EP2558243A2 - Solder alloy, soldering method and component - Google Patents

Abstract

Description

 Solder alloy, soldering process and component

The invention relates to a solder alloy, a method for soldering and a component with solder.

Components sometimes need to be repaired after manufacture, for example after casting or after they have been used and cracked.

There are various repair methods such. As the welding process, in which, however, a substrate material of the component must be melted, which can lead to a damage ^¬ tion in particular of cast and directionally solidified components and for evaporation of components of the substrate material.

 A soldering process works against the temperature at

Welding process and thus with respect to the melting temperature of the substrate material at lower temperatures.

The solder should still have a high strength, so that the solder filled with crack or depression does not weaken the entire component at the high

Operating temperatures leads.

It is therefore an object of the invention, a solder alloy which solves the above problem.

The object is achieved by a solder made of a solder alloy according to claim 1, a method according to claim 48 or 49 and a component according to claim 51.

The solder alloy consists of

(1 -x -y) * base + x * lot + y * addition,

where 0.2 <x <0.8 and

0 <y <0.8 and (y <1-x),

wherein the base comprises:

20wt% - 35wt% chromium (Cr), especially 22wt% to 27wt%, most especially 25wt%, lwt% - 15wt% nickel (Ni), in particular 10wt%,

 0, lwt% - 6wt% aluminum (AI), in particular 0.1-3wt% wt%, in particular 0, lwt%,

 3wt% - 12wt% tungsten (W), in particular 6wt% to 10wt%,

especially 8wt%,

optional

 0, lwt% - lwt% titanium (Ti), in particular 0, lwt%,

0, lwt% - lwt% molybdenum (Mo), in particular 0, lwt%,

0, lwt% - 6wt% tantalum (Ta), especially 4wt% and

Cobalt (Co) and

wherein the solder comprises:

 0, lwt% - 10wt% chromium (Cr), in particular 4wt% - 8wt%,

0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%,

0, lwt% - 6wt% aluminum (AI), especially l, 5wt%,

0, lwt% - 6wt% tungsten (W), in particular 3wt% and

Germanium (Ge) and / or gallium (Ga),

in particular 18wt% to 30wt%,

especially 27wt%,

Nickel,

wherein the additive comprises:

 0wt% - 0.010wt% boron (B), especially 0.001wt% <B <0.010wt%, 0wt% - 0.6wt% zirconium (Zr), especially ^ 0.05wt%,

0wt% - 0.7wt% carbon (C), in particular 0.01wt% <Zr <0.25wt%.

Further advantageous developments of the alloy are:

The base uses only one, two or three elements of the group titanium (Ti), molybdenum (Mo), tantalum (Ta),

the base is cobalt-based,

In particular, the base has cobalt as the remainder,

- the lot is nickel based,

In particular, the solder has nickel as the remainder,

the solder alloy is cobalt-based,

In particular, the solder alloy has cobalt as the remainder, it does not contain any deliberate addition of boron (B), in particular <20 ppm. it contains no silicon (Si),

- it does not have zirconium (Zr),

- she has no hafnium (Hf),

- it has no niobium (Nb),

- it has no carbon (C), - it contains no titanium,

it does not contain molybdenum (Mo),

- it does not contain tantalum (Ta),

it has cobalt (Co) the largest proportion by weight,

it has gallium (Ga) and no germanium (Ge), it has germanium (Ge) and no gallium (Ga),

it has the gallium (Ga) and germanium (Ge),

it has at least 0.01 wt% zirconium (Zr),

in particular at least 0.12wt%,

it has at most 0.04wt% zirconium (Zr),

in particular not more than 0,5wt%, - it has carbon (C),

at least 0.05wt%,

in particular at least 0.13wt%, - it has at most 0,55wt% carbon (C), in particular not more than 0,2wt% carbon (C),

