with the heat sink in order to control the thickness of the electrically insulating thermal connection element present between the heat sink and the lower face (s) of the main plate (s) left discovered by overmolding.
  • a method of manufacturing a power module comprising: obtaining a conductive plate, preferably made of metal, extending along a main plane; - Cutting, in the conductive plate, on the one hand, of a frame part and several flat parts comprising at least two electrical connection parts each having a main plate, the main plates extending along the main plane of so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate, and, on the other hand, of the attachment tabs of each main plate with at least one of the or other parts; the electrical connection of at least one transistor between two upper faces of respectively two main plates; the production with an electrically insulating material, for example resin, of an overmolding of the transistor and of at least part of the upper faces of the main plates; and cutting the fastening tabs to separate each electrical connection piece from the other piece (s); characterized in that the cutting of the fastening tabs is made so as to leave a residue of the fastening tab projecting from one of
  • a method according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination.
  • the overmolding is carried out by casting or injection in one go of the electrically insulating material in a mold.
  • the overmolding is carried out before the cutting of the fastening tabs.
  • the overmolding is carried out after the cutting of the fastening tabs.
  • the cutting of the fastening legs involves cutting a first part of the fastening legs, then performing the overmolding, then cutting a second part of the fastening legs.
  • the production of the overmolding comprises the production of a part of the overmolding, then the cutting of the fastening tabs, then the production of a second part of the overmolding.
  • the overmolding is carried out to present at least one cavity leaving at least partially uncovered an upper face of at least one of the attachment tenons.
  • the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity.
  • the cutting of the attachment tabs firstly comprises the placement of a reinforcing piece against the upper face of at least one of the attachment tabs, this upper face being uncovered by the cavity, then cutting the fastener 2104 from bottom to top with a cutting tool to achieve a shearing effect with the backing piece.
  • FIG. 1 Figure 1 schematically shows an electrical system comprising a voltage converter embodying the invention
  • FIG. 2 Figure 2 is an exploded three-dimensional view of the voltage converter of Figure 1
  • FIG.3 Figure 3 is a three-dimensional view from above of a power module of the voltage converter of Figure 2, without overmolding,
  • Figure 4 is a view similar to that of Figure 4, with overmolding
  • Figure 5 is a bottom three-dimensional view of the power module of the figures 3 and 4, without overmolding
  • Figure 6 is a view similar to that of Figure 5, with overmolding,
  • FIG. 7 is a three-dimensional view from above of the tenons attached to the overmolding of the power module of FIGS. 3 to 6, without overmolding,
  • Figure 8 is a view similar to that of Figure 7, with overmolding
  • Figure 9 is a three-dimensional view from below of the attachment pins of Figures 7 and 8, with overmolding
  • FIG.10 Figure 10 is a top view of a cavity of the overmolding revealing an upper face of the gripping post, [0069] [Fig.11] Figure 11 is a three-dimensional view of below the hooking lugs in an alternative embodiment,
  • Figure 12 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 11,
  • FIG. 13 is a three-dimensional view from below of the gripping pins in an alternative embodiment
  • Figure 14 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 13,
  • FIG. 15 is a three-dimensional view from below of the attachment pins in an alternative embodiment
  • FIG. 16 is a three-dimensional view in section of the power module in the alternative embodiment of figure 15,
  • FIG. 17 is a three-dimensional view from below of the gripping pins in an alternative embodiment
  • Figure 18 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 17,
  • Figure 19 is a three-dimensional view of another embodiment of the power module of the voltage converter of Figure 1, without overmolding,
  • Figure 20 is a view similar to that of Figure 19, with overmolding,
  • Figure 21 is a three-dimensional view from below of a plate cut to form electrical connection parts of the power module, with overmolding.
  • Figure 22 is a three-dimensional view from above of the cut-out plate of Figure 21, and [0081] [Fig.23] Figure 23 illustrates the successive steps of a method of manufacturing a power module, according to one embodiment of the invention.
  • the electrical system 100 is for example intended to be installed in a motor vehicle.
  • the electrical system 100 firstly comprises an electrical power source 102 designed to deliver a direct voltage U, for example between 10 V and 100 V, for example 48 V or else 12 V.
  • the source of power supply 102 comprises for example a battery.
  • the electrical system 100 further comprises an electrical machine 130 comprising several phases (not shown) intended to present respective phase voltages.
  • the electrical system 100 further includes a voltage converter 104 connected between the power source 102 and the electrical machine 130 to convert between the direct voltage U and the phase voltages.
  • the voltage converter 104 firstly comprises a positive bus bar 106 and a negative bus bar 108 intended to be connected to the power supply source 102 to receive the direct voltage U, the positive bus bar 106 receiving a high electric potential and the negative bus bar 108 receiving a low electric potential.
  • the voltage converter 104 further comprises at least one power module 110 comprising one or more phase bus bars 122 intended to be respectively connected to one or more phases of the electric machine 130, to supply their respective phase voltages.
  • the voltage converter 104 comprises three power modules 110 each comprising two phase bus bars 122 connected to two phases of the electrical machine 130.
  • the electric machine 130 comprises two three-phase systems each comprising three phases, and intended to be electrically phase-shifted by 120 ° with respect to each other.
  • the first phase busbars 122 of the power modules 110 are respectively connected to the three phases of the first three-phase system, while the second phase bus bars 122 of the power modules 110 are respectively connected to the three phases of the second three-phase system.
  • Each power module 110 comprises, for each phase bus bar 122, a high side switch 112 connected between the positive bus bar 106 and the phase bus bar 122 and a low side switch 114 connected between the bus bar phase 122 and the negative bus bar 108.
  • the switches 112, 114 are arranged to form a switching arm, in which the phase bus bar 122 forms a midpoint.
  • Each switch 112, 114 comprises first and second main terminals 116, 118 and a control terminal 120 intended to selectively open and close the switch 112, 114 between its two main terminals 116, 118 as a function of a signal command applied to it.
  • the switches 112, 114 are preferably transistors, for example field effect transistors with a metal-oxide-semiconductor structure (standing for “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) having a gate forming the control terminal. 120, and a drain and a source respectively forming the main terminals 116, 118.
  • MOSFET Metal Oxide Semiconductor Field Effect Transistor
  • the switches 112, 114 could be insulated gate bipolar transistors (standing for “Insulated Gâte Bipolar Transistor” or IGBT).
  • the switches 112, 114 each have the shape of a plate, for example substantially rectangular, having an upper face and a lower face.
  • the first main terminal 116 extends on the underside, while the second main terminal 118 extends on the upper face.
  • the switches 112, 114 are intended to be crossed, between their main terminals 116, 118, by a current greater than 1 A.
  • the positive bus bar 106, the negative bus bar 108 and the phase bus bars 122 are rigid electrical conductors designed to withstand electrical currents of at least 1 A intended to pass through the switches 112, 114 They preferably have a thickness of at least 1 mm.
  • the positive bus bar 106 firstly comprises a common positive bus bar 106A connecting the power modules 110 and, in each power module 110, a local bus bar positive 106B connected to the positive common bus bar 106A.
  • the negative bus bar 108 has a negative common bus bar 108A connecting the power modules 110 and, in each power module 110, a negative local bus bar 108B for each low side switch 114, the negative local bus bars 108B being connected to the negative common bus bar 108B.
  • the connections are represented in Figure 1 by diamonds.
  • the positive common bus bar 106A and the negative common bus bar 108A are each formed from a single conductive piece.
  • the electric machine 130 has both an alternator and an electric motor function. More specifically, the motor vehicle further comprises a heat engine (not shown) having an output axis to which the electric machine 130 is connected by a belt (not shown). The heat engine is intended to drive the wheels of the motor vehicle through its output axis.
  • the electrical machine 130 supplies electrical energy to the electrical power source 102 from the rotation of the output shaft.
  • the voltage converter 104 then operates as a rectifier.
  • the electric machine drives the output shaft (in addition to or instead of the heat engine).
  • the voltage converter 104 then operates as an inverter.
  • the electric machine 130 is for example located in a gearbox or in a clutch of the motor vehicle or instead of the alternator.
  • the voltage converter 104 comprises a heat sink 206, also called heat sink, having heat exchange surfaces 204 on which are respectively mounted the power modules 110 (a single module of power 110 is shown in Figure 2).
  • the heat exchange between the heat exchange surface 204 of the heat sink 206 and the power module 110 is achieved for example through contact, direct or via a thermally conductive paste, between the heat exchange surface 204 of the heat sink 206 and the power module 110.
  • the voltage converter 104 also includes a support box 208 on which is fixed a secondary electronic module such as a control module 210.
  • a control module 210 is a control card.
  • the support housing 208 is mounted on the heat sink 206.
  • the power module 110 comprises several electrical connection parts 304, preferably made of metal.
  • Each electrical connection piece 304 has a main plate 306 extending along a horizontal PP main plane, the same for all of the main plates 306 so that the main plates 306 are substantially coplanar.
  • the main plates 306 have respective horizontal top faces 308 extending at the same level.
  • the top faces 308 are only shown in Figure 3 for the larger main plates 306.
  • each gap 310 has a width of less than or equal to one five millimeters. This means that the two main plates delimiting the gap 310 are at most five millimeters apart along this gap 310.
  • At least one of the electrical connection parts 304 also has at least one electrical connector projecting from its main plate 306.
  • Each electrical connector is for example either in the form a pin 312i, either in the form of a bent tab 312 2 , 312 3 , or again in the form of a straight tab 312 4 .
  • the straight tabs 312 4 form the phase bus bars 122
  • the bent tab 312 3 forms the local bus bar 106A
  • the bent tabs 312 2 form the negative local bus bars 108B
  • each electrical connector 312i, 312 2 , 312 3 has a fixed end 314 fixed to the main plate 306, a main portion 316 extending vertically in the example described and ending in a free end 318 and an elbow 320 connecting the fixed end 314 to the main portion 316.
  • these different elements of the electrical connectors 312i, 312 2 , 312 3 are only indicated in FIG. 3 for two electrical connectors 312i , 312 2 , one in the form of a pin, the other in the form of a tongue.
  • the electrical connector 312 4 projects into the main plane PP over a great length in order to allow its connection, for example at least one centimeter.
  • the electrical connector 312 4 has a fixed end 314 fixed to the main plate 306, this fixed end 314 having a large width to allow the passage of current, for example of at least one centimeter.
  • At least one of the electrical connection parts 304 also has at least one attachment pin 322 to an overmolding of the power module 110, which will be described later with reference to FIG. 4.
  • the attachment pins 322 are dedicated to retain the overmolding against the electrical connection pieces 304.
  • the attachment stud (s) 322 of an electrical connection piece 304 are separate from the electrical connector (s) 312i, 312 2 , 312 3 , 312 4 possibly present on this electrical connection part 304.
  • each hooking pin 322 does not make it possible to establish an electrical connection with another electrical conductor and is therefore intended to remain free of any electrical connection to another electrical conductor.
  • Each attachment pin 322 thus projects only in a direction of projection DP in the main plane PP, from a slice of the main plate 306 of this electrical connection piece 304. This is in contrast to the electrical connectors 312i in pin form and electrical connectors in the form of a bent tongue 312 2 , 312 3 , the vertical portion 316 of which projects vertically.
  • the direction of projection DP of the attachment pin 322 is substantially perpendicular to the edge of the main plate 306 from which the attachment pin 322 projects.
  • the attachment pin 322 has a length, according to its direction of projection DP, less than or equal to five millimeters and has a thickness E, identical to that of the main plate 306 in the example described, and a width L greater than or equal to its thickness E.
