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EP3557333B1 - Method for manufacturing a timepiece mainspring - Google Patents

Method for manufacturing a timepiece mainspring Download PDF

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Publication number
EP3557333B1
EP3557333B1 EP18167501.8A EP18167501A EP3557333B1 EP 3557333 B1 EP3557333 B1 EP 3557333B1 EP 18167501 A EP18167501 A EP 18167501A EP 3557333 B1 EP3557333 B1 EP 3557333B1
Authority
EP
European Patent Office
Prior art keywords
mainspring
silicon
reducing atmosphere
thermally
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18167501.8A
Other languages
German (de)
French (fr)
Other versions
EP3557333A1 (en
Inventor
Sylvain Jeanneret
Frédéric Maier
Jean-Luc Bucaille
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Patek Philippe SA Geneve
Original Assignee
Patek Philippe SA Geneve
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP18167501.8A priority Critical patent/EP3557333B1/en
Application filed by Patek Philippe SA Geneve filed Critical Patek Philippe SA Geneve
Priority to PCT/IB2018/060218 priority patent/WO2019202378A1/en
Priority to JP2020556962A priority patent/JP7204776B2/en
Priority to EP18836894.8A priority patent/EP3781992B1/en
Priority to US17/047,936 priority patent/US11796966B2/en
Priority to CN201880090643.6A priority patent/CN111801627B/en
Priority to TW108110063A priority patent/TWI793285B/en
Publication of EP3557333A1 publication Critical patent/EP3557333A1/en
Application granted granted Critical
Publication of EP3557333B1 publication Critical patent/EP3557333B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B1/00—Driving mechanisms
    • G04B1/10—Driving mechanisms with mainspring
    • G04B1/14—Mainsprings; Bridles therefor
    • G04B1/145—Composition and manufacture of the springs
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00—Mechanisms for stabilising frequency
    • G04B17/04—Oscillators acting by spring tension
    • G04B17/06—Oscillators with hairsprings, e.g. balance
    • G04B17/066—Manufacture of the spiral spring
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B21/00—Indicating the time by acoustic means
    • G04B21/02—Regular striking mechanisms giving the full hour, half hour or quarter hour
    • G04B21/06—Details of striking mechanisms, e.g. hammer, fan governor
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0074—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment
    • G04D3/0076—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment for components of driving mechanisms, e.g. mainspring
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0074—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment
    • G04D3/0089—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment for components of the regulating mechanism, e.g. coil springs
    • G—PHYSICS
    • G04—HOROLOGY
    • G04F—TIME-INTERVAL MEASURING
    • G04F7/00—Apparatus for measuring unknown time intervals by non-electric means
    • G04F7/04—Apparatus for measuring unknown time intervals by non-electric means using a mechanical oscillator
    • G04F7/08—Watches or clocks with stop devices, e.g. chronograph
    • G04F7/0804—Watches or clocks with stop devices, e.g. chronograph with reset mechanisms

