EP2623643A4 - Aluminum electroplating solution - Google Patents

Aluminum electroplating solution

Info

Publication number: EP2623643A4
Authority: EP; European Patent Office
Prior art keywords: electroplating solution; aluminum electroplating; aluminum; solution; electroplating
Prior art date: 2010-09-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP20110828690

Other languages

German (de)

French (fr)

Other versions

EP2623643A1 (en

Inventor

Hiroshi Nakano

Yoshinori Negishi

Haruo Akahoshi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Ltd

Original Assignee

Hitachi Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-09-30

Filing date

2011-09-01

Publication date

2015-03-04

2011-09-01 Application filed by Hitachi Ltd filed Critical Hitachi Ltd

2013-08-07 Publication of EP2623643A1 publication Critical patent/EP2623643A1/en

2015-03-04 Publication of EP2623643A4 publication Critical patent/EP2623643A4/en

Status Withdrawn legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/42—Electroplating: Baths therefor from solutions of light metals
- C25D3/44—Aluminium
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

EP20110828690 2010-09-30 2011-09-01 Aluminum electroplating solution Withdrawn EP2623643A4 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2010220239		2010-09-30
PCT/JP2011/069895 WO2012043129A1 (en)	2010-09-30	2011-09-01	Aluminum electroplating solution

Publications (2)

Publication Number	Publication Date
EP2623643A1 EP2623643A1 (en)	2013-08-07
EP2623643A4 true EP2623643A4 (en)	2015-03-04

Family

ID=45892602

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20110828690 Withdrawn EP2623643A4 (en)	2010-09-30	2011-09-01	Aluminum electroplating solution

Country Status (4)

Country	Link
US (1)	US20130168258A1 (en)
EP (1)	EP2623643A4 (en)
JP (1)	JPWO2012043129A1 (en)
WO (1)	WO2012043129A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5704456B2 (en) *	2011-05-31	2015-04-22	日立金属株式会社	Electrolytic aluminum foil production equipment
US9771661B2 (en)	2012-02-06	2017-09-26	Honeywell International Inc.	Methods for producing a high temperature oxidation resistant MCrAlX coating on superalloy substrates
JP2014086139A (en) *	2012-10-19	2014-05-12	Sumitomo Electric Ind Ltd	Tab lead, method for manufacturing tab lead, and electrochemical device
CN103290443B (en) *	2013-05-15	2017-02-08	北京化工大学	Method for synchronizing high preferred orientation aluminum coating by using supergravity technology
US20150101935A1 (en) *	2013-10-14	2015-04-16	United Technologies Corporation	Apparatus and method for ionic liquid electroplating
US9903034B2 (en)	2013-11-22	2018-02-27	Sikorsky Aircraft Corporation	Methods and materials for electroplating aluminum in ionic liquids
US9758888B2 (en) *	2014-05-06	2017-09-12	Apple Inc.	Preparation of metal substrate surfaces for electroplating in ionic liquids
US10087540B2 (en)	2015-02-17	2018-10-02	Honeywell International Inc.	Surface modifiers for ionic liquid aluminum electroplating solutions, processes for electroplating aluminum therefrom, and methods for producing an aluminum coating using the same
WO2017023743A1 (en) *	2015-07-31	2017-02-09	University Of South Florida	ELECTRODEPOSITION OF Al-Ni ALLOYS AND AI/Ni MULTILAYER STRUCTURES
JP6471674B2 (en) *	2015-10-14	2019-02-20	住友電気工業株式会社	Aluminum film and manufacturing method thereof
KR102603742B1 (en) *	2016-03-11	2023-11-16	어플라이드 머티어리얼스, 인코포레이티드	Aluminum electroplating and oxide formation as a barrier layer for aluminum semiconductor process equipment
KR102210971B1 (en)	2016-03-11	2021-02-01	어플라이드 머티어리얼스, 인코포레이티드	Method for forming yttrium oxide on semiconductor processing equipment
US10407789B2 (en)	2016-12-08	2019-09-10	Applied Materials, Inc.	Uniform crack-free aluminum deposition by two step aluminum electroplating process
CN106782980B (en) *	2017-02-08	2018-11-13	包头天和磁材技术有限责任公司	The manufacturing method of permanent-magnet material
US11261533B2 (en)	2017-02-10	2022-03-01	Applied Materials, Inc.	Aluminum plating at low temperature with high efficiency
US11142841B2 (en)	2019-09-17	2021-10-12	Consolidated Nuclear Security, LLC	Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates
US11661665B2 (en)	2020-04-30	2023-05-30	The Boeing Company	Aluminum and aluminum alloy electroplated coatings