  • This width L is preferably less than or equal to 5 millimeter.
  • each hooking stud 322 is located outside the power module 110.
  • each hooking stud 322 is located on a portion of the outer edge of the main plate 306, that is, that is to say a portion of a wafer not delimiting an interstice 310.
  • each attachment post 322 may be formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
  • the metal plate is made of copper.
  • the metal plate could be made of aluminum or even of gold.
  • the power module 110 comprises the transistors 112, 114 each electrically connected between two upper faces 308 of respectively two of the main plates 306, for example to pass and interrupt a power current on command. , which may for example be greater than one ampere, between these two main plates 306.
  • Each transistor 112, 114 first of all has a lower face pressed against one of the two upper faces 308 to which this transistor is electrically connected.
  • Each transistor 112, 114 further has an upper face, part of which is electrically connected, for example by one or more ribbons 326 (as in the example shown) or wires, to the other of the two upper faces.
  • the upper face of transistor 112, 114 further comprises a control portion of transistor 112, 114, electrically connected to an upper face of a third main plate 306, for example by a wire 328 in the example described.
  • the tapes 326 are made of aluminum and have, for example, dimensions of 2mmx0.3mm.
  • the ribbons 326 are made of gold.
  • the wire 328 is made of aluminum and has a diameter of 0.2 mm. In an alternative embodiment, the wire 328 is made of gold.
  • the electrical connectors 312i in the form of a pin are used for connecting the power module 110 to the control module 210, in order to take measurements of electrical quantities and to control the transistors 112, 114. [0117] 0118] Further, still in the example described, the electrical connectors 312 2 are connected to the negative bus bar 108 and the electrical connector 312 3 is connected to the positive bus bar 106.
  • the two electrical connectors 312 4 in the form of a straight tab respectively form the two phase bus bars 122 of the power module 110.
  • the overmolding 402 is an electrical insulator and entirely covers each transistor 112, 114, each ribbons 326 and each wire 328 and at at least part of the upper faces 308 of the main plates 306.
  • the overmolding 402 is for example made of resin, for example also of epoxy.
  • the overmolding 402 is integral in one piece.
  • the overmolding 402 at least partially covers each attachment post 322.
  • the contact surface between the overmolding 402 and the connection parts 304 is increased, compared with the case without a post, which allows the overmolding 402 to better retain the main plates 306.
  • At least one of the main plates 306 has, on a lower face 502, at least one cavity 504 for retaining the overmolding 402.
  • Each retaining cavity 504 is open on the edge of the main plate 306 showing this cavity.
  • the retaining cavity 504 is located on the periphery of the underside 502 of the main plate 306. Further, each retaining cavity 504 defines a horizontal step offset vertically above the underside 502 of the. the main plate 306.
  • Each retaining cavity 504 is produced for example by stamping.
  • the overmolding 402 leaves visible at least part of the lower face 502 of the main plate 306 of each electrical connection piece 304 comprising at least one electrical connector 312i, 312 2 , 312 3 , 312 4 .
  • This part left exposed is designed to be pressed against the heat sink 206.
  • the heat sink 206 is in thermal contact with each part of the lower face 502 left visible by overmolding 402.
  • This thermal contact can be a direct contact or else via an insulating and thermally conductive electrical connection element.
  • each retaining cavity 504 is filled by the overmolding 402, and the overmolding 402 has, in this retaining cavity 504, a lower face flush with the lower face 502 of the main plate 206.
  • each electrical connector 312i, 312 2 , 312 3 , 312 4 has a lower face entirely uncovered with overmolding 402.
  • the overmolding 402 fills each gap 310 and has, in each gap 310, a lower face flush with the lower faces 502 of the main plates 206.
  • the overmolding 402 has at least one pad 506 projecting downwards and designed to come into direct contact with the heat sink 206 in order to define a predefined spacing between the lower faces 502 of the main plates 206 and the heat sink 206, and thus the thickness of the thermal conductor element filling this gap.
  • each stud 506 projects from the underside of the overmolding present in one of the interstices 310 between the main plates 206.
  • each attachment pin 322 has a fixed end 702 fixed to the edge (designated by the reference 704) of the main plate 306 carrying this attachment pin 322. It also has a upper face 706, a lower face 708, two side faces 710 and a front face 712 forming a free end of the attachment pin 322. For the sake of clarity, these different parts are only indicated for one of the attachment pins 322 , but it is apparent to the person skilled in the art that these parts are found on the other attachment lugs 322. In the example described, each attachment lug 322 has a thickness equal to that of the main plate 306 carrying it. In addition, the upper face 706 of the hooking pin also extends in the continuity of the upper face 308 of this main plate 306.
  • the overmolding 402 at least partially covers one or more of: the lower face 708, the upper face 706, the side faces 710 and the front face 712 of each tenon of. hook 322. [0129] In the example illustrated, the overmolding 402 covers the major part of the side faces 710 of each fastening pin 322 and leaves its front face 712, its lower face 708 and most of its upper face 706 visible.
  • the overmolding 402 at least partially covers the edges 704 of the main plates 306, in particular between the two attachment pins 322 of each pair of successive attachment pins 322, in particular those carried by the same main plate 306.
  • This part (indicated by the reference 806) of the overmolding 402 between the two attachment pins 322 extends from one to the other of the two side faces 710 facing these pins grip 322 and covers these two side faces 710 for the most part.
  • the overmolding 402 has at least one cavity 802 in the form of an indentation in a slice 804 of the overmolding 402.
  • the cavity 802 is open on the upper face of the overmolding. 402. This cavity 802 thus at least partially uncovers the upper face 706 of at least one of the attachment tenons 322.
  • each attachment pin 322 protrudes from the overmolding 402 (that is to say parts 806 in the example illustrated) along its direction of projection DP by a distance of at least 1 mm. .
  • the lower face 708 of the hooking pin 322 extends in continuity with the lower face 502 of the main plate 306.
  • the overmolding 402 does not goes no lower than the undersides 502 of the main plates 306 and leaves them fully uncovered, as do the undersides 708 of the hooking studs 322.
  • the cavity 802 delimits a free volume including a right cylinder having a circular base 1002 included in the main plane PP, this circular base 1002 having a diameter D of between 3 and 5 mm, preferably 4 mm, and a center C located at a distance G between 0.5 and 1.5 mm, preferably 1 mm, from a line L of the main plane PP connecting the two parts of the edge 804 of the overmolding 402 surrounding the cavity 802.
  • the center C of the circular base 1002 is located vertically over a middle of a width (for example parallel to the line L) of the attachment pin 322, the upper face 706 of which is exposed by the cavity 802.
  • the molding 402 is devoid of cavity 802 for at least one of the attachment pins 322 so that the molding 402 covers most of the upper face 706 of each of these attachment pins 322.
  • the overmolding 402 is provided with cavities 802 as in FIGS. 8 and 9 and also has a peripheral protuberance 1302 along at least part of an outer edge of the overmolding 402 along the main plane and projecting downwards lower than the lower faces 502 of the main plates 306.
  • This peripheral protuberance 1302 has for example the shape of a wall and at least partially covers the lower face 708 with at least one of the attachment tenons 322.
  • the peripheral protuberance 1302 covers the lower face 708 over the entire width of the attachment tenon 322.
  • the peripheral protuberance 1302 covers the hooking pin 322 at the front of its fixed end 702 so as to leave the part of its lower face uncovered. 708 located at its fixed end 702. This part is indicated in Figure 14 by the reference 1402.
  • the overmolding 402 is similar to that of Figures 13 and 14, except that it at least partially covers the front face 712 of minus one of the hooking lugs 322.
  • the overmolding 402 entirely covers the front face of the attachment pin 322 shown.
  • the overmolding 402 entirely covers at least one of the attachment pins 322.
  • the overmolding 402 is similar to that of Figures 15 and 16, except that it entirely covers the lower face 708 of the hooking pin 322 shown.
  • Figures 19 and 20 Another embodiment of the power module 110 is illustrated in Figures 19 and 20. As will be apparent, this other embodiment has the same elements as the embodiment of Figures 3 to 10, these elements being designated by the same references as above. The variant embodiments of Figures 11 to 18 can also be applied to the power module of Figures 19 and 20.
  • Figures 21 and 22 illustrate a conductive plate 2100, preferably made of metal, extending along the main plane and in which are cut first several flat pieces comprising a frame part 2102 and the electrical connection pieces 304 of the power module 110 (that of FIGS. 3 to 10 in the example illustrated). As explained previously, each electrical connection piece 304 has a main plate and, optionally, at least one electrical connector projecting from its main plate.
  • the electrical connectors 312i, 312 2 , 312 3 have been bent.
  • attachment tabs 2104 of each main plate with at least one of the other part (s) (other connection part 304 or else frame part 2102).
  • these Secondary attachment tabs are not visible.
  • the transistors 112, 114 are fixed and electrically connected and the overmolding 402 has been carried out, in particular so as to completely cover the transistors 112, 114 and at least part of the upper faces of the main plates, as well as at least partially at least some of the attachment tabs 2104.
  • the overmolding 402 extends to the plane of the lower faces of the main plates of the connection pieces 304.
  • a conductive plate extending along a main plane is obtained.
  • the conductive plate obtained in the previous step is cut to define the frame part 2102 and the connection parts 304.
  • the transistors 112, 114 are fixed and electrically connected to the main plates 306 of the connection pieces 304.
  • the overmolding 402 is made with an electrically insulating material, for example resin, so as to completely cover the transistors 112, 114, at least part of the upper faces 308 of the main plates. 306, as well as part of an upper face of some of the legs attachment 2104 (those designed to form the attachment lugs 322).
  • this step is carried out by casting or injection all at once into a single mold cavity. More preferably, the mold has a shape delimiting in the overmolding 402 each cavity 802 leaving at least partially uncovered the upper face of the fastening tabs 2104 designed to form the fastening tenons 322.
  • the electrical connectors 312i, 312 2 , 312 3 are bent to place their main portions vertically in the example described, as illustrated in FIG. 20.
  • the result of this step is illustrated in Figures 21 and 22.
  • the fastening tabs 2104 are cut to separate each electrical connection part 304 from the other part or parts.
  • this step comprises first of all, for at least one attachment tab (preferably for all the attachment tabs), the placement of a reinforcing piece against the upper face of this tab. 'fastener, this upper face being uncovered thanks to the presence of the cavity 802. Then, a cutting tool cuts this fastener 2104 from the bottom upwards in order to achieve a shearing effect with the reinforcing piece.
  • the presence of the reinforcement part makes it possible to avoid deformation of the overmolding during cutting, which could damage it.
  • the presence of the cavity (s) 802 makes it possible to discover a sufficient surface area of the upper face of the hooking tabs 2104 to allow the use of the reinforcement piece mentioned above.
  • the cutting of the attachment tabs 2104 is made so as to leave, for each attachment tab 2104 covered by the overmolding 402, at least the portion covered by the overmolding 402 as a residue of the attachment tab.
  • This attachment tab residue thus forms one of the attachment lugs 322 described above.
  • the overmolding 402 could be carried out after the cutting of the fastening tabs 2104. The overmolding 402 would then cover at least one residue of the fastening tab thus forming a fastening pin 322.
  • the cutting of the attachment tabs 2104 comprises the cutting of a first part of the attachment tabs 2104 (those designed to form the attachment lugs 322), then the production of the overmolding 422, then the cutting of a second part of the fastening tabs 2104.
  • the production of the overmolding 402 comprises the production of a first part of the overmolding (that shown in FIGS. 20 and 21), then the cutting of the fastening tabs 2104 (at least those designed to form the fastening tenons 322), then the production, on the first part of the overmolding, of a second part of the overmolding 402.
  • the second part of the overmolding may come to cover the front face of the attachment tenons 322, which was not possible during the production of the first part of the overmolding since the attachment tabs 2104 were not cut.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)

