EP2059365A1

EP2059365A1 - Monitoring device for a laser machining device

Info

Publication number: EP2059365A1
Application number: EP07801688A
Authority: EP
Inventors: Erwin Martin Heberer
Original assignee: FFT EDAG Produktionssysteme GmbH and Co KG
Current assignee: FFT EDAG Produktionssysteme GmbH and Co KG
Priority date: 2006-08-18
Filing date: 2007-08-16
Publication date: 2009-05-20
Also published as: US20100164739A1; JP2010500925A; DE102006038795A1; US8094036B2; WO2008019847A1

Abstract

The invention relates to a monitoring device (10) for a laser machining device (12) having one or more laser beams (13) that is/are displaced along a predetermined, adjustable trajectory (14, 16) along a workpiece (18) for the machining, such as welding, soldering, cutting, drilling or the like, of the same, said machining process being repeated from workpiece (18) to workpiece (18) during serial production of the workpieces (18). The monitoring device (10) is characterized by one or more sensors (20, 22) which monitor(s) the processing signal (24) of the machining process in a three-dimensional section (26). The one or more sensors (20, 22) activate an alarm device or interrupter (28) for the laser beam (13) if the one or more process signals (24) in the section (26) exceed a predetermined threshold value or fall short of it, the one or more sensors (20, 22) being independent of the laser machining device (12).

Description

Designation: Monitoring device for a laser processing device

description

The invention relates to a monitoring apparatus for a laser processing apparatus having one or more laser beams, each of which is moved in a predetermined adjustable curve along a workpiece for its processing, such as welding, cutting, drilling or the like, and wherein this processing repeated in series production of the workpieces from workpiece to workpiece.

State of the art

From DE 94 03 822 Ul a monitoring device for laser beams is already known, in which an optically transparent component of the processing optics for detecting a scattered radiation is connected to a measuring device. The control unit is designed so that the laser radiation is switched off at a predetermined exceeding or falling below a reference value. In this case, that optical component is monitored which is closest to the workpiece, such as a protective glass, which is to protect the focusing optics from contamination. The size of the scattered radiation of this component is basically constant with unchanged laser power. In the case of a positive or negative deviation of the measured scattered radiation, therefore, there is a disturbance of the radiation transmission from the laser source to the workpiece, so that a shutdown of the laser may be indicated. These However, monitoring device is not adapted to mass production of a plurality of workpieces, in which the laser beams or along predetermined, the same or adjustable trajectories are moved.

DE 10 2004 041 682 A1 discloses a CO ₂ laser processing head with integrated monitoring device. The head has a lens through which the laser beam is directed onto a workpiece. A monitoring device is provided for monitoring the processing optics for defects and contamination and comprises a multiplicity of light-emitting diodes and photodiodes, which are aligned around the CO 2 laser radiation on an optically effective surface of the processing optics in order to detect the reflection and scattering components of the processing optics

Light emitting diode radiation to be able to conclude defects and contamination of the optically effective surface of the processing optics.

Another, relatively complex laser beam processing device with a monitoring device is known from EP 0 407 598 B1. This device is also based on a reflection of the laser beam on the workpiece surface, wherein a maximum output value can be calculated by means of a complex calculation formula.

DE 101 20 251 A1 discloses a method and a sensor device for monitoring a laser processing operation to be carried out on a workpiece. In this case, an observation field which does not have to coincide with the interaction zone between the laser beam and the workpiece is optically evaluated by means of a sensor device attached to the laser processing head. DE 39 13 786 A1 discloses a device for non-contact acoustic emission measurement for process control or quality assurance.

JP 2000/024785 A discloses a device for detecting breakages of optical conductors to laser beam processing devices. With the help of the device, the UV radiation is detected in the processing room and from this conclusions about the state of the optical fiber cables are drawn.

problem

In contrast, the present invention has the object, a monitoring device for a laser processing device of the type mentioned in that in a series production of workpieces, in which the laser beam is traversed repeatedly along a predetermined adjustable trajectory, a simple detection of an error case is avoided.

