EP4068804A1

EP4068804A1 - Loudspeaker, loudspeaker module, and electronic device

Info

Publication number: EP4068804A1
Application number: EP21738865.1A
Authority: EP
Inventors: Ligang Yu; Tong Zhu; Yingming Li; Jie Su; Jing Chang; Guimin WU
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-01-08
Filing date: 2021-01-05
Publication date: 2022-10-05
Also published as: EP4068804A4; CN113099367A; WO2021139632A1

Abstract

Embodiments of this application disclose a speaker, a speaker module, and an electronic device. The speaker includes a support, a first diaphragm, a first piezoelectric plate, and a moving coil speaker core. Peripheral edges of the first diaphragm are fastened to the support, and the first piezoelectric plate is fastened to a middle part of the first diaphragm. The moving coil speaker core is fastened to the support and is spaced from the first diaphragm. The moving coil speaker core includes a second diaphragm. The second diaphragm is disposed facing the first diaphragm. The second diaphragm, the support, and the first diaphragm jointly enclose a front cavity. The support is provided with a speaker hole, and the speaker hole connects the front cavity and external space of the speaker. The first diaphragm and the second diaphragm of the speaker are disposed opposite each other and share the front cavity, to complement medium-frequency and high-frequency responses of the speaker and improve overall loudness of the speaker.

Description

This application claims priority to Chinese Patent Application No. 202010019342.3, filed with the China National Intellectual Property Administration on January 8, 2020 and entitled "SPEAKER, SPEAKER MODULE, AND ELECTRONIC DEVICE", which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

Embodiments of this application relate to the field of audio technologies, and in particular, to a speaker, a speaker module, and an electronic device.

BACKGROUND

A moving coil speaker is a speaker that is widely applied today, and is usually used in a speaker module and a receiver module of an electronic device such as a mobile phone or a tablet. However, due to a relatively small size of the moving coil speaker, loudness of the moving coil speaker is not enough. In addition, due to a relatively small thickness and low material strength of a dome of the moving coil speaker, medium-frequency and high-frequency responses of the moving coil speaker are insufficient.

