EP2543240A1

EP2543240A1 - Electrical contact arrangement

Info

Publication number: EP2543240A1
Application number: EP11706591A
Authority: EP
Inventors: Dieter Holste; Ulrich Rosemeyer
Original assignee: Phoenix Contact GmbH and Co KG
Current assignee: Phoenix Contact GmbH and Co KG
Priority date: 2010-03-04
Filing date: 2011-03-03
Publication date: 2013-01-09
Also published as: JP2013521639A; CN102783257A; US20130005163A1; DE102010010331A1; WO2011107547A1

Abstract

The invention relates to an electrical contact arrangement of a spring contact element (10) on a printed circuit board (12) with a soldering area (16) arranged on a surface of the printed circuit board (12) and a planar contact area (18) arranged on the soldering area (16), wherein the spring contact element (10) can be arranged on the contact area (18).

Description

Electrical contact arrangement

The invention relates to an electrical contact arrangement of a spring contact element on a printed circuit board.

For direct contacting of spring contact elements on printed circuit boards usually a soldering surface is applied in the form of a copper surface for contacting in the circuit pattern of the circuit board. The surface of the copper surface is designed conductive and solderable. In this type of contacting, however, it is usually only possible, the

To arrange spring contact elements on the front or the upward side of the circuit board. In this type of production, the surface is a large

Wear by the contact and the forces in the contacting state, for example, by vibration exposed. In addition, a large amount of space for the arrangement of the spring contact element to a contact

necessary to produce.

The object of the invention is therefore to provide an electrical contact arrangement of a spring contact element on a

PCB to provide available, which is characterized by a wear-free arrangement and a reduced footprint. The object is achieved according to the invention by the features of claim 1.

Advantageous embodiments of the invention are specified in the subclaims. The electrical contact arrangement of the invention

Spring contact element on a printed circuit board has a soldering surface arranged on a surface of the printed circuit board and a flat formed on the soldering surface Contact surface, wherein the spring contact element can be arranged on the contact surface.

The electrical contact arrangement according to the invention is characterized in that a soldering surface is flat

at least a portion of the surface of the

Printed circuit board is arranged and a flat contact surface is applied to this soldering surface. Just trained means that the contact surface is flat, for example in the form of a plate formed. In turn, a spring contact element can be arranged on this contact surface. The soldering surface is preferably designed in such a way that, when a solder is applied to the soldering surface, a soldering paste surface or arbitrarily

can be applied over part of the surface, wherein the soldering surface can cover the entire surface or a portion of the surface of the contact surface. Preferably, the soldering surface is provided at four Randeckbereichen the contact surface.

By means of the soldering surface and on the soldering surface

applied solder, the contact surface can be fixed to or on the circuit board. The newly formed contact surface itself is electrically conductive and serves on the one hand as a mechanical support for fixing the spring contact element to the circuit board and on the other hand for producing an electrical contact of the spring contact element with the circuit board. By providing the soldering surface and the contact surface formed thereon, it is possible that the spring contact element on the underside of the circuit board can be arranged, so that it is possible, for example, a shield connection to the

Provide spring contact element or form the spring contact element as a shield terminal, which should contact for reasons of space preferably below the circuit board. Thus it is with the electrical according to the invention Contact arrangement possible, a possible wear-free and space-saving contact, especially for

Contacting, where there is little space available to provide. The newly formed contact surface is also characterized by a space-saving Anordbarkeit. In addition, the electrical contact arrangement according to the invention enables wear phenomena

Required repair of the circuit board, which has not been possible in the known electrical contact arrangements.

According to an advantageous embodiment of the invention, the newly formed contact surface is a sheet metal element. The sheet metal element is characterized by the possibility of a particularly space-saving arrangement, wherein the

Sheet metal element can be arbitrarily large and thick. Preferably, the sheet metal element is made of a

Bronze material, preferably made of CuSn6, formed and may additionally be provided with a corrosion-protecting, electrically conductive surface, preferably formed of tin (Sn), silver (Ag) and / or gold (Au).

As a result, a particularly good electrical conductivity of the contact surface is given. The as a sheet metal element

trained flat molded contact surface allows prevention of wear of the circuit board in

Contact area. This is usually one

Base layer provided. The base layer usually consists of arbitrarily thick copper, which is directly on the

Printed circuit board is applied and connected. On this base layer can be one or more surfaces

be applied. By providing a sheet metal element, a particularly cost-effective contact surface for

Will be provided. Further, it is preferably provided that the

Spring contact element parallel to the longitudinal surface of

Printed circuit board can be pushed onto the newly formed contact surface. This is a particularly simple and secure attachment of the spring contact element to the

Printed circuit board possible, with a particularly preferred contacting with a very limited space is possible. This allows the handling of the

electrical contact arrangement over known

electrical contact arrangements are significantly improved.