According to a secondary aspect, a further object is that in laser processes with high-power lasers in conjunction with long-range optics, the laser protection walls are not subjected to excessive loads in case of failure and takes place by means of the monitoring device shutdown of the laser beam and to protect the laser protection walls. This is to take into account the fact that the previously used laser protection walls are exposed in the new high-power lasers a significantly higher power density, so that a Recourse to the physical property "heat conduction" no longer to the extent that could be used earlier.

Invention and advantageous effects

This object is achieved according to the invention in the

Surveillance device with the features mentioned above essentially solved by one or more sensors, which or which monitor the process signal processing in a three-dimensional space section, are provided, wherein the one or more sensors activate a warning or shutdown device for the laser beam, if that Process signal in the space section exceeds or falls below a predetermined threshold, wherein the sensor or sensors are independent of the laser processing device.

As a rule, the trajectories, which starts or depart depending on the shape of the workpiece to be machined or the laser beams, are preprogrammed, the repetition of repetitive machining in a series production from workpiece to workpiece. This makes it possible to spatially delimit the range of action of the laser beam or the course of the trajectory of the laser beam from the start position to the end position, so that a space section or a segment region can be defined in which the process signal below or above a certain threshold value in the normal case lie comes. If deviations are detected, the laser beam is switched off by means of a switch-off device. Alternatively or additionally, a warning device can be activated. Because the sensors are independent of the laser processing device, a decoupling of the laser processing device and the laser processing device overgrowing sensors is achieved. The sensors are thus able to detect when the laser beam (s) of the

Laser processing device leave the room section of the processing and pre-priming in the room.

According to a first advantageous development of the invention, it is provided that the sensor (s) can be positionally fixed relative to the workpiece. The sensors are advantageously designed so that they capture the entire processing area. This facilitates the adjustment. A stationary orientation of the sensors relative to the workpiece facilitates the monitoring of the laser beam (s) of the laser processing device, in particular, since limits can be defined in the monitoring software that must not be exceeded by the laser beam. Exceeding these limits then automatically leads to the activation of the shutdown and / or the warning device.

According to an alternative embodiment, the sensor or sensors are designed to be movable with respect to the workpiece. This makes it possible, on the one hand, to monitor spatial sections which are larger than the spatial section which can be detected by the sensor (s). As a result, fewer sensors must be used. On the other hand, this makes it possible to precisely adjust the sensor (s) and to select such an observation point which makes it possible to detect the processing area at any time, without, for example, the laser processing apparatus moving between the sensor and the processing area. It will thus allows to always completely capture the surveillance area even with different workpieces or different machining programs and resulting movements of the laser processing device. In this case, it can be advantageously provided that the sensor (s) are stationarily positioned relative to the workpiece during the machining process, thereby achieving an easy and unambiguous assignment of the signal detected by the sensor (s) to a position of the machining area of the laser beam of the laser processing device ,

It is particularly advantageous if the sensor or sensors are of spatial resolution. As a result, a particularly easy evaluation can be achieved by assigning the position of the process signal to the current processing area, whereas the use of non-spatially resolving sensors requires the use of a plurality of sensors and a special evaluation algorithm which reconstructs the position of the process signal from the different signal levels. In addition, spatially resolved sensors are less susceptible to interference, since, for example, in the case of non-spatially resolving sensors, further error sources can distort the signals. For example, in acoustic measurements, a non-optimal welding process leads to a change in the process signal and a different reflectivity of the workpieces in optical sensors to different brightnesses of the reflection signal of the recorded signals would then be required.

According to a further advantageous embodiment of the invention, the process signal is an optical signal and the or Sensors are designed accordingly as optical sensors. Such optical sensors are established and the signals of optical sensors, for example, cameras can be easily evaluated automatically.

When using sensors sensitive to optical wavelengths, it is possible that these sensors are tuned to the laser-specific wavelengths of the laser beams used.

It has proven to be particularly advantageous in the case of optical systems if one or more optical systems, for example diaphragms, lenses and the like, are coupled to the sensor or sensors, which enable precise imaging of the three-dimensional spatial section of the processing on the sensor (s). This will produce a clear and unambiguous signal.