SUMMARY

An objective of this application is to provide a speaker, a speaker module, and an electronic device. The speaker integrates a piezoelectric speaker core and a moving coil speaker core, and a diaphragm of the piezoelectric speaker core and a diaphragm of the moving coil speaker core are disposed opposite each other and share a front cavity, to complement medium-frequency and high-frequency responses of the speaker and improve overall loudness of the speaker.
According to a first aspect, this application provides a speaker, including a support, a first diaphragm, a first piezoelectric plate, and a moving coil speaker core. Peripheral edges of the first diaphragm are fastened to the support, and the first piezoelectric plate is fastened to a middle part of the first diaphragm. The moving coil speaker core is fastened to the support and is spaced from the first diaphragm. The moving coil speaker core includes a second diaphragm. The second diaphragm is disposed facing the first diaphragm. The second diaphragm, the support, and the first diaphragm jointly enclose a front cavity. The support is provided with a speaker hole, and the speaker hole connects the front cavity and external space of the speaker.
In this application, the speaker includes a piezoelectric speaker core having the first diaphragm and the first piezoelectric plate. The speaker integrates the piezoelectric speaker core and the moving coil speaker core, and the first diaphragm of the piezoelectric speaker core and the second diaphragm of the moving coil speaker core can simultaneously push air in the front cavity to vibrate, to make a sound. Therefore, compared with loudness of a conventional moving coil speaker, overall loudness of the speaker in this application is significantly improved. Compared with the conventional moving coil speaker, the speaker in this application can complement medium-frequency and high-frequency responses by using the piezoelectric speaker core, so that medium-frequency and high-frequency sound pressure levels of the speaker are significantly improved.
In addition, because the piezoelectric speaker core is relatively thin, top space of the second diaphragm of the moving coil speaker core may be used for arrangement. The first diaphragm and the second diaphragm are disposed opposite each other and share the front cavity. Therefore, when a dual diaphragm structure is implemented, the speaker can help save space without obviously increasing an overall volume, and the speaker may still have a relatively small thickness and a relatively small overall volume.
In a possible implementation, the first diaphragm may be a metal sheet, an organic sheet, or the like. A thickness of the first diaphragm may be from 50 µm to 0.3 mm. The first diaphragm may be in a rectangular, circular, or another shape. In a possible implementation, the first piezoelectric plate is located on a side that is of the first diaphragm and that is away from the support or on a side that is of the first diaphragm and that faces the support. The first piezoelectric plate may be in a rectangular, circular, or another shape. In a possible implementation, a shape of the first piezoelectric plate is the same as a shape of the first diaphragm, and a size of the first piezoelectric plate is less than a size of the first diaphragm.
In a possible implementation, the support includes a first support part and a second support part that are disposed opposite each other, two sides of the peripheral edges of the first diaphragm are separately fastened to the first support part and the second support part, and the speaker hole is disposed in the first support part. The second diaphragm includes a vibration part and a dome part, and the dome part is fastened to a middle part of the vibration part. A spacing between the first diaphragm and the dome part increases in a direction from the second support part to the first support part.
In this implementation, the first diaphragm is inclined relative to the second diaphragm, the first diaphragm and the second diaphragm roughly form a horn shape, and an opening direction of the horn faces the speaker hole. This facilitates acoustic impedance matching between the speaker and the outside, improves sound making efficiency, and reduces an airflow noise generation risk.
In a possible implementation, an area of the first diaphragm is greater than or equal to an area of the second diaphragm. In the conventional moving coil speaker, because an overall volume of a module is greatly limited, it is difficult to increase a diaphragm area of the module. In this implementation, when the area of the second diaphragm is limited, the first diaphragm having a relatively larger area is disposed on the speaker, to improve a sound pressure level. In addition, a larger area of the first diaphragm helps the speaker obtain a larger front cavity, so that the speaker has less noise and better sound quality.
In a possible implementation, the support further includes a mounting part, the mounting part is connected between the first support part and the second support part, the mounting part is provided with a mounting hole, the moving coil speaker core is fastened to the mounting part, and a part or all of the moving coil speaker core is accommodated in the mounting hole.
In this implementation, the first support part and the second support part of the support are separately located on two sides of the mounting part, the two sides of peripheral edges of the first diaphragm are fastened to the first support part and the second support part, and the second diaphragm is mounted on the mounting part, so that the area of the first diaphragm can be greater than the area of the second diaphragm.
In a possible implementation, a shape of the mounting hole matches an appearance of the moving coil speaker core. The mounting hole may be roughly in a rectangular, circular, or another shape.
In a possible implementation, the support further includes a third support part and a fourth support part that are disposed opposite each other, the third support part and the fourth support part are connected between the first support part and the second support part, and the other two sides of the peripheral edges of the first diaphragm are separately fastened to the third support part and the fourth support part. The mounting part is further connected between the third support part and the fourth support part.
In a possible implementation, the first support part includes a first sub-support part and a second sub-support part, the second sub-support part is connected to the mounting part, the first sub-support part is connected to the second sub-support part and the first diaphragm, and the first sub-support part protrudes relative to the second sub-support part in a direction away from the second support part.
In this implementation, because the first sub-support part of the speaker protrudes relative to the second sub-support part in a direction away from the second support part, when the speaker has no obvious change in a bottom structure and a size of the support, the first sub-support part that is of the first support part and that is configured to fasten the first diaphragm protrudes in a direction away from the second support part, so that the first diaphragm having a larger area can be disposed on the speaker. This improves a sound pressure level.
In a possible implementation, the support further includes the third support part and the fourth support part that are disposed opposite each other, the third support part and the fourth support part are connected between the first support part and the second support part, and the other two sides of the peripheral edges of the first diaphragm are separately fastened to the third support part and the fourth support part. In other words, the first support part, the third support part, the second support part, and the fourth support part may be sequentially connected to form a mounting frame part, and the peripheral edges of the first diaphragm are continuously fastened to the mounting frame part.
The support further includes a first frame part and a second frame part. The first frame part is located on a side that is of the third support part and that is away from the fourth support part, two ends of the first frame part are separately connected to one end of the first support part and one end of the second support part, and first connection space is formed between the first frame part and the third support part. The second frame part is located on a side that is of the fourth support part and that is away from the third support part, two ends of the second frame part are separately connected to the other end of the first support part and the other end of the second support part, and second connection space is formed between the second frame part and the fourth support part. Surfaces that are of the first frame part, the first support part, the second support part, and the second frame part and that are away from the first diaphragm are disposed in a coplanar manner.
In this implementation, surfaces that are of the first frame part, the first support part, the second support part, and the second frame part and that are away from the first diaphragm are jointly connected to form a bottom surface of the support. When the speaker is installed on another component, the speaker may be fastened to the another component by using the bottom surface of the support. In this case, space below the mounting part forms a part of a back cavity of the speaker. The first connection space between the first frame part and the third support part and the second connection space between the second frame part and the fourth support part each are also a part of the back cavity of the speaker. Therefore, designs of the first frame part and the second frame part facilitate increasing of back cavity space of the speaker. This improves a low-frequency sound pressure level of the speaker. In addition, the piezoelectric speaker core may share the back cavity with the moving coil speaker core by using the first connection space and the second connection space, so that total back cavity space of the speaker is relatively small. This facilitates miniaturization of the speaker.
In a possible implementation, the speaker further includes a second piezoelectric plate. The second piezoelectric plate and the first piezoelectric plate are separately fastened on two side surfaces of the first diaphragm. The second piezoelectric plate is a part of the piezoelectric speaker core. The piezoelectric speaker core includes the first piezoelectric plate and the second piezoelectric plate. The first piezoelectric plate and the second piezoelectric plate can simultaneously drive the first diaphragm, to improve sensitivity of the piezoelectric speaker core.
According to a second aspect, this application further provides an electronic device, including a housing and the foregoing speaker. The speaker is accommodated in the housing, the support is fixedly connected to the housing, the housing is provided with a connection hole, and the connection hole connects the speaker hole and external space of the electronic device.
In this application, because overall loudness of the speaker is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the electronic device to which the speaker is applied is relatively high, and sound quality is relatively good.
In a possible implementation, the housing includes a middle frame and a first cover plate, the first cover plate is fastened to one side of the middle frame, and a connection hole is disposed on a bezel part of the middle frame and/or the first cover plate. The speaker may be used as a loudspeaker of the electronic device, and the connection hole is disposed on the bezel part of the middle frame. Alternatively, the speaker may be used as an ear speaker of the electronic device, and the connection hole may be disposed on the bezel part of the middle frame, or may be disposed on the first cover plate, or may be partially disposed on the bezel part of the middle frame and partially disposed on the first cover plate.
In an optional implementation, the electronic device further includes a sealing element. The sealing element is mounted between the housing and the support, and is disposed around the speaker hole and the connection hole. In this implementation, the sealing element can separate the front cavity from the back cavity of the speaker, to reduce sound leakage in internal space of the electronic device. In addition, the front cavity and the back cavity of the piezoelectric speaker core are completely separated, which can effectively avoid an acoustic short circuit, so that sound making efficiency of the piezoelectric speaker core is ensured, and overall sound making efficiency of the speaker is relatively high.
In a possible implementation, the housing further includes a second cover plate, and the second cover plate is fastened to a side that is of the middle frame and that is away from the first cover plate. The support is fastened to the middle frame, the first diaphragm is disposed facing the first cover plate, and the moving coil speaker core is located between the first diaphragm and the second cover plate. A first back cavity is formed between the first diaphragm and the first cover plate, and a second back cavity is formed between the second diaphragm and the second cover plate. Both the first back cavity and the second back cavity are parts of the back cavity of the speaker.
In this implementation, the speaker can use free space inside the electronic device as the back cavity, so that the volume of the speaker can be reduced. This facilitates lightness and thinning of the speaker. In addition, the back cavity of the speaker has relatively large space, so that a low-frequency sound pressure level of the speaker can be effectively improved.
In a possible implementation, the second back cavity and the first back cavity are separated from or connected to each other. When the second back cavity and the first back cavity are connected to each other, and a low-frequency sound pressure level requirement of the speaker is basically ensured, a total requirement for space of the back cavity of the speaker can be properly reduced. This facilitates miniaturization of the electronic device. When the second back cavity and the first back cavity are separated from each other, mutual interference between vibration of the first diaphragm of the piezoelectric speaker core and vibration of the second diaphragm of the moving coil speaker core is relatively low. This helps improve sound quality of the speaker.
In a possible implementation, the electronic device further includes a first component, and a part or all of the first component is located between the first diaphragm and the second cover plate. In this implementation, the first diaphragm and the first component partially overlap in a thickness direction of the electronic device, to fully utilize thickness space of the electronic device. This facilitates miniaturization of the electronic device. In addition, the speaker fully utilizes of free space inside the entire electronic device, to increase an area of the first diaphragm. This improves a sound pressure level of the speaker.
In a possible implementation, the first component may be a component such as an electrical connector, a circuit board, or a microphone.
According to a third aspect, this application further provides a speaker module, including a module upper cover, a module lower cover, and the foregoing speaker. The module upper cover is fastened on a side that is of the support and on which the first diaphragm is mounted, and the module upper cover is fastened on the other side of the support. In this application, because overall loudness of the speaker is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the speaker module to which the speaker is applied is relatively high, and sound quality is relatively good.
In a possible implementation, a first back cavity is formed between the module upper cover and the first diaphragm, and a second back cavity is formed between the module lower cover and the second diaphragm. Both the first back cavity and the second back cavity are parts of the back cavity of the speaker module. The second back cavity and the first back cavity are separated from or connected to each other. When the second back cavity and the first back cavity are connected to each other, and a low-frequency sound pressure level requirement of the speaker module is basically ensured, a total requirement for space of the back cavity of the speaker can be properly reduced. This facilitates miniaturization of the speaker module. The second back cavity and the first back cavity may be connected to each other by using the first connection space and the second connection space, and the first connection space and the second connection space each are also a part of the back cavity of the speaker. When the second back cavity and the first back cavity are separated from each other, mutual interference between vibration of the first diaphragm of the piezoelectric speaker core and vibration of the second diaphragm of the moving coil speaker core is relatively low. This helps improve sound quality of the speaker module.
According to a fourth aspect, this application provides an electronic device, including a housing and the foregoing speaker module. The speaker module is accommodated in the housing, the module upper cover and/or the module lower cover are/is fixedly connected to the housing, the housing is provided with a connection hole, and the connection hole connects the speaker hole and external space of the electronic device. In this application, because overall loudness of the speaker in the speaker module is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the electronic device to which the speaker module is applied is relatively high, and sound quality is relatively good.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram of a structure of an electronic device according to an embodiment of this application;
FIG. 2 is a schematic exploded view of a part of the electronic device shown in FIG. 1 in some embodiments;
FIG. 3 is a schematic diagram of a structure of a speaker according to some embodiments of this application;
FIG. 4 is a schematic exploded view of the speaker shown in FIG. 3;
FIG. 5 is a schematic exploded view of the moving coil speaker core shown in FIG. 4;
FIG. 6 is a schematic diagram of a structure obtained after the speaker shown in FIG. 3 is cut along A-A;
FIG. 7 is a schematic diagram of a structure obtained after the speaker shown in FIG. 3 is cut along B-B;
FIG. 8 is a schematic diagram of a sound pressure level of the speaker shown in FIG. 3 in a possible implementation;
FIG. 9 is a schematic diagram 1 of a structure of the speaker shown in FIG. 3 when the speaker is used as a loudspeaker in the electronic device shown in FIG. 2;
FIG. 10 is a schematic diagram 2 of a structure of the speaker shown in FIG. 3 when the speaker is used as a loudspeaker in the electronic device shown in FIG. 2;
FIG. 11 is a schematic diagram of a structure of a speaker according to some other embodiments of this application;
FIG. 12 is a schematic diagram of a structure obtained after the speaker shown in FIG. 11 is cut along C-C;
FIG. 13 is a schematic diagram of a structure of the speaker shown in FIG. 11 when the speaker is used as a loudspeaker in the electronic device shown in FIG. 2;
FIG. 14 is a schematic diagram of a structure of a speaker module according to an embodiment of this application;
FIG. 15 is a schematic exploded view of a part of the speaker module shown in FIG. 14;
FIG. 16 is a schematic diagram of a structure obtained after the speaker module shown in FIG. 14 is cut along D-D;
FIG. 17 is a schematic diagram of a structure obtained after the speaker module shown in FIG. 14 is cut along E-E; and
FIG. 18 is a schematic diagram of a structure of the speaker module shown in FIG. 14 when the speaker module is used as a loudspeaker in the electronic device shown in FIG. 2.

