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EP2969373A4 - Laser ablation platform for solar cells - Google Patents

Laser ablation platform for solar cells

Info

Publication number
EP2969373A4
EP2969373A4 EP14775131.7A EP14775131A EP2969373A4 EP 2969373 A4 EP2969373 A4 EP 2969373A4 EP 14775131 A EP14775131 A EP 14775131A EP 2969373 A4 EP2969373 A4 EP 2969373A4
Authority
EP
European Patent Office
Prior art keywords
solar cells
laser ablation
ablation platform
platform
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14775131.7A
Other languages
German (de)
French (fr)
Other versions
EP2969373A1 (en
Inventor
Rohit Dey
Jeffrey L Franklin
Giridhar Basappa
Marulasiddeswara Karisiddappa
Penchala N Kankanala
Christopher T Lane
James M Gee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP2969373A1 publication Critical patent/EP2969373A1/en
Publication of EP2969373A4 publication Critical patent/EP2969373A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Laser Beam Processing (AREA)
EP14775131.7A 2013-03-13 2014-01-31 Laser ablation platform for solar cells Withdrawn EP2969373A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361780657P 2013-03-13 2013-03-13
PCT/US2014/014306 WO2014158346A1 (en) 2013-03-13 2014-01-31 Laser ablation platform for solar cells

Publications (2)

Publication Number Publication Date
EP2969373A1 EP2969373A1 (en) 2016-01-20
EP2969373A4 true EP2969373A4 (en) 2016-11-16

Family

ID=51624997

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14775131.7A Withdrawn EP2969373A4 (en) 2013-03-13 2014-01-31 Laser ablation platform for solar cells

Country Status (4)

Country Link
EP (1) EP2969373A4 (en)
CN (1) CN105073333B (en)
TW (1) TWI630970B (en)
WO (1) WO2014158346A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2940740A1 (en) * 2014-05-02 2015-11-04 Applied Materials, Inc. Edge scan and alignment
KR20170001452A (en) * 2015-06-26 2017-01-04 주식회사 코윈디에스티 High speed texturing method and system
JP2017113788A (en) * 2015-12-24 2017-06-29 株式会社リコー Optical processing device
CN105810769B (en) * 2016-05-24 2019-02-22 晋能清洁能源科技股份公司 A kind of laser slotting structure of back passivation solar battery
CN106112280B (en) * 2016-07-11 2018-03-13 长沙理工大学 Laser perforation processing method
CN106077954B (en) * 2016-07-11 2018-01-30 长沙理工大学 Non-penetration laser welding method
CN106064278B (en) * 2016-07-11 2018-01-19 长沙理工大学 Galvanized steel sheet laser lap welding method based on local vacuum atmosphere
WO2018127295A1 (en) * 2017-01-09 2018-07-12 Applied Materials Italia S.R.L. Apparatus for processing of substrates used in the manufacture of solar cells, system for the manufacture of solar cells, and method for processing of substrates used in the manufacture of solar cells
CN106944745A (en) * 2017-04-22 2017-07-14 山东拜科通新材料科技有限公司 A kind of laser processing for processing large format circuit
CN108666374B (en) * 2018-05-18 2020-03-17 通威太阳能（安徽）有限公司 Back passivation matrix point type laser fluting conducting structure
JP6740299B2 (en) 2018-08-24 2020-08-12 ファナック株式会社 Processing condition adjusting device and machine learning device
CN110202256B (en) * 2019-06-27 2024-09-24 常州捷佳创智能装备有限公司 Triaxial scanning galvanometer laser device, battery piece processing equipment and control method thereof
CN111618447B (en) * 2020-05-20 2022-04-01 Tcl华星光电技术有限公司 Substrate bilateral laser cutting device and cutting method
DE102022109021A1 (en) * 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Method and device for forming a structure on a workpiece

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110126712A1 (en) * 2009-04-24 2011-06-02 Peter Gefter Separating contaminants from gas ions in corona discharge ionizing bars
CN202129246U (en) * 2011-05-30 2012-02-01 昆山元崧电子科技有限公司 Surface dust-removing and static-eliminating equipment of Printed Circuit Board (PCB)
US20130052768A1 (en) * 2011-08-24 2013-02-28 Applied Materials, Inc. High speed laser scanning system for silicon solar cell fabrication

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300593B1 (en) * 1999-12-07 2001-10-09 First Solar, Llc Apparatus and method for laser scribing a coated substrate
US7154066B2 (en) * 2002-11-06 2006-12-26 Ultratech, Inc. Laser scanning apparatus and methods for thermal processing
WO2011123205A1 (en) * 2010-03-30 2011-10-06 Imra America, Inc. Laser-based material processing apparatus and methods
FR2883503B1 (en) * 2005-03-23 2020-11-06 Datacard Corp HIGH RATE LASER MARKING MACHINE
WO2008053915A1 (en) * 2006-11-02 2008-05-08 Nabtesco Corporation Scanner optical system, laser processing device, and scanner optical device
JP4085127B1 (en) * 2007-10-02 2008-05-14 株式会社エムアンドシー Removal suction device
JP2010044272A (en) * 2008-08-14 2010-02-25 Omron Corp Laser radiation device
CN101722369A (en) * 2008-10-18 2010-06-09 江苏扬力数控机床有限公司 Optical length adjustment device of numerical control laser cutting machine
WO2012029142A1 (en) * 2010-09-01 2012-03-08 三菱電機株式会社 Laser processing apparatus and substrate position detecting method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110126712A1 (en) * 2009-04-24 2011-06-02 Peter Gefter Separating contaminants from gas ions in corona discharge ionizing bars
CN202129246U (en) * 2011-05-30 2012-02-01 昆山元崧电子科技有限公司 Surface dust-removing and static-eliminating equipment of Printed Circuit Board (PCB)
US20130052768A1 (en) * 2011-08-24 2013-02-28 Applied Materials, Inc. High speed laser scanning system for silicon solar cell fabrication

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 201215, Derwent World Patents Index; AN 2012-C18519, XP002762603 *
See also references of WO2014158346A1 *

Also Published As

Publication number Publication date
CN105073333B (en) 2017-10-31
EP2969373A1 (en) 2016-01-20
WO2014158346A1 (en) 2014-10-02
TWI630970B (en) 2018-08-01
TW201434569A (en) 2014-09-16
CN105073333A (en) 2015-11-18

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Effective date: 20161018

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