EP2880682A1

EP2880682A1 - Wiring device for wiring an electronic apparatus

Info

Publication number: EP2880682A1
Application number: EP13745626.5A
Authority: EP
Inventors: Jakob Schillinger; Dietmar Huber; Lothar Biebricher; Manfred Goll; Matthias Viering
Original assignee: Continental Teves AG and Co OHG
Current assignee: Continental Teves AG and Co OHG
Priority date: 2012-07-30
Filing date: 2013-07-30
Publication date: 2015-06-10
Also published as: US9661775B2; CN104508816A; US20150189783A1; KR102107262B1; MX341106B; KR20150037930A; WO2014020034A1; CN104508816B; BR112015002057A2; DE102013214915A1; MX2015001290A

Abstract

The invention relates to a wiring device (34) for wiring an electronic apparatus (14) comprising an interface (42), a conductor track (40) and a component fitting island (38) that is connected to the interface (42) via the conductor track (40) and that is set up to carry an electronic component (26, 28) and to make electrical contact with the interface (42) via the electrical conductor track (40), wherein the component fitting island (38) is free of a web element (58) that is set up to hold the component fitting island (38) on a support element (56) during a housing process housing the component fitting island (38).

Description

Wiring device for wiring an electronic device

The invention relates to a wiring device for

Wiring an electronic device, the electronic device and a method of manufacturing the electronic device.

From WO 2010/037 810 AI an electronic device in the form of a sensor for outputting an electrical signal based on a detected physical quantity is known. The sensor has a measuring circuit carried on a wiring device, which is housed in a circuit housing.

It is an object of the invention, the known

Improve wiring device.

The object is solved by the features of the independent claims. Preferred developments are the subject of the dependent claims.

According to one aspect of the invention, a

Wiring device for wiring an electronic device, an interface, a conductor track and via the conductor to the interface connected Bestückinsel which is adapted to carry an electronic component and to electrically contact the interface via the electrical conductor, wherein the Bestückinsel free of a

Is a bridge element that is set up during one of the

Placement island einhausenden Einhausprozesses to keep the placement island on a support element.

The specified wiring device is based on the consideration that within the above-mentioned

Wiring device, the electrical conductor and the Bestückinsel on at least one web element to a Dambar called support element and a further web element a transport frame could be connected. In this way, a stable mechanical structure would be ensured. This would be particularly important for the production of solid wire-bond connections in the wiring of the electronic component. The support element and the transport frame are after the

Manufacture of the electronic device removed, so that as the final wiring device only the

Bestückinsel, the conductor track, the interface and the

Barrier element left over.

In the context of the specified wiring device, however, it is recognized that when the above-mentioned wiring device with the assembled and wired electronic component is housed in a circuit housing, the exit region of these web elements from the circuit housing acts as an entry zone for ions, moisture and thus contamination.

The aforementioned problem is exacerbated when the above-mentioned wiring device is punched in a cost effective manner. The force or stress during punching can act on the adhesion zone between the circuit housing and the web element, and so called for a delamination, the circuit housing of the aforementioned

Lead wiring, especially when the circuit housing from a to the above-mentioned

Wiring device cast thermoset is made. The resulting by the separation gap can be at

Temperature change in the direction of Bestückinsel and the

Spread wiring zones. Along this gap, it is also possible to pass reactive ions which either become a

Interruption causing corrosion or short-circuiting migration within the electronic

Can lead device with the wiring device mentioned above.

For this reason, with the specified

Wiring device another way. Here, the web elements are at least not used in the areas in where the Bestückinsel and the electronic component are arranged. In this way, the aforementioned gap formation in the area of these elements would be made more difficult and the elements correspondingly protected against the aforementioned corrosion and migration.

In a further development of the specified wiring device, the conductor track has a modulus of elasticity which is dimensioned such that a bending of the conductor track after the placement of the mounting pad with the electronic component remains within a predetermined restriction. Of the

Further education is based on the consideration that the

Placement island, which is connected to the track, as a lever cantilever is. Upon loading on the placement island, the trace would yield, deform, and beyond a certain degree, make the wiring device unusable for use in the electronic device. For this reason, it is proposed in the context of the development to select the elasticity module at least the conductor track so that a bending of the conductor track due to the lever load within the predetermined

Restriction remains. This predetermined restriction may be preferably designed such that the aforementioned deformation is so small that the indicated

Wiring device in the electronic device can be used.