Abstract

The power module comprises: - electrical connection parts, preferably made of metal, each having a main plate, the main plates extending in a same main plane so as to be substantially coplanar, at least one of the electrical connection parts comprising at least one electrical connector projecting from its main plate; - at least one transistor, electrically connected between two upper faces of respectively two of the main plates; and - an electrically insulating overmoulding (402), made of resin for example, covering each transistor and at least a part of the upper faces of the main plates. At least one of the electrical connection parts also has at least one attachment tenon (322) to the overmoulding (402), separate from the one or more electrical connectors of this electrical connection part if the latter comprises any, each attachment tenon (322) projecting only in a projection direction (DP) in the main plane, from an edge of the main plate of this electrical connection part, and the overmoulding (402) at least partially covers the attachment tenon (322).

Description

Description Description
TITRE : MODULE DE PUISSANCE AVEC SURMOULAGE, DISPOSITIFS COMPORTANT UN TEL MODULE DE PUISSANCE ET PROCEDE DE FABRICATION D’UN MODULE DE PUISSANCE AVEC SURMOULAGE [0001] La présente invention concerne un module de puissance avec surmoulage, un système électronique et un convertisseur de tension comportant un tel module de puissance, ainsi qu’un procédé de fabrication d’un tel module de puissance avec surmoulage. TITLE: POWER MODULE WITH OVERMOLDING, DEVICES INCLUDING SUCH A POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE WITH OVERMOLDING [0001] The present invention relates to a power module with overmolding, an electronic system and a voltage converter comprising such a power module, as well as a method of manufacturing such a power module with overmolding.
[0002] La demande de brevet français publiée sous le numéro FR 3 068 564 A1 décrit un module de puissance comportant : des pièces de connexion électrique, de préférence en métal, présentant chacune une plaque principale, les plaques principales s’étendant selon un même plan principal de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique comprenant au moins un connecteur électrique se projetant depuis sa plaque principale ; au moins un transistor connecté électriquement entre deux faces supérieures de respectivement deux des plaques principales ; et un surmoulage isolant électrique, par exemple en résine, recouvrant chaque transistor et au moins une partie des faces supérieures des plaques principales. The French patent application published under the number FR 3,068,564 A1 describes a power module comprising: electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates.
[0003] Un tel module de puissance peut par exemple être employé dans un véhicule automobile. Or, dans un tel environnement, le module de puissance peut être soumis à des vibrations mécaniques relativement importantes. [0003] Such a power module can for example be used in a motor vehicle. However, in such an environment, the power module can be subjected to relatively high mechanical vibrations.
[0004] Un inconvénient d’un tel module de puissance est que le surmoulage risque de se décoller avec le temps, par exemple à cause des vibrations mécaniques mentionnées précédemment. [0004] A drawback of such a power module is that the overmolding risks peeling off over time, for example due to the mechanical vibrations mentioned above.
[0005] Il peut ainsi être souhaité de prévoir un module de puissance qui permette de s’affranchir d’au moins une partie des problèmes et contraintes précités. [0005] It may thus be desirable to provide a power module which makes it possible to overcome at least some of the aforementioned problems and constraints.
[0006] Il est donc proposé un module de puissance comportant : - des pièces de connexion électrique, de préférence en métal, présentant chacune une plaque principale, les plaques principales s’étendant selon un même plan principal de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique comprenant au moins un connecteur électrique se projetant depuis sa plaque principale ; au moins un transistor connecté électriquement entre deux faces supérieures de respectivement deux des plaques principales ; et un surmoulage isolant électrique, par exemple en résine, recouvrant chaque transistor et au moins une partie des faces supérieures des plaques principales ; caractérisé en ce qu’au moins une des pièces de connexion électrique présente en outre au moins un tenon d’accroche au surmoulage, distinct du ou des connecteurs électriques de cette pièce de connexion électrique si cette dernière en comprend, chaque tenon d’accroche se projetant uniquement selon une direction de projection dans le plan principal, depuis une tranche de la plaque principale de cette pièce de connexion électrique, et en ce que le surmoulage recouvre au moins partiellement le tenon d’accroche. [0006] A power module is therefore proposed comprising: - electrical connection parts, preferably made of metal, each having a main plate, the main plates extending along the same main plane so as to be substantially coplanar, at least one of the electrical connection parts comprising at least one electrical connector projecting from its main plate; at least one transistor electrically connected between two upper faces of respectively two of the main plates; and an electrically insulating overmolding, for example made of resin, covering each transistor and at least part of the upper faces of the main plates; characterized in that at least one of the electrical connection parts also has at least one attachment post to the overmolding, distinct from the electrical connector (s) of this electrical connection part if the latter includes any, each attachment pin is projecting only in a direction of projection in the main plane, from a portion of the main plate of this electrical connection part, and in that the overmolding at least partially covers the attachment pin.
[0007] Grâce à l’invention, la surface de contact entre le surmoulage et les pièces de connexion est augmentée par rapport au cas sans tenon, ce qui permet aux plaques principales d’être mieux retenues par le surmoulage. [0007] Thanks to the invention, the contact surface between the overmolding and the connection pieces is increased compared to the case without a tenon, which allows the main plates to be better retained by the overmolding.
[0008] Un module de puissance selon l’invention peut en outre comporter une ou plusieurs des caractéristiques optionnelles suivantes, prises isolément ou bien selon n’importe quelle combinaison techniquement possible. [0008] A power module according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination.
[0009] Selon une première caractéristique, le connecteur électrique se projette depuis la plaque principale dans le plan principal. [0009] According to a first characteristic, the electrical connector projects from the main plate into the main plane.
[0010] Selon une outre caractéristique, le transistor présente une face inférieure plaquée contre la face supérieure d’une des plaques principales à laquelle le transistor est connecté. [0010] According to a further characteristic, the transistor has a lower face pressed against the upper face of one of the main plates to which the transistor is connected.
[0011] Selon une autre caractéristique, le tenon d’accroche et la plaque principale le portant sont réalisés en une seul pièce par continuité de matière. [0011] According to another characteristic, the fastening pin and the main plate carrying it are made in one piece by continuity of material.
[0012] Selon une autre caractéristique, le connecteur électrique et la plaque principale le portant sont réalisés en une seul pièce par continuité de matière. [0012] According to another characteristic, the electrical connector and the main plate carrying it are made in one piece by continuity of material.
[0013] Selon une outre caractéristique, le module de puissance comporte deux transistors, par exemple présentant des faces inférieures plaquées respectivement contre des faces supérieures des plaques principales de deux pièces de connexion différentes ou bien contre la face supérieure de la plaque principale d’une même pièce de connexion. According to a further characteristic, the power module comprises two transistors, for example having plated lower faces respectively against upper faces of the main plates of two different connection pieces or against the upper face of the main plate of the same connection piece.
[0014] Selon une autre caractéristique, au moins un du ou des connecteurs électriques se projette au moins en partie selon le plan principal. [0014] According to another characteristic, at least one of the electrical connector (s) projects at least in part along the main plane.
[0015] Selon une autre caractéristique, chacune des pièces de connexion électrique comprend au moins un connecteur électrique se projetant depuis sa plaque principale. [0015] According to another characteristic, each of the electrical connection parts comprises at least one electrical connector projecting from its main plate.
[0016] Selon une autre caractéristique, le surmoulage est intégral en une seule pièce. [0016] According to another characteristic, the overmolding is integral in one piece.
[0017] Selon une autre caractéristique, chaque transistor, d’une part, présente une face inférieure plaquée contre l’une des deux faces supérieures auxquelles ce transistor est connecté électriquement et, d’autre part, est connecté électriquement, par exemple par un ou plusieurs rubans ou fils, à l’autre des deux faces supérieures. [0018] Selon une autre caractéristique, au moins une des plaques principales présente, sur une face inférieure, au moins une première cavité remplie par le surmoulage, et le surmoulage présente, dans cette cavité, une face inférieure affleurant la face inférieure de la plaque principale. According to another characteristic, each transistor, on the one hand, has a lower face pressed against one of the two upper faces to which this transistor is electrically connected and, on the other hand, is electrically connected, for example by a or more ribbons or threads, on the other of the two upper faces. According to another characteristic, at least one of the main plates has, on a lower face, at least a first cavity filled by the overmolding, and the overmolding has, in this cavity, a lower face flush with the lower face of the plate main.
[0019] Selon une autre caractéristique, chaque première cavité est ouverte sur la tranche de la plaque principale présentant cette cavité. According to another characteristic, each first cavity is open on the edge of the main plate having this cavity.
[0020] Selon une autre caractéristique, chaque connecteur électrique présente une extrémité fixe fixée à la plaque principale, cette extrémité fixe présentant une face inférieure entièrement découverte de surmoulage. [0020] According to another characteristic, each electrical connector has a fixed end fixed to the main plate, this fixed end having a lower face entirely uncovered by overmolding.
[0021] Selon une autre caractéristique, le surmoulage présente un plot se projetant vers le bas According to another characteristic, the overmolding has a stud projecting downwards
[0022] Selon une autre caractéristique, les plaques principales sont séparées les unes des autres selon le plan principal par au moins un interstice et le surmoulage remplit chaque interstice et présente, dans chaque interstice, une face inférieure affleurant des faces inférieures des plaques principales. [0023] Selon une autre caractéristique, le plot se projette depuis la face inférieure du surmoulage présent dans l’interstice. [0024] Selon une autre caractéristique, la direction de projection du tenon d’accroche est sensiblement perpendiculaire à la tranche de la plaque principale d’où se projette le tenon d’accroche. According to another characteristic, the main plates are separated from each other along the main plane by at least one gap and the overmolding fills each gap and has, in each gap, a lower face flush with the lower faces of the main plates. [0023] According to another characteristic, the stud projects from the underside of the overmolding present in the interstice. [0024] According to another characteristic, the direction of projection of the attachment post is substantially perpendicular to the edge of the main plate from which the attachment post projects.
[0025] Selon une autre caractéristique, le tenon d’accroche présente une longueur, selon sa direction de projection, inférieure ou égale à 5 mm [0025] According to another characteristic, the hooking pin has a length, depending on its direction of projection, less than or equal to 5 mm
[0026] Selon une autre caractéristique, les pièces de connexion électrique sont obtenues par découpage d’une plaque métallique. [0026] According to another characteristic, the electrical connection parts are obtained by cutting a metal plate.
[0027] Selon une autre caractéristique, le tenon d’accroche est formé par un résidu de patte d’attache résultant d’une découpe d’une patte d’attache reliant, avant la découpe, la plaque principale à une autre plaque coplanaire de ladite plaque métallique. [0027] According to another characteristic, the attachment pin is formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
[0028] Selon une autre caractéristique, le tenon d’accroche est situé sur une portion de tranche externe de la plaque principale. [0028] According to another characteristic, the hooking pin is located on a portion of the outer edge of the main plate.
[0029] Selon une autre caractéristique, chacun d’au moins un du ou des tenons d’accroche présente une épaisseur, ainsi qu’une largeur supérieure ou égale à son épaisseur. [0029] According to another characteristic, each of at least one of the attachment stud (s) has a thickness, as well as a width greater than or equal to its thickness.
[0030] Selon une autre caractéristique, le tenon d’accroche est entièrement recouvert par le surmoulage. [0030] According to another characteristic, the gripping pin is entirely covered by the overmolding.
[0031] Selon une autre caractéristique, chaque tenon d’accroche présente : - une extrémité fixe fixée à la tranche de la plaque principale, une face supérieure, une face inférieure, deux faces latérales, et une face avant, et le surmoulage recouvre au moins partiellement un ou plusieurs parmi : la face inférieure, la face supérieure, les faces latérales et la face avant de chaque tenon d’accroche. According to another characteristic, each fastening pin has: - a fixed end fixed to the edge of the main plate, an upper face, a lower face, two side faces, and a front face, and the overmolding covers the less partially one or more of: the lower face, the upper face, the side faces and the front face of each hooking pin.
[0032] Selon une autre caractéristique, le surmoulage laisse au moins partiellement découvert la face inférieure d’au moins un du ou des tenons d’accroche. [0033] Selon une autre caractéristique, le surmoulage présente au moins une deuxième cavité laissant au moins partiellement découvert la face supérieure d’au moins un du ou des tenons d’accroche. [0032] According to another characteristic, the overmolding leaves at least partially uncovered the underside of at least one of the attachment tenons. According to another characteristic, the overmolding has at least one second cavity leaving at least partially uncovered the upper face of at least one of the attachment tenons.
[0034] Selon une autre caractéristique, la cavité délimite un volume libre englobant un cylindre droit ayant une base circulaire comprise dans le plan principal, cette base circulaire ayant un diamètre compris entre 3 et 5 mm, de préférence 4 mm, et un centre situé à une distance comprise entre 0,5 et 1 ,5 mm, de préférence 1 mm, d’une ligne du plan principal reliant les deux parties d’une tranche du surmoulage entourant la cavité. [0035] Selon une autre caractéristique, le centre de la base circulaire est situé à la verticale d’un milieu d’une largeur du tenon d’accroche. According to another characteristic, the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity. [0035] According to another characteristic, the center of the circular base is located vertically over a middle of the width of the gripping post.
[0036] Selon une autre caractéristique, le surmoulage présente une excroissance périphérique longeant au moins une partie un bord externe du surmoulage selon le plan principal et se projetant vers le bas plus bas que la face inférieure de la ou des plaques principales, cette excroissance périphérique recouvrant au moins partiellement la face inférieure d’au moins un du ou des tenons d’accroche. According to another characteristic, the overmolding has a peripheral protuberance along at least part of an outer edge of the overmolding according to the main plane and projecting downwards lower than the underside of the main plate (s), this peripheral protuberance at least partially covering the underside of at least one of the attachment tenons.
[0037] Selon une autre caractéristique, l’excroissance périphérique recouvre le tenon d’accroche à l’avant de son extrémité fixe de manière à laisser la face inférieure du tenon d’accroche découverte au niveau de son extrémité fixe. [0038] Selon une autre caractéristique, la face avant d’au moins un du ou des tenons d’accroche dont la face inférieure est recouverte par l’excroissance périphérique, est entièrement recouverte par le surmoulage, par exemple par l’excroissance périphérique du surmoulage. [0037] According to another feature, the peripheral protuberance covers the gripping post at the front of its fixed end so as to leave the underside of the gripping post uncovered at its fixed end. [0038] According to another characteristic, the front face of at least one of the attachment stud (s), the lower face of which is covered by the peripheral protuberance, is entirely covered by the overmolding, for example by the peripheral protuberance of the overmolding.
[0039] Selon une autre caractéristique, la face avant d’au moins un du ou des tenons d’accroche est entièrement recouverte par le surmoulage. [0039] According to another characteristic, the front face of at least one of the attachment stud (s) is completely covered by the overmolding.
[0040] Selon une autre caractéristique, au moins un du ou des tenons d’accroche dépasse du surmoulage selon sa direction de projection d’une distance inférieure à 2 mm. [0040] According to another characteristic, at least one of the attachment stud (s) protrudes from the overmolding in its direction of projection by a distance of less than 2 mm.
