EP3209102A4 - Kommunikationssystem und kommunikationsvorrichtung dafür - Google Patents

Kommunikationssystem und kommunikationsvorrichtung dafür Download PDF

Info

Publication number: EP3209102A4
Authority: EP; European Patent Office
Prior art keywords: device therefor; communication; communication device; communication system; therefor
Prior art date: 2014-10-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP15851522.1A

Other languages

English (en)

French (fr)

Other versions

EP3209102B1 (de

EP3209102A1 (de

Inventor

Zhengdong YANG

Jitao Li

Minhua Zhang

Yi Tang

Kun Fan

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ZTE Corp

Original Assignee

ZTE Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-10-17

Filing date

2015-06-10

Publication date

2017-09-06

2015-06-10 Application filed by ZTE Corp filed Critical ZTE Corp

2017-08-23 Publication of EP3209102A1 publication Critical patent/EP3209102A1/de

2017-09-06 Publication of EP3209102A4 publication Critical patent/EP3209102A4/de

2022-11-16 Application granted granted Critical

2022-11-16 Publication of EP3209102B1 publication Critical patent/EP3209102B1/de

Status Active legal-status Critical Current

2035-06-10 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Aviation & Aerospace Engineering (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)

EP15851522.1A 2014-10-17 2015-06-10 Kommunikationssystem und kommunikationsvorrichtung dafür Active EP3209102B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
CN201410555066.7A CN105578839B (zh)	2014-10-17	2014-10-17	通信系统及其通信设备
PCT/CN2015/081196 WO2016058396A1 (zh)	2014-10-17	2015-06-10	通信系统及其通信设备

Publications (3)

Publication Number	Publication Date
EP3209102A1 EP3209102A1 (de)	2017-08-23
EP3209102A4 true EP3209102A4 (de)	2017-09-06
EP3209102B1 EP3209102B1 (de)	2022-11-16

Family

ID=55746083

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP15851522.1A Active EP3209102B1 (de)	2014-10-17	2015-06-10	Kommunikationssystem und kommunikationsvorrichtung dafür

Country Status (4)

Country	Link
US (1)	US20170231109A1 (de)
EP (1)	EP3209102B1 (de)
CN (1)	CN105578839B (de)
WO (1)	WO2016058396A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US10342127B2 (en) *	2016-11-14	2019-07-02	Samsung Electronics Co., Ltd	Electronic device including a reinforced printed circuit board
CN107889425A (zh) *	2017-10-30	2018-04-06	惠州市德赛西威汽车电子股份有限公司	一种连接器散热结构
CN115413158A (zh) *	2022-08-05	2022-11-29	上海移为通信技术股份有限公司	一种电子设备

Citations (5)

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JPH07106782A (ja) *	1993-10-05	1995-04-21	Nippon Steel Corp	電子機器における冷却構造
US20070115643A1 (en) *	2005-11-21	2007-05-24	Delta Electronics, Inc.	Electronic device with dual heat dissipating structures
US20110194255A1 (en) *	2010-02-09	2011-08-11	Honda Elesys Co., Ltd.	Electronic component unit and manufacturing method thereof
US20120123664A1 (en) *	2010-11-15	2012-05-17	Governors America Corp.	Electronic digital governor and method of assembly
EP2510764A1 (de) *	2009-12-09	2012-10-17	Thomson Licensing	Digitalempfänger mit mikroperforationen

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US4599680A (en) *	1983-09-26	1986-07-08	Southwest Research Institute	Packaging arrangement for spacecraft computer
US5175613A (en) *	1991-01-18	1992-12-29	Digital Equipment Corporation	Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5473511A (en) *	1994-05-05	1995-12-05	Ford Motor Company	Printed circuit board with high heat dissipation
US5581443A (en) *	1994-09-14	1996-12-03	Kabushiki Kaisha Toshiba	Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5982619A (en) *	1997-06-12	1999-11-09	Harris Corporation	Housing for diverse cooling configuration printed circuit cards
US5880930A (en) *	1997-06-18	1999-03-09	Silicon Graphics, Inc.	Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US6434000B1 (en) *	1998-12-03	2002-08-13	Iv Phoenix Group, Inc.	Environmental system for rugged disk drive
US6518868B1 (en) *	2000-08-15	2003-02-11	Galaxy Power, Inc.	Thermally conducting inductors
JP2006278941A (ja) *	2005-03-30	2006-10-12	Fujitsu Ltd	放熱装置及びプラグインユニット
JP2008277327A (ja) *	2007-04-25	2008-11-13	Toyota Industries Corp	電子機器
CN201115248Y (zh) *	2007-09-14	2008-09-10	杭州华三通信技术有限公司	一种散热器
CN201134983Y (zh) *	2007-12-26	2008-10-15	深圳市三旺通信技术有限公司	通信设备结构
CN101568247B (zh) *	2008-04-25	2012-09-05	深圳迈瑞生物医疗电子股份有限公司	屏蔽绝缘散热系统
CN201623944U (zh) *	2009-12-17	2010-11-03	江苏艾索新能源股份有限公司	针对smd元件的散热结构
WO2011129130A1 (ja) *	2010-04-15	2011-10-20	古河電気工業株式会社	基板および基板の製造方法
US8714459B2 (en) *	2011-05-12	2014-05-06	Waveconnex, Inc.	Scalable high-bandwidth connectivity
TWM413319U (en) *	2011-05-13	2011-10-01	Askey Computer Corp	Heat-dissipating casing for communication apparatus
JP6070977B2 (ja) *	2012-05-21	2017-02-01	日本精機株式会社	電子回路装置
CN103338613B (zh) *	2012-10-15	2016-05-11	东莞生益电子有限公司	具有非对称散热结构的电子设备
TWI508238B (zh) *	2012-12-17	2015-11-11	Princo Corp	晶片散熱系統
WO2014115456A1 (ja) *	2013-01-22	2014-07-31	信越化学工業株式会社	熱伝導性シリコーン組成物、熱伝導性層及び半導体装置
TWI522032B (zh) *	2013-03-07	2016-02-11	台達電子工業股份有限公司	散熱模組

2014
- 2014-10-17 CN CN201410555066.7A patent/CN105578839B/zh active Active
2015
- 2015-06-10 EP EP15851522.1A patent/EP3209102B1/de active Active
- 2015-06-10 US US15/518,867 patent/US20170231109A1/en not_active Abandoned
- 2015-06-10 WO PCT/CN2015/081196 patent/WO2016058396A1/zh active Application Filing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07106782A (ja) *	1993-10-05	1995-04-21	Nippon Steel Corp	電子機器における冷却構造
US20070115643A1 (en) *	2005-11-21	2007-05-24	Delta Electronics, Inc.	Electronic device with dual heat dissipating structures
EP2510764A1 (de) *	2009-12-09	2012-10-17	Thomson Licensing	Digitalempfänger mit mikroperforationen
US20110194255A1 (en) *	2010-02-09	2011-08-11	Honda Elesys Co., Ltd.	Electronic component unit and manufacturing method thereof
US20120123664A1 (en) *	2010-11-15	2012-05-17	Governors America Corp.	Electronic digital governor and method of assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016058396A1 *

Also Published As

Publication number	Publication date
EP3209102B1 (de)	2022-11-16
EP3209102A1 (de)	2017-08-23
CN105578839B (zh)	2019-03-15
CN105578839A (zh)	2016-05-11
US20170231109A1 (en)	2017-08-10
WO2016058396A1 (zh)	2016-04-21

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