In an additional development, the specified wiring device comprises a leadframe enclosing the interface, the conductor track and the placement island. The specified wiring device can be mass-produced in one

Band structure can be produced, wherein the leadframe the specified wiring device of another

Wiring device separates. In a particular embodiment, the specified includes

Wiring device, the support element which is connected via a further web element with the leadframe. By connecting the support element to the leadframe, the stability of the Wiring device in the manufacture of the electronic device further increased and so the risk of the aforementioned deformations are reduced. In a preferred embodiment, the leadframe has in its cross section a contour deviating from a sheet-metal profile. This contour can be formed arbitrarily, for example, U-shaped, L-shaped or wavy. The contour increases the rod stiffness of the wiring device, which further increases the stability of the wiring device in the manufacture of the electronic device and thus reduces the risk of the aforementioned deformations.

According to a further aspect of the invention, an electronic device comprises one of the specified

Wiring equipment, one on the Bestückinsel the

Wiring device worn and electrically contacted with the interface of the wiring device via the electrical trace of the wiring device

electronic element, and a circuit housing which houses at least the mounting pad and the electronic element. In such an electronic device, the risk of corrosion and migration as described above would be reduced, resulting in a much higher

Life expectancy for the specified electronic device leads.

In a further development, the specified electronic device comprises a molding compound which partially encloses the circuit housing, wherein the circuit housing protrudes from the molding compound at least in the region of the mounting island. This area of the electronic device no longer needs to be surrounded by molding compound, because in the specified electronic device, the risk of moisture penetration is no longer present. In this way, molding material can be saved and the costs for the production of the specified electronic device can be reduced. In an additional development, the specified electronic device is configured as a sensor to output with the circuit an electrical signal based on a detected physical quantity. Here, the present invention is particularly effective, because a sensor, such as a temperature sensor or a

As a result of the missing molding compound, the structure-borne sound sensor is brought closer to the measuring field and can thus carry out measurements with smaller tolerances.

According to a further aspect of the invention, a method for producing an electronic circuit comprises equipping the placement island of one of the specified wiring devices with the electronic component and including at least the placement island in a circuit package.

In a development of the specified method, at least part of the wiring device is heated to a predetermined temperature when the placement island is loaded. As a result of the warm-up, the wiring device is brought to a temperature at which certain assembly processes, such as electrical connection by bonding wires, must be carried out more easily and with less mechanical forces. In this way, the above-mentioned danger of deformation can be further reduced.

The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood

Related to the following description of

Embodiments, which are explained in more detail in connection with the drawings, wherein:

1 is a schematic view of a vehicle with a vehicle dynamics control,

2 is a schematic representation of an inertial sensor for the vehicle dynamics control in a first manufacturing state, 3 shows a schematic representation of the inertial sensor for the vehicle dynamics control in a second production state, FIG. 4 shows a schematic representation of the inertial sensor for the vehicle dynamics control in a third production state,

5 shows a schematic representation of the inertial sensor for the vehicle dynamics control in a fourth production state,

Fig. 6 is a schematic representation of the finished

Inertial sensors for vehicle dynamics control,

Fig. 7 is a cross-sectional view of a possible

Execution of a leadframe used in the manufacture of the inertial sensor and

Fig. 8 shows a cross-sectional view of an alternative embodiment of a leadframe used in the manufacture of the inertial sensor.

In the figures, the same technical elements are provided with the same reference numerals and described only once. Reference is made to Fig. 1, which is a schematic view of a vehicle 2 with a known per se

Vehicle dynamics control shows. Details about this

Vehicle dynamics control can be found for example in DE 10 2011 080 789 AI.

The vehicle 2 comprises a chassis 4 and four wheels 6. Each wheel 6 can be slowed down relative to the chassis 4 via a brake 8 fastened fixedly to the chassis 4 in order to slow down a movement of the vehicle 2 on a road (not shown).

It can happen in a manner known to those skilled that the wheels 6 of the vehicle 2 lose their grip and the vehicle 2 even moves away from a trajectory predetermined, for example, via a steering wheel, not shown, by understeering or oversteering. This is avoided by known control circuits such as ABS (antilock braking system) and ESP (electronic stability program).

In the present embodiment, the vehicle 2 for speed sensors 10 on the wheels 6, which detect a rotational speed 12 of the wheels 6. Furthermore, the vehicle 2 has a

Inertialsensor 14 on, the driving dynamics data 16 of the vehicle 2 detects from which, for example, a pitch rate, a roll rate, a yaw rate, a lateral acceleration, a

Longitudinal acceleration and / or vertical acceleration can be output in a manner known to those skilled in the art.

