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EP2868775A3 - Plating bath and method - Google Patents

Plating bath and method Download PDF

Info

Publication number
EP2868775A3
EP2868775A3 EP14191882.1A EP14191882A EP2868775A3 EP 2868775 A3 EP2868775 A3 EP 2868775A3 EP 14191882 A EP14191882 A EP 14191882A EP 2868775 A3 EP2868775 A3 EP 2868775A3
Authority
EP
European Patent Office
Prior art keywords
plating bath
tin
combination
brightening agents
void formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14191882.1A
Other languages
German (de)
French (fr)
Other versions
EP2868775A2 (en
Inventor
Julia WOERTINK
Yi Qin
Jonathan D. PRANGE
Pedro O. LOPEZ MONTESINOS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of EP2868775A2 publication Critical patent/EP2868775A2/en
Publication of EP2868775A3 publication Critical patent/EP2868775A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Tin-containing electroplating baths having a combination of certain brightening agents provide tin-containing solder deposits having reduced void formation and smooth morphology.
EP14191882.1A 2013-11-05 2014-11-05 Plating bath and method Withdrawn EP2868775A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/071,677 US20150122661A1 (en) 2013-11-05 2013-11-05 Plating bath and method

Publications (2)

Publication Number Publication Date
EP2868775A2 EP2868775A2 (en) 2015-05-06
EP2868775A3 true EP2868775A3 (en) 2015-08-12

Family

ID=51932182

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14191882.1A Withdrawn EP2868775A3 (en) 2013-11-05 2014-11-05 Plating bath and method

Country Status (6)

Country Link
US (1) US20150122661A1 (en)
EP (1) EP2868775A3 (en)
JP (1) JP2015092021A (en)
KR (1) KR20150051926A (en)
CN (1) CN104674312A (en)
TW (1) TW201533278A (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590259B1 (en) * 2014-01-28 2014-09-17 千住金属工業株式会社 Cu core ball, solder paste and solder joint
CA3009779C (en) * 2016-02-16 2021-03-23 Lumishield Technologies Incorporated Electrochemical deposition of elements in aqueous media
US10879156B2 (en) 2016-03-08 2020-12-29 Washington State University Mitigation of whisker growth in tin coatings by alloying with indium
US20170321340A1 (en) * 2016-03-08 2017-11-09 Washington State University Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte
KR101757192B1 (en) * 2016-03-30 2017-07-12 주식회사 호진플라텍 Electroplating solution of tin-silver alloy for electroplating wafer bumps
JP6818520B2 (en) * 2016-11-11 2021-01-20 ローム・アンド・ハース電子材料株式会社 Barrel plating or high-speed rotary plating method using neutral tin plating solution
US11268203B2 (en) * 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution
JP6620859B2 (en) * 2017-10-24 2019-12-18 三菱マテリアル株式会社 Method for forming tin or tin alloy plating layer
EP3728702B1 (en) 2017-12-20 2021-09-22 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
US20190259722A1 (en) * 2018-02-21 2019-08-22 Rohm And Haas Electronic Materials Llc Copper pillars having improved integrity and methods of making the same
KR20210002514A (en) 2018-04-20 2021-01-08 바스프 에스이 Composition for electroplating tin or tin alloys containing inhibitors
JP7035821B2 (en) * 2018-06-05 2022-03-15 トヨタ自動車株式会社 Method of forming a metal solution for film formation and a metal film
KR102634250B1 (en) * 2018-12-27 2024-02-07 솔브레인 주식회사 Plating Composition and Method for Forming The Solder Bump
WO2021193696A1 (en) * 2020-03-27 2021-09-30 三菱マテリアル株式会社 Electroplating solution and electroplating method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
JP4362568B2 (en) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 Tin - copper alloy electroplating solution
US20110189848A1 (en) * 2008-10-21 2011-08-04 Ingo Ewert Method to form solder deposits on substrates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL151449B (en) * 1966-09-14 1976-11-15 Philips Nv PROCESS FOR THE PREPARATION OF AN ACID BATH FOR THE ELECTROLYTIC DEPOSITION OF TIN.
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4871429A (en) 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
JPH0233795B2 (en) * 1983-05-16 1990-07-30 Matsugiin Rooko Inc METSUKYOKUSOSEIBUTSU
US5174887A (en) 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2001181889A (en) * 1999-12-22 2001-07-03 Nippon Macdermid Kk Bright tin-copper alloy electroplating bath
US6578754B1 (en) * 2000-04-27 2003-06-17 Advanpack Solutions Pte. Ltd. Pillar connections for semiconductor chips and method of manufacture
US6818545B2 (en) 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
TWI245402B (en) 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
TWI240979B (en) 2004-10-28 2005-10-01 Advanced Semiconductor Eng Bumping process
KR100921919B1 (en) 2007-11-16 2009-10-16 (주)화백엔지니어링 Copper pillar tin bump on semiconductor chip and method of forming of the same
US9217205B2 (en) * 2007-12-11 2015-12-22 Enthone Inc. Electrolytic deposition of metal-based composite coatings comprising nano-particles
JP5583894B2 (en) * 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Electrotin plating solution and electrotin plating method
JP5033979B1 (en) * 2011-09-29 2012-09-26 ユケン工業株式会社 Acidic aqueous composition for plating comprising tin
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5061351A (en) * 1990-07-23 1991-10-29 Enthone-Omi, Inc. Bright tin electrodeposition composition
JP4362568B2 (en) * 2000-06-02 2009-11-11 奥野製薬工業株式会社 Tin - copper alloy electroplating solution
US20110189848A1 (en) * 2008-10-21 2011-08-04 Ingo Ewert Method to form solder deposits on substrates

Also Published As

Publication number Publication date
EP2868775A2 (en) 2015-05-06
KR20150051926A (en) 2015-05-13
TW201533278A (en) 2015-09-01
US20150122661A1 (en) 2015-05-07
CN104674312A (en) 2015-06-03
JP2015092021A (en) 2015-05-14

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