EP2404108A1 - Lighting device having a socket and bulb fitting - Google Patents
Lighting device having a socket and bulb fittingInfo
- Publication number
- EP2404108A1 EP2404108A1 EP09779115A EP09779115A EP2404108A1 EP 2404108 A1 EP2404108 A1 EP 2404108A1 EP 09779115 A EP09779115 A EP 09779115A EP 09779115 A EP09779115 A EP 09779115A EP 2404108 A1 EP2404108 A1 EP 2404108A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lighting device
- socket
- heat transfer
- base
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/97—Holders with separate means to prevent loosening of the coupling or unauthorised removal of apparatus held
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a lighting device comprising at least one light source, at least one with the light source thermally and electrically in Wirkverbin- standing base and at least one intended for receiving the socket socket.
- the invention further relates to a socket for receiving a base which is electrically and thermally operatively connected to at least one light source.
- the invention likewise relates to a base which is electrically and thermally operatively connected to at least one light source.
- light sources in particular semiconductor light sources such as light-emitting diodes (LED)
- LED light-emitting diodes
- the disadvantage here is in addition to the poor thermal conductivity also in particular with screw sockets, the mechanical fixation, which can easily solve vibration or by excessive tightening can lead to destruction of the lighting device or the socket NEN.
- the object of the present invention is to provide a loading leuchtungsvoriques at least one light ⁇ source comprising to provide at least one thermally and electrically operatively connected to the light source pedestal and at least one intended to receive the base version, which the disadvantages of the prior art avoids and in particular a if necessary, ins ⁇ particular for replacing the light source, easily releasable attachment of the light source allows a zuver ⁇ casual transmission of electrical energy as well as a secure mechanical attachment and transmission of thermal power to be ensured.
- the object of the invention is further, a socket for receiving a base which is electrically and thermally in operative connection with at least one light ⁇ source, to create for use in any of the above
- the invention likewise relates to a base which is electrically and thermally operatively connected to at least one light source.
- Is by the base has at least one firstticiangangsflä ⁇ surface and the socket has at least one directly or through a film in contact with the ers ⁇ th heat transfer surface second heat transfer surface and at least one device for exerting a predefined contact pressure between the first and the second heat transfer surface is provided , an optimized heat transfer between socket and socket is ensured.
- the size of the contact force and size and design of the heat transfer surfaces are chosen so that the heat ⁇ transmission is sufficient to keep the temperature of the light source in the desired range under the expected operating conditions. By predefining the contact pressure, it is ensured that the heat transfer conditions between the heat transfer surfaces can be set reproducibly.
- sheet-like elements are to be considered as sheets whose thickness, ie the distance between two essentially plane-parallel surfaces, is very small in relation to their lateral dimensions.
- the contact pressure is chosen so that on the heat ⁇ meübergangs vom a pressure between 0.002 N / mm 2 and 1.0 N / mm 2 , preferably between 0.05 N / mm 2 and 0.5 N / mm 2 more preferably between 0.08 N / mm 2 and 0.3 N / mm 2 , in particular from approximately 0.1 N / mm 2 to 0.2 N / mm 2 is applied, in the usual conditions of a socket-holding system both a good heat transfer, as well as sufficient contact reliability and good solubility of the connection in the event of replacement of the light source.
- a film of a good heat-conducting material is arranged between the first heat transfer surface and the second heat transfer surface .
- This film can compensate for unevenness oreuerunge- inaccuracies of the heat transfer surfaces and thus avoid unwanted air cushion between the surfaces.
- insbesonde ⁇ re films having a heat conductivity are perpendicular to the surface of more than 1 W / mK, preferably greater than 15 W / mK, more preferably of more than 50 W / mK angese ⁇ hen as a good heat conductor.
- Such materials can, for example, ceramic films, that is preferably polymer-based films with a ceramic j ⁇ rule insert, as sold for example under the name of Kerafol, but also graphite based films or metallic foils, especially before ⁇ Trains t indium, be.
- indium has, in addition to a high thermal conductivity of more than 80 W / mK, the necessary low hardness, which allows a good adaptation to the surface of the heat transfer surfaces. Since the contact resistance of ceramic films changes with the pressure, a pressure range according to the preceding claim is particularly advantageous, since such a good heat transfer is ensured.
- the film at least on one side has an adhesive effect, in particular coated with an adhesive, the production of the lighting device with simple mittein is possible. In particular, such a slipping of the film when inserting the base into the socket is easily avoidable.