Definitions

  • the present invention relates to a method of manufacturing a mainspring for a timepiece.
  • mainspring any spring, other than a spring exercising a simple return function, capable of storing energy to supply the operation of a mechanism.
  • a typical example of a mainspring is the barrel spring.
  • the barrel spring provides the energy to maintain the oscillator of the watch.
  • the barrel spring is housed in a barrel drum and provides its energy through a system of wheels and pinions which mesh with the barrel drum.
  • the space available for storing energy namely the volume of the barrel drum, is limited, especially in wristwatches, all the more so when the watch is thin.
  • the amount of energy that can be stored depends on this available space. This amount of energy is used to guarantee a certain running time of the watch.
  • the precision of the rate is determined by the frequency and the inertia of the oscillator. A high frequency and high inertia oscillator will have very good running precision but will require a significant energy input, which can penalize the running time. A compromise must therefore be made between the running time and the precision of the oscillator.
  • the amount of energy that can be stored is also related to the material from which the mainspring is made.
  • Nivaflex® an alloy based on Co, Ni, Cr and Fe developed by the company Vacuumschmelze GmbH & Co. KG. This alloy has the notable advantage of having a very high elastic limit, of about 3.7 GPa, given by work hardening and heat treatments, while retaining a part of ductility.
  • Silicon is a material increasingly used in watchmaking and which has many advantages.
  • its elastic limit and the ratio of its elastic limit squared to its modulus of elasticity ( ⁇ 2 / E) are too low to be able to store enough energy to supply the operation of a watch movement. This is why, in the patent CH 706020 , it is associated with diamond, but in practice this does not give complete satisfaction in terms of mechanical resistance.
  • the present invention aims to remedy these drawbacks, at least in part, and to this end proposes a method according to claim 1 or claim 2.
  • a first step consists in etching in a silicon wafer, preferably by deep reactive ionic etching (DRIE), a part having the desired shape, typically spiral, and substantially the desired dimensions of the mainspring.
  • DRIE deep reactive ionic etching
  • Silicon can be monocrystalline, polycrystalline or amorphous. If it is single crystal, its crystal orientation is preferably ⁇ 111 ⁇ so that its Young's modulus is isotropic. Polycrystalline silicon is preferred over silicon monocrystalline for its isotropy and greater mechanical strength.
  • the silicon used in the invention can also be doped or not.
  • a second step of the process consists in thermally oxidizing the part, typically at a temperature between 600 ° C and 1300 ° C, preferably between 800 ° C and 1200 ° C, so as to cover it with a layer of oxide.
  • silicon SiO 2
  • This silicon oxide layer is formed by consuming silicon, which pushes back the interface between silicon and silicon oxide and attenuates silicon surface defects.
  • the silicon oxide layer is removed, for example by wet etching, vapor phase etching or dry etching.
  • annealing treatment in English is carried out in a reducing atmosphere, preferably at a pressure strictly greater than 100 Torr and less than or equal to atmospheric pressure (760 Torr), but which may be of the order atmospheric pressure, and preferably at a temperature between 800 ° C and 1300 ° C.
  • the duration of the annealing treatment can be from a few minutes to several hours.
  • the reducing atmosphere can consist mainly or totally of hydrogen. It can also include argon or any other neutral gas.
  • the combination of the second, third and fourth stages gives the part remarkable mechanical properties for a mainspring. Chips and other defects liable to create the initiators of rupture are greatly reduced or even eliminated. The roughness of the surfaces is smoothed out. The wavelets created by the DRIE engraving on the sides of the part are attenuated or even eliminated. The edges are rounded, which decreases the stress concentrations. The tensile strength of silicon, corresponding to its elastic limit, is increased.
  • a silicon oxide layer (SiO 2 ) is formed on the part, making it possible to increase its mechanical strength.
  • This layer of silicon oxide can be formed by thermal oxidation, in the same way as in the second step, or by deposition, in particular chemical or physical vapor deposition (CVD, PVD). It is preferably formed over all or almost the entire surface of the part. Its thickness is for example a few micrometers.
  • said part is part of a batch of parts made from the same silicon wafer.
  • the part and the other parts of the batch are detached from the wafer.
  • the process according to the invention by virtue of the surface treatments described above, makes it possible to obtain motor springs reaching elastic limits in bending greater than 3 GPa and even being able to go up to 6 GPa.
  • the energy storage capacity ( ⁇ 2 / E) is increased.
  • the motor spring (s) obtained according to the method according to the invention can (can) comprise parts fulfilling additional functions with respect to the storage and return of energy, for example parts serving as a plug or flange as described in the patent CH 705368 .
  • the fourth step is implemented before the second step (thermal oxidation).

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Springs (AREA)

Description

La présente invention concerne un procédé de fabrication d'un ressort moteur pour pièce d'horlogerie.The present invention relates to a method of manufacturing a mainspring for a timepiece.

Par ressort moteur on entend tout ressort, autre qu'un ressort exerçant une simple fonction de rappel, capable d'emmagasiner de l'énergie pour alimenter le fonctionnement d'un mécanisme. Un exemple typique de ressort moteur est le ressort de barillet.By mainspring is meant any spring, other than a spring exercising a simple return function, capable of storing energy to supply the operation of a mechanism. A typical example of a mainspring is the barrel spring.