[0041] Selon une autre caractéristique, le module de puissance comporte deux tenons d’accroche se projetant depuis la tranche de la même plaque principale, et le surmoulage recouvre, d’une part, au moins partiellement une partie de la tranche s’étendant entre les deux tenons d’accroche et, d’autre part, au moins partiellement les faces latérales en vis-à-vis de ces deux tenons d’accroche. [0042] Selon une autre caractéristique, le surmoulage laisse apparent au moins une partie d’une face inférieure de la plaque principale d’au moins une pièce de connexion électrique, cette partie laissée apparente étant conçue pour être plaquée contre un dissipateur thermique. [0043] Selon une autre caractéristique, un transistor est plaqué contre la plaque principale dont une partie de la face inférieure est laissée apparente par le surmoulage pour être plaquée contre le dissipateur thermique. [0041] According to another characteristic, the power module comprises two hooking pins projecting from the edge of the same main plate, and the overmolding covers, on the one hand, at least partially a part of the extending edge. between the two attachment tenons and, on the other hand, at least partially the side faces facing these two attachment tenons. [0042] According to another characteristic, the overmolding leaves visible at least part of a lower face of the main plate of at least one electrical connection part, this part left visible being designed to be pressed against a heat sink. According to another characteristic, a transistor is pressed against the main plate, part of the lower face of which is left visible by the overmolding to be pressed against the heat sink.
[0044] Il est également proposé un système électronique comprenant un dissipateur thermique et un module de puissance selon l’invention, et dans lequel le dissipateur de chaleur est en contact thermique avec au moins une face inférieure laissée apparente par le surmoulage. [0044] An electronic system is also provided comprising a heat sink and a power module according to the invention, and in which the heat sink is in thermal contact with at least one underside left exposed by the overmolding.
[0045] Selon une caractéristique optionnelle, le dissipateur thermique est en contact thermique avec au moins une partie de la face inférieure laissées apparentes par le surmoulage via un élément de liaison thermique électriquement isolant. [0046] Selon une autre caractéristique optionnelle, le plot vient au contact du dissipateur thermique afin de contrôler l’épaisseur de l’élément de liaison thermique électriquement isolant présent entre le dissipateur thermique et la ou les faces inférieures de la ou des plaques principales laissées découvertes par le surmoulage. According to an optional feature, the heat sink is in thermal contact with at least part of the lower face left visible by the overmolding via an electrically insulating thermal connection element. According to another optional feature, the pad comes into contact with the heat sink in order to control the thickness of the electrically insulating thermal connection element present between the heat sink and the lower face (s) of the main plate (s) left discovered by overmolding.
[0047] Il est également proposé un convertisseur de tension comprenant un module de puissance selon l’invention ou bien un système électronique selon l’invention. [0047] There is also proposed a voltage converter comprising a power module according to the invention or else an electronic system according to the invention.
[0048] Il est également proposé un procédé de fabrication d’un module de puissance, comportant : l’obtention d’une plaque conductrice, de préférence en métal, s’étendant selon un plan principal ; - la découpe, dans la plaque conductrice, d’une part, d’une pièce de cadre et de plusieurs pièces planes comportant au moins deux pièces de connexion électrique présentant chacune une plaque principale, les plaques principales s’étendant selon le plan principal de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique comprenant au moins un connecteur électrique se projetant depuis sa plaque principale, et, d’autre part, de pattes d’attache de chaque plaque principale avec au moins une de la ou des autres pièces ; la connexion électrique d’au moins un transistor entre deux faces supérieures de respectivement deux plaques principales ; la réalisation avec un matériau isolant électrique, par exemple de la résine, d’un surmoulage du transistor et d’au moins une partie des faces supérieures des plaques principales ; et la coupe des pattes d’attache pour séparer chaque pièce de connexion électrique de la ou des autres pièces ; caractérisé en ce que la coupe des pattes d’attache est réalisée de manière à laisser un résidu de patte d’attache se projetant d’une des plaques principales et formant un tenon d’accroche au surmoulage se projetant depuis la plaque principale selon le plan principal, distinct du ou des connecteurs électriques de cette pièce de connexion électrique si cette dernière en comprend, chaque tenon d’accroche se projetant uniquement selon une direction de projection dans le plan principal, depuis une tranche de la plaque principale de cette pièce de connexion électrique, et en ce que le surmoulage (est réalisé de manière à recouvrir au moins partiellement le tenon d’accroche. There is also proposed a method of manufacturing a power module, comprising: obtaining a conductive plate, preferably made of metal, extending along a main plane; - Cutting, in the conductive plate, on the one hand, of a frame part and several flat parts comprising at least two electrical connection parts each having a main plate, the main plates extending along the main plane of so as to be substantially coplanar, at least one of the electrical connection pieces comprising at least one electrical connector projecting from its main plate, and, on the other hand, of the attachment tabs of each main plate with at least one of the or other parts; the electrical connection of at least one transistor between two upper faces of respectively two main plates; the production with an electrically insulating material, for example resin, of an overmolding of the transistor and of at least part of the upper faces of the main plates; and cutting the fastening tabs to separate each electrical connection piece from the other piece (s); characterized in that the cutting of the fastening tabs is made so as to leave a residue of the fastening tab projecting from one of the main plates and forming an overmolding attachment pin projecting from the main plate according to the plane main, distinct from the electrical connector (s) of this electrical connection part if the latter includes any, each attachment tenon projecting only in a direction of projection in the main plane, from a slice of the main plate of this connection part electrical, and in that the overmolding (is carried out so as to at least partially cover the attachment pin.
[0049] Un procédé selon l’invention peut en outre comporter une ou plusieurs des caractéristiques optionnelles suivantes, prises isolément ou bien selon n’importe quelle combinaison techniquement possible. [0050] Selon une première caractéristique, le surmoulage est réalisé par coulage ou injection en une seule fois du matériau isolant électrique dans un moule. [0049] A method according to the invention may further include one or more of the following optional characteristics, taken in isolation or else in any technically possible combination. According to a first characteristic, the overmolding is carried out by casting or injection in one go of the electrically insulating material in a mold.
[0051] Selon une autre caractéristique, le surmoulage est réalisé avant la coupe des pattes d’attache. [0051] According to another characteristic, the overmolding is carried out before the cutting of the fastening tabs.
[0052] Selon une autre caractéristique, le surmoulage est réalisé après la coupe des pattes d’attache. [0052] According to another characteristic, the overmolding is carried out after the cutting of the fastening tabs.
[0053] Selon une autre caractéristique, la coupe des pattes d’attache comporte la coupe d’une première partie des pattes d’attache, puis la réalisation du surmoulage, puis la coupe d’une deuxième partie des pattes d’attache. [0053] According to another feature, the cutting of the fastening legs involves cutting a first part of the fastening legs, then performing the overmolding, then cutting a second part of the fastening legs.
[0054] Selon une autre caractéristique, la réalisation du surmoulage comporte la réalisation d’une partie du surmoulage, puis la coupe des pattes d’attache, puis la réalisation d’une deuxième partie du surmoulage. [0055] Selon une autre caractéristique, le surmoulage est réalisé pour présenter au moins une cavité laissant au moins partiellement découvert une face supérieure d’au moins un du ou des tenons d’accroche. [0054] According to another characteristic, the production of the overmolding comprises the production of a part of the overmolding, then the cutting of the fastening tabs, then the production of a second part of the overmolding. According to another characteristic, the overmolding is carried out to present at least one cavity leaving at least partially uncovered an upper face of at least one of the attachment tenons.
[0056] Selon une autre caractéristique, la cavité délimite un volume libre englobant un cylindre droit ayant une base circulaire comprise dans le plan principal, cette base circulaire ayant un diamètre compris entre 3 et 5 mm, de préférence 4 mm, et un centre situé à une distance comprise entre 0,5 et 1 ,5 mm, de préférence 1 mm, d’une ligne du plan principal reliant les deux parties d’une tranche du surmoulage entourant la cavité. [0057] Selon une autre caractéristique, la coupe des pattes d’attache comporte tout d’abord le placement d’une pièce de renfort contre la face supérieure d’au moins une des pattes d’attache, cette face supérieure étant découverte par la cavité, puis la coupe de la patte d’attache 2104 du bas vers le haut avec un outil de coupe afin de réaliser un effet de cisaillement avec la pièce de renfort. [0058] L’invention sera mieux comprise à l’aide de la description qui va suivre, donnée uniquement à titre d’exemple et faite en se référant aux dessins annexés dans lesquels : According to another characteristic, the cavity defines a free volume including a right cylinder having a circular base included in the main plane, this circular base having a diameter between 3 and 5 mm, preferably 4 mm, and a center located at a distance of between 0.5 and 1.5 mm, preferably 1 mm, from a line of the main plane connecting the two parts of an edge of the overmolding surrounding the cavity. [0057] According to another characteristic, the cutting of the attachment tabs firstly comprises the placement of a reinforcing piece against the upper face of at least one of the attachment tabs, this upper face being uncovered by the cavity, then cutting the fastener 2104 from bottom to top with a cutting tool to achieve a shearing effect with the backing piece. The invention will be better understood with the aid of the description which follows, given solely by way of example and made with reference to the accompanying drawings in which:
[0059] [Fig. 1] la figure 1 représente schématiquement un système électrique comportant un convertisseur de tension mettant en oeuvre l’invention, [0060] [Fig. 2] la figure 2 est une vue éclatée en trois dimensions du convertisseur de tension de la figure 1 , [0059] [Fig. 1] Figure 1 schematically shows an electrical system comprising a voltage converter embodying the invention, [0060] [Fig. 2] Figure 2 is an exploded three-dimensional view of the voltage converter of Figure 1,
[0061] [Fig.3] la figure 3 est une vue en trois dimensions de dessus d’un module de puissance du convertisseur de tension de la figure 2, sans surmoulage, [0061] [Fig.3] Figure 3 is a three-dimensional view from above of a power module of the voltage converter of Figure 2, without overmolding,
[0062] [Fig.4] la figure 4 est une vue similaire à celle de la figure 4, avec surmoulage, [0063] [Fig.5] la figure 5 est une vue en trois dimensions de dessous du module de puissance des figures 3 et 4, sans surmoulage, [0062] [Fig.4] Figure 4 is a view similar to that of Figure 4, with overmolding, [0063] [Fig.5] Figure 5 is a bottom three-dimensional view of the power module of the figures 3 and 4, without overmolding,
[0064] [Fig.6] la figure 6 est une vue similaire à celle de la figure 5, avec surmoulage,[0064] [Fig.6] Figure 6 is a view similar to that of Figure 5, with overmolding,
[0065] [Fig.7] la figure 7 est une vue en trois dimensions de dessus de tenons d’accroche au surmoulage du module de puissance des figures 3 à 6, sans surmoulage, [0065] [Fig.7] FIG. 7 is a three-dimensional view from above of the tenons attached to the overmolding of the power module of FIGS. 3 to 6, without overmolding,
[0066] [Fig.8] la figure 8 est une vue similaire à celle de la figure 7, avec surmoulage, [0067] [Fig.9] la figure 9 est une vue en trois dimensions de dessous des tenons d’accroche des figures 7 et 8, avec surmoulage, [0066] [Fig.8] Figure 8 is a view similar to that of Figure 7, with overmolding, [0067] [Fig.9] Figure 9 is a three-dimensional view from below of the attachment pins of Figures 7 and 8, with overmolding,
[0068] [Fig.10] la figure 10 est une vue de dessus d’une cavité du surmoulage découvrant une face supérieure du tenon d’accroche, [0069] [Fig.11] la figure 11 est une vue en trois dimensions de dessous des tenons d’accroche dans un mode de réalisation alternatif, [0068] [Fig.10] Figure 10 is a top view of a cavity of the overmolding revealing an upper face of the gripping post, [0069] [Fig.11] Figure 11 is a three-dimensional view of below the hooking lugs in an alternative embodiment,
[0070] [Fig.12] la figure 12 est une vue en trois dimensions en coupe du module de puissance dans le mode de réalisation alternatif de la figure 11 , [0070] [Fig.12] Figure 12 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 11,
[0071] [Fig.13] la figure 13 est une vue en trois dimensions de dessous des tenons d’accroche dans un mode de réalisation alternatif, [0071] [Fig.13] FIG. 13 is a three-dimensional view from below of the gripping pins in an alternative embodiment,
[0072] [Fig.14] la figure 14 est une vue en trois dimensions en coupe du module de puissance dans le mode de réalisation alternatif de la figure 13, [0072] [Fig.14] Figure 14 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 13,
[0073] [Fig.15] la figure 15 est une vue en trois dimensions de dessous des tenons d’accroche dans un mode de réalisation alternatif, [0074] [Fig.16] la figure 16 est une vue en trois dimensions en coupe du module de puissance dans le mode de réalisation alternatif de la figure 15, [0073] [Fig.15] FIG. 15 is a three-dimensional view from below of the attachment pins in an alternative embodiment, [0074] [Fig.16] FIG. 16 is a three-dimensional view in section of the power module in the alternative embodiment of figure 15,
[0075] [Fig.17] la figure 17 est une vue en trois dimensions de dessous des tenons d’accroche dans un mode de réalisation alternatif, [0075] [Fig.17] FIG. 17 is a three-dimensional view from below of the gripping pins in an alternative embodiment,
[0076] [Fig.18] la figure 18 est une vue en trois dimensions en coupe du module de puissance dans le mode de réalisation alternatif de la figure 17, [0076] [Fig.18] Figure 18 is a three-dimensional sectional view of the power module in the alternative embodiment of Figure 17,
[0077] [Fig.19] la figure 19 est une vue en trois dimensions d’un autre mode de réalisation du module de puissance du convertisseur de tension de la figure 1 , sans surmoulage, [0077] [Fig.19] Figure 19 is a three-dimensional view of another embodiment of the power module of the voltage converter of Figure 1, without overmolding,
[0078] [Fig.20] la figure 20 est une vue similaire à celle de la figure 19, avec surmoulage, [0078] [Fig.20] Figure 20 is a view similar to that of Figure 19, with overmolding,
[0079] [Fig.21] la figure 21 est une vue en trois dimensions de dessous d’une plaque découpée pour former des pièces de connexion électrique du module de puissance, avec surmoulage. [0079] [Fig.21] Figure 21 is a three-dimensional view from below of a plate cut to form electrical connection parts of the power module, with overmolding.
[0080] [Fig.22] la figure 22 est une vue en trois dimensions de dessus de la plaque découpée de la figure 21 , et [0081] [Fig.23] la figure 23 illustre les étapes successives d’un procédé de fabrication d’un module de puissance, selon un mode de réalisation de l’invention. [0080] [Fig.22] Figure 22 is a three-dimensional view from above of the cut-out plate of Figure 21, and [0081] [Fig.23] Figure 23 illustrates the successive steps of a method of manufacturing a power module, according to one embodiment of the invention.
[0082] En référence à la figure 1 , un système électrique 100 mettant en oeuvre l’invention va à présent être décrit. [0083] Le système électrique 100 est par exemple destiné à être implanté dans un véhicule automobile. Referring to Figure 1, an electrical system 100 implementing the invention will now be described. The electrical system 100 is for example intended to be installed in a motor vehicle.
[0084] Le système électrique 100 comporte tout d’abord une source d’alimentation électrique 102 conçue pour délivrer une tension continue U, par exemple comprise entre 10 V et 100 V, par exemple 48 V ou bien 12 V. La source d’alimentation électrique 102 comporte par exemple une batterie. The electrical system 100 firstly comprises an electrical power source 102 designed to deliver a direct voltage U, for example between 10 V and 100 V, for example 48 V or else 12 V. The source of power supply 102 comprises for example a battery.
[0085] Le système électrique 100 comporte en outre une machine électrique 130 comportant plusieurs phases (non représentées) destinées à présenter des tensions de phase respectives. The electrical system 100 further comprises an electrical machine 130 comprising several phases (not shown) intended to present respective phase voltages.
[0086] Le système électrique 100 comporte en outre un convertisseur de tension 104 connecté entre la source d’alimentation électrique 102 et la machine électrique 130 pour effectuer une conversion entre la tension continue U et les tensions de phase. [0086] The electrical system 100 further includes a voltage converter 104 connected between the power source 102 and the electrical machine 130 to convert between the direct voltage U and the phase voltages.
[0087] Le convertisseur de tension 104 comporte tout d’abord une barre omnibus positive 106 et une barre omnibus négative 108 destinées à être connectées à la source d’alimentation électrique 102 pour recevoir la tension continue U, la barre omnibus positive 106 recevant un potentiel électrique haut et la barre omnibus négative 108 recevant un potentiel électrique bas. The voltage converter 104 firstly comprises a positive bus bar 106 and a negative bus bar 108 intended to be connected to the power supply source 102 to receive the direct voltage U, the positive bus bar 106 receiving a high electric potential and the negative bus bar 108 receiving a low electric potential.