DESCRIPTION OF EMBODIMENTS

The following describes embodiments of this application with reference to the accompanying drawings in embodiments of this application.
Embodiments of this application provide a speaker and a speaker module and an electronic device that include the speaker. The speaker is configured to convert an electrical signal into a sound signal. A dual diaphragm structure is formed in the speaker through coupling between a piezoelectric speaker core and a moving coil speaker core, and a diaphragm of the piezoelectric speaker core and a diaphragm of the moving coil speaker core are disposed opposite each other and share a front cavity, to complement medium-frequency and high-frequency responses of the speaker and improve overall loudness of the speaker.
The speaker may be independently installed in the electronic device, or may be used as a core of the speaker module and integrally installed in the electronic device along with the speaker module. The electronic device may be an electronic product having a sound play function, for example, a mobile phone, a tablet computer, a notebook computer, or a wearable device. The wearable device may be a smart band, a smart watch, a smart head-mounted display device, smart glasses, or the like.
FIG. 1 is a schematic diagram of a structure of an electronic device 100 according to an embodiment of this application. FIG. 2 is a schematic exploded view of a part of the electronic device 100 shown in FIG. 1 in some embodiments. In FIG. 1, an example in which the electronic device 100 is a mobile phone is used for description.
The electronic device 100 includes a housing 10, and a circuit board 20, a battery 30, a camera module 40, a loudspeaker 50, and an ear speaker 60 that are accommodated in the housing 10. In the following, for ease of describing the structure of the electronic device 100, an orientation of the electronic device 100 in FIG. 1 is used as an example. A width direction of the electronic device 100 is defined as an X direction, a length direction of the electronic device 100 is defined as a Y direction, and a thickness direction of the electronic device 100 is defined as a Z direction. The width direction X of the electronic device 100, the length direction Y of the electronic device 100, and the thickness direction Z of the electronic device 100 are perpendicular to each other.
The housing 10 includes a middle frame 101 and a first cover plate 102 and a second cover plate 103 that are separately fastened on two sides of the middle frame 101. In some embodiments, the first cover plate 102 may be a front cover plate of the electronic device 100, and the second cover plate 103 may be a rear cover plate of the electronic device 100. The first cover plate 102 includes a protection cover plate and a display panel that are disposed in a stacked manner. The display panel is fastened on a side that is of the protection cover plate and that faces the second cover plate 103. The display panel is configured to display an image, and the display panel may further be integrated with a touch function. The middle frame 101 includes a bezel part 1011 and a fastening part 1012 located on an inner side of the bezel part 1011. Two sides of the bezel part 1011 of the middle frame 101 are separately fixedly connected to peripheral edges of the first cover plate 102 and peripheral edges of the second cover plate 103. The fastening part 1012 of the middle frame 101 is located between the first cover plate 102 and the second cover plate 103, and is configured to fasten one or more components that are accommodated in the housing 10 and that are located in the electronic device 100. It should be noted that FIG. 2 shows only a part of a structure of the fastening part 1012 of the middle frame 101, and the other part of the structure of the fastening part 1012 of the middle frame 101 is not shown in FIG. 2. The bezel part 1011 and the fastening part 1012 of the middle frame 101 may be integrally molded, or may form an integrated structure in an assembly manner. This is not strictly limited in this application. The bezel part 1011 and the second cover plate 103 of the middle frame 101 may be integrally molded, or may form an integrated structure in an assembly manner. This is not strictly limited in this application.
For example, the circuit board 20, the battery 30, and the camera module 40 each are fixedly connected to the middle frame 101. A plurality of components 201 may be fastened on the circuit board 20. The plurality of components 201 include but are not limited to a processor, a memory, and the like. The memory is coupled to the processor. There may be one or more circuit boards 20. The battery 30 is configured to supply power to the electronic device 100. The camera module 40 is configured to collect light for photographing. For example, the camera module 40 is configured to perform rear-facing photographing of the electronic device 100, the second cover plate 103 is provided with a photographing through hole 1031, and the camera module 40 collects light through the photographing through hole 1031. The camera module 40 may include one or more cameras. In some other embodiments, the electronic device 100 may further include a camera module configured to perform front-facing photographing, or may include a camera module configured to collect a face image and/or a pupil image. None of a specific quantity, a type, and the like of camera modules is strictly limited in this application. In embodiments of this application, "A and/or B" includes three cases: "A", "B", and "A and B".
For example, both the loudspeaker 50 and the ear speaker 60 are fixedly connected to the middle frame 101 of the housing 10. The ear speaker 60 may also be referred to as an earpiece, and may be configured to transmit a voice of a peer party to a user during a non-handsfree call. The loudspeaker 50 may also be referred to as a horn, may be configured to amplify and play a voice of a peer party to the user during a handsfree call, and may further be applied to a scenario in which a sound or an audio signal needs to be played through the loudspeaker, such as music playing, voice navigation, or broadcast.
For example, the housing 10 is provided with a connection hole, and the connection hole connects inner space of the housing 10 and outer space of the housing 10, that is, connects internal space of the electronic device 100 and external space of the electronic device 100. A quantity and locations of connection holes on the housing 10 may be designed in combination with factors such as sound production types, arrangement locations, and sound emitting locations of the loudspeaker 50 and the ear speaker 60 of the electronic device 100.
In some embodiments, the loudspeaker 50 makes a sound by pushing air to vibrate by using a diaphragm. The loudspeaker 50 is fastened to the fastening part 1012 of the middle frame 101. The housing 10 includes a connection hole 104 used as a speaker grill. The connection hole 104 may be disposed on the bezel part 1011 of the middle frame 101. The loudspeaker 50 may transmit a sound to the external space of the electronic device 100 through the connection hole 104, to play the sound. There may be one or more connection holes 104. A quantity and shapes of the connection holes 104 may be designed in cooperation, so that a total cross-sectional area of the connection holes 104 meets a sound emitting requirement. The electronic device 100 may further include a sealing element 70. The sealing element 70 may be roughly in a frame shape. The sealing element 70 may be mounted between the bezel part 1011 of the middle frame 101 and the loudspeaker 50, and disposed around the connection hole 104, to reduce leakage of a sound in the internal space of the electronic device 100. For example, the sealing element 70 may be a double-sided tape, foam, or the like.
In some embodiments, the ear speaker 60 makes a sound by pushing air to vibrate by using a diaphragm. The housing 10 includes a connection hole 105 used as an earpiece grill. The connection hole 105 may be disposed on the first cover plate 102. The ear speaker 60 may transmit a sound to the external space of the electronic device 100 through the connection hole 105, to play the sound. In some other embodiments, the connection hole 105 may alternatively be disposed on the bezel part 1011 of the middle frame 101. In still some embodiments, the connection hole 105 may alternatively be partially disposed on the first cover plate 102 and partially disposed on the bezel part 1011 of the middle frame 101, and the two parts are jointed. In some other embodiments, the ear speaker 60 may alternatively make a sound in a sound-on-display manner. In this case, the connection hole 105 used as an earpiece grill may be omitted from the housing 10.
It may be understood that the foregoing descriptions show some implementations of the loudspeaker 50 and the ear speaker 60 of the electronic device 100. The loudspeaker 50 and the ear speaker 60 may alternatively have other implementations. This is not strictly limited in this application.
A speaker provided in an embodiment of this application is described below with reference to the accompanying drawings. The speaker may be used as the loudspeaker 50 and/or the ear speaker 60 of the electronic device 100.
FIG. 3 is a schematic diagram of a structure of a speaker 1 according to some embodiments of this application. FIG. 4 is a schematic exploded view of the speaker 1 shown in FIG. 3.
In some embodiments, the speaker 1 includes a support 11, a piezoelectric speaker core 12, and a moving coil speaker core 13. Both the piezoelectric speaker core 12 and the moving coil speaker core 13 are mounted on the support 11.
In some embodiments, the piezoelectric speaker core 12 includes a first diaphragm 121, a first piezoelectric plate 122, and a second piezoelectric plate 123. The first diaphragm 121 includes a middle part and peripheral edges disposed around the middle part. The peripheral edges of the first diaphragm 121 are fastened to the support 11. The first piezoelectric plate 122 and the second piezoelectric plate 123 are fastened to the middle part of the first diaphragm 121, and are separately fastened on two side surfaces of the first diaphragm 121. For example, the first piezoelectric plate 122 is located on a side that is of the first diaphragm 121 and that is away from the support 11, and the second piezoelectric plate 123 is located on a side that is of the first diaphragm 121 and that faces the support 11. In some other embodiments, a position of the first piezoelectric plate 122 and a position of the second piezoelectric plate 123 may be exchanged with each other.
The first piezoelectric plate 122 and the second piezoelectric plate 123 are deformed when being powered on, to drive the first diaphragm 121 to vibrate, so that the piezoelectric speaker core 12 makes a sound. Alternatively, in some other embodiments, the piezoelectric speaker core 12 may include a first piezoelectric plate 122, and include no second piezoelectric plate 123. The first piezoelectric plate 122 is located on a side that is of the first diaphragm 121 and that is away from the support 11 or on a side that is of the first diaphragm 121 and that faces the support 11. The piezoelectric speaker core 12 drives, by using the first piezoelectric plate 122, the first diaphragm 121 to vibrate.
The first diaphragm 121 may be in a rectangular shape. In some embodiments, the first diaphragm 121 may be a metal sheet, an organic sheet, or the like. In some embodiments, a thickness of the first diaphragm 121 may be in a range from 50 µm to 0.3 mm. When an area of the first diaphragm 121 is relatively large, a relatively large thickness may be selected.
The first piezoelectric plate 122 and the second piezoelectric plate 123 may be in rectangular shapes. In some other embodiments, the first diaphragm 121 may alternatively be in another shape such as a circle. In some other embodiments, the first piezoelectric plate 122 and/or the second piezoelectric plate 123 may alternatively be in another shape such as a circle. For example, shapes of the first piezoelectric plate 122 and the second piezoelectric plate 123 may be the same as a shape of the first diaphragm 121, and sizes of the first piezoelectric plate 122 and the second piezoelectric plate 123 are smaller than a size of the first diaphragm 121.