Dans l'horlogerie mécanique, le ressort de barillet apporte l'énergie permettant d'entretenir l'oscillateur de la montre. Le ressort de barillet est logé dans un tambour de barillet et fournit son énergie par l'intermédiaire d'un système de roues et pignons qui engrène avec le tambour de barillet. La place disponible pour stocker l'énergie, à savoir le volume du tambour de barillet, est limitée, surtout dans les montres-bracelets, ceci d'autant plus lorsque la montre est fine. De cette place disponible dépend la quantité d'énergie emmagasinable. Cette quantité d'énergie est utilisée pour garantir une certaine durée de marche de la montre. La précision de la marche est, elle, déterminée par la fréquence et l'inertie de l'oscillateur. Un oscillateur à haute fréquence et haute inertie aura une très bonne précision de marche mais nécessitera un apport d'énergie conséquent, ce qui peut pénaliser la durée de marche. Un compromis doit donc être opéré entre la durée de marche et la précision de l'oscillateur.In mechanical watchmaking, the barrel spring provides the energy to maintain the oscillator of the watch. The barrel spring is housed in a barrel drum and provides its energy through a system of wheels and pinions which mesh with the barrel drum. The space available for storing energy, namely the volume of the barrel drum, is limited, especially in wristwatches, all the more so when the watch is thin. The amount of energy that can be stored depends on this available space. This amount of energy is used to guarantee a certain running time of the watch. The precision of the rate is determined by the frequency and the inertia of the oscillator. A high frequency and high inertia oscillator will have very good running precision but will require a significant energy input, which can penalize the running time. A compromise must therefore be made between the running time and the precision of the oscillator.

La quantité d'énergie emmagasinable est aussi liée au matériau dans lequel on fabrique le ressort de barillet. Depuis plusieurs années, des fabricants utilisent le Nivaflex®, un alliage à base de Co, Ni, Cr et Fe développé par la société Vacuumschmelze GmbH & Co. KG. Cet alliage a pour avantage notable de présenter une très haute limite élastique, d'environ 3,7 GPa, donnée par l'écrouissage et les traitements thermiques, tout en conservant une part de ductilité. Quelques améliorations (Nivaflex Plus, demande de brevet DE 102009014442 ) ou matériaux alternatifs (Bioflex®, brevet CH 704471 ) sont maintenant proposés, mais sans permettre un gain significatif des propriétés mécaniques et de la quantité d'énergie stockée. Il est également proposé de réaliser des ressorts de barillet en verre métallique (brevets CH 698962 et CH 704391 ) ou en un matériau composite comprenant une portion de support en un matériau métallique ou en un métalloïde tel que le carbone, le silicium ou le germanium, cette portion de support étant recouverte par une deuxième portion, en diamant, supportant l'essentiel des contraintes de déformation (brevet CH 706020 de la demanderesse).The amount of energy that can be stored is also related to the material from which the mainspring is made. For several years, manufacturers have used Nivaflex®, an alloy based on Co, Ni, Cr and Fe developed by the company Vacuumschmelze GmbH & Co. KG. This alloy has the notable advantage of having a very high elastic limit, of about 3.7 GPa, given by work hardening and heat treatments, while retaining a part of ductility. Some improvements (Nivaflex Plus, patent application FROM 102009014442 ) or alternative materials (Bioflex®, patent CH 704471 ) are now proposed, but without allowing a significant gain in mechanical properties and the amount of energy stored. It is also proposed to produce barrel springs in metallic glass (patents CH 698962 and CH 704391 ) or in a composite material comprising a support portion in a metallic material or in a metalloid such as carbon, silicon or germanium, this support portion being covered by a second portion, in diamond, withstanding most of the stresses deformation (patent CH 706020 of the plaintiff).

Le silicium est un matériau de plus en plus utilisé dans l'horlogerie et qui présente de nombreux avantages. Cependant, sa limite élastique et le rapport de sa limite élastique au carré sur son module d'élasticité (σ2/E) sont trop bas pour pouvoir emmagasiner suffisamment d'énergie pour alimenter le fonctionnement d'un mouvement horloger. C'est pourquoi, dans le brevet CH 706020 , on l'associe avec du diamant, mais sans que cela donne en pratique entière satisfaction en termes de résistance mécanique.Silicon is a material increasingly used in watchmaking and which has many advantages. However, its elastic limit and the ratio of its elastic limit squared to its modulus of elasticity (σ 2 / E) are too low to be able to store enough energy to supply the operation of a watch movement. This is why, in the patent CH 706020 , it is associated with diamond, but in practice this does not give complete satisfaction in terms of mechanical resistance.