A further advantage results if at least one attenuation filter is provided in front of the sensor or sensors, which is tuned to the wavelength of the laser beam of the laser processing device. An optical process signal of a laser processing device is dependent on the workpiece, usually very bright and thus can easily exceed the contrast range of an optical sensor. With the aid of a damping filter, the optical signal can be attenuated in such a way that the contrast range of the sensor is not exceeded. Exceeding the contrast range can lead to an over-radiation on adjacent sensor surfaces, so that the recorded process signal is larger and blurred and thus more inaccurate. Furthermore, the active sensor surface to be damaged. Another advantage of such a damping filter is that the signal detected by the sensor is substantially reduced to the process signal. The workpiece concerning the workpiece are below the contrast range of the sensor. This facilitates the evaluation of the sensor signal or signals.

CCD or CMOS sensors have proven particularly suitable for the detection. It is particularly advantageous if only part of the chip is read out. The

Processing times for producing a spot weld are in the millisecond range of modern laser processing devices, so that the evaluation of the process signal must be extremely fast. Thus, if the area to be read and / or evaluated is reduced to a limited range, the evaluation time can be reduced, allowing the use of simpler system components. The readout speed then corresponds to the processing speed of the laser processing device.

As an alternative to optical process signals, it may be provided that the process signal is an acoustic signal and the sensor or sensors are correspondingly designed as acoustic sensors. Acoustic sensors have also proven to be suitable for detecting a processing area in space.

For both sensor types, reference points are advantageously provided in the three-dimensional space section to be monitored, which are detectable by the sensor (s). This can be used to ensure that the sensors are inadvertently turned on Monitor wrong area, for example, because they have been misaligned. This further increases process reliability.

If a positionally adjustable low-energy laser pointer can be positioned with respect to the workpiece, an adjustment of the sensor (s) can be simplified. The laser pointer can then - without damaging the workpiece or endangering the environment - be aligned to different points of the detection area of the sensor or sensors. A calibration of the optical system is possible. A laser pointer is particularly advantageous if attenuation filters are provided which greatly darken the captured image of the sensor (s). In this case, an adjustment by manual alignment of the sensors based on the camera image is no longer possible. However, the laser pointer of the laser pointer generates such a strong reflection that it is visible even in the muted image.

It has proven to be particularly advantageous if a diffractive grating is provided in front of the laser pointer with which the laser beam of the laser pointer is widened to form a strip or grid structure which is projected into the spatial section of the processing. The striped or grid pattern is then visible in the camera image and allows a particularly easy adjustment of the sensor or sensors both in terms of direction and in terms of the position of the sensors.

According to a further embodiment of the invention, it is possible to obtain the process signal directly from the laser beam or indirectly from the processing point of the workpiece. Furthermore, it makes sense, the signals of the sensor or sensors are evaluated in a computing unit. The evaluation takes place taking into account the spatial detection range or angle of view of each of the sensors, thereby making it possible to monitor a predetermined, three-dimensional space section on process signals of the machining process.

Preferably, according to an advantageous alternative, the arithmetic unit also supplies the data of the one or more trajectories along which the laser beam is traversed over the workpiece. As a result, an even greater significance with regard to the eventual occurrence of a fault is brought about.

It is advisable that the space section also includes the one or more trajectories and a drop in the process signal below a threshold value leads to an activation of the warning or shutdown device.

Alternatively, it can also be provided for this purpose that the space section does not include the trajectory, but lies in the vicinity of the trajectory, and an increase of the process signal above a threshold value leads to activation of the warning or shutdown device.

Finally, it makes sense that the

Laser processing device is surrounded by laser protective walls, and the monitoring device by switching off the Laser beam by means of the shutdown device for protecting the laser protective walls is used.

embodiment

Other objects, advantages, applications and embodiments of the present invention will become apparent from the following description of an embodiment with reference to the drawings. All described and / or illustrated features alone or in any meaningful combination form the subject matter of the present invention, also independent of their summary in the claims or their dependency.

The sole FIGURE 1 shows a schematic representation of an embodiment of an inventive

Monitoring device 10 for a laser processing device 12 having one or more laser beams 13. The laser beam (s) are moved in a predetermined, adjustable trajectory curve 14, 16 along a workpiece 18 for its processing, this repetition being repeated in series production from workpiece 18 to workpiece 18. The machining of the workpiece can take the form of welding, soldering, cutting, drilling or the like.