In some embodiments, the support 11 includes a first support part 111 and a second support part 112 that are disposed opposite each other, and a third support part 113 and a fourth support part 114 that are disposed opposite each other. The third support part 113 and the fourth support part 114 are connected between the first support part 111 and the second support part 112. For example, the first support part 111, the third support part 113, the second support part 112, and the fourth support part 114 may be sequentially connected to form a mounting frame part 110, and the peripheral edges of the first diaphragm 121 are continuously fastened to the mounting frame part 110. The support 11 is provided with a speaker hole 115, and the speaker hole 115 is disposed on the first support part 111. The speaker hole 115 passes through the first support part 111, to connect space on two sides of the first support part 111.
In some embodiments, the support 11 further includes a mounting part 116. The mounting part 116 is connected between the first support part 111 and the second support part 112. The mounting part 116 is further connected between the third support part 113 and the fourth support part 114. The mounting part 116 is provided with a mounting hole 1161. The mounting hole 1161 connects top-side space and bottom-side space of the mounting part 116. For example, the mounting hole 1161 may be roughly in a rectangular shape. In some other embodiments, the mounting hole 1161 may alternatively be in another shape such as a circle, and a shape of the mounting hole 1161 matches an appearance of the moving coil speaker core 13. It may be understood that orientation terms such as "top" and "bottom" used in embodiments of this application are mainly described based on orientations of related structures in the accompanying drawings, and do not constitute a limitation on orientations of the related structures in an actual application scenario.
In some embodiments, the support 11 may further include a first frame part 117 and a second frame part 118. The first frame part 117 and the second frame part 118 are separately fastened on two sides of the mounting frame part 110. The first frame part 117 is located on a side that is of the third support part 113 and that is away from the fourth support part 114, two ends of the first frame part 117 are separately connected to one end of the first support part 111 and one end of the second support part 112, and first connection space 1171 is formed between the first frame part 117 and the third support part 113. The second frame part 118 is located on a side that is of the fourth support part 114 and that is away from the third support part 113, two ends of the second frame part 118 are separately connected to the other end of the first support part 111 and the other end of the second support part 112, and second connection space 1181 is formed between the second frame part 118 and the fourth support part 114.
FIG. 5 is a schematic exploded view of the moving coil speaker core 13 shown in FIG. 4.
In some embodiments, the moving coil speaker core 13 includes a basin support 131, a vibration component 13a, and a magnetic circuit component 13b. The vibration component 13a and the magnetic circuit component 13b are mounted on the basin support 131. The vibration component 13a includes a second diaphragm 132 and a voice coil 133. Peripheral edges of the second diaphragm 132 are fastened on one side of the basin support 131, and the voice coil 133 is fastened on a side that is of the second diaphragm 132 and that faces the basin support 131. The magnetic circuit component 13b includes a lower electrode plate 134, a center magnet 135, a plurality of side magnets 136, a center electrode plate 137, and a side electrode plate 138. The lower electrode plate 134 is fastened on the other side of the basin support 131. The center magnet 135 and the plurality of side magnets 136 are all fastened on a side that is of the lower electrode plate 134 and that faces the basin support 131. The plurality of side magnets 136 are dispersedly arranged on a periphery of the center magnet 135. The center electrode plate 137 is fastened on a side that is of the center magnet 135 and that is away from the lower electrode plate 134. The side electrode plate 138 is fastened to the basin support 131, located on sides that are of the plurality of side magnets 136 and that are away from the lower electrode plate 134, and disposed around the center electrode plate 137. A first gap is formed between the plurality of side magnets 136 and the center magnet 135, a second gap is formed between the side electrode plate 138 and the center electrode plate 137, and the second gap is connected to the first gap to be combined into a magnetic gap. An end that is of the voice coil 133 and that is away from the second diaphragm 132 is inserted into the magnetic gap of the magnetic circuit component 13b. The magnetic circuit component 13b provides a magnetic field that drives the voice coil 133 to vibrate. When the voice coil 133 is powered on, the voice coil 133 drives the second diaphragm 132 to vibrate, so that the moving coil speaker core 13 makes a sound.
In some embodiments, the second diaphragm 132 may include a vibration part 1321 and a dome part 1322. Peripheral edges of the vibration part 1321 are fastened to the basin support 131, and the dome part 1322 is fastened to a middle part of the vibration part 1321. The dome part 1322 may be fastened on a side that is of the vibration part 1321 and that faces the basin support 131 or is away from the basin support 131. The dome part 1322 is roughly in a flat plate shape, and the vibration part 1321 is roughly in a folded ring shape.
FIG. 6 is a schematic diagram of a structure obtained after the speaker 1 shown in FIG. 3 is cut along A-A. FIG. 7 is a schematic diagram of a structure obtained after the speaker 1 shown in FIG. 3 is cut along B-B.
The peripheral edges of the first diaphragm 121 of the piezoelectric speaker core 12 are fastened to the support 11. Two sides of the peripheral edges of the first diaphragm 121 are separately fastened to the first support part 111 and the second support part 112, and the other two sides of the peripheral edges of the first diaphragm 121 are separately fastened to the third support part 113 and the fourth support part 114. The first piezoelectric plate 122 and the second piezoelectric plate 123 are separately fastened on two side surfaces of the first diaphragm 121.
The moving coil speaker core 13 is fastened to the support 11 and is spaced from the first diaphragm 121. For example, the moving coil speaker core 13 is fastened to the mounting part 116, and a part or all of the moving coil speaker core 13 is accommodated in the mounting hole 1161 of the mounting part 116. In this case, the moving coil speaker core 13 is roughly located below the piezoelectric speaker core 12.
The second diaphragm 132 of the moving coil speaker core 13 is disposed facing the first diaphragm 121. The second diaphragm 132, the support 11, and the first diaphragm 121 jointly enclose a front cavity 1a. For example, the second diaphragm 132, the mounting part 116, the mounting frame part 110, and the first diaphragm 121 jointly enclose the front cavity 1a. The speaker hole 115 of the support 11 connects the front cavity 1a and external space of the speaker 1. When the speaker 1 is powered on and works, the first diaphragm 121 and the second diaphragm 132 push air in the front cavity 1a to vibrate, and the speaker 1 makes a sound to the external space through the speaker hole 115.
In this embodiment, the speaker 1 integrates the piezoelectric speaker core 12 and the moving coil speaker core 13, and the first diaphragm 121 of the piezoelectric speaker core 12 and the second diaphragm 132 of the moving coil speaker core 13 can simultaneously push air in the front cavity 1a to vibrate, to make a sound. Therefore, compared with loudness of a conventional moving coil speaker, overall loudness of the speaker 1 in this embodiment of this application is significantly improved. Compared with the conventional moving coil speaker, the speaker 1 in this embodiment of this application can complement medium-frequency and high-frequency responses by using the piezoelectric speaker core 12, so that medium-frequency and high-frequency sound pressure levels of the speaker 1 are significantly improved.
In addition, because the piezoelectric speaker core 12 is relatively thin, top space of the second diaphragm 132 of the moving coil speaker core 13 may be used for arrangement. The first diaphragm 121 and the second diaphragm 132 are disposed opposite each other and share the front cavity. Therefore, when the dual diaphragm structure is implemented, the speaker 1 can help save space without obviously increasing an overall volume, and the speaker 1 may still have a relatively small thickness and a relatively small overall volume.
The speaker 1 in this embodiment of this application is verified through emulation, experiments, and the like. For medium-frequency and high-frequency bands, compared with the conventional moving coil speaker, the speaker 1 in this embodiment of this application can increase a sound pressure level in a frequency band from 1 Hz to 10 kHz, and expand a frequency response width and increase a sound pressure level in a frequency band from 10 kHz to 20 kHz.
FIG. 8 is a schematic diagram of a sound pressure level of the speaker 1 shown in FIG. 3 in a possible implementation. As shown in FIG. 8, a total sound pressure level of the speaker 1 in this embodiment is better than those of a conventional piezoelectric speaker and the conventional moving coil speaker. Compared with those of the conventional moving coil speaker, the medium-frequency and high-frequency sound pressure levels of the speaker 1 in this embodiment are significantly improved.
It may be understood that, as shown in FIG. 6, the speaker 1 in this embodiment of this application may adjust vibration directions and amplitudes of the first diaphragm 121 and the second diaphragm 132 by controlling amplitudes and phases of drive voltages of the piezoelectric speaker core 12 and the moving coil speaker core 13, so as to implement vibration reduction. In some embodiments, the piezoelectric speaker core 12 may enable, based on a ratio of vibration mass of the second diaphragm 132 to vibration mass of the first diaphragm 121, and a vibration direction and an amplitude of the second diaphragm 132, a drive voltage of the piezoelectric speaker core 12 to match an appropriate amplitude and phase, to control a vibration direction and an amplitude of the first diaphragm 121, so that a momentum change of the first diaphragm 121 is equal to or close to a momentum change of the second diaphragm 132. This implements vibration reduction. In some other embodiments, the moving coil speaker core 13 may enable, based on a ratio of vibration mass of the first diaphragm 121 to vibration mass of the second diaphragm 132, and a vibration direction and an amplitude of the first diaphragm 121, a drive voltage of the moving coil speaker core 13 to match an appropriate amplitude and phase, to control a vibration direction and an amplitude of the second diaphragm 132, so that a momentum change of the second diaphragm 132 is equal to or close to a momentum change of the first diaphragm 121. This implements vibration reduction. A manner of adjusting the drive voltages and the phases of the piezoelectric speaker core 12 and the moving coil speaker core 13 is not strictly limited in this application, provided that the drive voltage and the phase finally match each other.
When the momentum change of the first diaphragm 121 is equal to the momentum change of the second diaphragm 132, M₁V₁=M₂V₂. M₁ is a mass of the first diaphragm 121, V₁ is a vibration speed of the first diaphragm 121, M₂ is a mass of the second diaphragm 132, and V₂ is a vibration speed of the second diaphragm 132.