Based on the detected rotational speeds 12 and vehicle dynamics data 16, a controller 18 can determine in a manner known to those skilled, whether the vehicle 2 slips on the road or even deviates from the above-mentioned predetermined trajectory and react with a known controller output signal 20 to respond. The regulator output signal 20 can then be used by an actuator 22 to control actuators 24, such as the brakes 8, to respond to slippage and deviation from the given trajectory in a manner known per se by means of actuating signals.

The controller 18 may be integrated, for example, in a known motor control of the vehicle 2. Also, the controller 18 and the actuator 22 as a common

Control device formed and optionally be integrated into the aforementioned engine control.

With reference to the inertial sensor 14 shown in Fig. 1, the present invention will be further clarified, even if the present invention to any electronic

Devices and in particular to any sensors, such as magnetic field sensors, acceleration sensors, Rotation rate sensors, structure-borne sound sensors or

Temperature sensors can be implemented.

Reference is made to FIG. 2, which shows a schematic representation of the inertia sensor 14 for vehicle dynamics control in a first production state.

The inertial sensor 14 comprises at least one

Microelectromechanical system 26, called MEMS 26, as a sensor, in a conventional manner dependent on the vehicle dynamics data 16, not further shown signal to a signal evaluation circuits 28 in the form of application-specific integrated circuit 28, ASIC 28 (engl: application-specific integrated circuit ) issues. The ASIC 28 may then be based on the received one of the

Vehicle dynamics data 16 dependent signal generate the vehicle dynamics data 16, that then, for example, before feeding into a driving dynamics data 16 transmitted data cable 30 can be filtered by a filter capacitor 32. The data cable 30 is shown for example in FIG. 4.

In the present embodiment, the MEMS 26, the ASIC 28, the data cable 30 and the filter capacitor 32 are via a

Wiring device 34 wired together. to

Production of the wiring device 34, a punched grid 36 is first formed by punching. The punched grid 36 includes a plurality of juxtaposed

Wiring devices 34, wherein in Fig. 2 of the

For clarity, only of these only one

Wiring device 34 is shown.

Each wiring device 34 has one

Bestückinsel 38 on which the MEMS 26 and the ASIC 28 are placed and electrically contacted. This can be done for example by soldering or gluing techniques. The

Bestückinsel 38 is connected via a first, familiar under the term Innenlead conductor 40 with a first, common under the term Außenlead interface 42. At this first Außenlead 42 shown in FIG. 4 transmission line 44 of the data cable 30 are connected. Another

Electrical connection between the MEMS 26 and the ASIC 28 is made via a first bonding wire 46.

For the connection of the inertial sensor 14 to a ground line 48 of the data cable 30 shown in FIG. 4, each wiring device 34 has a second interconnect 50 familiar under the term inner lead, which is connected to a second interface 52 familiar under the term outer lead. The second outer lead 52 is connected to the

Ground line 48 of the cable connected. Via a second bonding wire 54, the ASIC 28 is electrically contacted to the second inner lead 50.

The wiring of the wiring device 34 with the MEMS 26, the ASIC 28, the data cable 30 and the filter capacitor 32 can be done for example by gluing or soldering, so that the electrical connection to the wiring device 34 is produced simultaneously with the equipping. Subsequently, the bonding wires 46, 54 can be bonded in the above-mentioned manner.

When bonding, the partners to be connected to each other, that is, for example, the ASIC 28 and the first bonding wire 46 are brought against each other in a state in which materials of these elements merge together or can form a metallic compound. It is also necessary to apply mechanical pressures. To withstand these mechanical pressures are the leads 40, 42, 50, 52 and the

Picking island 38 via a so-called Dambar 56 as well

Web elements 58 mechanically held on lead frames 60. Dabeisind, however, in contrast to conventional solutions, between the inner leads 40, 50, the Bestückinsel 38 and the Dambar 56 no web elements 58 are arranged.

The lead frames 60 are held on transport frame 62, in which transport openings 64 for machine transporting the Wired wiring devices 34 are formed in the manufacture of the initial sensor 14. Furthermore, coding openings 66 may also be present, based on which, for example, an advance of the

Wiring devices 34 can be controlled.

In the region of the connection point between the inner leads 40, 50 and the outer leads 42, 52, armature openings 68 which are made in the present embodiment are formed by the stamped grid 36, to which an electronic circuit housing 70 to be described, shown in FIG. 3, can be anchored.