- the film on the base-side first heat transfer surface is brought by means of the adhesive action at ⁇ , since the film can be easily replaced thus when replacing the light source and thus of the base than when it is connected to the socket or only loosely between base and holder inserted is.
- At least one spring element is provided for exerting the contact pressure on the heat transfer surfaces.
- Spring elements allow for a good adjustment of the contact pressure and on the other hand are well suited to compensate for dimensional tolerances without an excessive force is exerted on one of the components.
- At least one, in particular wedge-shaped, fixing element for locking the seat is provided in the socket.
- a secure hold of the base is given in the socket.
- Wedge-shaped fixing elements that is, elements whose cross-section increases along a given line, are particularly well suited for fixing because these when they are inserted along this line into a holding member have with increas ⁇ mender insertion depth is an increasing retention force on ⁇ .
- dimensional tolerances of the interacting components can be well balanced.
- the socket on at least one groove and / or a jump ahead ⁇ and the socket at least one in the operating state in the groove and / or the projection engaging Fixie ⁇ tion element.
- the socket comprises at least one groove and / or projection and the socket in at least one operating condition in the groove and / or the projection eingrei ⁇ fendes fixing element.
- a positive connection between the base and the socket is produced by a factor of ten .
- the base is at least partially approximately circular.
- circular components are easily producible ⁇ bar
- the circular portion in egg ⁇ ner circular holding member can be easily introduced and the position can be changed by rotation.
- the base has at least one element for ensuring the installation position, in particular for preventing rotation. This ensures that the electrical contacts as well as the emission direction of the light source are in the correct position during operation.
- the particular wedge-shaped ⁇ fixing member is movable by means of a linear movement of a fixing in a non-fixing position and / or from a non-fixing in a fixing position.
- Linear movements can also be easily made by operators, so that incorrect operation or unergonomic workflows in the Fixie ⁇ tion of the base, especially in the manufacture of the lighting device can be excluded.
- the particular wedge-shaped fixing element is movable by means of a rotary and / or pivoting movement from a fixing to a non-fixing position and / or from a non-fixing to a fixing position.
- Such devices are easy to produce.
- the leadership of the fixing element can be taken over by the axis of rotation, which can be easily formed.
- the Fix istsele ⁇ ment is secured by simple means against losing.
- Turning and / or pivoting movements can also be carried out relatively easily by operators, which means that days of the socket.
- bayonet closures make mostly use of a Schwenkbe ⁇ movement of a fixing element use.
- an element is brought into the locked position by means of a sliding rotary movement in relation to a second element, wherein additionally a catch safety device may be provided.
- the fixing element is designed as a coupling ring and / or union nut, a particularly simple and secure way to attach the base is created.
- FIG. 1 shows a first embodiment of a lighting device according to the invention in a perspective view
- FIG. 2 shows the illumination device according to FIG. 1 in a sectional illustration
- FIG. 3 shows a further exemplary embodiment of a lighting device according to the invention in a perspective view
- FIG. 4 shows the illumination device according to FIG. 3 in a perspective sectional illustration
- FIG. 5 shows the illumination device according to FIG. 3 in a further perspective view
- Fig. 6 shows a further embodiment of a fiction, modern ⁇ lighting device in a Explosionsdarsander
- FIG. 7 shows the illumination module of a lighting device according to FIG. 6 in a perspective view
- FIG. 9 shows the illumination device according to FIG. 6 in a sectional illustration
- FIG. 11 shows the illumination device according to FIG. 10 in a perspective sectional illustration
- the lighting device 1 shows a first embodiment of an OF INVENTION ⁇ to the invention the lighting device 1 in a perspective view.
- the lighting device 1 comprises a lighting module 2 and a base element 3.
- the illumination module 2 is provided on one side 4 with not visible in the figure LEDs (LED) 5 as a light source and has on its side facing away from the LED 5 side 6 a base 7.
- the base 7 has a rectangular cross-section and has on both sides in each case a groove 8.
- the base element 3 comprises a heat sink 9 and a socket 10 for receiving the illumination module 2, which is essentially formed from a slot 11 which is arranged in a recess 12.
- a fork-shaped Fix istsele ⁇ ment 14 is guided, which is shown in the open position.
- the base member 3 and / or the loading can leuchtungsmodul 2, further according to the knowledge of the skilled ⁇ 's for the operation of the lighting device 1 necessary or appropriate devices include such as driver circuits, power supplies, sensors, optical components or the power supply ports or Control of lighting functions.