When the piezoelectric speaker core 12 and the moving coil speaker core 13 are fastened to the support 11, a correct electrode connection manner needs to be selected, so that the drive voltages of the piezoelectric speaker core 12 and the moving coil speaker core 13 can correctly drive the diaphragms to vibrate, to meet a vibration requirement. For example, when the second diaphragm 132 vibrates in a direction close to the first diaphragm 121, the first diaphragm 121 vibrates in a direction close to the second diaphragm 132, that is, the first diaphragm 121 and the second diaphragm 132 vibrate in directions close to each other, air in the front cavity 1a is squeezed by the first diaphragm 121 and the second diaphragm 132, and is pushed out to the external space of the speaker 1 through the speaker hole 115. When the second diaphragm 132 vibrates in a direction away from the first diaphragm 121, the first diaphragm 121 vibrates in a direction away from the second diaphragm 132, that is, the first diaphragm 121 and the second diaphragm 132 vibrate in directions away from each other, air in the external space of the speaker 1 is sucked into the front cavity 1a through the speaker hole 115.
In this embodiment of this application, the speaker 1 may separately drive, by using two power amplifiers (power amplifier, PA), the piezoelectric plates (122 and 123) of the piezoelectric speaker core 12 and the voice coil 133 of the moving coil speaker core 13, to better meet drive voltage requirements of the two cores of the speaker 1. For example, the drive voltage of the piezoelectric speaker core 12 may be about 30 V, and the drive voltage of the moving coil speaker core 13 may be about 12 V. Certainly, in some other embodiments, driving may alternatively be implemented by using a same power amplifier.
As shown in FIG. 6, in some embodiments, a spacing between the first diaphragm 121 and the dome part 1322 of the second diaphragm 132 increases in a direction from the second support part 112 to the first support part 111. In this embodiment, the first diaphragm 121 is inclined relative to the second diaphragm 132, the first diaphragm 121 and the second diaphragm 132 roughly form a horn shape, and an opening direction of the horn faces the speaker hole 115. This facilitates acoustic impedance matching between the speaker 1 and the outside, improves sound making efficiency, and reduces an airflow noise generation risk.
When an inclination degree of the first diaphragm 121 relative to the second diaphragm 132 is in a specific angle, airflow noise of the speaker 1 can be reduced to a very low degree, and sound quality of the speaker 1 is better. However, an inclination degree of the first diaphragm 121 relative to the second diaphragm 132 affects an overall thickness of the speaker 1. Consequently, it is difficult for the speaker 1 to be applied to an electronic device 100 having relatively limited internal space. Therefore, the speaker 1 can balance an airflow noise reduction requirement and an installation space requirement, to properly design an inclination degree of the first diaphragm 121 relative to the second diaphragm 132. In some other embodiments, the first diaphragm 121 and the dome part 1322 of the second diaphragm 132 may alternatively be parallel to each other.
For example, a minimum spacing between the first diaphragm 121 and the second diaphragm 132 needs to meet vibration space requirements of the first diaphragm 121 and the second diaphragm 132. Therefore, when the overall volume of the speaker 1 can be controlled within a proper range, a larger spacing between the first diaphragm 121 and the second diaphragm 132 is better. In some embodiments, a minimum spacing between the first diaphragm 121 and the second diaphragm 132 may be 0.7 mm
As shown in FIG. 6 and FIG. 7, in some embodiments, an area of the first diaphragm 121 is greater than or equal to an area of the second diaphragm 132. In the conventional moving coil speaker, because an overall volume of a module is greatly limited, it is difficult to increase a diaphragm area of the module. In this embodiment, when the area of the second diaphragm 132 is limited, the first diaphragm 121 having a relatively larger area is disposed on the speaker 1, to improve a sound pressure level. In addition, a larger area of the first diaphragm 121 helps the speaker 1 obtain a larger front cavity 1a, so that the speaker 1 has less noise and better sound quality.
In this embodiment, the mounting frame part 110 of the support 11 is disposed around a periphery of the mounting part 116, the peripheral edges of the first diaphragm 121 are fastened to the mounting frame part 110, and the second diaphragm 132 is mounted to the mounting part 116, so that the area of the first diaphragm 121 can be greater than the area of the second diaphragm 132. In some other embodiments, the support 11 may alternatively have another structure, to meet mounting space requirements of the first diaphragm 121 and the second diaphragm 132. For example, the mounting frame part 110 and the mounting part 116 are stacked from top to bottom, the mounting frame part 110 is in a horn shape in a direction away from the mounting part 116, and an end that is of the mounting frame part 110 and that is away from the mounting part 116 has a relatively large opening region, to meet a mounting space requirement of the first diaphragm 121.
In some other embodiments, an area of the first diaphragm 121 may alternatively be equal to or less than an area of the second diaphragm 132. This is not strictly limited in embodiments of this application.
In some embodiments, as shown in FIG. 6 and FIG. 7, surfaces that are of the first frame part 117, the first support part 111, the second support part 112, and the second frame part 118 of the support 11 and that are away from the first diaphragm 121 are disposed in a coplanar manner. In this embodiment, a bottom surface of the first frame part 117, a bottom surface of the first support part 111, a bottom surface of the second support part 112, and a bottom surface of the second frame part 118 are jointly connected to form a bottom surface of the support 11. When the speaker 1 is installed on another component, the speaker 1 may be fastened to the another component by using the bottom surface of the support 11. In this case, space below the mounting part 116 forms a part of a back cavity of the speaker 1. The first connection space 1171 between the first frame part 117 and the third support part 113 and the second connection space 1181 between the second frame part 118 and the fourth support part 114 each are also a part of the back cavity of the speaker 1. Therefore, designs of the first frame part 117 and the second frame part 118 facilitate increasing of back cavity space of the speaker 1. This improves a low-frequency sound pressure level of the speaker 1. In addition, the piezoelectric speaker core 12 may share the back cavity with the moving coil speaker core 13 by using the first connection space 1171 and the second connection space 1181, so that total back cavity space of the speaker 1 is relatively small. This facilitates miniaturization of the speaker 1.
In some other embodiments, the speaker 1 is fastened to another component by using a bottom surface of the mounting frame part 110 of the speaker 1, and space below the mounting part 116 forms a part of back cavity space of the speaker 1. When the back cavity space of the speaker 1 is sufficient, the first frame part 117 and the second frame part 118 may alternatively be omitted from the support 11, to reduce the volume of the speaker 1.
FIG. 9 is a schematic diagram 1 of a structure of the speaker 1 shown in FIG. 3 when the speaker 1 is used as the loudspeaker 50 in the electronic device 100 shown in FIG. 2. FIG. 10 is a schematic diagram 2 of a structure of the speaker 1 shown in FIG. 3 when the speaker 1 is used as the loudspeaker 50 in the electronic device 100 shown in FIG. 2.
The speaker 1 is accommodated in the housing 10 of the electronic device 100, and the support 11 of the speaker 1 is fixedly connected to the housing 10. In some embodiments, the support 11 is fastened to the middle frame 101. For example, the support 11 may be fixedly connected to the fastening part 1012 of the middle frame 101. The support 11 may be mutually fastened to the fastening part 1012 of the middle frame 101 in a bonding manner, or may be mutually fastened to the fastening part 1012 of the middle frame 101 in another manner such as clamping or welding. This is not strictly limited in this application. The first diaphragm 121 is disposed facing the first cover plate 102, and the moving coil speaker core 13 is located between the first diaphragm 121 and the second cover plate 103. The front cavity 1a of the speaker 1 is located between the first diaphragm 121 and the second diaphragm 132. A first back cavity 106 is formed between the first diaphragm 121 and the first cover plate 102, a second back cavity 107 is formed between the second diaphragm 132 and the second cover plate 103, and the second back cavity 107 is connected to the first back cavity 106. For example, the second back cavity 107 is connected to the first back cavity 106 by using the first connection space 1171 and the second connection space 1181. The first back cavity 106, the second back cavity 107, the first connection space 1171, and the second connection space 1181 each are a part of the back cavity 1b of the speaker 1.
The housing 10 is provided with a connection hole 104. For example, the connection hole 104 is disposed on the bezel part 1011 of the middle frame 101. The connection hole 104 connects the speaker hole 115 and the external space of the electronic device 100. In this case, the front cavity 1a of the speaker 1, the speaker hole 115 of the speaker 1, the connection hole 104 of the housing 10, and the external space of the electronic device 100 are connected, so that a sound from the speaker 1 can smoothly propagate to the outside of the electronic device 100.
In this embodiment, because overall loudness of the speaker 1 is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the electronic device 100 to which the speaker 1 is applied is relatively high, and sound quality is relatively good. In addition, the speaker 1 can use free space inside the electronic device 100 as the back cavity 1b, so that the volume of the speaker 1 can be reduced. This facilitates lightness and thinning of the speaker 1. In addition, the back cavity 1b of the speaker 1 has relatively large space, so that a low-frequency sound pressure level of the speaker 1 can be effectively improved. In addition, because the second back cavity 107 and the first back cavity 106 of the speaker 1 are connected to each other, when a low-frequency sound pressure level requirement of the speaker 1 is basically ensured, a total requirement for space of the back cavity 1b of the speaker 1 can be properly reduced. This facilitates miniaturization of the electronic device 100.
In some other embodiments, for the speaker 1, a structure of the support 11 of the speaker 1 may be changed, a structure of the fastening part 1012 of the middle frame 101 may be changed, a fitting structure between the support 11 and the fastening part 1012 of the middle frame 101 may be changed, or the like, so that the second back cavity 107 and the first back cavity 106 are separated from each other. In this case, mutual interference between vibration of the first diaphragm 121 of the piezoelectric speaker core 12 and vibration of the second diaphragm 132 of the moving coil speaker core 13 is relatively low. This helps improve sound quality of the speaker 1.
In some embodiments, as shown in FIG. 9, the sealing element 70 of the electronic device 100 is mounted between the support 11 and the bezel part 1011 of the middle frame 101, and the sealing element 70 is disposed around the speaker hole 115 and the connection hole 104, to separate the front cavity 1a from the back cavity 1b of the speaker 1. This reduces leakage of a sound in the internal space of the electronic device 100. In addition, the front cavity and the back cavity of the piezoelectric speaker core 12 are completely separated, which can effectively avoid an acoustic short circuit, so that sound making efficiency of the piezoelectric speaker core 12 is ensured, and overall sound making efficiency of the speaker 1 is relatively high.