[0088] Le convertisseur de tension 104 comporte en outre au moins un module de puissance 110 comportant une ou plusieurs barres omnibus de phase 122 destinées être respectivement connectées à une ou plusieurs phases de la machine électrique 130, pour fournir leurs tensions de phase respectives. The voltage converter 104 further comprises at least one power module 110 comprising one or more phase bus bars 122 intended to be respectively connected to one or more phases of the electric machine 130, to supply their respective phase voltages.
[0089] Dans l’exemple décrit, le convertisseur de tension 104 comporte trois modules de puissance 110 comportant chacun deux barres omnibus de phase 122 connectées à deux phases de la machine électrique 130. In the example described, the voltage converter 104 comprises three power modules 110 each comprising two phase bus bars 122 connected to two phases of the electrical machine 130.
[0090] Plus précisément, dans l’exemple décrit, la machine électrique 130 comporte deux systèmes triphasés comportant chacun trois phases, et destinés à être électriquement déphasés de 120° l’un par rapport à l’autre. De préférence, les premières barres omnibus de phase 122 des modules de puissance 110 sont respectivement connectées aux trois phases du premier système triphasé, tandis que les deuxièmes barres omnibus de phase 122 des modules de puissance 110 sont respectivement connectées aux trois phases du deuxième système triphasé. More specifically, in the example described, the electric machine 130 comprises two three-phase systems each comprising three phases, and intended to be electrically phase-shifted by 120 ° with respect to each other. Preferably, the first phase busbars 122 of the power modules 110 are respectively connected to the three phases of the first three-phase system, while the second phase bus bars 122 of the power modules 110 are respectively connected to the three phases of the second three-phase system.
[0091 ] Chaque module de puissance 110 comporte, pour chaque barre omnibus de phase 122, un interrupteur de côté haut 112 connecté entre la barre omnibus positive 106 et la barre omnibus de phase 122 et un interrupteur de côté bas 114 connecté entre la barre omnibus de phase 122 et la barre omnibus négative 108. Ainsi, les interrupteurs 112, 114 sont agencés de manière à former un bras de commutation, dans lequel la barre omnibus de phase 122 forme un point milieu. [0092] Chaque interrupteur 112, 114 comporte des première et deuxième bornes principales 116, 118 et une borne de commande 120 destinée à sélectivement ouvrir et fermer l’interrupteur 112, 114 entre ses deux bornes principales 116, 118 en fonction d’un signal de commande qui lui est appliqué. Les interrupteurs 112, 114 sont de préférence des transistors, par exemple des transistors à effet de champ à structure métal-oxyde-semiconducteur (de l’anglais « Métal Oxide Semiconductor Field Effect Transistor » ou MOSFET) présentant une grille formant la borne de commande 120, et un drain et une source formant respectivement les bornes principales 116, 118. Alternativement, les interrupteurs 112, 114 pourraient être des transistors bipolaires à grille isolée (de l’anglais « Insulated Gâte Bipolar Transistor » ou IGBT). Each power module 110 comprises, for each phase bus bar 122, a high side switch 112 connected between the positive bus bar 106 and the phase bus bar 122 and a low side switch 114 connected between the bus bar phase 122 and the negative bus bar 108. Thus, the switches 112, 114 are arranged to form a switching arm, in which the phase bus bar 122 forms a midpoint. Each switch 112, 114 comprises first and second main terminals 116, 118 and a control terminal 120 intended to selectively open and close the switch 112, 114 between its two main terminals 116, 118 as a function of a signal command applied to it. The switches 112, 114 are preferably transistors, for example field effect transistors with a metal-oxide-semiconductor structure (standing for “Metal Oxide Semiconductor Field Effect Transistor” or MOSFET) having a gate forming the control terminal. 120, and a drain and a source respectively forming the main terminals 116, 118. Alternatively, the switches 112, 114 could be insulated gate bipolar transistors (standing for “Insulated Gâte Bipolar Transistor” or IGBT).
[0093] Dans l’exemple décrit, les interrupteurs 112, 114 ont chacun la forme d’une plaque, par exemple sensiblement rectangulaire, présentant une face supérieure et une face inférieure. La première borne principale 116 s’étend sur la face inférieure, tandis que la deuxième borne principale 118 s’étend sur la face supérieure. Les interrupteurs 112, 114 sont destinés à être traversés, entre leurs bornes principales 116, 118, par un courant supérieure à 1 A. In the example described, the switches 112, 114 each have the shape of a plate, for example substantially rectangular, having an upper face and a lower face. The first main terminal 116 extends on the underside, while the second main terminal 118 extends on the upper face. The switches 112, 114 are intended to be crossed, between their main terminals 116, 118, by a current greater than 1 A.
[0094] Il sera apprécié que la barre omnibus positive 106, la barre omnibus négative 108 et les barres omnibus de phase 122 sont des conducteurs électriques rigides conçus pour supporter les courants électriques d’au moins 1 A destinés à traverser les interrupteurs 112, 114. Elles présentent de préférence une épaisseur d’au moins 1 mm. [0094] It will be appreciated that the positive bus bar 106, the negative bus bar 108 and the phase bus bars 122 are rigid electrical conductors designed to withstand electrical currents of at least 1 A intended to pass through the switches 112, 114 They preferably have a thickness of at least 1 mm.
[0095] Par ailleurs, dans l’exemple décrit, la barre omnibus positive 106 comporte tout d’abord une barre omnibus commune positive 106A reliant les modules de puissance 110 et, dans chaque module de puissance 110, une barre omnibus locale positive 106B connectée à la barre omnibus commune positive 106A. De manière similaire, la barre omnibus négative 108 comporte une barre omnibus commune négative 108A reliant les modules de puissance 110 et, dans chaque module de puissance 110, une barre omnibus locale négative 108B pour chaque interrupteur de côté bas 114, les barres omnibus locales négatives 108B étant connectées à la barre omnibus commune négative 108B. Les connexions sont représentées sur la figure 1 par des losanges. Furthermore, in the example described, the positive bus bar 106 firstly comprises a common positive bus bar 106A connecting the power modules 110 and, in each power module 110, a local bus bar positive 106B connected to the positive common bus bar 106A. Similarly, the negative bus bar 108 has a negative common bus bar 108A connecting the power modules 110 and, in each power module 110, a negative local bus bar 108B for each low side switch 114, the negative local bus bars 108B being connected to the negative common bus bar 108B. The connections are represented in Figure 1 by diamonds.
[0096] En outre, dans l’exemple décrit, la barre omnibus commune positive 106A et la barre omnibus commune négative 108A sont chacune formée d’une seule pièce conductrice. [0096] Further, in the example described, the positive common bus bar 106A and the negative common bus bar 108A are each formed from a single conductive piece.
[0097] En outre, dans l’exemple décrit, la machine électrique 130 a à la fois une fonction d’alternateur et de moteur électrique. Plus précisément, le véhicule automobile comporte en outre un moteur thermique (non représenté) présentant un axe de sortie auquel la machine électrique 130 est reliée par une courroie (non représentée). Le moteur thermique est destiné à entraîner des roues du véhicule automobile par l’intermédiaire de son axe de sortie. Ainsi, en fonctionnement comme alternateur, la machine électrique 130 fournit de l’énergie électrique en direction de la source d’alimentation électrique 102 à partir de la rotation de l’axe de sortie. Le convertisseur de tension 104 fonctionne alors comme redresseur. En fonctionnement comme moteur électrique, la machine électrique entraîne l’arbre de sortie (en complément ou bien à la place du moteur thermique). Le convertisseur de tension 104 fonctionne alors comme onduleur. [0097] Furthermore, in the example described, the electric machine 130 has both an alternator and an electric motor function. More specifically, the motor vehicle further comprises a heat engine (not shown) having an output axis to which the electric machine 130 is connected by a belt (not shown). The heat engine is intended to drive the wheels of the motor vehicle through its output axis. Thus, in operation as an alternator, the electrical machine 130 supplies electrical energy to the electrical power source 102 from the rotation of the output shaft. The voltage converter 104 then operates as a rectifier. When operating as an electric motor, the electric machine drives the output shaft (in addition to or instead of the heat engine). The voltage converter 104 then operates as an inverter.
[0098] La machine électrique 130 est par exemple localisée dans une boîte de vitesses ou bien dans un embrayage du véhicule automobile ou bien en lieu et place de l’alternateur. The electric machine 130 is for example located in a gearbox or in a clutch of the motor vehicle or instead of the alternator.
[0099] Dans la suite de la description, la structure et la disposition des éléments du convertisseur de tension 104 vont être décrits plus en détails, en référence à une direction verticale H-B, « H » représentant le haut et « B » représentant le bas. In the remainder of the description, the structure and the arrangement of the elements of the voltage converter 104 will be described in more detail, with reference to a vertical direction HB, "H" representing the top and "B" representing the bottom. .
[0100] En référence à la figure 2, le convertisseur de tension 104 comprend un dissipateur thermique 206, également appelé dissipateur de chaleur, présentant des surfaces d’échange thermique 204 sur lesquelles sont respectivement montés les modules de puissance 110 (un seul module de puissance 110 est représenté sur la figure 2). L’échange thermique entre la surface d’échange thermique 204 du dissipateur thermique 206 et le module de puissance 110 est réalisé par exemple grâce à un contact, direct ou par l’intermédiaire d’une pâte conductrice thermiquement, entre la surface d’échange thermique 204 du dissipateur thermique 206 et le module de puissance 110. Referring to Figure 2, the voltage converter 104 comprises a heat sink 206, also called heat sink, having heat exchange surfaces 204 on which are respectively mounted the power modules 110 (a single module of power 110 is shown in Figure 2). The heat exchange between the heat exchange surface 204 of the heat sink 206 and the power module 110 is achieved for example through contact, direct or via a thermally conductive paste, between the heat exchange surface 204 of the heat sink 206 and the power module 110.
[0101 ] Le convertisseur de tension 104 comprend également un boîtier support 208 sur lequel est fixé un module électronique secondaire comme un module de contrôle 210. Dans l’exemple de la figure 1 , le module de contrôle 210 est une carte de contrôle. En outre et de façon optionnelle, le boîtier support 208 est monté sur le dissipateur thermique 206. [0101] The voltage converter 104 also includes a support box 208 on which is fixed a secondary electronic module such as a control module 210. In the example of FIG. 1, the control module 210 is a control card. In addition and optionally, the support housing 208 is mounted on the heat sink 206.
[0102] En référence à la figure 3, le module de puissance 110 comporte plusieurs pièces de connexion électrique 304, de préférence en métal. [0102] With reference to FIG. 3, the power module 110 comprises several electrical connection parts 304, preferably made of metal.
[0103] Chaque pièce de connexion électrique 304 présente une plaque principale 306 s’étendant selon un plan principal PP horizontal, le même pour toutes les plaques principales 306 de manière que les plaques principales 306 soient sensiblement coplanaires. En particulier, dans l’exemple décrit, les plaques principales 306 présentent des faces supérieures 308 horizontales respectives s’étendant au même niveau. Par soucis de clarté, les faces supérieures 308 ne sont indiquées sur la figure 3 que pour les plaques principales 306 les plus grandes. [0103] Each electrical connection piece 304 has a main plate 306 extending along a horizontal PP main plane, the same for all of the main plates 306 so that the main plates 306 are substantially coplanar. In particular, in the example described, the main plates 306 have respective horizontal top faces 308 extending at the same level. For the sake of clarity, the top faces 308 are only shown in Figure 3 for the larger main plates 306.
[0104] Par ailleurs, les plaques principales 306 sont séparées les unes des autres selon le plan principal PP par au moins un interstice 310. Dans l’exemple décrit, chaque interstice 310 présente une largeur inférieure ou égale à un cinq millimètres. Cela signifie que les deux plaques principales délimitant l’interstice 310 sont distantes d’au plus cinq millimètres le long de cet interstice 310. [0104] Furthermore, the main plates 306 are separated from each other along the main plane PP by at least one gap 310. In the example described, each gap 310 has a width of less than or equal to one five millimeters. This means that the two main plates delimiting the gap 310 are at most five millimeters apart along this gap 310.
[0105] De manière générale, au moins une des pièces de connexion électrique 304 (toutes dans l’exemple décrit) présente en outre au moins un connecteur électrique se projetant depuis sa plaque principale 306. Chaque connecteur électrique est par exemple soit sous la forme d’une broche 312i , soit sous la forme d’une languette pliée 3122, 3123, soit encore sous la forme d’une languette droite 3124. In general, at least one of the electrical connection parts 304 (all in the example described) also has at least one electrical connector projecting from its main plate 306. Each electrical connector is for example either in the form a pin 312i, either in the form of a bent tab 312 2 , 312 3 , or again in the form of a straight tab 312 4 .
[0106] Dans l’exemple décrit ici, les languettes droites 3124 forment les barres omnibus de phase 122, la languette pliée 3123 forme la barre omnibus locale 106A et les languettes pliées 3122 forment les barres omnibus locales négatives 108B[0106] In the example described here, the straight tabs 312 4 form the phase bus bars 122, the bent tab 312 3 forms the local bus bar 106A and the bent tabs 312 2 form the negative local bus bars 108B
[0107] Dans les deux premiers cas, chaque connecteur électrique 312i, 3122, 3123 présente une extrémité fixe 314 fixée à la plaque principale 306, une portion principale 316 s’étendant verticalement dans l’exemple décrit et se terminant par une extrémité libre 318 et un coude 320 reliant l’extrémité fixe 314 à la portion principale 316. Par soucis de clarté, ces différents éléments des connecteurs électriques 312i, 3122, 3123 ne sont indiqués sur la figure 3 que pour deux connecteurs électriques 312i, 3122, l’un en forme de broche, l’autre en forme de languette. [0108] Dans le cas d’une languette droite, le connecteur électrique 3124 se projette dans le plan principal PP sur une grande longueur afin de permettre sa connexion, par exemple au moins un centimètre. En outre, le connecteur électrique 3124 présente une extrémité fixe 314 fixée à la plaque principale 306, cette extrémité fixe 314 ayant une grande largeur pour permettre le passage de courant, par exemple d’au moins un centimètre. In the first two cases, each electrical connector 312i, 312 2 , 312 3 has a fixed end 314 fixed to the main plate 306, a main portion 316 extending vertically in the example described and ending in a free end 318 and an elbow 320 connecting the fixed end 314 to the main portion 316. For the sake of clarity, these different elements of the electrical connectors 312i, 312 2 , 312 3 are only indicated in FIG. 3 for two electrical connectors 312i , 312 2 , one in the form of a pin, the other in the form of a tongue. In the case of a straight tab, the electrical connector 312 4 projects into the main plane PP over a great length in order to allow its connection, for example at least one centimeter. In addition, the electrical connector 312 4 has a fixed end 314 fixed to the main plate 306, this fixed end 314 having a large width to allow the passage of current, for example of at least one centimeter.
[0109] Par ailleurs, au moins une des pièces de connexion électrique 304 présente en outre au moins un tenon d’accroche 322 à un surmoulage du module de puissance 110, qui sera décrit plus loin en référence à la figure 4. Dans l’exemple décrit, plusieurs tenons d’accroche 322 sont prévus. Les tenons d’accroche 322 sont dédiés à retenir le surmoulage contre les pièces de connexion électrique 304. Ainsi, le ou les tenons d’accroche 322 d’une pièce de connexion électrique 304 sont distincts du ou des connecteurs électriques 312i, 3122, 3123, 3124 éventuellement présents sur cette pièce de connexion électrique 304. En particulier, de par sa conception, par exemple de par ses dimensions, chaque tenon d’accroche 322 ne permet pas d’établir une connexion électrique avec un autre conducteur électrique et est de ce fait destiné à rester libre de toute connexion électrique à un autre conducteur électrique. [0109] Furthermore, at least one of the electrical connection parts 304 also has at least one attachment pin 322 to an overmolding of the power module 110, which will be described later with reference to FIG. 4. In the example described, several hooking lugs 322 are provided. The attachment pins 322 are dedicated to retain the overmolding against the electrical connection pieces 304. Thus, the attachment stud (s) 322 of an electrical connection piece 304 are separate from the electrical connector (s) 312i, 312 2 , 312 3 , 312 4 possibly present on this electrical connection part 304. In particular, by its design, for example by its dimensions, each hooking pin 322 does not make it possible to establish an electrical connection with another electrical conductor and is therefore intended to remain free of any electrical connection to another electrical conductor.