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0339536A1 (en) *	1988-04-26	1989-11-02	Nisshin Steel Co., Ltd.	Plating bath for electrodeposition of aluminum and plating process making use of the bath
EP0398358A2 (en) *	1989-05-18	1990-11-22	Mitsubishi Petrochemical Co., Ltd.	Aluminum electroplating method
JPH06293991A (en) *	1992-08-14	1994-10-21	Sony Corp	Aluminum nonaqueous electrolyte, battery using the electrolyte and aluminum electrodepositing method
EP2130949A1 (en) *	2007-02-09	2009-12-09	Dipsol Chemicals Co., Ltd.	ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2446349A (en) *	1944-02-29	1948-08-03	William Marsh Rice Inst For Th	Electrodeposition of aluminum
JPH0613758B2 (en)	1985-09-20	1994-02-23	日新製鋼株式会社	Electro aluminum plating method
JP2657991B2 (en)	1988-04-26	1997-09-30	日新製鋼株式会社	Electric aluminum plating bath and plating method using the bath
JP2678984B2 (en) *	1988-04-26	1997-11-19	日新製鋼株式会社	Electric aluminum plating bath and plating method using the bath
US5336378A (en) *	1989-02-15	1994-08-09	Japan Energy Corporation	Method and apparatus for producing a high-purity titanium
JPH03134193A (en) *	1989-10-18	1991-06-07	Mitsubishi Petrochem Co Ltd	Low-melting point composition and electric aluminum plating method
JPH0361392A (en) *	1989-07-28	1991-03-18	Mitsubishi Petrochem Co Ltd	Composition having low melting point and aluminum electroplating method using the same as bath
JPH0421794A (en) *	1990-05-16	1992-01-24	Mitsubishi Petrochem Co Ltd	Composition having low melting point and aluminum electroplating method
JP3202072B2 (en) *	1992-09-21	2001-08-27	三菱化学株式会社	Electric aluminum plating method
WO1997002252A1 (en) *	1995-06-30	1997-01-23	Covalent Associates, Inc.	Hydrophobic ionic liquids
JP2004076031A (en)	2002-08-09	2004-03-11	Ishikawajima Harima Heavy Ind Co Ltd	Plating bath for electroplating and plating bath for composite plating, and their production method
JP4756462B2 (en)	2004-11-09	2011-08-24	日立金属株式会社	Electrolytic aluminum plating solution
JP5080097B2 (en) *	2007-02-09	2012-11-21	ディップソール株式会社	Molten salt electroplating bath and plating method using the same
EP1983079A1 (en) *	2007-04-17	2008-10-22	Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO	Barrier layer and method for making the same
EP1983592A1 (en) *	2007-04-17	2008-10-22	Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO	Method for manufacturing an electrode
JP5299814B2 (en) *	2008-01-22	2013-09-25	ディップソール株式会社	Electric Al-Zr-Mn alloy plating bath using room temperature molten salt bath, plating method using the plating bath, and Al-Zr-Mn alloy plating film
JP5581523B2 (en) *	2009-10-19	2014-09-03	ディップソール株式会社	Aluminum or aluminum alloy barrel electroplating method

2011
- 2011-09-01 JP JP2012536292A patent/JPWO2012043129A1/en active Pending
- 2011-09-01 US US13/820,701 patent/US20130168258A1/en not_active Abandoned
- 2011-09-01 WO PCT/JP2011/069895 patent/WO2012043129A1/en active Application Filing
- 2011-09-01 EP EP20110828690 patent/EP2623643A4/en not_active Withdrawn

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0339536A1 (en) *	1988-04-26	1989-11-02	Nisshin Steel Co., Ltd.	Plating bath for electrodeposition of aluminum and plating process making use of the bath
EP0398358A2 (en) *	1989-05-18	1990-11-22	Mitsubishi Petrochemical Co., Ltd.	Aluminum electroplating method
JPH06293991A (en) *	1992-08-14	1994-10-21	Sony Corp	Aluminum nonaqueous electrolyte, battery using the electrolyte and aluminum electrodepositing method
EP2130949A1 (en) *	2007-02-09	2009-12-09	Dipsol Chemicals Co., Ltd.	ELECTRIC Al-Zr ALLOY PLATING BATH USING ROOM TEMPERATURE MOLTEN SALT BATH AND PLATING METHOD USING THE SAME

Also Published As

Publication number	Publication date
EP2623643A1 (en)	2013-08-07
US20130168258A1 (en)	2013-07-04
JPWO2012043129A1 (en)	2014-02-06
WO2012043129A1 (en)	2012-04-05

Publication	Publication Date	Title
EP2623643A4 (en)	2015-03-04	Aluminum electroplating solution
EP2506275A4 (en)	2015-06-17	Electrolytic capacitor
EP2580190A4 (en)	2014-04-16	New antiviral compounds
AP2012006640A0 (en)	2012-12-31	New aminopyrazoloquinazolines
PL2612407T3 (en)	2015-01-30	Rack
PT2646736T (en)	2021-10-01	Vessel
GB201020426D0 (en)	2011-01-19	Aerofoil
EP2714954A4 (en)	2015-08-19	Aluminum alloys
GB2485334B (en)	2014-08-06	Structure
HK1208653A1 (en)	2016-03-11	Watercraft
PL2558234T3 (en)	2016-04-29	Vessel
HK1188597A1 (en)	2014-05-09	Continuous arycyclic compound
HK1179666A1 (en)	2013-10-04	Electrolyzer
EP2756116A4 (en)	2015-06-17	Zincating aluminum
GB2481021B (en)	2014-02-26	Quick fixine
EP2591985A4 (en)	2014-04-23	Panel-joining structure
EP2466359A4 (en)	2013-03-13	Immersion solution
RS53660B2 (en)	2019-01-31	Aluminium alloy
GB201016065D0 (en)	2010-11-10	Buoys
GB201004091D0 (en)	2010-04-28	Selective plating
GB201118411D0 (en)	2011-12-07	Not available
GB2478974B (en)	2013-06-19	Rowlock
AU332017S (en)	2010-08-03	Bath
GB201017535D0 (en)	2010-12-01	Sensaslim solution
GB2487980B (en)	2016-06-08	Bath

Legal Events

Date	Code	Title	Description
2013-07-05	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2013-08-07	17P	Request for examination filed	Effective date: 20130502
2013-08-07	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2014-01-08	DAX	Request for extension of the european patent (deleted)
2015-03-04	A4	Supplementary search report drawn up and despatched	Effective date: 20150203
2015-03-04	RIC1	Information provided on ipc code assigned before grant	Ipc: C25D 3/44 20060101AFI20150128BHEP Ipc: C25D 3/66 20060101ALI20150128BHEP
2016-07-22	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN
2016-08-24	18W	Application withdrawn	Effective date: 20160720