In this embodiment of this application, a partial structure of the support 11 of the speaker 1 may be changed, to mount the first diaphragm 121 having a larger area, so as to improve a sound pressure level. For example, for the speaker 1, in a case that the basic frame of the support 11 is kept, a top that is of the first support part 111 and that is configured to fasten the first diaphragm 121 is enabled to protrude in a direction away from the second support part 112, so that a spacing between the protruding top of the first support part 111 and the second support part 112 is relatively large, to fasten the first diaphragm 121 having a larger area. In addition, a relative position relationship between the bottom of the first support part 111 and the other parts of the support 11 has no change or has no obvious change, so that installation difficulty is relatively low when the speaker 1 is installed by using the bottom of the support 11. The following embodiment provides an example for description.
FIG. 11 is a schematic diagram of a structure of a speaker 1 according to some other embodiments of this application. FIG. 12 is a schematic diagram of a structure obtained after the speaker 1 shown in FIG. 11 is cut along C-C. The speaker 1 in this embodiment may include some or all features of the speaker 1 in the foregoing embodiment. The following mainly describes a difference of the speaker 1 in this embodiment.
For example, the first support part 111 includes a first sub-support part 111a and a second sub-support part 111b. The second sub-support part 111b is connected to the mounting part 116, and the first sub-support part 111a is connected to the second sub-support part 111b and the first diaphragm 121. The first sub-support part 111a protrudes relative to the second sub-support part 111b in a direction away from the second support part 112.
In this embodiment, because the first sub-support part 111a of the speaker 1 protrudes relative to the second sub-support part 111b in a direction away from the second support part 112, when the speaker 1 has no obvious change in a bottom structure and a size of the support 11, the first sub-support part 111a that is of the first support part 111 and that is configured to fasten the first diaphragm 121 protrudes in a direction away from the second support part 112, so that the first diaphragm 121 having a larger area can be disposed on the speaker 1. This improves a sound pressure level.
In some embodiments, as shown in FIG. 12, the first sub-support part 111a is fastened on a side that is of the second sub-support part 111b and that is away from the second support part 112. A surface 111c that is of the second sub-support part 111b and that faces the first diaphragm 121 may be disposed in an inclined manner, and an end that is of the surface 111c and that is close to the first sub-support part 111a is close to the first diaphragm 121, so that a connection area of the first sub-support part 111a and the second sub-support part 111b is relatively large, reliability of a connection between the first sub-support part 111a and the second sub-support part 111b is high. An end that is of the surface 111c and that is close to the mounting part 116 is far away from the first diaphragm 121, to increase space of the front cavity 1a of the speaker 1 and provide sufficient vibration space for the first diaphragm 121. In some other embodiments, the first sub-support part 111a may alternatively be fastened on a side that is of the second sub-support part 111b and that faces the first diaphragm 121, and an end that is of the first sub-support part 111a and that is away from the second sub-support part 111b is inclined toward a direction away from the second support part 112.
FIG. 13 is a schematic diagram of a structure of the speaker 1 shown in FIG. 11 when the speaker is used as the loudspeaker 50 in the electronic device 100 shown in FIG. 2. For example, the second sub-support part 111b of the first support part 111 of the support 11 of the speaker 1 and the second support part 112 are fastened to the fastening part 1012 of the middle frame 101. The electronic device 100 further includes a first component 80, and a part or all of the first component 80 is located between the first diaphragm 121 and the second cover plate 103. For example, the first component 80 may be a component such as an electrical connector, a circuit board, or a microphone. In this case, the first diaphragm 121, the first sub-support part 111a, and the first component 80 partially overlap in a thickness direction Z of the electronic device 100, to fully utilize thickness space of the electronic device 100. This facilitates miniaturization of the electronic device 100. In addition, the speaker 1 fully utilizes free space inside the entire electronic device 100, to increase an area of the first diaphragm 121. This improves a sound pressure level of the speaker 1.
In some other embodiments, when the free space inside the electronic device 100 is located in another position around the speaker 1, a structure of the support 11 of the speaker 1 may also be adaptively adjusted, so that the first diaphragm 121 can fully utilize the free space to increase an area. For example, in an embodiment in which neither of the first frame part 117 and the second frame part 118 is disposed on the support 11, a top of the third support part 113 may protrude relative to a bottom of the third support part 113 in a direction away from the fourth support part 114, to increase an area of the first diaphragm 121 by using free space on an outer side of the third support part 113. Atop of the fourth support part 114 may protrude relative to a bottom of the fourth support part 114 in a direction away from the third support part 113, to increase the area of the first diaphragm 121 by using free space on an outer side of the fourth support part 114.
It should be noted that, in some other embodiments, when the support 11 meets the requirements described above, such as the support requirements for the piezoelectric speaker core 12 and the moving coil speaker core 13, and the space requirements for the front cavity 1a and the speaker hole 115, the support 11 may be designed in a structure different from that in the foregoing embodiment. This is not strictly limited in this application.
It should be noted that the foregoing mainly describes embodiments in which the speaker 1 shown in FIG. 3 and the speaker 1 shown in FIG. 11 are used as the loudspeaker 50 in the electronic device 100. The speaker 1 shown in FIG. 3 and the speaker 1 shown in FIG. 11 may alternatively be used as the ear speaker 60 in the electronic device 100 (as shown in FIG. 2). The front cavity 1a of the speaker 1 is connected to the connection hole 105. More specific details of this application are not described again.
FIG. 14 is a schematic diagram of a structure of a speaker module 2 according to an embodiment of this application. FIG. 15 is a schematic exploded view of a part of the speaker module 2 shown in FIG. 14.
The speaker module 2 includes a module upper cover 21, a module lower cover 22, and the speaker 1 described above. The module upper cover 21 is fastened on a side that is of the support 11 and on which the first diaphragm 121 is mounted, and the module upper cover 21 is fastened on the other side of the support 11. In other words, the module upper cover 21 and the module lower cover 22 are separately fastened on the two sides of the support 11. The module upper cover 21 and the module lower cover 22 may be mutually fastened to the support 11 in a manner such as bonding. In this embodiment, because overall loudness of the speaker 1 is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the speaker module 2 to which the speaker 1 is applied is relatively high, and sound quality is relatively good.
The module upper cover 21 is provided with a first leakage hole 211, and the first leakage hole 211 connects space on two sides of the module upper cover 21. The module lower cover 22 is provided with a second leakage hole 221, and the second leakage hole 221 connects space on two sides of the module lower cover 22.
FIG. 16 is a schematic diagram of a structure obtained after the speaker module 2 shown in FIG. 14 is cut along D-D. FIG. 17 is a schematic diagram of a structure obtained after the speaker module 2 shown in FIG. 14 is cut along E-E.
A first back cavity 212 is formed between the module upper cover 21 and the first diaphragm 121, a second back cavity 222 is formed between the module lower cover 22 and the second diaphragm 132, and the second back cavity 222 is connected to the first back cavity 212. The second back cavity 222 and the first back cavity 212 are connected to each other by using the first connection space 1171 and the second connection space 1181. The first back cavity 212, the second back cavity 222, the first connection space 1171, and the second connection space 1181 each are a part of a back cavity of the speaker module 2. In this embodiment, because the second back cavity 222 and the first back cavity 212 are connected to each other, the first diaphragm 121 and the second diaphragm 132 share the back cavity, so that a requirement for a total space size of the back cavity of the speaker module 2 can be reduced. This facilitates miniaturization of the speaker module 2.
The first leakage hole 211 is connected to the first back cavity 212, and the second leakage hole 221 is connected to the second back cavity 222. In some other embodiments, either the first leakage hole 211 or the second leakage hole 221 may be omitted from the speaker module 2.
In some other embodiments, the second back cavity 222 and the first back cavity 212 may alternatively be separated from each other. For example, the first frame part 117 and the second frame part 118 of the support 11 may be omitted, and the module upper cover 21 and the module lower cover 22 are connected to the mounting frame part 110 of the support 11.
FIG. 18 is a schematic diagram of a structure of the speaker module 2 shown in FIG. 14 when the speaker module 2 is used as the loudspeaker 50 in the electronic device 100 shown in FIG. 2. The electronic device 100 in this embodiment may include some or all features of the electronic device 100 in the foregoing embodiment. The following mainly describes a difference of the electronic device 100 in this embodiment.
The speaker module 2 is accommodated in the housing 10, and the module lower cover 22 is fixedly connected to the housing 10. For example, the module lower cover 22 is fixedly connected to the fastening part 1012 of the middle frame 101 of the housing 10. The housing 10 is provided with the connection hole 104, and the connection hole 104 connects the speaker hole 115 and the external space of the electronic device 100. In this embodiment, because overall loudness of the speaker 1 in the speaker module 2 is relatively high, and medium-frequency and high-frequency sound pressure levels are relatively high, sound volume of a sound played by the electronic device 100 to which the speaker module 2 is applied is relatively high, and sound quality is relatively good.
In some other embodiments, the speaker module 2 may alternatively be fixedly connected to the housing 10 by using the module upper cover 21, or both the module upper cover 21 and the module lower cover 22 are fixedly connected to the housing 10. A manner of fastening the speaker module 2 to the electronic device 100 is not strictly limited in this application.
The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. When no conflict occurs, embodiments of this application and the features in the embodiments may be mutually combined. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A speaker, comprising a support, a first diaphragm, a first piezoelectric plate, and a moving coil speaker core, wherein
peripheral edges of the first diaphragm are fastened to the support, and the first piezoelectric plate is fastened to a middle part of the first diaphragm; and