The monitoring device 10 has one or more sensors 20, 22, which monitor the process signal 24 of processing in a three-dimensional space section 26, wherein the sensor or sensors 20, 22 activate a warning or shutdown device 28 for the laser beam 13, if that or the process signals 24 in the space section 26 a predetermined Threshold exceed or fall below. The process signal 24 may be an optical or acoustic signal, which may depend on the respective processing of the workpiece 18 by means of the laser beam 13. In that regard, the sensor or sensors 20, 22 are correspondingly designed as optical and / or acoustic detectors. If optical sensors 20, 22 are involved, they are advantageously matched to the laser-specific wavelength of the laser beams 13 used.

The sensors 20, 22 are arranged independently of the laser processing device 12. The laser processing device 12 can thus be moved in space to guide the laser beam 13 along the path curves 14, 16. The sensors 20, 22 thereby capture the associated space portion 26. Furthermore, the sensors 20, 22 are positionally positionable during the machining process, so that always a predetermined space portion is monitored and not a predetermined by the direction of the laser beam 13 space section.

The sensors 20, 22 are spatially resolving sensors, which detect the space portion 26 and the processing point 30 two-dimensionally. For this purpose, the sensors 20, 22 are provided with optical systems which project the image onto the respectively active sensor surface of the sensors 20, 22. For this purpose, generally suitable devices are known in the prior art. The sensors 20, 22 are designed as CCD sensors. It is also possible to use CMOS sensors instead of CCD sensors. For evaluation, only part of the image taken by the sensors 20, 22 is read out and evaluated in order to increase the processing speed. The process signal 24 can be derived or obtained directly from the laser beam 13. Alternatively, it is also possible to obtain the process signal 24 indirectly from the processing point 30 of the workpiece 18.

Preferably, two or more sensors 20, 22 are used, the signals of which are evaluated in a computing unit 32. The arithmetic unit 32 can also be additionally supplied with the data 34 of the one or more trajectories 14, 16.

On the one hand, the monitoring by means of monitoring device 10 can take place such that the space section 26 also includes the one or more trajectories 14, 16 and then a drop in the process signal 24 below a threshold value or in a certain defined threshold range to an activation of the warning or shutdown device 28 leads.

As an alternative to this measure, it may also be appropriate that the space section 26 does not include the trajectories 14, 16, but lies in the vicinity of the trajectories 14, 16, in which case an increase in the process signal 24 over a threshold value or within a certain threshold range Activation of the warning or shutdown device 28 leads.

On the one hand, it is thus possible to monitor the three-dimensional space section by normally stopping the laser beam or the process signal in the fault-free case, in which case a decrease in the activities for detecting an error is used. On the other hand, the three-dimensional space section, adjacent to the trajectories, be monitored, in which normally in a fault-free case, process activities are not or only to a small degree. An increase in the process signals in this area is then used to detect a possible accident.

The monitoring device 10 can advantageously be used even if the laser processing device 12 is surrounded by laser protective walls and the monitoring device 10 is used by switching off the laser beam by means of the shutdown device 28 for the protection of the laser walls.

To facilitate the adjustment of the sensors 20, 22 reference points 38 ', 38' ', 38' '' are provided in the processing space, which are detected by the sensors 20, 22. The reference points 38 ', 38' ', 38' '' further serve to ensure the correct alignment of the sensors 20, 22 by evaluating by the evaluation device 32, whether the reference points 38 ', 38' ', 38' '' in a certain image area of the sensors 20, 22 are located.