La présente invention vise à remédier à ces inconvénients, au moins en partie, et propose à cette fin un procédé selon la revendication 1 ou la revendication 2.The present invention aims to remedy these drawbacks, at least in part, and to this end proposes a method according to claim 1 or claim 2.

Un mode de réalisation particulier du procédé de fabrication d'un ressort moteur d'horlogerie, de préférence un ressort de barillet, selon l'invention va maintenant être décrit.A particular embodiment of the method of manufacturing a clockwork mainspring, preferably a barrel spring, according to the invention will now be described.

Une première étape consiste à graver dans une plaquette de silicium, de préférence par gravure ionique réactive profonde (DRIE), une pièce ayant la forme souhaitée, typiquement en spirale, et sensiblement les dimensions souhaitées du ressort moteur.A first step consists in etching in a silicon wafer, preferably by deep reactive ionic etching (DRIE), a part having the desired shape, typically spiral, and substantially the desired dimensions of the mainspring.

Le silicium peut être monocristallin, polycristallin ou amorphe. S'il est monocristallin, son orientation cristalline est de préférence {111} pour que son module de Young soit isotrope. Le silicium polycristallin est préféré au silicium monocristallin pour son isotropie et sa plus grande résistance mécanique. Le silicium utilisé dans l'invention peut en outre être dopé ou non.Silicon can be monocrystalline, polycrystalline or amorphous. If it is single crystal, its crystal orientation is preferably {111} so that its Young's modulus is isotropic. Polycrystalline silicon is preferred over silicon monocrystalline for its isotropy and greater mechanical strength. The silicon used in the invention can also be doped or not.

Une deuxième étape du procédé consiste à oxyder thermiquement la pièce, typiquement à une température comprise entre 600°C et 1300°C, de préférence entre 800°C et 1200°C, de manière à la recouvrir d'une couche d'oxyde de silicium (SiO2). Cette couche d'oxyde de silicium se forme en consommant du silicium, ce qui fait reculer l'interface entre le silicium et l'oxyde de silicium et atténue les défauts de surface du silicium.A second step of the process consists in thermally oxidizing the part, typically at a temperature between 600 ° C and 1300 ° C, preferably between 800 ° C and 1200 ° C, so as to cover it with a layer of oxide. silicon (SiO 2 ). This silicon oxide layer is formed by consuming silicon, which pushes back the interface between silicon and silicon oxide and attenuates silicon surface defects.

A une troisième étape, la couche d'oxyde de silicium est éliminée, par exemple par gravure humide, gravure en phase vapeur ou gravure sèche.In a third step, the silicon oxide layer is removed, for example by wet etching, vapor phase etching or dry etching.

A une quatrième étape, on applique à la pièce le traitement de recuit décrit dans la demande de brevet CH 702431 . Ce traitement de recuit (« thermal annealing » en anglais) est effectué dans une atmosphère réductrice, de préférence à une pression strictement supérieure à 100 Torr et inférieure ou égale à la pression atmosphérique (760 Torr), mais qui peut être de l'ordre de la pression atmosphérique, et de préférence à une température comprise entre 800°C et 1300°C. La durée du traitement de recuit peut être de quelques minutes à plusieurs heures. L'atmosphère réductrice peut être constituée principalement ou totalement d'hydrogène. Elle peut comprendre aussi de l'argon ou tout autre gaz neutre.In a fourth step, the annealing treatment described in the patent application is applied to the part. CH 702431 . This annealing treatment (“thermal annealing” in English) is carried out in a reducing atmosphere, preferably at a pressure strictly greater than 100 Torr and less than or equal to atmospheric pressure (760 Torr), but which may be of the order atmospheric pressure, and preferably at a temperature between 800 ° C and 1300 ° C. The duration of the annealing treatment can be from a few minutes to several hours. The reducing atmosphere can consist mainly or totally of hydrogen. It can also include argon or any other neutral gas.