it is 0.3 <x <0.5,

- y = 0,

- 0.2 <Y,

in particular 0.3 -S y -S 0.5,

- it does not contain manganese (Mn),

- it contains tungsten (W) at least 1.5%,

in particular l, 6wt%,

- the maximum tungsten content is 6,4wt%,

especially not more than 6, 0wt%,

- it contains tantalum (Ta) at least 0,6wt%,

in particular at least 0.8wt%,

- it has a maximum of 3.2wt% tantalum,

in particular not more than 2.5wt%, - the gallium (Ga) or germanium (Ge) content

is 1, 5wt%,

especially at the gallium or germanium content

> 3wt%, - is the gallium (Ga) or germanium (Ge) content

> 6wt%,

- the gallium (Ga) or germanium (Ge) content

is ^ 28wt%,

especially where the gallium or germanium content is <24wt%, - it contains at least 4,8wt% chromium (Cr),

in particular at least 5.8wt%,

- it contains at most 24wt% chromium (Cr),

in particular at most 20% chromium,

- It contains at least 0.05wt% aluminum (AI),

- it contains a maximum of 0.2wt% aluminum (AI),

it has at least 0.06wt% of titanium (Ti),

it has at most 0,24wt% of titanium (Ti), it has no aluminum (AI),

the solder alloy consists of nickel, chromium, cobalt,

Aluminum, tungsten and germanium or - the solder alloy consists of nickel, chromium, germanium, cobalt, tungsten and tantalum or

the solder alloy consists of nickel, chromium, cobalt,

Aluminum, tungsten, tantalum and germanium or

- The solder alloy consists of nickel, germanium, cobalt, chromium, aluminum, titanium, tungsten and tantalum or

- It consists of nickel, germanium, cobalt, chromium,

Aluminum, titanium, tungsten and tantalum or the process involves that the solder alloy

polycrystalline (CC) is solidified,

especially in CC components.

Further advantageous developments of the process are: - The solder alloy is straightened.

- The solder alloy is solidified isothermally. The component has a solder alloy according to the abovementioned features and is preferably directionally solidified.

The component is advantageously formed in each case by the following measures:

- The substrate is directionally solidified,

the substrate is not directionally solidified, the chromium content of the solder alloy corresponds to the chromium content of the substrate of the component,

- The cobalt content of the solder alloy corresponds to the

Cobalt content of the substrate of the component,

- The aluminum content of the solder alloy corresponds to the

Aluminum content of the substrate of the component,

the titanium content of the solder alloy corresponds to the titanium content of the substrate of the component,

- The titanium content of the solder alloy is compared to the

Titanium content of the substrate of the component is reduced when higher proportions of germanium are used,

- In which the molybdenum content of the solder alloy is

 2% by weight, in particular 1% by weight,

if tungsten is present in the solder alloy,

which is greater than the degree of contamination,

- in which the tantalum content of the solder alloy is ^ 4Gew .-%. In the dependent claims further advantageous measures are listed, which can be combined with each other in an advantageous manner with each other.

Show it:

Figure 1 is a cross-sectional view of a component after a

 Treatment with the solder according to the invention,

FIG. 2 shows in perspective a turbine blade,

FIG. 3 shows in perspective a combustion chamber,

FIG. 4 shows a gas turbine

Figure 5 is a list of superalloys.

The figures and the description only

Embodiment of the invention.

FIG. 1 shows a component 1 which is treated with a solder 10 made of a solder alloy according to the invention.

The component 1 comprises a substrate 4, in particular for components for high-temperature applications, in particular in

Turbine vanes 120, 130 (FIG. 2) or combustion chamber elements 155 (FIG. 3) for steam or gas turbines 100 (FIG. 4) made of a nickel- or cobalt-based superalloy (FIG. 5).

The solder material 10 may preferably be used for all alloys according to FIG.

 These may preferably be the known materials PWA 1483, PWA 1484 or Rene N5.

 The solder material 10 is also used for blades for aircraft.

The substrate 4 has a crack 7 or a recess 7, which is to be filled by soldering. The cracks 7 or depressions 7 are preferably about 200ym wide and can be up to 5mm deep.

 In this case, the solder 10 is applied from a solder alloy in or in the vicinity of the recess 7 and by a heat treatment (+ T) melts the solder material 10 below a

Melting temperature of the substrate 4 and fills the

Well 7 completely off.