[0110] Chaque tenon d’accroche 322 se projette ainsi uniquement selon une direction de projection DP dans le plan principal PP, depuis une tranche de la plaque principale 306 de cette pièce de connexion électrique 304. Ceci est en contraste des connecteurs électriques 312i en forme de broche et des connecteurs électriques en forme de languette pliée 3122, 3123, dont la portion verticale 316 se projette verticalement. Par exemple, la direction de projection DP du tenon d’accroche 322 est sensiblement perpendiculaire à la tranche de la plaque principale 306 d’où se projette le tenon d’accroche 322. De préférence, le tenon d’accroche 322 présente une longueur, selon sa direction de projection DP, inférieure ou égale à cinq millimètres et présente une épaisseur E, identique à celle de la plaque principale 306 dans l’exemple décrit, et une largeur L supérieure ou égale à son épaisseur E. Cette largeur L est de préférence inférieure ou égale à 5 millimètre. Ces dimensions sont en contraste de celles des connecteurs électriques 3124 en forme de languette droite. [0110] Each attachment pin 322 thus projects only in a direction of projection DP in the main plane PP, from a slice of the main plate 306 of this electrical connection piece 304. This is in contrast to the electrical connectors 312i in pin form and electrical connectors in the form of a bent tongue 312 2 , 312 3 , the vertical portion 316 of which projects vertically. For example, the direction of projection DP of the attachment pin 322 is substantially perpendicular to the edge of the main plate 306 from which the attachment pin 322 projects. Preferably, the attachment pin 322 has a length, according to its direction of projection DP, less than or equal to five millimeters and has a thickness E, identical to that of the main plate 306 in the example described, and a width L greater than or equal to its thickness E. This width L is preferably less than or equal to 5 millimeter. These dimensions are in contrast to those of the electrical connectors 312 4 in the form of a straight tab.
[0111] Toujours de préférence, les tenons d’accroche 322 sont situés à l’extérieur du module de puissance 110. Ainsi, chaque tenon d’accroche 322 est situé sur une portion de tranche externe de la plaque principale 306, c’est-à-dire une portion de tranche ne délimitant pas un interstice 310. [0111] Still preferably, the hooking studs 322 are located outside the power module 110. Thus, each hooking stud 322 is located on a portion of the outer edge of the main plate 306, that is, that is to say a portion of a wafer not delimiting an interstice 310.
[0112] Comme cela sera expliqué en détail en références aux figures 21 à 23, les pièces de connexion électrique 304 sont obtenues dans l’exemple décrit par découpage d’une plaque métallique. Ainsi, chaque tenon d’accroche 322 peut être formé par un résidu de patte d’attache résultant d’une découpe d’une patte d’attache reliant, avant la découpe, la plaque principale à une autre plaque coplanaire de ladite plaque métallique. As will be explained in detail with reference to Figures 21 to 23, the electrical connection parts 304 are obtained in the example described by cutting a metal plate. Thus, each attachment post 322 may be formed by a residue of the attachment tab resulting from a cutout of an attachment tab connecting, before cutting, the main plate to another coplanar plate of said metal plate.
[0113] Dans l’exemple décrit ici, la plaque métallique est en cuivre. En variante, la plaque métallique pourrait être en aluminium ou encore en or. [0114] Par ailleurs, comme expliqué précédemment, le module de puissance 110 comporte les transistors 112, 114 chacun connecté électriquement entre deux faces supérieures 308 de respectivement deux des plaques principales 306, par exemple pour faire passer et interrompre sur commande un courant de puissance, pouvant par exemple être supérieure à un ampère, entre ces deux plaques principales 306. Chaque transistor 112, 114 présente tout d’abord une face inférieure plaquée contre l’une des deux faces supérieures 308 auxquelles ce transistor est connecté électriquement. Chaque transistor 112, 114 présente en outre une face supérieure dont une partie est connecté électriquement, par exemple par un ou plusieurs rubans 326 (comme dans l’exemple représenté) ou fils, à l’autre des deux faces supérieures. Dans l’exemple décrit, la face supérieure du transistor 112, 114 comporte en outre une partie de commande du transistor 112, 114, connectée électriquement à une face supérieure d’une troisième plaque principale 306, par exemple par un fil 328 dans l’exemple décrit. [0113] In the example described here, the metal plate is made of copper. As a variant, the metal plate could be made of aluminum or even of gold. [0114] Furthermore, as explained above, the power module 110 comprises the transistors 112, 114 each electrically connected between two upper faces 308 of respectively two of the main plates 306, for example to pass and interrupt a power current on command. , which may for example be greater than one ampere, between these two main plates 306. Each transistor 112, 114 first of all has a lower face pressed against one of the two upper faces 308 to which this transistor is electrically connected. Each transistor 112, 114 further has an upper face, part of which is electrically connected, for example by one or more ribbons 326 (as in the example shown) or wires, to the other of the two upper faces. In the example described, the upper face of transistor 112, 114 further comprises a control portion of transistor 112, 114, electrically connected to an upper face of a third main plate 306, for example by a wire 328 in the example described.
[0115] Dans l’exemple décrit, les rubans 326 sont en aluminium et présente par exemple des dimensions de 2mmx0.3mm. Dans une variante de réalisation, les rubans 326 sont en or. [0115] In the example described, the tapes 326 are made of aluminum and have, for example, dimensions of 2mmx0.3mm. In an alternative embodiment, the ribbons 326 are made of gold.
[0116] Dans l’exemple décrit, le fil 328 est en aluminium et présente un diamètre de 0.2mm Dans une variante de réalisation, le fil 328 est en or. [0117] Dans l’exemple décrit, les connecteurs électriques 312i en forme de broche servent à la connexion du module de puissance 110 au module de contrôle 210, afin de faire des mesures de grandeurs électriques et de commander les transistors 112, 114. [0118] En outre, toujours dans l’exemple décrit, les connecteurs électriques 3122 sont connectés à la barre omnibus négative 108 et le connecteur électrique 3123 est connecté à la barre omnibus positive 106. In the example described, the wire 328 is made of aluminum and has a diameter of 0.2 mm. In an alternative embodiment, the wire 328 is made of gold. In the example described, the electrical connectors 312i in the form of a pin are used for connecting the power module 110 to the control module 210, in order to take measurements of electrical quantities and to control the transistors 112, 114. [0117] 0118] Further, still in the example described, the electrical connectors 312 2 are connected to the negative bus bar 108 and the electrical connector 312 3 is connected to the positive bus bar 106.
[0119] En outre, toujours dans l’exemple décrit, les deux connecteurs électriques 3124 en forme de languette droite forment respectivement les deux barres omnibus de phase 122 du module de puissance 110. In addition, still in the example described, the two electrical connectors 312 4 in the form of a straight tab respectively form the two phase bus bars 122 of the power module 110.
[0120] En référence à la figure 4, le surmoulage du module de puissance 110 est représenté et porte la référence 402. Le surmoulage 402 est un isolant électrique et recouvre entièrement chaque transistor 112, 114, chaque rubans 326 et chaque fil 328 et au moins une partie des faces supérieures 308 des plaques principales 306. Le surmoulage 402 est par exemple en résine, par exemple encore en époxy. De préférence, le surmoulage 402 est intégral en une seule pièce. [0120] With reference to FIG. 4, the overmolding of the power module 110 is shown and bears the reference 402. The overmolding 402 is an electrical insulator and entirely covers each transistor 112, 114, each ribbons 326 and each wire 328 and at at least part of the upper faces 308 of the main plates 306. The overmolding 402 is for example made of resin, for example also of epoxy. Preferably, the overmolding 402 is integral in one piece.
[0121] Le surmoulage 402 recouvre au moins partiellement chaque tenon d’accroche 322. Ainsi, la surface de contact entre le surmoulage 402 et les pièces de connexion 304 est augmentée, par rapport au cas sans tenon, ce qui permet au surmoulage 402 de mieux retenir les plaques principales 306. [0121] The overmolding 402 at least partially covers each attachment post 322. Thus, the contact surface between the overmolding 402 and the connection parts 304 is increased, compared with the case without a post, which allows the overmolding 402 to better retain the main plates 306.
[0122] En référence à la figure 5, au moins une des plaques principales 306 présente, sur une face inférieure 502, au moins une cavité 504 de retenue du surmoulage 402. Chaque cavité de retenue 504 est ouverte sur la tranche de la plaque principale 306 présentant cette cavité. En d’autres termes, la cavité de retenue 504 se situe à la périphérie de la face inférieure 502 de la plaque principale 306. En outre, chaque cavité de retenue 504 définit une marche horizontale décalée verticalement au-dessus de la face inférieure 502 de la plaque principale 306. [0122] With reference to FIG. 5, at least one of the main plates 306 has, on a lower face 502, at least one cavity 504 for retaining the overmolding 402. Each retaining cavity 504 is open on the edge of the main plate 306 showing this cavity. In other words, the retaining cavity 504 is located on the periphery of the underside 502 of the main plate 306. Further, each retaining cavity 504 defines a horizontal step offset vertically above the underside 502 of the. the main plate 306.
Chaque cavité de retenue 504 est réalisée par exemple par emboutissage. Each retaining cavity 504 is produced for example by stamping.
[0123] Comme cela est visible sur la figure 6, le surmoulage 402 laisse apparent au moins une partie de la face inférieure 502 de la plaque principale 306 de chaque pièce de connexion électrique 304 comprenant au moins un connecteur électrique 312i, 3122, 3123, 3124. Cette partie laissée apparente est conçue pour être plaquée contre le dissipateur thermique 206. Ainsi, le dissipateur thermique 206 est en contact thermique avec chaque partie de la face inférieure 502 laissée apparente par le surmoulage 402. Ce contact thermique peut être un contact direct ou bien via un élément de liaison électrique isolant et thermiquement conducteur. As can be seen in FIG. 6, the overmolding 402 leaves visible at least part of the lower face 502 of the main plate 306 of each electrical connection piece 304 comprising at least one electrical connector 312i, 312 2 , 312 3 , 312 4 . This part left exposed is designed to be pressed against the heat sink 206. Thus, the heat sink 206 is in thermal contact with each part of the lower face 502 left visible by overmolding 402. This thermal contact can be a direct contact or else via an insulating and thermally conductive electrical connection element.
[0124] En outre, chaque cavité de retenue 504 est remplie par le surmoulage 402, et le surmoulage 402 présente, dans cette cavité de retenue 504, une face inférieure affleurant la face inférieure 502 de la plaque principale 206. [0124] In addition, each retaining cavity 504 is filled by the overmolding 402, and the overmolding 402 has, in this retaining cavity 504, a lower face flush with the lower face 502 of the main plate 206.
[0125] Par ailleurs, il sera apprécié que l’extrémité fixe 314 de chaque connecteur électrique 312i, 3122, 3123, 3124 présente une face inférieure entièrement découverte de surmoulage 402. En outre, le surmoulage 402 remplit chaque interstice 310 et présente, dans chaque interstice 310, une face inférieure affleurant des faces inférieures 502 des plaques principales 206. [0125] Furthermore, it will be appreciated that the fixed end 314 of each electrical connector 312i, 312 2 , 312 3 , 312 4 has a lower face entirely uncovered with overmolding 402. In addition, the overmolding 402 fills each gap 310 and has, in each gap 310, a lower face flush with the lower faces 502 of the main plates 206.
[0126] Le surmoulage 402 présente au moins un plot 506 se projetant vers le bas et conçu pour venir au contact direct du dissipateur thermique 206 afin de définir un écartement prédéfini entre les faces inférieures 502 des plaques principales 206 et le dissipateur thermique 206, et ainsi l’épaisseur de l’élément conducteur thermique remplissant cet écartement. Dans l’exemple décrit, chaque plot 506 se projette depuis la face inférieure du surmoulage présent dans l’un des interstices 310 entre les plaques principales 206. [0126] The overmolding 402 has at least one pad 506 projecting downwards and designed to come into direct contact with the heat sink 206 in order to define a predefined spacing between the lower faces 502 of the main plates 206 and the heat sink 206, and thus the thickness of the thermal conductor element filling this gap. In the example described, each stud 506 projects from the underside of the overmolding present in one of the interstices 310 between the main plates 206.
[0127] En référence à la figure 7, chaque tenon d’accroche 322 présente une extrémité fixe 702 fixée à la tranche (désignée par la référence 704) de la plaque principale 306 portant ce tenon d’accroche 322. Il présente en outre une face supérieure 706, une face inférieure 708, deux faces latérales 710 et une face avant 712 formant une extrémité libre du tenon d’accroche 322. Par soucis de clarté, ces différentes parties ne sont indiquées que pour un seul des tenons d’accroche 322, mais il est apparent pour la personne du métier que ces parties se retrouvent sur les autres tenons d’accroche 322. Dans l’exemple décrit, chaque tenon d’accroche 322 présente une épaisseur égale à celle de la plaque principale 306 le portant. En outre, la face supérieure 706 du tenon d’accroche s’étend également dans la continuité de la face supérieure 308 de cette plaque principale 306. [0127] With reference to FIG. 7, each attachment pin 322 has a fixed end 702 fixed to the edge (designated by the reference 704) of the main plate 306 carrying this attachment pin 322. It also has a upper face 706, a lower face 708, two side faces 710 and a front face 712 forming a free end of the attachment pin 322. For the sake of clarity, these different parts are only indicated for one of the attachment pins 322 , but it is apparent to the person skilled in the art that these parts are found on the other attachment lugs 322. In the example described, each attachment lug 322 has a thickness equal to that of the main plate 306 carrying it. In addition, the upper face 706 of the hooking pin also extends in the continuity of the upper face 308 of this main plate 306.
[0128] En référence à la figure 8, de manière générale, le surmoulage 402 recouvre au moins partiellement un ou plusieurs parmi : la face inférieure 708, la face supérieure 706, les faces latérales 710 et la face avant 712 de chaque tenon d’accroche 322. [0129] Dans l’exemple illustré, le surmoulage 402 recouvre la majeure partie des faces latérales 710 de chaque tenon d’accrochage 322 et laisse apparent sa face avant 712, sa face inférieure 708 et la majeure partie de sa face supérieure 706. [0128] Referring to Figure 8, in general, the overmolding 402 at least partially covers one or more of: the lower face 708, the upper face 706, the side faces 710 and the front face 712 of each tenon of. hook 322. [0129] In the example illustrated, the overmolding 402 covers the major part of the side faces 710 of each fastening pin 322 and leaves its front face 712, its lower face 708 and most of its upper face 706 visible.
[0130] Pour recouvrir les faces latérales 710, le surmoulage 402 recouvre au moins partiellement les tranches 704 des plaques principales 306, en particulier entre les deux tenons d’accroche 322 de chaque paire de tenons d’accroche 322 successifs, notamment ceux portés par la même plaque principale 306. Cette partie (indiquée par la référence 806) du surmoulage 402 entre les deux tenons d’accroche 322 s’étend d’une à l’autre des deux faces latérales 710 en vis-à-vis de ces tenons d’accroche 322 et recouvre ces deux faces latérales 710 en majeure partie. [0130] To cover the side faces 710, the overmolding 402 at least partially covers the edges 704 of the main plates 306, in particular between the two attachment pins 322 of each pair of successive attachment pins 322, in particular those carried by the same main plate 306. This part (indicated by the reference 806) of the overmolding 402 between the two attachment pins 322 extends from one to the other of the two side faces 710 facing these pins grip 322 and covers these two side faces 710 for the most part.
[0131] Pour laisser apparent les faces supérieures 706 des tenons d’accroche 322, le surmoulage 402 présente au moins une cavité 802 en forme d’indentation dans une tranche 804 du surmoulage 402. La cavité 802 est ouverte sur la face supérieure du surmoulage 402. Cette cavité 802 découvre ainsi au moins partiellement la face supérieure 706 d’au moins un du ou des tenons d’accroche 322. To leave visible the upper faces 706 of the attachment pins 322, the overmolding 402 has at least one cavity 802 in the form of an indentation in a slice 804 of the overmolding 402. The cavity 802 is open on the upper face of the overmolding. 402. This cavity 802 thus at least partially uncovers the upper face 706 of at least one of the attachment tenons 322.
[0132] De préférence, chaque tenon d’accroche 322 dépasse du surmoulage 402 (c’est-à-dire des parties 806 dans l’exemple illustré) selon sa direction de projection DP d’une distance d’au moins un 1 mm. Preferably, each attachment pin 322 protrudes from the overmolding 402 (that is to say parts 806 in the example illustrated) along its direction of projection DP by a distance of at least 1 mm. .
[0133] En référence à la figure 9, dans l’exemple décrit, la face inférieure 708 du tenon d’accroche 322 s’étend dans la continuité de la face inférieure 502 de la plaque principale 306. En outre, le surmoulage 402 ne va pas plus bas que les faces inférieures 502 des plaques principales 306 et les laisse entièrement découvertes, de même que les faces inférieures 708 des tenons d’accroche 322. [0133] With reference to FIG. 9, in the example described, the lower face 708 of the hooking pin 322 extends in continuity with the lower face 502 of the main plate 306. In addition, the overmolding 402 does not goes no lower than the undersides 502 of the main plates 306 and leaves them fully uncovered, as do the undersides 708 of the hooking studs 322.