Ferners are on the outer leads 42, 52 seen from the inner leads 40, 50 from behind the anchor openings 68 a first

Holding opening 72 and a second holding opening 74 is formed, in which a not further shown tool can engage, which is suitable for the production of a molding compound 77 to be described, shown in Fig. 6. The two holding openings 72 and 74 serve at the same time as well as anchor openings in the molding compound. They also act as an abutment for forces by

Temperature stress or mechanical force via the data cable 30 are introduced. An introduction of force into the inertial sensor 14 and thus a shear stress of the composite between the circuit housing 70 and the

Wiring device 34 is thereby largely prevented. The design of the holding openings 72, 74 should the

Cover temperature expansion of the outer leads 42, 52 while high positioning accuracy and protect against rotation of the inertial sensor 14 (Poka Yoke). For this purpose, the holding openings 72, 74 in the present embodiment

designed differently sized. But they can also be designed, for example, as a pairing of a slot and a round hole. Instead of a long / round hole, other anchoring structures such as T-shapes are possible.

The placement island 38 is attached to the first outer lead 42 via the first inner lead 40. In the above Verbonden the Bestückinsel 38 so, by the absence of web elements 58 between the first inner lead 40 and the

Insertion pad 38 and the dambar 56 give way by the lever forces occurring and bend so. Although these leverage forces are kept as low as possible, because the dambar 56 itself is held on the lead frames 60 via web elements 58. Also, during bonding, the punching frame 36 could be warmed up, in particular in the region of the placement island 38 and of the first inner lead 40, in order to reduce the mechanical forces necessary for bonding. Optimally, but is the

Young's modulus of the first inner lead 40 is selected so that bending of the inner lead 40 during the Verbondens leads to no plastic deformation. For this purpose, the material and / or the geometry of the first inner lead 40 can be adjusted accordingly.

Reference is made to FIG. 3, which is a schematic representation of the inertia sensor 14 for vehicle dynamics control in a second production state.

In this production state is the

Wiring device 34 in the region of the MEMS 26, the ASIC 28, the data cable 30 and the filter capacitor 32 to the armature openings 68 from the circuit housing 70 housed. The circuit housing 70 is formed in the present embodiment of a thermosetting material and is cast around the aforementioned elements.

On the circuit housing 70, a depression 76, for example in the form of a blind hole, can be formed in the region of the MEMS 26, the placement island 38 or the inner lead 40. This recess 76 or a survey can also serve for fixing and adjustment in a tool for applying the molding compound 77 and be formed on the side of the circuit housing 70 shown and / or on the opposite side of this page. The arrangement of the MEMS 26 over the

Recess 76 allows the production of a very tightly tolerated air gap, so that the inertial sensor 14 in the Installation position of the application can be used with a very tightly tolerated air gap.

Reference is made to FIG. 4, which shows a schematic representation of the inertia sensor 14 for vehicle dynamics control in a third production state.

In this manufacturing state are from the

Wiring device 34, the web elements 58 and the

Dambar 56 away. Litzenösen 78 are applied to the lower transport frame 62, in the cable strands 80 of

Sensor line 44 and the ground line 48 are introduced. The attachment of the Litzenösen 78 on the transport frame 62 provides during the insertion of the cable strands 80 in this a stable hold.

Reference is made to FIG. 5, which shows a schematic representation of the inertia sensor 14 for vehicle dynamics control in a fourth production state.

In this state of manufacture, the transport frames 62 and the leadframes 60 are removed, so that the stranded eyelets on the outer leads 42, 52 can be contacted. The contacting can be done arbitrarily, for example, by crimping, splicing, welding, plugging, gluing or soldering.

Reference is made to Fig. 6, which is a schematic representation of the finished inertial sensor 14 for the

Vehicle dynamics control shows.

For the completion of the inertial sensor 14, a part of the circuit housing 70, the outer leads 42, 52, and a part of the data cable 30 with the above-mentioned molding compound 77 is encapsulated. A holding element 82 can be provided, which can be fastened, for example, to a housing, not shown, of the end application, that is to say the vehicle 2, for fixing the inertial sensor 14. The encapsulation of the inertial sensor 14 with the molding compound can take place in such a way that an exempt region 84 remains on the circuit housing 70 in which, in particular, the depression 76 should be formed so as not to jeopardize the close tolerance of the above-mentioned air gap. The excepted area may remain, in particular, because in the manufacture of the circuit housing 70 no web elements 58 between the dambar 56 and the Bestückinsel 38 or the

Internal leads 40, 50 were present, which could contribute to the formation of a gap and thus the ingress of moisture. Without the web elements 58, the tolerance of the inertial sensor 14 can thus be appreciably increased. Is the

Inertial sensor 14 designed as a magnetic field or temperature sensor, the effect of the tightly tolerated air gap is much more evident.