The solder alloy has a base, a solder and an additive, preferably it consists of base, solder and additive: with (1 -x -y) * base + x * solder + y * additive,

where 0.2 <x <0.8 and

 0 <y <0.8 and (y <1-x),

wherein the base comprises:

 20wt% - 35wt% chromium (Cr), in particular 25wt%,

lwt% - 15wt% nickel (Ni), in particular 10wt%,

 0, lwt% - 6wt% aluminum (AI), in particular 0, lwt% - 3wt%, in particular 0, lwt%,

3wt% - 12wt% tungsten (W), in particular 8wt% and

optional

 0, lwt% - lwt% titanium (Ti), in particular 0, lwt%,

0, lwt% - lwt% molybdenum (Mo), in particular 0, lwt%,

0, lwt% - 6wt% tantalum (Ta), especially 4wt% and

Cobalt (Co) and

wherein the solder comprises:

 0, lwt% - 10wt% chromium (Cr), in particular 4wt% - 8wt%,

0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%,

0, lwt% - 6wt% aluminum (AI), especially l, 5wt%,

0, lwt% - 6wt% tungsten (W), in particular 3wt% and

Germanium (Ge) and / or gallium (Ga),

in particular 18wt% to 30wt%,

especially 27wt%,

Nickel,

wherein the additive comprises:

 0wt% - 0.010wt% boron (B), in particular <0.010wt%,

0wt% - 0.6wt% zircon (Zr), in particular ^ 0.05wt%,

0wt% - 0.7wt% carbon (C), in particular ^ 0.25wt%. The solder alloy thus represents a physical mixture of two (base, solder) or three (+ additive) powders. For the base, only one, two or three elements of the group titanium, molybdenum, tantalum can be used.

The addition of germanium preferably dispenses with the addition of boron (B).

This is preferably the same for the melting point lower silicon (Si).

When adding the melting point depressant, the

Have solder alloy: gallium (Ga) and no germanium (Ge) or germanium (Ge) and no gallium (Ga) or gallium (Ga) and germanium (Ge).

The base is cobalt-based.

The lot is nickel based.

The solder alloy is cobalt-based and is suitable

preferably for cobalt-based superalloys.

Preferably, the solder alloy has no zircon (Zr), no hafnium (Hf), no niobium (Nb), manganese (Mn) or none

Carbon (C) on.

Particularly good solder alloys are achieved with

0.3 <x <0.5,

y = 0 or

0.2 <Y,

in particular 0.3 -S y -S 0.5.

Advantageous values for carbon (C), zirconium (Zr),

Aluminum (Al), titanium (Ti), tungsten (W), tantalum (Ta), chromium (Cr), cobalt (Co), germanium (Ge), gallium (Ga) are listed in the subclaims. Advantageous listings final

 Alloy compositions are listed in the subclaims. Also, the addition of rhenium can preferably be dispensed with.

Preferably, the addition or the presence of Sili ^¬ zium and / or carbon is avoided because they form in the solder Sprödpha- sen.

 It is also preferred to avoid the addition or presence of iron and / or manganese since the elements form low melting or non-oxidizing phases.

The solder material 10 may be in an isothermal or a temperature gradient process with the substrate 4 of the

Component 1, 120, 130, 155 are connected. One

Gradient method is then preferable if the substrate 4 has a directional structure, for example an SX or DS structure, so that the solder material 10 subsequently has a directed structure. A

directionally solidified structure in solder can also be carried out in an isothermal process.

Similarly, the component 1, 120, 130 need not have a directionally solidified structure (but a CC structure).

Likewise, the solders in CC substrates of components 1, 120, 130 can be soldered and solidified in a CC structure, the solders then being polycrystalline solidified (CC). Especially for the polycrystalline solidification of the solders, the following solders are particularly interesting:

In the melting (isothermal method or gradient method), it is preferable to use an inert gas, particularly argon, which reduces the chromium evaporation from the substrate 4 at the high temperatures, or uses a reducing gas (argon / hydrogen). The solder material 10 can also be applied over a large area to a surface of a component 1, 120, 130, 155 in order to achieve a thickening of the substrate 4, in particular in the case of hollow components. Preferably, the solder material 10 is used to fill in cracks 7 or depressions 7.