[0134] En référence à la figure 10, la cavité 802 délimite un volume libre englobant un cylindre droit ayant une base circulaire 1002 comprise dans le plan principal PP, cette base circulaire 1002 ayant un diamètre D compris entre 3 et 5 mm, de préférence 4 mm, et un centre C situé à une distance G comprise entre 0,5 et 1 ,5 mm, de préférence 1 mm, d’une ligne L du plan principal PP reliant les deux parties de la tranche 804 du surmoulage 402 entourant la cavité 802. De préférence, le centre C de la base circulaire 1002 est situé à la verticale d’un milieu d’une largeur (par exemple parallèle à la ligne L) du tenon d’accroche 322 dont la face supérieure 706 est découverte par la cavité 802. [0135] En référence aux figures 11 et 12, dans un autre mode de réalisation, le surmoulage 402 est dépourvu de cavité 802 pour au moins un des tenons d’accroche 322 de sorte que le surmoulage 402 recouvre la majeure partie de la face supérieure 706 de chacun de ces tenons d’accroche 322. [0136] En référence aux figures 13 et 14, dans un autre mode de réalisation, le surmoulage 402 est pourvu de cavités 802 comme aux figures 8 et 9 et présente en outre une excroissance périphérique 1302 longeant au moins une partie d’un bord externe du surmoulage 402 selon le plan principal et se projetant vers le bas plus bas que les faces inférieures 502 des plaques principales 306. Cette excroissance périphérique 1302 a par exemple la forme d’un muret et recouvre au moins partiellement la face inférieure 708 d’au moins un des tenons d’accroche 322. Plus précisément, dans l’exemple décrit, l’excroissance périphérique 1302 recouvre la face inférieure 708 sur toute la largeur du tenon d’accroche 322. En outre, dans l’exemple illustré sur les figures 13 et 14, il sera apprécié que l’excroissance périphérique 1302 recouvre le tenon d’accroche 322 à l’avant de son extrémité fixe 702 de manière à laisser découverte la partie de sa face inférieure 708 située au niveau de son extrémité fixe 702. Cette partie est indiquée sur la figure 14 par la référence 1402. [0134] With reference to FIG. 10, the cavity 802 delimits a free volume including a right cylinder having a circular base 1002 included in the main plane PP, this circular base 1002 having a diameter D of between 3 and 5 mm, preferably 4 mm, and a center C located at a distance G between 0.5 and 1.5 mm, preferably 1 mm, from a line L of the main plane PP connecting the two parts of the edge 804 of the overmolding 402 surrounding the cavity 802. Preferably, the center C of the circular base 1002 is located vertically over a middle of a width (for example parallel to the line L) of the attachment pin 322, the upper face 706 of which is exposed by the cavity 802. [0135] Referring to Figures 11 and 12, in another embodiment, the molding 402 is devoid of cavity 802 for at least one of the attachment pins 322 so that the molding 402 covers most of the upper face 706 of each of these attachment pins 322. [0136] With reference to FIGS. 13 and 14, in another embodiment, the overmolding 402 is provided with cavities 802 as in FIGS. 8 and 9 and also has a peripheral protuberance 1302 along at least part of an outer edge of the overmolding 402 along the main plane and projecting downwards lower than the lower faces 502 of the main plates 306. This peripheral protuberance 1302 has for example the shape of a wall and at least partially covers the lower face 708 with at least one of the attachment tenons 322. More precisely, in the example described, the peripheral protuberance 1302 covers the lower face 708 over the entire width of the attachment tenon 322. In furthermore, in the example illustrated in FIGS. 13 and 14, it will be appreciated that the peripheral protuberance 1302 covers the hooking pin 322 at the front of its fixed end 702 so as to leave the part of its lower face uncovered. 708 located at its fixed end 702. This part is indicated in Figure 14 by the reference 1402.
[0137] En référence aux figures 15 et 16, dans un autre mode de réalisation, le surmoulage 402 est similaire à celui des figures 13 et 14, si ce n’est qu’il recouvre au moins partiellement la face avant 712 d’au moins un des tenons d’accroche 322.Referring to Figures 15 and 16, in another embodiment, the overmolding 402 is similar to that of Figures 13 and 14, except that it at least partially covers the front face 712 of minus one of the hooking lugs 322.
Dans l’exemple illustré, le surmoulage 402 recouvre entièrement la face avant du tenon d’accroche 322 représenté. In the example illustrated, the overmolding 402 entirely covers the front face of the attachment pin 322 shown.
[0138] En référence aux figures 17 et 18, dans un autre mode de réalisation, le surmoulage 402 recouvre entièrement au moins un des tenons d’accroche 322. Dans l’exemple illustré, le surmoulage 402 est similaire à celui des figures 15 et 16, si ce n’est qu’il recouvre entièrement la face inférieure 708 du tenon d’accroche 322 représenté. [0138] Referring to Figures 17 and 18, in another embodiment, the overmolding 402 entirely covers at least one of the attachment pins 322. In the example illustrated, the overmolding 402 is similar to that of Figures 15 and 16, except that it entirely covers the lower face 708 of the hooking pin 322 shown.
[0139] Un autre mode de réalisation du module de puissance 110 est illustré sur les figures 19 et 20. Comme cela sera apparent, cet autre mode de réalisation présente les mêmes éléments que le mode de réalisation des figures 3 à 10, ces éléments étant désignés par les mêmes références que précédemment. Les variantes de réalisation des figures 11 à 18 peuvent également s’appliquer au module de puissance des figures 19 et 20. [0140] Les figures 21 et 22 illustrent une plaque conductrice 2100, de préférence en métal, s’étendant selon le plan principal et dans laquelle sont découpées tout d’abord plusieurs pièces planes comportant une pièce de cadre 2102 et les pièces de connexion électrique 304 du module de puissance 110 (celui des figures 3 à 10 dans l’exemple illustré). Comme expliqué précédemment, chaque pièce de connexion électrique 304 présente une plaque principale et, éventuellement, au moins un connecteur électrique se projetant depuis sa plaque principale. Sur les figures 21 et 22, les connecteurs électriques 312i, 3122, 3123 ont été pliés. Dans la plaque conductrice 2100 sont en outre formées des pattes d’attache 2104 de chaque plaque principale avec au moins une de la ou des autres pièces (autre pièce de connexion 304 ou bien pièce de cadre 2102). Dans la plaque conductrice 2100 sont en outre également formées des pattes secondaires d’attache de chaque pièce de connexion électrique devant être pliée avec au moins une autre pièce de connexion électrique ou avec la pièce de cadre 2102. Sur les figures 21 et 22, ces pattes secondaires d’attache ne sont pas visibles. Les transistors 112, 114 sont fixés et connectés électriquement et le surmoulage 402 a été réalisé, en particulier de manière à recouvrir totalement les transistors 112, 114 et au moins une partie des faces supérieures des plaques principales, ainsi qu’au moins partiellement au moins certaines des pattes d’attache 2104. Dans l’exemple décrit, le surmoulage 402 s’étend jusqu’au plan des faces inférieures des plaques principales des pièces de connexion 304. Another embodiment of the power module 110 is illustrated in Figures 19 and 20. As will be apparent, this other embodiment has the same elements as the embodiment of Figures 3 to 10, these elements being designated by the same references as above. The variant embodiments of Figures 11 to 18 can also be applied to the power module of Figures 19 and 20. [0140] Figures 21 and 22 illustrate a conductive plate 2100, preferably made of metal, extending along the main plane and in which are cut first several flat pieces comprising a frame part 2102 and the electrical connection pieces 304 of the power module 110 (that of FIGS. 3 to 10 in the example illustrated). As explained previously, each electrical connection piece 304 has a main plate and, optionally, at least one electrical connector projecting from its main plate. In Figures 21 and 22, the electrical connectors 312i, 312 2 , 312 3 have been bent. In the conductive plate 2100 are further formed attachment tabs 2104 of each main plate with at least one of the other part (s) (other connection part 304 or else frame part 2102). In the conductive plate 2100 are further also formed secondary attachment tabs of each electrical connection piece to be bent with at least one other electrical connection piece or with the frame piece 2102. In Figures 21 and 22, these Secondary attachment tabs are not visible. The transistors 112, 114 are fixed and electrically connected and the overmolding 402 has been carried out, in particular so as to completely cover the transistors 112, 114 and at least part of the upper faces of the main plates, as well as at least partially at least some of the attachment tabs 2104. In the example described, the overmolding 402 extends to the plane of the lower faces of the main plates of the connection pieces 304.
[0141] En référence à la figure 23, un procédé 2300 de fabrication du module de puissance 110 va à présent être décrit. [0141] With reference to FIG. 23, a method 2300 for manufacturing the power module 110 will now be described.
[0142] Au cours d’une étape 2302, une plaque conductrice s’étendant selon un plan principal est obtenue. [0142] During a step 2302, a conductive plate extending along a main plane is obtained.
[0143] Au cours d’une étape 2304, la plaque conductrice obtenue à l’étape précédente est découpée pour définir la pièce de cadre 2102 et les pièces de connexion 304. [0143] During a step 2304, the conductive plate obtained in the previous step is cut to define the frame part 2102 and the connection parts 304.
[0144] Au cours d’une étape 2306, les transistors 112, 114 sont fixés et électriquement connectés aux plaques principales 306 des pièces de connexion 304. [0144] During a step 2306, the transistors 112, 114 are fixed and electrically connected to the main plates 306 of the connection pieces 304.
[0145] Au cours d’une étape 2308, le surmoulage 402 est réalisé avec un matériau isolant électrique, par exemple de la résine, de manière à recouvrir totalement les transistors 112, 114, au moins une partie des faces supérieures 308 des plaques principales 306, ainsi qu’une partie d’une face supérieure de certaines des pattes d’attache 2104 (celles conçues pour former les tenons d’accroche 322). De préférence, cette étape est réalisée par coulage ou injection en une seule fois dans une seule cavité de moule. De préférence encore, le moule présente une forme délimitant dans le surmoulage 402 chaque cavité 802 laissant au moins partiellement découvert la face supérieure des pattes d'attaches 2104 conçues pour former les tenons d’accroche 322. During a step 2308, the overmolding 402 is made with an electrically insulating material, for example resin, so as to completely cover the transistors 112, 114, at least part of the upper faces 308 of the main plates. 306, as well as part of an upper face of some of the legs attachment 2104 (those designed to form the attachment lugs 322). Preferably, this step is carried out by casting or injection all at once into a single mold cavity. More preferably, the mold has a shape delimiting in the overmolding 402 each cavity 802 leaving at least partially uncovered the upper face of the fastening tabs 2104 designed to form the fastening tenons 322.
[0146] Au cours d’une étape 2309, les pattes secondaires d’attache des connecteurs électrique 312i, 3122, 3123 sont coupées. During a step 2309, the secondary attachment tabs of the electrical connectors 312i, 312 2 , 312 3 are cut.
[0147] Au cours d’une étape 2310, les connecteurs électrique 312i, 3122, 3123 sont pliés pour placer leurs portions principales à la verticale dans l’exemple décrit, comme illustré sur la figure 20. Le résultat de cette étape est illustré sur les figures 21 et 22. During a step 2310, the electrical connectors 312i, 312 2 , 312 3 are bent to place their main portions vertically in the example described, as illustrated in FIG. 20. The result of this step is illustrated in Figures 21 and 22.
[0148] Au cours d’une étape 2312, les pattes d’attache 2104 sont coupées pour séparer chaque pièce de connexion électrique 304 de la ou des autres pièces. Dans l’exemple décrit, cette étape comporte tout d’abord, pour au moins une patte d’attache (de préférence pour toutes les pattes d’attache), le placement d’une pièce de renfort contre la face supérieure de cette patte d’attache, cette face supérieure étant découverte grâce à la présence de la cavité 802. Ensuite, un outil de coupe vient couper cette patte d’attache 2104 du bas vers le haut afin de réaliser un effet de cisaillement avec la pièce de renfort. La présence de la pièce de renfort permet d’éviter une déformation du surmoulage pendant la coupe, ce qui pourrait l’endommager. [0148] During a step 2312, the fastening tabs 2104 are cut to separate each electrical connection part 304 from the other part or parts. In the example described, this step comprises first of all, for at least one attachment tab (preferably for all the attachment tabs), the placement of a reinforcing piece against the upper face of this tab. 'fastener, this upper face being uncovered thanks to the presence of the cavity 802. Then, a cutting tool cuts this fastener 2104 from the bottom upwards in order to achieve a shearing effect with the reinforcing piece. The presence of the reinforcement part makes it possible to avoid deformation of the overmolding during cutting, which could damage it.
[0149] Ainsi, la présence de la ou des cavités 802 permet de découvrir une surface suffisante de la face supérieure des pattes d’accroche 2104 pour permettre l’utilisation de la pièce de renfort mentionnée précédemment. [0149] Thus, the presence of the cavity (s) 802 makes it possible to discover a sufficient surface area of the upper face of the hooking tabs 2104 to allow the use of the reinforcement piece mentioned above.
[0150] La coupe des pattes d’attache 2104 est réalisée de manière à laisser, pour chaque patte d’attache 2104 recouverte par le surmoulage 402, au moins la portion recouverte par le surmoulage 402 comme résidu de patte d’attache. Ce résidu de patte d’attache forme ainsi un des tenons d’accroche 322 décrits précédemment. [0151] Dans une autre mode de réalisation, le surmoulage 402 pourrait être réalisé après la coupe des pattes d’attache 2104. Le surmoulage 402 recouvrirait alors au moins un résidu de patte d’attache formant ainsi un tenon d’accroche 322. [0152] Dans encore un autre mode de réalisation, la coupe des pattes d’attache 2104 comporte la coupe d’une première partie des pattes d’attache 2104 (celles conçues pour former les tenons d’accroche 322), puis la réalisation du surmoulage 422, puis la coupe d’une deuxième partie des pattes d’attache 2104. [0153] Dans encore un autre mode de réalisation, la réalisation du surmoulage 402 comporte la réalisation d’une première partie du surmoulage (celle représentée sur les figure 20 et 21), puis la coupe des pattes d’attache 2104 (au moins celles conçues pour former les tenons d’accroche 322), puis la réalisation, sur la première partie du surmoulage, d’une deuxième partie du surmoulage 402. En particulier, la deuxième partie du surmoulage peut venir recouvrir la face avant des tenons d’accroche 322, ce qui n’était pas possible lors de la réalisation de la première partie du surmoulage puisque les pattes d’attache 2104 n’étaient pas coupées. [0150] The cutting of the attachment tabs 2104 is made so as to leave, for each attachment tab 2104 covered by the overmolding 402, at least the portion covered by the overmolding 402 as a residue of the attachment tab. This attachment tab residue thus forms one of the attachment lugs 322 described above. [0151] In another embodiment, the overmolding 402 could be carried out after the cutting of the fastening tabs 2104. The overmolding 402 would then cover at least one residue of the fastening tab thus forming a fastening pin 322. [0152] In yet another embodiment, the cutting of the attachment tabs 2104 comprises the cutting of a first part of the attachment tabs 2104 (those designed to form the attachment lugs 322), then the production of the overmolding 422, then the cutting of a second part of the fastening tabs 2104. [0153] In yet another embodiment, the production of the overmolding 402 comprises the production of a first part of the overmolding (that shown in FIGS. 20 and 21), then the cutting of the fastening tabs 2104 (at least those designed to form the fastening tenons 322), then the production, on the first part of the overmolding, of a second part of the overmolding 402. In in particular, the second part of the overmolding may come to cover the front face of the attachment tenons 322, which was not possible during the production of the first part of the overmolding since the attachment tabs 2104 were not cut.
[0154] Il apparaît clairement qu’un module de puissance tel que ceux décrits précédemment permet de retenir le surmoulage pour éviter son décollement. [0155] On notera par ailleurs que l’invention n’est pas limitée aux modes de réalisation décrits précédemment. Il apparaîtra en effet à l'homme de l'art que diverses modifications peuvent être apportées aux modes de réalisation décrits ci- dessus, à la lumière de l'enseignement qui vient de lui être divulgué. [0154] It clearly appears that a power module such as those described above makes it possible to retain the overmolding in order to prevent its detachment. [0155] It will also be noted that the invention is not limited to the embodiments described above. It will indeed appear to those skilled in the art that various modifications can be made to the embodiments described above, in the light of the teaching which has just been disclosed to him.
[0156] Dans la présentation détaillée de l’invention qui est faite précédemment, les termes utilisés ne doivent pas être interprétés comme limitant l’invention aux modes de réalisation exposés dans la présente description, mais doivent être interprétés pour y inclure tous les équivalents dont la prévision est à la portée de l'homme de l'art en appliquant ses connaissances générales à la mise en oeuvre de l'enseignement qui vient de lui être divulgué. In the detailed presentation of the invention which is given above, the terms used should not be interpreted as limiting the invention to the embodiments presented in the present description, but should be interpreted to include therein all the equivalents of which forecasting is within the reach of those skilled in the art by applying their general knowledge to the implementation of the teaching which has just been disclosed to them.