the moving coil speaker core is fastened to the support and is spaced from the first diaphragm, the moving coil speaker core comprises a second diaphragm, the second diaphragm is disposed facing the first diaphragm, the second diaphragm, the support, and the first diaphragm jointly enclose a front cavity, the support is provided with a speaker hole, and the speaker hole connects the front cavity and external space of the speaker.
The speaker according to claim 1, wherein the support comprises a first support part and a second support part that are disposed opposite each other, two sides of the peripheral edges of the first diaphragm are separately fastened to the first support part and the second support part, and the speaker hole is disposed on the first support part;
the second diaphragm comprises a vibration part and a dome part, and the dome part is fastened to a middle part of the vibration part; and

a spacing between the first diaphragm and the dome part increases in a direction from the second support part to the first support part.
The speaker according to claim 2, wherein an area of the first diaphragm is greater than or equal to an area of the second diaphragm.
The speaker according to claim 3, wherein the support further comprises a mounting part, the mounting part is connected between the first support part and the second support part, the mounting part is provided with a mounting hole, the moving coil speaker core is fastened to the mounting part, and a part or all of the moving coil speaker core is accommodated in the mounting hole.
The speaker according to claim 4, wherein the first support part comprises a first sub -support part and a second sub-support part, the second sub-support part is connected to the mounting part, the first sub-support part is connected to the second sub-support part and the first diaphragm, and the first sub-support part protrudes relative to the second sub-support part in a direction away from the second support part.
The speaker according to any one of claims 2 to 5, wherein the support further comprises a third support part and a fourth support part that are disposed opposite each other, the third support part and the fourth support part are connected between the first support part and the second support part, and the other two sides of the peripheral edges of the first diaphragm are separately fastened to the third support part and the fourth support part;
the support further comprises a first frame part and a second frame part, the first frame part is located on a side that is of the third support part and that is away from the fourth support part, two ends of the first frame part are separately connected to one end of the first support part and one end of the second support part, first connection space is formed between the first frame part and the third support part, the second frame part is located on a side that is of the fourth support part and that is away from the third support part, two ends of the second frame part are separately connected to the other end of the first support part and the other end of the second support part, and second connection space is formed between the second frame part and the fourth support part; and