2 shows a perspective view of a rotor blade 120 or guide vane show ^¬ 130 of a turbomachine, which extends along a longitudinal axis of the 121st

The turbomachine may be a gas turbine of an aircraft or a power plant for power generation, a steam turbine or a compressor.

The blade 120, 130 has along the ^longitudinal axis 121 to each other, a securing region 400, an adjoining blade or vane platform 403 and a blade 406 and a blade tip 415.

As a guide vane 130, the vane 130 may be pointed on its shovel 415 have a further platform (not Darge ^¬ asserted).

In the mounting region 400, a blade root 183 is formed, which serves for attachment of the blades 120, 130 to a shaft or a disc (not shown).

The blade root 183 is, for example, as a hammerhead out staltet ^¬. Other designs as Christmas tree or Schwalbenschwanzfuß are possible.

The blade 120, 130 has a medium felblatt to the Schau- 406 flows past, a leading edge 409 and a ^trailing edge 412th

In conventional blades 120, 130, in all regions 400, 403, 406 of the blade 120, 130, for example, massive metallic materials, in particular superalloys, are used, in particular the superalloys according to FIG. 5. Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949.

 The blade 120, 130 can be made by a casting process, also by directional solidification, by a forging process, by a milling process or combinations thereof.

Workpieces with a monocrystalline structure or structures are used as components for machines which are exposed to high mechanical, thermal and / or chemical stresses during operation.

 The production of such monocrystalline workpieces takes place e.g. by directed solidification from the melt. These are casting processes in which the liquid metallic alloy is transformed into a monocrystalline structure, i. to the single-crystal workpiece, or directionally solidified.

Here, dendritic crystals are aligned along the heat flow and form either a columnar grain structure (columnar, ie grains that run the entire length of the workpiece and here, in common parlance, referred to as directionally solidified) or a monocrystalline structure, ie the whole workpiece be ^¬ is made of a single crystal. In these methods, you have to avoid solidification transition to globular (polycrystalline), since non-directional growth inevitably forms transverse and longitudinal grain boundaries ^¬ which make the good properties of the directionally solidified or single-crystal component naught.

If the term generally refers to directionally solidified structures, it means both single crystals that have no grain boundaries or at most small-angle grain boundaries, and stem crystal structures that have grain boundaries running in the longitudinal direction but no transverse grain boundaries. In these second-mentioned crystalline

Structures are also called directionally solidified structures. Such methods are known from US Pat. No. 6,024,792 and EP 0 892 090 A1.

Likewise, the blades 120, 130 may have coatings against corrosion or oxidation, e.g. B. (MCrAlX, M is at least one element of the group iron (Fe), cobalt (Co),

Nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare earths, or hafnium (Hf)). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1.

 The density is preferably 95% of the theoretical

Density.

 A protective aluminum oxide layer (TGO = thermal grown oxide layer) is formed on the MCrAlX layer (as an intermediate layer or as the outermost layer).

Preferably, the layer composition comprises Co-30Ni-28Cr-8A1-0, 6Y-0, 7Si or Co-28Ni-24Cr-10Al-0, 6Y. Besides these cobalt-based protective coatings, nickel-based protective layers such as Ni-10Cr-12Al-0.6Y-3Re or Ni-12Co-21Cr-IIAl-O, 4Y-2Re or Ni-25Co-17Cr-10A1-0, 4Y-1 are also preferably used , 5Re. On the MCrAlX may still be present a thermal barrier coating, which is preferably the outermost layer, and consists for example of Zr0 ₂ , Y2Ü3-Zr02, ie it is not, partially ^¬ or fully stabilized by yttria

and / or calcium oxide and / or magnesium oxide.

The thermal barrier coating covers the entire MCrAlX layer.

 By suitable coating methods, e.g. Electron beam evaporation (EB-PVD) produces stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, for example atmospheric plasma spraying (APS), LPPS, VPS or CVD. The heat insulation layer may have ^¬ porous, micro- or macro-cracked ^compatible grains for better thermal shock resistance. The Thermal insulation layer is therefore preferably more porous than the

MCrAlX layer.