Claims

Revendications Claims
[1 ] Module de puissance (110) comportant : des pièces de connexion électrique (304), de préférence en métal, présentant chacune une plaque principale (306), les plaques principales (306) s’étendant selon un même plan principal (PP) de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique (304) comprenant au moins un connecteur électrique (312i,[1] Power module (110) comprising: electrical connection parts (304), preferably made of metal, each having a main plate (306), the main plates (306) extending along the same main plane (PP ) so as to be substantially coplanar, at least one of the electrical connection pieces (304) comprising at least one electrical connector (312i,
3122, 3123, 3124) se projetant depuis sa plaque principale (306) ; au moins un transistor (112, 114) connecté électriquement entre deux faces supérieures (308) de respectivement deux des plaques principales (306) ; et un surmoulage isolant électrique (402), par exemple en résine, recouvrant chaque transistor (112, 114) et au moins une partie des faces supérieures (308) des plaques principales (306) ; caractérisé en ce qu’au moins une des pièces de connexion électrique (304) présente en outre au moins un tenon d’accroche (322) au surmoulage (402), distinct du ou des connecteurs électriques (312i, 3122, 3123, 3124) de cette pièce de connexion électrique (304) si cette dernière en comprend, chaque tenon d’accroche (322) se projetant uniquement selon une direction de projection (DP) dans le plan principal (PP), depuis une tranche (704) de la plaque principale (306) de cette pièce de connexion électrique (304), et en ce que le surmoulage (402) recouvre au moins partiellement le tenon d’accroche (322). 312 2 , 312 3 , 312 4 ) projecting from its main plate (306); at least one transistor (112, 114) electrically connected between two upper faces (308) of respectively two of the main plates (306); and an electrically insulating overmolding (402), for example made of resin, covering each transistor (112, 114) and at least part of the upper faces (308) of the main plates (306); characterized in that at least one of the electrical connection parts (304) also has at least one attachment pin (322) to the overmolding (402), separate from the electrical connector (s) (312i, 312 2 , 312 3 , 312 4 ) of this electrical connection piece (304) if the latter includes any, each hooking pin (322) projecting only in a direction of projection (DP) in the main plane (PP), from a slice (704 ) of the main plate (306) of this electrical connection part (304), and in that the overmolding (402) at least partially covers the attachment pin (322).
[2] Module de puissance (110) selon la revendication 1 , dans lequel au moins une des plaques principales (306) présente, sur une face inférieure (502), au moins une cavité (504) remplie par le surmoulage (402), et dans lequel le surmoulage (402) présente, dans cette cavité (504), une face inférieure affleurant la face inférieure (502) de la plaque principale (306). [2] Power module (110) according to claim 1, wherein at least one of the main plates (306) has, on a lower face (502), at least one cavity (504) filled by the overmolding (402), and in which the overmolding (402) has, in this cavity (504), a lower face flush with the lower face (502) of the main plate (306).
[3] Module de puissance (110) selon la revendication 1 ou 2, dans lequel les pièces de connexion électrique (304) sont obtenues par découpage d’une plaque métallique (2100). [3] Power module (110) according to claim 1 or 2, wherein the electrical connection parts (304) are obtained by cutting a metal plate (2100).
[4] Module de puissance (110) selon l’une quelconque des revendications 1 à 3, dans lequel chaque tenon d’accroche (322) présente : une extrémité fixe (702) fixée à la tranche (704) de la plaque principale (306), une face supérieure (706), une face inférieure (708), - deux faces latérales (710), et une face avant (712), et dans lequel le surmoulage (402) recouvre au moins partiellement un ou plusieurs parmi : la face inférieure (708), la face supérieure (706), les faces latérales (710) et la face avant (712) de chaque tenon d’accroche (322). [5] Module de puissance (110) selon la revendication 4, dans lequel le surmoulage[4] Power module (110) according to any one of claims 1 to 3, wherein each attachment pin (322) has: a fixed end (702) fixed to the edge (704) of the main plate (306), an upper face (706), a lower face (708), - two side faces (710), and a front face (712) , and wherein the overmolding (402) at least partially covers one or more of: the lower face (708), the upper face (706), the side faces (710) and the front face (712) of each post of hook (322). [5] The power module (110) according to claim 4, wherein the overmolding
(402) présente au moins une cavité (802) laissant au moins partiellement découvert la face supérieure (706) d’au moins un du ou des tenons d’accroche (322). (402) has at least one cavity (802) leaving at least partially uncovered the upper face (706) of at least one of the gripping stud (s) (322).
[6] Module de puissance (110) selon la revendication 5, dans lequel la cavité (802) délimite un volume libre englobant un cylindre droit ayant une base circulaire (1002) comprise dans le plan principal (PP), cette base circulaire (1002) ayant un diamètre (D) compris entre 3 et 5 mm, de préférence 4 mm, et un centre (C) situé à une distance (G) comprise entre 0,5 et 1 ,5 mm, de préférence 1 mm, d’une ligne (L) du plan principal (PP) reliant les deux parties d’une tranche (804) du surmoulage (402) entourant la cavité (802). [7] Module de puissance (110) selon la revendication 6, dans lequel le centre (C) de la base circulaire (1002) est situé à la verticale d’un milieu d’une largeur du tenon d’accroche (322). [6] The power module (110) according to claim 5, wherein the cavity (802) defines a free volume including a right cylinder having a circular base (1002) included in the main plane (PP), this circular base (1002 ) having a diameter (D) between 3 and 5 mm, preferably 4 mm, and a center (C) located at a distance (G) between 0.5 and 1.5 mm, preferably 1 mm, a line (L) of the main plane (PP) connecting the two parts of a slice (804) of the overmolding (402) surrounding the cavity (802). [7] The power module (110) of claim 6, wherein the center (C) of the circular base (1002) is located vertically over a middle of the width of the gripping post (322).
[8] Module de puissance (110) selon l’une quelconque des revendications 4 à 7, dans lequel le surmoulage (402) présente une excroissance périphérique (1302) longeant au moins une partie d’un bord externe du surmoulage (402) selon le plan principal (PP) et se projetant vers le bas plus bas que la face inférieure (502) de la ou des plaques principales (306), cette excroissance périphérique (1302) recouvrant au moins partiellement la face inférieure (706) d’au moins un du ou des tenons d’accroche (322). [9] Module de puissance selon la revendication 8, dans lequel la face avant (712) d’au moins un du ou des tenons d’accroche (322) dont la face inférieure (706) est recouverte par l’excroissance périphérique (1302), est entièrement recouverte par le surmoulage (402), par exemple par l’excroissance périphérique (1302) du surmoulage (402). [8] Power module (110) according to any one of claims 4 to 7, wherein the overmolding (402) has a peripheral protuberance (1302) running along at least part of an outer edge of the overmolding (402) according to the main plane (PP) and projecting downwards lower than the lower face (502) of the main plate (s) (306), this peripheral protuberance (1302) at least partially covering the lower face (706) of least one of the attachment tenons (322). [9] The power module according to claim 8, wherein the front face (712) of at least one of the attachment stud (s) (322), the lower face (706) of which is covered by the peripheral protuberance (1302). ), is completely covered by the overmolding (402), for example by the peripheral protuberance (1302) of the overmolding (402).
[10] Système électronique comprenant un dissipateur thermique (206) et un module de puissance (110) selon l’une des revendication 1 à 9, et dans lequel le dissipateur de chaleur (206) est en contact thermique avec au moins une face inférieure (502) laissée apparente par le surmoulage (402). [10] An electronic system comprising a heat sink (206) and a power module (110) according to one of claims 1 to 9, and wherein the heat sink (206) is in thermal contact with at least one underside (502) left visible by the overmolding (402).
[11 ] Convertisseur de tension (104) comprenant un module de puissance (110) selon l’une quelconque des revendications 1 à 9 ou bien un système électronique selon la revendication 10. [12] Procédé (2300) de fabrication d’un module de puissance (110), comportant : l’obtention (2302) d’une plaque conductrice (2100), de préférence en métal, s’étendant selon un plan principal (PP) ; la découpe (2304), dans la plaque conductrice (2100), d’une part, d’une pièce de cadre (2102) et de plusieurs pièces planes comportant au moins deux pièces de connexion électrique (304) présentant chacune une plaque principale (306), les plaques principales (306) s’étendant selon le plan principal (PP) de manière à être sensiblement coplanaires, au moins une des pièces de connexion électrique (304) comprenant au moins un connecteur électrique (312i, 3122, 3123, 3124) se projetant depuis sa plaque principale (306), et, d’autre part, de pattes d’attache (2104) de chaque plaque principale (306) avec au moins une de la ou des autres pièces ; la connexion électrique (2306) d’au moins un transistor entre deux faces supérieures de respectivement deux plaques principales ; - la réalisation (2308) avec un matériau isolant électrique, par exemple de la résine, d’un surmoulage du transistor et d’au moins une partie des faces supérieures des plaques principales ; et la coupe (2310) des pattes d’attache (2104) pour séparer chaque pièce de connexion électrique (304) de la ou des autres pièces ; caractérisé en ce que la coupe des pattes d’attache (2104) est réalisée de manière à laisser un résidu de patte d’attache se projetant d’une des plaques principales et formant un tenon d’accroche (322) au surmoulage (402) se projetant depuis la plaque principale (306) selon le plan principal (PP), distinct du ou des connecteurs électriques (312 3122, 3123, 3124) de cette pièce de connexion électrique (304) si cette dernière en comprend, chaque tenon d’accroche (322) se projetant uniquement selon une direction de projection (DP) dans le plan principal (PP), depuis une tranche (704) de la plaque principale (306) de cette pièce de connexion électrique (304), et en ce que le surmoulage (402) est réalisé de manière à recouvrir au moins partiellement le tenon d’accroche (322). [11] Voltage converter (104) comprising a power module (110) according to any one of claims 1 to 9 or else an electronic system according to claim 10. [12] Method (2300) for manufacturing a module power (110), comprising: obtaining (2302) a conductive plate (2100), preferably made of metal, extending along a main plane (PP); the cutout (2304), in the conductive plate (2100), on the one hand, of a frame part (2102) and of several flat parts comprising at least two electrical connection parts (304) each having a main plate ( 306), the main plates (306) extending along the main plane (PP) so as to be substantially coplanar, at least one of the electrical connection pieces (304) comprising at least one electrical connector (312i, 312 2 , 312 3 , 312 4 ) projecting from its main plate (306), and, on the other hand, from the attachment tabs (2104) of each main plate (306) with at least one of the other part (s); the electrical connection (2306) of at least one transistor between two upper faces of respectively two main plates; - The production (2308) with an electrically insulating material, for example resin, of an overmolding of the transistor and of at least part of the upper faces of the main plates; and cutting (2310) the tabs (2104) to separate each electrical connection piece (304) from the other piece (s); characterized in that the cutting of the fastening tabs (2104) is made so as to leave a residue of the fastening tab projecting from one of the main plates and forming a fastening pin (322) to the overmolding (402) projecting from the main plate (306) along the main plane (PP), distinct from the connector (s) electrical connections (312 312 2 , 312 3 , 312 4 ) of this electrical connection piece (304) if the latter includes any, each hooking pin (322) projecting only in a direction of projection (DP) in the main plane (PP), from a slice (704) of the main plate (306) of this electrical connection part (304), and in that the overmolding (402) is carried out so as to at least partially cover the attachment pin (322).
EP21715263.6A 2020-03-30 2021-03-30 Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding Pending EP4129026A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2003115A FR3108822B1 (en) 2020-03-30 2020-03-30 POWER MODULE WITH OVERMOLDING, DEVICES COMPRISING SUCH A POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE WITH OVERMOLDING
PCT/EP2021/058252 WO2021198230A1 (en) 2020-03-30 2021-03-30 Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding

Publications (1)

Publication Number Publication Date
EP4129026A1 true EP4129026A1 (en) 2023-02-08

Family

ID=74045438

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21715263.6A Pending EP4129026A1 (en) 2020-03-30 2021-03-30 Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding

Country Status (6)

Country Link
US (1) US20230128774A1 (en)
EP (1) EP4129026A1 (en)
KR (1) KR20220160618A (en)
CN (1) CN115399081A (en)
FR (1) FR3108822B1 (en)
WO (1) WO2021198230A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022134657A1 (en) 2022-12-22 2024-06-27 Valeo Eautomotive Germany Gmbh Power module, electrical power converter and electric drive for a means of transport

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3068564B1 (en) 2017-06-28 2020-11-27 Valeo Equip Electr Moteur POWER MODULE OF A VOLTAGE CONVERTER AND METHOD FOR MANUFACTURING SUCH A POWER MODULE
FR3082306B1 (en) * 2018-06-08 2020-09-18 Valeo Equip Electr Moteur SYSTEM FOR MEASURING A TEMPERATURE OF AN ELECTRICAL COMPONENT AND SWITCHING ARMS INCLUDING SUCH A SYSTEM
FR3082369B1 (en) * 2018-06-08 2021-02-19 Valeo Equip Electr Moteur ELECTRICAL CIRCUIT, SWITCHING ARM AND VOLTAGE CONVERTER

Also Published As

Publication number Publication date
US20230128774A1 (en) 2023-04-27
FR3108822A1 (en) 2021-10-01
KR20220160618A (en) 2022-12-06
CN115399081A (en) 2022-11-25
FR3108822B1 (en) 2023-11-03
WO2021198230A1 (en) 2021-10-07

Similar Documents

Publication Publication Date Title
FR3068564A1 (en) POWER MODULE OF A VOLTAGE CONVERTER AND METHOD OF MANUFACTURING SUCH A POWER MODULE
FR2720877A1 (en) Construction element for the regulator and the brush holder of an electric machine and its method of manufacture.
EP3939396A1 (en) Electronic system and electrical assembly
EP3804111A1 (en) Electrical circuit, switching arm and voltage converter
EP4129026A1 (en) Power module with overmoulding, devices comprising such a power module and method for manufacturing a power module with overmoulding
EP2891178A1 (en) Body for pressing a part against a surface
EP4074149A1 (en) Electrical assembly and voltage converter
FR3110034A1 (en) ELECTRIC MODULE WITH OVERMOLDING AND SYSTEMS INCLUDING SUCH AN ELECTRIC MODULE
EP3646681B1 (en) Voltage converter, method for manufacturing such a voltage converter and assembly of a main module and a terminal block module for forming such a voltage converter
FR3131079A1 (en) POWER MODULE WITH OVERMOLDING AND ELECTRICAL SYSTEM COMPRISING SUCH POWER MODULE
FR3068541B1 (en) PARTS ASSEMBLY AND METHOD FOR MANUFACTURING SUCH ASSEMBLY
WO2023275133A1 (en) Electronic system and mobility device comprising such an electronic system
EP3910781A1 (en) Electric module with overmoulding and devices comprising such an electric module
EP4114158A1 (en) Electronic module with overmoulding, devices comprising such an electronic module and method for manufacturing such an electronic module
EP4020530A1 (en) Power module with overmoulding and systems comprising such a power module
WO2023118111A1 (en) Power module with overmoulding and electrical system comprising such a power module
WO2023217597A1 (en) Electrical assembly and voltage converter
FR3118390A1 (en) POWER MODULE WITH OVERMOLDING AND SYSTEMS COMPRISING SUCH POWER MODULE
WO2020156842A1 (en) Power electronics module, voltage converter and electrical system
FR3147447A1 (en) Electrical conduction bar
WO2024003316A1 (en) Switching cell
FR3137531A1 (en) SWITCHING CELL
WO2024200805A1 (en) Power module
WO2024068873A1 (en) Power module
FR3137532A1 (en) ELECTRICAL SYSTEM WITH COOLING CIRCUIT OF A POWER MODULE

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20220727

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: VALEO ELECTRIFICATION