Preferably, a solder paste is on the soldering surface for

Forming a mat-shaped solder paste surface applied to the surface of the circuit board. In this case, mat-shaped means that the solder formed in the form of a solder paste is applied to the soldering surface in such a way that a surface wetting of the soldering surface takes place by means of the solder paste. The solder paste can according to the dimensions of the contact surface on the circuit board

be applied, but the surface of the solder paste can also be formed smaller or larger than the dimensions of the contact surface. The application of the solder paste can

for example, by printing done. In the

Application of the solder paste, it is possible to provide both a total surface application or provide more individual surfaces. When applying the solder paste preferably forms a mat-shaped

Lotpastenfläche, whereby a particularly good fixation of the newly formed contact surface on the soldering surface is possible. When using a solder paste as

Solder may preferably be a reflow soldering for

Attachment of the contact surface can be used on the circuit board. For this, first on the soldering surface of PCB solder paste applied. Subsequently, the newly formed contact surface is arranged on the soldering paste or the soldering surface. The use of solder paste has the advantage that it has a large adhesive effect without that additional adhesive would be necessary, and so the newly formed contact surface can be fixed directly to the solder paste or on the soldering surface. By supplying heat, the applied solder paste melts, whereby the newly formed contact surface can automatically center on the soldering surface as a result of the surface tension during the melting of the solder paste or the solder. By using a solder paste can be made a large-scale, easy to produce soldering. Further, it is preferably provided that the circuit board in the region of the soldering surface has a through hole, wherein the through hole as a ventilation hole

is formed or wherein the through hole for

Formation of a via is provided. If the through-hole is formed as a ventilation hole, it is possible that air can escape from the soldering surface during soldering, so that the heat generated during soldering can be dissipated. Thereby, the formation of air bubbles and / or voids between the soldering surface and the newly formed contact surface can be prevented, whereby the strength of the connection of the soldering surface with the

Contact surface, in particular against shear forces and against shear and compressive stress can be increased. Further, via the ventilation hole in a further, that is preferably preferably supplied by an additional soldering process from the opposite side of the contact surface of the circuit board according to necessity solder to be supplied in order to increase the strength of the solder connection between the contact surface and the soldering surface can. Is the Through hole formed as a via, an anchoring of the solder deposited on the solder surface in the through hole is possible, whereby the strength of the compound of the solder with the soldering surface or the circuit board, in particular against shear forces, can be improved. Is in addition to the as

Through-hole formed through hole Lotmittel supplied to the already provided on the solder surface solder, the strength of the contact surface on the soldering surface against shear forces can be additionally increased. The provision of a trained as a via

Through hole for the supply of solder allows a reflow and a subsequent wave soldering. Furthermore, it is preferably provided that the contact surface has at least one of its edge regions a chamfer and / or a run-on slope. By providing a chamfer and / or a run-on slope, a deflection of the spring contact element can be made possible in the attachment of the spring contact element to the contact surface, whereby the

Installation can be performed easier and gentler material. In the provision of a chamfer on the contact surface, the contact surface can be in the form of a straight contact surface or a straight one, for example

Be formed sheet metal element, wherein at an edge region of the straight shaped contact surface or the straight

shaped sheet metal element, the chamfer may be formed. The provision of a run-on slope can both by a

Bending the contact surface or the sheet metal element or by changing the thickness of the contact surface or the sheet metal element. The provision of a chamfer and / or a run-on slope prevents damage to the

Spring contact element, in particular when fixing the spring contact element to the contact surface. Further allows the provision of a chamfer and / or a

Anlaufschräge that the spring contact element can be introduced in both the horizontal direction and in the vertical direction to the contact surface angled and thereby facilitating the interfitting of the spring contact element with the contact surface, whereby the

Handling of a fixation of the spring contact element on the contact surface or on the circuit board is simplified. The chamfer and / or the chamfer bevel are preferably provided on the edge region of the contact surface, which in the insertion direction or in the attachment direction of

Spring contact element on the contact surface on the front or is provided as the first. Hereinafter, the invention with reference to the accompanying drawings by way of a preferred

Embodiment explained in more detail.