Refurbishment means that components 120, 130 may need to be deprotected after use (e.g., by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. Optionally, even cracks in the component 120, 130 are repaired. This is followed by a re-coating of the component 120, 130 and a renewed use of the component 120, 130.

The blade 120, 130 may be hollow or solid. If the blade 120, 130 is to be cooled, it is hollow and also has, if necessary, film cooling holes 418 ^(indicated by dashed lines) on.

FIG. 3 shows a combustion chamber 110 of a gas turbine.

The combustion chamber 110 is configured, for example, as so-called ^an annular ^combustion chamber, in which a plurality of in the circumferential direction about an axis of rotation 102 arranged burners 107 open into a common combustion chamber space 154 and generate flames 156th For this purpose, the combustion chamber 110 is configured in its entirety as an annular structure, which is positioned around the axis of rotation 102 around.

To achieve a comparatively high efficiency, the combustion chamber 110 is designed for a comparatively high temperature of the working medium M of about 1000 ° C to 1600 ° C. To even with these operating parameters unfavorable for the materials, a comparatively long operating time to be made ^¬ union, the combustion chamber wall 153 is provided on its side facing the ^working medium M facing side with a formed from heat shield elements 155. liner.

Each heat shield element 155 made of an alloy is on the working medium side with a particularly heat-resistant protective layer (MCrAlX layer and / or ceramic coating). equipped or is made of high temperature resistant material (solid ceramic stones).

 These protective layers may be similar to the turbine blades, so for example MCrAlX means: M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and stands for yttrium (Y) and / or silicon and / or at least one element of the rare earths, or hafnium (Hf). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1.

On the MCrAlX, for example, a ceramic Wär ^¬ medämmschicht be present and consists for example of ZrÜ2, Y203 ^~ Zr02, ie it is not, partially or completely stabilized by yttrium and / or calcium oxide and / or magnesium oxide.

 By suitable coating methods, e.g. Electron beam evaporation (EB-PVD) produces stalk-shaped grains in the thermal barrier coating.

Other coating methods are conceivable, for example atmospheric plasma spraying (APS), LPPS, VPS or CVD. The heat insulation layer may have ^¬ porous, micro- or macro-cracked ^compatible grains for better thermal shock resistance. Reprocessing (Refurbishment) means that ^heat shield elements may need to be removed 155 after use of protective layers (for example by sandblasting). This is followed by removal of the corrosion and / or oxidation layers or products. If necessary, cracks in the heat shield element 155 are also repaired.

 Thereafter, a re-coating of the heat shield elements 155 and a renewed use of the heat shield elements 155. Due to the high temperatures inside the combustion chamber

110 may also be provided for the heat shield elements 155 and for their holding elements, a cooling system. The heat shield elements 155 are then hollow and have, for example possibly still in the combustion chamber 154 opening cooling holes (not shown).

FIG. 4 shows by way of example a gas turbine 100 in a longitudinal partial section.

The gas turbine 100 has a rotatably mounted about a rotational axis 102 ^¬ rotor 103 having a shaft 101, which is also referred to as the turbine rotor.

Along the rotor 103 follow one another an intake housing 104, a compressor 105, for example, a toroidal combustion chamber 110, in particular annular combustion chamber, with a plurality of coaxially arranged burners 107, a turbine 108 and the exhaust housing 109th

The annular combustion chamber 110 communicates with an annular annular hot gas channel 111, for example. There, for example, four turbine stages 112 connected in series form the turbine 108.

 Each turbine stage 112 is formed, for example, from two blade rings. In the flow direction of a working medium

As can be seen in the hot gas duct 111 of a guide blade row 115, a row 125 formed of rotor blades 120 follows.

The guide vanes 130 are fastened to an inner housing 138 of a stator 143, whereas the moving blades 120 of a row 125 are attached to the rotor 103 by means of a turbine disk 133, for example.

 Coupled to the rotor 103 is a generator or work machine (not shown).