Furthermore, a laser pointer 40 is provided, which generates a light spot or the like in the processing area 26, which are detected by the sensors 20, 22 before the beginning of the processing. It is also possible to generate a stripe or grid pattern with the aid of a diffractive grating. LIST OF REFERENCE NUMBERS

10 monitoring device

12 laser processing device

13 laser beam

14 trajectory 16 trajectory 18 workpiece 20 sensor

22 sensor

24 process signal

26 room section

28 switch-off device

30 processing point

32 arithmetic unit

34 data

38 ', ","' reference source

40 laser pointers

Claims

claims

1. Monitoring device (10) for a

A laser processing apparatus (12) comprising one or more laser beams (13), each in a predetermined adjustable trajectory (14, 16) along a workpiece (18) for machining such as welding, cutting, soldering, drilling or the like , and wherein this processing repeats in series production of the workpieces (18) from workpiece (18) to workpiece (18), with one or more sensors

(20, 22), characterized in that the one or more sensors (20, 22) monitor the process signal (24) of processing in a three-dimensional space section (26), by means of the one or more sensors (20, 22) a warning and / or switch-off device (28) for the laser beam (13) can be activated in the event that the process signal or signals (24) in the space section (26) exceeds or falls below a predetermined threshold value, the sensor or sensors (20, 22) independent of the laser processing device (12).

2. Monitoring device according to claim 1, characterized in that the one or more sensors (20, 22) are stationary with respect to the workpiece (18) positionable.

3. Monitoring device according to claim 1, characterized in that the one or more sensors (20, 22) are designed to be movable with respect to the workpiece (18).

4. Monitoring device according to claim 3, characterized in that the one or more sensors (20, 22) during the processing operation of the laser beam processing device (12) stationary with respect to the workpiece (18) are positioned.

5. Monitoring device according to one of the preceding claims, characterized in that the one or more sensors (20, 22) are formed spatially resolving.

6. Monitoring device according to one of the preceding claims, characterized in that the process signal

(24) is an optical signal and the sensor or sensors (20, 22) are designed as optical sensors accordingly.

7. Monitoring device according to claim 6, characterized in that the one or more sensors (20, 22) are tuned to the laser-specific wavelength of the laser beams (13).

8. Monitoring device according to claim 6 or 7, characterized in that one or more diaphragms (12) and / or one or more optical systems (16) are provided which are coupled to the sensor (s) (20, 22).

9. Monitoring device according to one of claims 6 to 8, characterized in that before the or the sensors (20, 22) at least one attenuation filter () is provided, which is tuned to the wavelength of the laser beam (13) of the laser processing device (12).

10. Monitoring device according to one of claims 6 to 9, characterized in that the one or more sensors (20, 22) are designed as CCD or CMOS sensors and / or that read only a part of the recorded image for evaluation and / or evaluated becomes.

11. Monitoring device according to one of claims 1 to 5, characterized in that the process signal (24) is an acoustic signal and the one or more sensors (20, 22) are designed accordingly as acoustic sensors.

12. Monitoring device according to one of the preceding claims, characterized in that in the three-dimensional space section to be monitored (26) reference points (38 ', 38' ', 38' '') are provided, which of the one or more sensors (20, 22) are detectable.

13. Monitoring device according to one of the preceding claims, characterized in that a stationary with respect to the workpiece (18) positionable low-energy laser pointer (40) is provided.

14. A monitoring device according to claim 13, characterized in that a diffractive grating (12) is provided, with which the laser beam of the laser pointer (12) is widened to a strip or grid structure, which is projected into the space portion (26).

15. Monitoring device according to one of the preceding claims, characterized in that the process signal (24) is obtained directly from the laser beam (13) or indirectly from the processing point (30) of the workpiece (18).

16. Monitoring device according to one of the preceding claims, characterized in that the signals of the one or more sensors (20, 22) are evaluated in a computing unit (32).

17. Monitoring device according to claim 16, characterized in that the arithmetic unit (32) data (34) of the one or more trajectories (14, 16) are supplied.

18. Monitoring device according to one of the preceding claims, characterized in that the space section

(26) in any case includes at least one trajectory (14, 16) or all trajectories (14, 16) and a drop in the process signal (24) below a threshold range leads to an activation of the warning or shutdown device.

19. Monitoring device according to one of claims 1 to 17, characterized in that the space portion (26) does not include the trajectory (14, 16), but in the vicinity of this trajectory (14, 16), and an increase of the process signal (24 ) leads over a threshold range to an activation of the warning or shutdown device (28).

20. Monitoring device according to one of the preceding claims, characterized in that the Laser processing device (12) is surrounded by laser protective walls and the monitoring device (10) by switching off the laser beam (13) by means of the shutdown device (28) for protecting the laser protective walls is used.