La combinaison des deuxième, troisième et quatrième étapes (oxydation, désoxydation et recuit) confère à la pièce des propriétés mécaniques remarquables pour un ressort moteur. Les ébréchures et autres défauts susceptibles de créer des amorces de rupture sont fortement réduits voire supprimés. La rugosité des surfaces est lissée. Les vaguelettes que crée la gravure DRIE sur les flancs de la pièce sont atténuées voire supprimées. Les arêtes sont arrondies, ce qui diminue les concentrations de contraintes. La limite à la rupture du silicium, correspondant à sa limite élastique, est augmentée.The combination of the second, third and fourth stages (oxidation, deoxidation and annealing) gives the part remarkable mechanical properties for a mainspring. Chips and other defects liable to create the initiators of rupture are greatly reduced or even eliminated. The roughness of the surfaces is smoothed out. The wavelets created by the DRIE engraving on the sides of the part are attenuated or even eliminated. The edges are rounded, which decreases the stress concentrations. The tensile strength of silicon, corresponding to its elastic limit, is increased.

A une cinquième étape du procédé, on forme sur la pièce une couche d'oxyde de silicium (SiO2) permettant d'augmenter sa résistance mécanique. Cette couche d'oxyde de silicium peut être formée par oxydation thermique, de la même manière qu'à la deuxième étape, ou par dépôt, notamment dépôt chimique ou physique en phase vapeur (CVD, PVD). Elle est de préférence formée sur toute ou presque toute la surface de la pièce. Son épaisseur est par exemple de quelques micromètres.In a fifth step of the process, a silicon oxide layer (SiO 2 ) is formed on the part, making it possible to increase its mechanical strength. This layer of silicon oxide can be formed by thermal oxidation, in the same way as in the second step, or by deposition, in particular chemical or physical vapor deposition (CVD, PVD). It is preferably formed over all or almost the entire surface of the part. Its thickness is for example a few micrometers.

Typiquement, ladite pièce fait partie d'un lot de pièces réalisées dans une même plaquette de silicium. A une dernière étape du procédé, la pièce et les autres pièces du lot sont détachées de la plaquette.Typically, said part is part of a batch of parts made from the same silicon wafer. At a final stage of the process, the part and the other parts of the batch are detached from the wafer.

Le procédé selon l'invention, grâce aux traitements de surface décrits ci-dessus, permet l'obtention de ressorts moteurs atteignant des limites élastiques en flexion supérieures à 3 GPa et pouvant même aller jusqu'à 6 GPa. La capacité de stockage d'énergie (σ2/E) est augmentée.The process according to the invention, by virtue of the surface treatments described above, makes it possible to obtain motor springs reaching elastic limits in bending greater than 3 GPa and even being able to go up to 6 GPa. The energy storage capacity (σ 2 / E) is increased.

Le(s) ressort(s) moteur(s) obtenu(s) selon le procédé selon l'invention peut(peuvent) comprendre des parties remplissant des fonctions supplémentaires par rapport au stockage et à la restitution d'énergie, par exemple des parties servant de bonde ou de bride comme décrit dans le brevet CH 705368 .The motor spring (s) obtained according to the method according to the invention can (can) comprise parts fulfilling additional functions with respect to the storage and return of energy, for example parts serving as a plug or flange as described in the patent CH 705368 .

Dans une variante de l'invention, la quatrième étape (recuit) est mise en œuvre avant la deuxième étape (oxydation thermique).In a variant of the invention, the fourth step (annealing) is implemented before the second step (thermal oxidation).

Claims (13)