The surface of the circuit housing 70 can be activated at least in some areas before encapsulation with the molding compound 77. Under an activation of the surface of the

Circuit housing 70 is intended to be a partial

Destruction of the molecular structure of the surface of the

Circuit housing 70 are understood, so that at the

Surface of the circuit housing 70 free radicals arise. These free radicals are capable of forming chemical and / or physical compounds with the molding compound 77 so that they no longer separate from the surface of the molding compound

Circuit housing 70 can solve. In this way, the molding compound 77 is firmly fixed to the circuit housing 70. The molding compound 77 may comprise a thermoplastic or thermosetting plastic. Particularly preferably, the molding compound 77 comprises a polar material, such as polyamide. The polar polyamide may be physically bonded to the activated surface of the circuit package 70 in a manner known to those skilled in the art and thus fixedly secured to the circuit package. Other connections are possible, which have a polar surface in the molten state of the molding compound 77 and thereby form a connection with the activated surface of the circuit housing 70. This incoming compound remains after solidification of the molten molding compound 77 is obtained.

A part of the surface of the circuit housing 70 in

Contact area with the molding compound 77 may alternatively or additionally roughened, so that the effective activated surface is increased and in particular by the activation

caused adhesion between the circuit housing 70 and molding compound 77 is increased.

The roughened portion of the surface of the circuit package 70 could be roughened with a laser. With the laser, the surface of the circuit package 70 can not only be activated by the laser from the surface of the

Circuit housing 70 also removed any existing mold release agents that could suppress adhesion between the circuit housing 70 and the molding compound 77. Furthermore, the laser can also be used at the same time to create a characteristic of the inertial sensor 14, such as a serial number or a known DataMatrix code with the serial number.

Alternatively, the laser can also be used only for roughening the surface. The activation can then be carried out, for example, with a plasma.

In the same way, the data cable 30 and the other components of the inertial sensor 14 to be encapsulated can also be treated prior to encapsulation.

The encapsulation of the inertial sensor 14 with the molding compound 77 can be carried out by any injection molding method, such as

For example, injection molding, RIM (Reaction Injection Molding), Transfermolden or potting can be performed.

FIGS. 7 and 8 show two possible cross-sections 86 for the leadframes 60 in FIGS. 2 to 4. These cross sections 86 deviate from a sheet-like course and reinforce it the wiring device 34 further, in particular during the above Verbondens. The other elements of the wiring device 34 could also be equipped with this cross-section 86.

Claims

claims

1. Wiring device (34) for wiring a

electronic device (14) comprising a

Interface (42), a conductor track (40) and via the conductor track (40) to the interface (42) connected

Bestückinsel (38), which is adapted to carry an electronic component (26, 28) and electrically connected to the

Interface (42) via the electrical conductor (40) to contact, wherein the Bestückinsel (38) is free of a web element (58), which is arranged during a Einückprozesses the Bestückinsel (38) einhausenden process

To keep Bestückinsel (38) on a support element (56).

2. Wiring device (34) according to claim 1, wherein the conductor track (40) has a modulus of elasticity which is dimensioned such that a bending of the conductor track (40) after loading the Bestückinsel (38) with the electronic

Component (26, 28) remains within a predetermined limit.

3. Wiring device (34) according to 1 or 2, comprising an interface (42), the conductor track (40) and the

Bestückinsel (38) enclosing leadframe (60).

4. Wiring device (34) according to claim 3, comprising the support element (56) which is connected via a web element (58) with the leadframe (60).

5. Wiring device (34) according to claim 3 or 4, wherein the leadframe (60) in its cross section (86) has a deviating from a sheet-metal profile contour.

6. Electronic device (14) comprising a

Wiring device (34) according to one of the preceding claims, one on the Bestückinsel (38) carried and electrically connected to the interface (42) via the electrical Printed circuit board (40) contacted electronic component (26, 28), and a circuit housing (70), at least the

Bestückinsel (38) and the electronic component (26, 28) einhaust.

7. An electronic device (14) according to claim 6, comprising a circuit housing (70) partially einhausende

Molding compound (76), wherein the circuit housing (70) at least in the region (84) of the Bestückinsel (38) protrudes from the molding compound (76).

8. An electronic device (14) according to claim 6 or 7, which is arranged as a sensor (14) with the electronic component (26, 28) to output an electrical signal (16) based on a detected physical quantity.

9. Method for producing an electronic

Device (14) comprising:

- Equipping the Bestückinsel (38) one

Wiring device (34) according to one of claims 1 to 6 with the electronic component (26, 28), and

- Elnhausen at least the Bestückinsel (38) in one

Circuit housing (70).

10. The method of claim 9, wherein at least a part of the wiring device (34) when loading the

Bestückinsel (38) is heated to a predetermined temperature.