- the base member 3 can be performed substantially as a heat sink 9 ⁇ .
- the lighting module 2 has a heat transfer surface 15, on which a heat-conducting film 16 is attached.
- the fixing member 14 is moved in the arrow Rich ⁇ processing and so the illumination module 2 in Basisele ⁇ element 3 is fixed.
- This state is shown in a sectional image ⁇ representation in Figure 2.
- the configuration of the recess 12, the grooves 8, of the locking element 14, and the thickness of the prongs 14a of the fixing element 14 and the heat-conducting film 16 are selected such that between the heat transfer surface 15 of the lighting module 2 and the heat transfer surface 17 of the base element 3 - defined contact force is exerted between the Heat transfer surfaces 15, 17 leads to a pressure of 0.2 N / mm 2 .
- the base member 3 shows an embodiment of the invention showing overall, in which the base member 3 has a circular From ⁇ recess 18 into which the lighting module 2, a ⁇ can be set.
- the recess 18 acts as a socket 10 and the lighting module 2 in total as So ⁇ ckel 7.
- the base member 3 is similar to that shown in the first embodiment constructed and includes just ⁇ if the heat sink. 9
- a thermally conductive foil 16 is arranged in the bottom of the circular recess 18.
- a longitudinal hole 19 which serves to receive an oblong projection of the illumination module 2, which is not visible here, whereby the illumination module 2 is secured against rotation.
- the elongated projection bears here not visible contacts which abut against countercontacts 21 of the base element 3 during operation.
- the lighting module 3 laterally on two retaining lugs 23 which engage in corresponding receptacles 24 in a Haltekra ⁇ conditions 25 of the base member 3, which surrounds the recess 18.
- Illumination module 2 fixed, which is shown in Figure 5.
- Figure 5 Here are the Students, whose leadership in
- FIG. 6 A further embodiment of the invention is shown in FIG. 6, in which an illumination device according to the invention is shown in an exploded view.
- a cylindrical base member 3 is provided for receiving a flat ⁇ if cylindrical lighting module 2.
- the base element 3 is embodied in several pieces, wherein an upper part 27, which receives the lighting module 2 as the socket 27, is connected to a lower part 28, which essentially comprises the heat sink 9.
- the upper part 27 further serves for the attachment of further attachments, for example, a not illustrated here ⁇ luminaire housing or a lampshade, by means of the thread 29th
- the lighting module 2 is constructed in several parts and essentially comprises a rotationally symmetrical core 30, an outer housing 31, a circumferential corrugated spring ring 32 and a cover 33rd
- the core 30 When assembling the lighting module, the core 30 is first introduced into the outer housing 31 and then the spring ring 32 placed on a circumferential projection 34 of the core 30, so that the structure shown in Figure 7 results. Subsequently, the cover ring 33 is screwed to the outer housing 31, so that the core 30 is mounted longitudinally displaceably in the outer housing 31 against the resistance of the spring ring 32.
- the complete lighting module 2 produced in this way is reproduced in FIG.
- the outer housing 31 has in the lower half Gara ⁇ sen 35 which are inserted into grooves 36 in the base member and engage by a rotation in recesses 37, so that substantially the outer housing 31 acts as a so- skel.
- the structure of the illumination device 1 shown in figure 9 in a sectional ⁇ image display is achieved.
- the core 30 is pressed by the heat sink 9 against the resistance of the spring ring 32 upwards, thereby ensuring that at the heat transfer surfaces 15, 17 of the desired pressure is achieved.
- Figure 10 and Figure 11 show a further embodiment of the invention.
- the base element 3 has a rectangular recess 38, in which two fixing elements 39 are guided in lateral grooves 40, where ⁇ results in a socket.
- the heat sink 9 is part of the base ⁇ element 3.
- a slot 41 is provided in the bottom of the recess 38, in which, similar to the first embodiment, the lower part of the base 7 of a Illumination module 2 can be used.
- the fixing elements 39 when the illumination ⁇ module 2, which serves as a base 7 in total, is inserted into the recess 38, pushed towards each other and fi- Due to their wedge shape, they thus illuminate the illumination module 2, which thus acts as a pedestal in its entirety.
- the shape of the lighting module 2, Fixie ⁇ approximately elements 39 and recess 38 is selected so that the heat transfer surface 15 of the lighting module 2 is pressed onto the heat transfer surface 17 of the base member 3 with the pre ⁇ defined force.
- a heat-conducting foil 16 can be provided between the heat transfer surfaces 15, 17.