  1. Method for manufacturing a timepiece mainspring, comprising the following steps:
    a) producing a part, having the desired shape of the mainspring, from silicon,
    b) thermally oxidising the part,
    c) deoxidising the part,
    d) thermally annealing the part in a reducing atmosphere,
    e) forming a layer of silicon oxide on the part.
  2. Method for manufacturing a timepiece mainspring, comprising the following steps:
    a) producing a part, having the desired shape of the mainspring, from silicon,
    b) thermally annealing the part in a reducing atmosphere,
    c) thermally oxidising the part,
    d) deoxidising the part,
    e) forming a layer of silicon oxide on the part.
  3. Method as claimed in claim 1 or 2, wherein step a) comprises an etching step, preferably a deep reactive ion etching step.
  4. Method as claimed in any one of claims 1 to 3, wherein the thermally oxidising step is performed at a temperature between 600°C and 1300°C, preferably between 800°C and 1200°C.
  5. Method as claimed in any one of claims 1 to 4, wherein the deoxidising step comprises an etching step, preferably a wet etching, vapour phase etching or dry etching step.
  6. Method as claimed in any one of claims 1 to 5, wherein the thermal annealing step is performed at a pressure strictly greater than 100 Torr.
  7. Method as claimed in any one of claims 1 to 6, wherein the thermal annealing step is performed at a pressure less than or equal to atmospheric pressure.
  8. Method as claimed in any one of claims 1 to 7, wherein the thermal annealing step is performed at a temperature between 800°C and 1300°C.
  9. Method as claimed in any one of claims 1 to 8, wherein said reducing atmosphere comprises hydrogen.
  10. Method as claimed in claim 9, wherein said reducing atmosphere also comprises an inert gas, e.g. argon.
  11. Method as claimed in any one of claims 1 to 10, wherein step e) is performed by thermal oxidation.
  12. Method as claimed in any one of claims 1 to 11, wherein the silicon is monocrystalline or polycrystalline.
  13. Method as claimed in any one of claims 1 to 12, wherein the mainspring is a barrel spring.
EP18167501.8A 2018-04-16 2018-04-16 Method for manufacturing a timepiece mainspring Active EP3557333B1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP18167501.8A EP3557333B1 (en) 2018-04-16 2018-04-16 Method for manufacturing a timepiece mainspring
JP2020556962A JP7204776B2 (en) 2018-04-16 2018-12-18 How to make silicon-based watch springs
EP18836894.8A EP3781992B1 (en) 2018-04-16 2018-12-18 Method for manufacturing a timepiece mainspring of silicium based material
US17/047,936 US11796966B2 (en) 2018-04-16 2018-12-18 Method for producing a silicon-based timepiece spring
PCT/IB2018/060218 WO2019202378A1 (en) 2018-04-16 2018-12-18 Method for manufacturing a silicon-based timepiece spring
CN201880090643.6A CN111801627B (en) 2018-04-16 2018-12-18 Method for manufacturing silicon-based clock spring
TW108110063A TWI793285B (en) 2018-04-16 2019-03-22 Method for producing a silicon-based timepiece spring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP18167501.8A EP3557333B1 (en) 2018-04-16 2018-04-16 Method for manufacturing a timepiece mainspring

Publications (2)

Publication Number Publication Date
EP3557333A1 EP3557333A1 (en) 2019-10-23
EP3557333B1 true EP3557333B1 (en) 2020-11-04

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EP18167501.8A Active EP3557333B1 (en) 2018-04-16 2018-04-16 Method for manufacturing a timepiece mainspring
EP18836894.8A Active EP3781992B1 (en) 2018-04-16 2018-12-18 Method for manufacturing a timepiece mainspring of silicium based material

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US (1) US11796966B2 (en)
EP (2) EP3557333B1 (en)
JP (1) JP7204776B2 (en)
CN (1) CN111801627B (en)
TW (1) TWI793285B (en)
WO (1) WO2019202378A1 (en)

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EP3882710A1 (en) 2020-03-19 2021-09-22 Patek Philippe SA Genève Method for manufacturing a silicon-based clock component
EP4075204A1 (en) * 2020-03-31 2022-10-19 ETA SA Manufacture Horlogère Suisse Pawl for timepiece movement
EP4191346B1 (en) * 2021-12-06 2024-06-26 The Swatch Group Research and Development Ltd Shock protection of a resonator mechanism with rotatable flexible guiding

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US11796966B2 (en) 2023-10-24
WO2019202378A1 (en) 2019-10-24
EP3781992B1 (en) 2022-05-04
EP3781992A1 (en) 2021-02-24
CN111801627B (en) 2021-12-28
JP7204776B2 (en) 2023-01-16
TWI793285B (en) 2023-02-21
CN111801627A (en) 2020-10-20
JP2021521455A (en) 2021-08-26
TW201944182A (en) 2019-11-16
EP3557333A1 (en) 2019-10-23
US20210109483A1 (en) 2021-04-15

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