During operation of the gas turbine 100 104 air 135 is sucked by the compressor 105 through the intake housing and ver ^¬ seals. The 105 ^¬ be compressed air provided at the turbine end of the compressor is supplied to the burners 107, where it is mixed with a fuel. The mixture is then burned to form the working fluid 113 in the combustion chamber 110. From there, the working medium 113 flows along the hot gas channel 111 past the guide vanes 130 and the blades 120. On the blades 120, the working medium 113 expands in a pulse-transmitting manner, so that the blades 120 drive the rotor 103 and this drives the working machine coupled to it.

The components exposed to the hot working medium 113 are subject to thermal loads during operation of the gas turbine 100. The guide vanes 130 and rotor blades 120 of the first turbine stage 112, viewed in the flow direction of the working medium 113, are subjected to the greatest thermal stress in addition to the heat shield elements lining the annular combustion chamber 110.

 To withstand the prevailing temperatures, they can be cooled by means of a coolant.

Likewise, substrates of the components may have a directional structure, i. they are monocrystalline (SX structure) or have only longitudinal grains (DS structure).

As a material for the components, in particular for the ^turbine blade or vane 120, 130 and components of the combustion chamber 110. For example, iron-, nickel- or cobalt-based superalloys are used.

 Such superalloys are known, for example, from EP 1 204 776 B1, EP 1 306 454, EP 1 319 729 A1, WO 99/67435 or WO 00/44949.

Also, the blades 120, 130 may be anti-corrosion coatings (MCrAlX; M is at least one element of the group iron (Fe), cobalt (Co), nickel (Ni), X is an active element and is yttrium (Y) and / or silicon , Scandium (Sc) and / or at least one element of the rare earth or hafnium). Such alloys are known from EP 0 486 489 B1, EP 0 786 017 B1, EP 0 412 397 B1 or EP 1 306 454 A1.

On the MCrAlX may still be present a thermal barrier coating, and consists for example of Zr02, Y203-Zr02, ie it is not, partially or completely stabilized by Ytt ^¬ riumoxid and / or calcium oxide and / or magnesium oxide. Suitable coating processes, such as electron beam evaporation (EB-PVD), produce stalk-shaped grains in the thermal barrier coating. The guide vane 130 has an inner housing 138 of the turbine 108 facing guide vane root (not Darge here provides ^¬) and a side opposite the guide-blade root vane root. The vane head faces the rotor 103 and fixed to a mounting ring 140 of the stator 143.