- the locking of the fixing elements 39 in the closed function takes place via inserts not shown here, which are placed in the recess 38 he ⁇ the.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2009/052626 WO2010099828A1 (en) | 2009-03-05 | 2009-03-05 | Lighting device having a socket and bulb fitting |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2404108A1 true EP2404108A1 (en) | 2012-01-11 |
Family
ID=41346046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09779115A Ceased EP2404108A1 (en) | 2009-03-05 | 2009-03-05 | Lighting device having a socket and bulb fitting |
Country Status (4)
Country | Link |
---|---|
US (1) | US8591070B2 (en) |
EP (1) | EP2404108A1 (en) |
CN (1) | CN102341646A (en) |
WO (1) | WO2010099828A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012097721A1 (en) * | 2011-01-21 | 2012-07-26 | 贵州光浦森光电有限公司 | Method and device for constructing high-power led lighting fixture |
DE202013103419U1 (en) * | 2013-07-30 | 2014-11-03 | Zumtobel Lighting Gmbh | Luminaire with support element and replaceable lamp module |
US9093809B2 (en) * | 2013-08-26 | 2015-07-28 | Abl Ip Holding Llc | Theft deterrents for solid state lamps |
US10168030B2 (en) * | 2015-02-12 | 2019-01-01 | Cree, Inc. | LED lamp with fusible metal heat management elements |
JP6738532B2 (en) * | 2016-05-27 | 2020-08-12 | 東芝ライテック株式会社 | Vehicle lighting device and vehicle lamp |
CN114838331B (en) * | 2022-03-31 | 2024-01-09 | 彭睿轩 | Lamp installation kit |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2340100Y (en) | 1998-08-14 | 1999-09-22 | 赖丽纯 | Main-lead plug structure |
US6903380B2 (en) | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
US7549786B2 (en) * | 2006-12-01 | 2009-06-23 | Cree, Inc. | LED socket and replaceable LED assemblies |
US7540761B2 (en) * | 2007-05-01 | 2009-06-02 | Tyco Electronics Corporation | LED connector assembly with heat sink |
DE102007042978A1 (en) * | 2007-09-10 | 2009-03-12 | Osram Gesellschaft mit beschränkter Haftung | lamp |
AU2008326437B2 (en) * | 2007-11-19 | 2014-03-13 | Revolution Lighting Technologies, Inc. | Apparatus for housing a light assembly |
DE202008001026U1 (en) * | 2008-01-24 | 2008-03-27 | Bjb Gmbh & Co.Kg | Connection element for the electrical connection of an LED |
US8117395B1 (en) * | 2008-06-25 | 2012-02-14 | Marvell Israel (Misl) Ltd. | Multi-stage pipeline for cache access |
CA2797219A1 (en) * | 2010-04-26 | 2011-11-10 | Xicato, Inc. | Led-based illumination module attachment to a light fixture |
KR101073927B1 (en) * | 2010-06-23 | 2011-10-17 | 엘지전자 주식회사 | Lighting device |
-
2009
- 2009-03-05 EP EP09779115A patent/EP2404108A1/en not_active Ceased
- 2009-03-05 US US13/254,962 patent/US8591070B2/en not_active Expired - Fee Related
- 2009-03-05 WO PCT/EP2009/052626 patent/WO2010099828A1/en active Application Filing
- 2009-03-05 CN CN2009801578139A patent/CN102341646A/en active Pending
Non-Patent Citations (3)
Title |
---|
LEE S ET AL: "Thermal Interface Material Performance in Microelectronics Packaging Applications", MICROELECTRONICS JOURNAL, MACKINTOSH PUBLICATIONS LTD. LUTON, GB, vol. 28, no. 1, 1 January 1997 (1997-01-01), pages xiii - xx, XP004016088, ISSN: 0026-2692, DOI: 10.1016/S0026-2692(97)87871-8 * |
SARVAR F ET AL: "Thermal interface materials - a review of the state of the art", PROCEEDINGS OF THE 1ST IEEE ELECTRONIC SYSTEM INTEGRATION TECHNOLOGY CONFERENCE, vol. 2, 5 September 2006 (2006-09-05), pages 5 - 7, XP055167800 * |
See also references of WO2010099828A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102341646A (en) | 2012-02-01 |
US20110317438A1 (en) | 2011-12-29 |
WO2010099828A1 (en) | 2010-09-10 |
US8591070B2 (en) | 2013-11-26 |
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