Show it:

Fig. 1 is a schematic representation of a

electric contact arrangement according to the invention;

Fig. 2 is a schematic representation of a printed circuit board with the soldering surface arranged thereon according to the

Invention in a plan view of the underside of the circuit board;

3 is a schematic representation of the in Fig. 2

shown circuit board in a plan view of the top of the circuit board;

Fig. 4 is a schematic representation of

contact surface according to the invention. 1 shows schematically an inventive electrical contact arrangement of a spring contact element 10 on a printed circuit board 12, wherein in this case a plan view of the underside 14 of the printed circuit board 12 is shown. On the surface of the underside 14 of the circuit board 12, a soldering surface 16, on which a mat-shaped solder paste surface can be applied, is provided. On the soldering surface 16 a flat formed contact surface 18 is arranged in the form of a sheet metal element to which the

Spring contact element 10 can be fastened to a

Making contact between the spring contact element 10 and the circuit board 12. The spring contact element 10 can serve as a shield connection. The attachment of the spring contact element 10 to the contact surface 18 is preferably carried out by pushing the spring contact element 10 on the contact surface 18 via the side surface 26 of the

Printed circuit board 12, wherein a preferred AufSchieberichtung of the spring contact element 10 is indicated by the arrow 30.

As shown in Fig. 2, the soldering surface 16 is applied flat on the underside 14 of the circuit board 12, wherein the soldering surface 16 is preferably a solder paste surface on the surface of the underside 14 of the circuit board 12th

is applied, so that a kind of solder pad is formed. However, it is also possible to provide the soldering surface 16, the contact surface 18 and the spring contact element 10 on the upper side 18 of the printed circuit board 12. Furthermore, it is also possible to provide one or more spring contact elements 10 on the underside 14 and the upper side 18 of the printed circuit board 12.

In Fig. 3, the circuit board 12 is shown in the form of a plan view of the top 28 of the circuit board 12, wherein It can be seen here that in the case shown here

Embodiment, the circuit board 12 has a through hole 20. The through hole 20 may as

Ventilation hole or be formed as a via, through which heat generated during soldering or air from the soldering surface 16 can escape to the

Formation of air bubbles and / or voids between the soldering surface 16 and arranged on the soldering surface 16 contact surface 18 to prevent. In the embodiment shown here, the through hole 20 is as

Through contact formed, in which a

metallized ring 32 on the inner surface of

Through hole 20 is formed, whereby anchoring of the applied to the soldering surface 16 Lotmittels is possible. The through-bore 20 is additionally indicated in FIG. 2, the through-hole 20 in FIG. 2 being coated with the solder applied to the soldering surface 16. 4, the contact surface 18, which has just been formed, is shown, wherein the contact surface 18 is formed as a sheet-metal element, which is substantially planar, wherein the edge region 22 of the contact surface 18 is provided with a run-on slope 24. The run-up slope 24 is in this case in the form of an angling of the contact surface 18 formed as a sheet-metal element on the edge region 22

educated. The run-on slope 24 is shaped such that the run-on slope 24, as shown in Fig. 1, in an arrangement on the circuit board 12 rests against a side surface 26 of the circuit board 12 and in this area

Side surface 26 of the circuit board 12, the circuit board 12 protects and at the same time as a kind of guide means in the attachment of the spring contact element 10 to the

Printed circuit board 12 is used. Reference sign list

Spring contact element 10

Circuit board 12 underside 14

Soldering surface 16

Contact surface 18

Through hole 20

Edge area 22 starting slope 24

Side surface 26

Top 28

Sliding direction 30

Metallized ring 32

Claims

claims

1. Electrical contact arrangement of a spring contact element (10) on a printed circuit board (12), with

a soldering surface (16) arranged on a surface of the printed circuit board (12) and

one on the soldering surface (16) arranged flat

trained contact surface (18), wherein the

Spring contact element (10) on the contact surface (18) can be arranged.

2. Electrical contact arrangement according to claim 1, characterized in that the newly formed

Contact surface (18) is a sheet metal element.

3. Electrical contact arrangement according to claim 1 or 2, characterized in that the spring contact element (10) parallel to the longitudinal surface of the printed circuit board (12) on the newly formed contact surface (18) can be pushed.

4. Electrical contact arrangement according to one of claims 1 to 3, characterized in that on the soldering surface

(16) a solder paste for forming a mat-shaped solder paste surface on the surface of the circuit board

(12) is applied.

5. Electrical contact arrangement according to one of claims 1 to 4, characterized in that the circuit board (12) in the region of the soldering surface (16) a

Through hole (20), wherein the

Through hole (20) as a ventilation hole

is formed or wherein the through hole (20) is provided for forming a via. Electrical contact arrangement according to one of claims to 5, characterized in that the contact surface (18) on at least one of its edge regions (22) has a chamfer and / or a run-on slope (24).