Claims

claims 1. solder alloy  consisting of  (1 -x -y) * base + x * lot + y * addition,  where 0.2 <x <0.8 and  0 <y <0.8 and (y <1-x),  wherein the base comprises:  20wt% - 35wt% chromium (Cr), especially 22wt% to 27wt%, most especially 25wt%,  lwt% - 15wt% nickel (Ni), in particular 10wt%,  0, lwt% - 6wt% aluminum (AI),  in particular 0.1-3 wt% wt%,  in particular 0, lwt%,  3wt% - 12wt% tungsten (W), especially 6wt% to 10wt%, most especially 8wt%,  optional  0, lwt% - lwt% titanium (Ti), in particular 0, lwt%,  0, lwt% - lwt% molybdenum (Mo), in particular 0, lwt%,  0, lwt% - 6wt% tantalum (Ta), especially 4wt% and  at least lwt% cobalt (Co) and  wherein the solder comprises:  0, lwt% - 10wt% chromium (Cr), especially 4wt% - 8wt%, 0, lwt% - 10wt% cobalt (Co), in particular 4wt% - 8wt%, 0, lwt% - 6wt% aluminum (AI), especially l, 5wt%,  0, lwt% - 6wt% tungsten (W), in particular 3wt% and  Germanium (Ge) and / or gallium (Ga),  in particular 18wt% to 30wt%,  especially 27wt%,  at least 1% nickel,  wherein the additive comprises:  0wt% - 0.010wt% Boron (B), especially 0,001wt% <B <  0, 010wt%  0wt% - 0.6wt% zircon (Zr), in particular <0.05wt% 0wt% - 0.7wt% carbon (C), in particular 0.01wt% <Zr <0.25wt%. 2. solder alloy according to claim 1,  in which only one element of the group titanium (Ti), molybdenum (Mo), tantalum (Ta) is used for the base. 3. solder alloy according to claim 1,  in which at least two elements of the group titanium (Ti), molybdenum (Mo), tantalum (Ta) are used for the base, in particular only two elements of this group are used. 4. solder alloy according to claim 1,  which has for the base titanium (Ti), molybdenum (Mo), tantalum (Ta). 5. solder alloy according to claim 1, 2, 3 or 4,  where the base is cobalt-based,  in particular in which the base has cobalt as the remainder. 6. solder alloy according to claim 1, 2, 3, 4, or 5,  where the solder is nickel-based,  in particular, in which the solder has the remainder of nickel. A solder alloy according to claim 1, 2, 3, 4, 5 or 6, which is cobalt-based,  in particular in which the solder alloy has cobalt as the remainder. Solder alloy according to claim 1, 2, 3, 4, 5, 6 or 7, which does not contain any deliberate addition of boron (B), especially <20ppm. A solder alloy according to claim 1, 2, 3, 4, 5, 6, 7 or 8, which does not contain any deliberate addition of silicon (Si). 10. solder alloy according to claim 1, 2, 3, 4, 5, 6, 7, 8 or 9,  which has no deliberate addition of zircon (Zr). 11. solder alloy according to one or more of claims 1 to 10,  which has no deliberate addition of hafnium (Hf). 12. solder alloy according to one or more of claims 1 to 11,  which has no deliberate addition of niobium (Nb). 13. solder alloy according to one or more of the preceding claims,  which has no deliberate addition of carbon (C). 14. Soldering according to one or more of the preceding claims,  which does not contain any deliberate addition of titanium (Ti). 15. solder alloy according to one or more of the preceding claims, which does not contain any deliberate addition of molybdenum (Mo). 16. solder alloy according to one or more of the preceding claims,  which does not contain a deliberate addition of tantalum (Ta). 17. Soldering according to one or more of the preceding claims,  in the cobalt (Co) has the largest proportion by weight. 18. solder alloy according to one or more of the preceding claims,  which has gallium (Ga) and no germanium (Ge). 19. Solder alloy according to one or more of the preceding claims,  which has germanium (Ge) and no gallium (Ga). 20. Solder alloy according to one or more of the preceding claims,  which has gallium (Ga) and germanium (Ge). 21. Solder alloy according to one or more of the preceding claims,  which has at least 0.01 wt% zirconium (Zr),  in particular at least 0.12wt%. 22. Solder alloy according to one or more of the preceding claims,  having at most 0.04wt% zirconium (Zr), in particular at most 0,5wt%. 23. Solder alloy according to one or more of the preceding claims,  which has carbon (C),  at least 0.05wt%,  in particular at least 0.13wt%. 24. Soldering according to one or more of the preceding claims,  having at most 0,55wt% carbon (C),  in particular at most 0.2wt% carbon (C). 25. Soldering alloy according to one or more of the preceding claims,  where 0.3 <x <0.5. 26. Soldering according to one or more of the preceding claims,  where y = 0. 27. Soldering according to one or more of the preceding claims,  in the applies  0.2 <y,  in particular 0.3 ^ y ^ 0.5. 28. Soldering according to one or more of the preceding claims, which does not contain any deliberate addition of manganese (Mn). 29. Soldering according to one or more of the preceding claims,  the tungsten (W) contains at least 1.5%,  in particular l, 6wt%. 