surfaces that are of the first frame part, the first support part, the second support part, and the second frame part and that are away from the first diaphragm are disposed in a coplanar manner.
The speaker according to any one of claims 1 to 5, wherein the speaker further comprises a second piezoelectric plate, and the second piezoelectric plate and the first piezoelectric plate are separately fastened on two side surfaces of the first diaphragm.
An electronic device, comprising a housing and the speaker according to any one of claims 1 to 7, wherein the speaker is accommodated in the housing, a support is fixedly connected to the housing, the housing is provided with a connection hole, and the connection hole connects a speaker hole and external space of the electronic device.
The electronic device according to claim 8, wherein the housing comprises a middle frame and a first cover plate, the first cover plate is fastened on one side of the middle frame, and the connection hole is disposed on a bezel part of the middle frame and/or the first cover plate.
The electronic device according to claim 9, wherein the housing further comprises a second cover plate, and the second cover plate is fastened on a side that is of the middle frame and that is away from the first cover plate;
the support is fastened to the middle frame, a first diaphragm is disposed facing the first cover plate, and a moving coil speaker core is located between the first diaphragm and the second cover plate; and

a first back cavity is formed between the first diaphragm and the first cover plate, a second back cavity is formed between a second diaphragm and the second cover plate, and the second back cavity and the first back cavity are separated from or connected to each other.
The electronic device according to claim 10, wherein the electronic device further comprises a first component, and a part or all of the first component is located between the first diaphragm and the second cover plate.
A speaker module, comprising a module upper cover, a module lower cover, and the speaker according to any one of claims 1 to 7, wherein the module upper cover is fastened on a side that is of a support and on which a first diaphragm is mounted, and the module upper cover is fastened on the other side of the support; and
a first back cavity is formed between the module upper cover and the first diaphragm, a second back cavity is formed between the module lower cover and a second diaphragm, and the second back cavity and the first back cavity are separated from or connected to each other.
An electronic device, comprising a housing and the speaker module according to claim 12, wherein the speaker module is accommodated in the housing, a module upper cover and/or a module lower cover are/is fixedly connected to the housing, the housing is provided with a connection hole, and the connection hole connects a speaker hole and external space of the electronic device.