30. solder alloy according to one or more of the preceding claims,  when the tungsten content is at most 6.4 wt%,  in particular maximum 6, 0wt%. 31. Soldering according to one or more of the preceding claims,  the tantalum (Ta) contains at least 0.6wt%,  in particular at least 0.8wt%. 32. Solder alloy according to one or more of the preceding claims,  which has a maximum of 3.2wt% tantalum,  in particular maximum 2.5wt%. 33. Solder alloy according to one or more of the preceding claims,  where the gallium (Ga) or germanium (Ge) content is 1, 5wt%,  especially where the gallium or germanium content is> 3wt%. 34. Solder alloy according to one or more of the preceding claims, where the gallium (Ga) or germanium (Ge) content is> 6wt%. 35. Solder alloy according to one or more of the preceding claims,  at the gallium (Ga) or germanium (Ge) content  28wt%,  especially at the gallium or germanium content <24wt%. 36. Solder alloy according to one or more of the preceding claims,  containing at least 4.8wt% chromium (Cr),  in particular at least 5.8wt%. 37. Solder alloy according to one or more of the preceding claims,  containing at most 24wt% chromium (Cr),  in particular contains at most 20% chromium. 38. Solder alloy according to one or more of the preceding claims,  containing at least 0.05wt% aluminum (AI). 39. Solder alloy according to one or more of the preceding claims,  containing max. 0.2wt% aluminum (AI). 40. Solder alloy according to one or more of the preceding claims, which has at least 0.06wt% of titanium (Ti). 1. solder alloy according to one or more of the preceding claims,  which has at most 0,24wt% of titanium (Ti). 2. solder alloy according to one or more of the preceding claims,  which has no deliberate addition of aluminum (AI). 3. solder alloy according to one or more of the preceding claims,  in which the solder alloy of nickel, chromium, cobalt,  Aluminum, tungsten and germanium exists. 4. solder alloy according to one or more of the preceding claims,  wherein the solder alloy consists of nickel, chromium, germanium, cobalt, tungsten and tantalum. 5. solder alloy according to one or more of the preceding claims,  in which the solder alloy of nickel, chromium, cobalt,  Aluminum, tungsten, tantalum and germanium. 6. solder alloy according to one or more of the preceding claims, wherein the solder alloy consists of nickel, germanium, cobalt, chromium, aluminum, titanium, tungsten and tantalum. 47. Solder alloy according to one or more of the preceding claims,  wherein the solder alloy consists of nickel, germanium, cobalt, chromium, aluminum, titanium, tungsten and tantalum. 48. Method using a solder alloy according to one or more of the claims  in which the solder alloy polycrystalline (CC) is solidified, especially in CC components. 49. Method using a solder alloy according to one or more of the claims  in which the solder alloy is directionally solidified,  especially in DS components. 50. The method according to claim 48 or 49,  in which the solder alloy is solidified isothermally. 51. Solder alloy solder component according to one or more of  several of the preceding claims. 52. Component according to claim 51,  whose substrate (4) is directionally solidified. 53. Component according to claim 51, whose substrate (4) is not directionally solidified. 54. Component according to one or more of the preceding claims 51 to 53,  wherein the chromium content (Cr) of the solder alloy is the  Chromium content of the substrate (4) of the component (1, 120, 130, 155) corresponds. 55. Component according to one or more of the preceding  Claims 51 to 54,  wherein the cobalt content (Co) of the solder alloy is the  Cobalt content of the substrate (4) of the component (1, 120, 130, 155) corresponds. 56. Component according to one or more of the preceding  Claims 51 to 55,  wherein the aluminum content (AI) of the solder alloy to the  Aluminum content of the substrate (4) of the component (1, 120, 130, 155) corresponds. 57. Component according to one or more of the preceding  Claims 51 to 56,  wherein the titanium content (Ti) of the solder alloy is the  Titanium content of the substrate (4) of the component (1, 120, 130, 155). 58. Component after one or more preceding ones  Claims 51 to 56,  in which the titanium alloy (Ti) content of the solder alloy is reduced compared to the titanium content of the substrate (4) of the component (1, 120, 130, 155), if higher proportions of germanium are used, in particular reduced by 10%. 59. Component according to one or more of the preceding claims 51 to 58,  wherein the molybdenum content (Mo) of the solder alloy  <2% by weight,  in particular, 1% by weight  is,  when tungsten (W) is present in the solder alloy, which is larger than the impurity level. 60. Component according to one or more of the preceding claims 1 to 59,  where the tantalum content (Ta) of the solder alloy <4Gew. is.