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EP1792699A1 - Method of manufacturing a balsa core chipboard - Google Patents

Method of manufacturing a balsa core chipboard Download PDF

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Publication number
EP1792699A1
EP1792699A1 EP06024363A EP06024363A EP1792699A1 EP 1792699 A1 EP1792699 A1 EP 1792699A1 EP 06024363 A EP06024363 A EP 06024363A EP 06024363 A EP06024363 A EP 06024363A EP 1792699 A1 EP1792699 A1 EP 1792699A1
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EP
European Patent Office
Prior art keywords
layer
chipboard
wood
glue
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP06024363A
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German (de)
French (fr)
Other versions
EP1792699B1 (en
Inventor
Hans Günter Isensee
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Guenther Isensee Modellbaubedarf
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Guenther Isensee Modellbaubedarf
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Publication of EP1792699A1 publication Critical patent/EP1792699A1/en
Application granted granted Critical
Publication of EP1792699B1 publication Critical patent/EP1792699B1/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres
    • B27N3/143—Orienting the particles or fibres

Definitions

  • the invention is directed to a method for producing a chipboard from at least three layers.
  • the continuous production of particle board has long been known ( DE-44 34 876-A1 ), taking, as an example, a lower layer in a thickness of 2-5 mm of fine chips with a spall diameter ⁇ 2 mm, a middle layer of chips with a spud diameter of about ⁇ 15 mm and an upper layer, which in turn is formed of fine chips with a spall diameter ⁇ 2 mm, which are exposed to high pressure and temperature to form the chipboard.
  • Lightweight panels which have a core of Balsastirnholz are also known per se. So by a display of the applicant at the Nuremberg Toy Fair in February 2000, as well as from the DE-31 00 094-A or the DE-20 11 865-B which show an end-skin middle layer with under- and over-laid plywood layers or cover layers. This also applies to the DE-36 25 534-A or the DE-39 27 538-A or from 1943 originating US-2 479 342 , However, there is a significant disadvantage in that first all layers, whether covering layer, middle layer or lower layer, manufactured separately and then connected to each other, eg glued, must be.
  • the object of the invention is to make the Balsastirnholztechnologie available for the production of particle board, such that an endless product is formed from a core of Balsastirnholz with underlay and on-laid fine layer in a single manufacturing process.
  • the middle layer is formed from coarse chips, also produce Balsahollese chipboard by means of a feeder, the middle layer of Balsastirnholzbrettchen or Balsastirnholzplatten is formed.
  • the invention provides that wood chips or sawdust, wood shavings, grinding chips, grinding dust, abrasive fibers made of wood or other organic materials such as straw, hemp or the like., Is used as a layer-forming fine granules.
  • glass fibers or fabrics can be used, it goes without saying that even mixtures the above materials can be used.
  • the invention provides in an embodiment that the applied Balsastirnholzbrettchen and / or plates are glued on one side or both sides (for gluing technology s GB-1 439 578 ).
  • At least one of the two outer sides of the endless chipboard produced in this way is provided with a further surface coating.
  • This surface coating may for example consist of a coating, but it can also be formed from other laminated films, veneer wood or the like.
  • the chipboard shown in Fig. 1, generally designated 1, consists of an upper layer 2, a middle balsam wood layer 3 and a lower layer 4, with a fine layer being a mixture of fine chips having a chip diameter ⁇ 2 mm in connection with adhesive, via a pressure / heating device compacted and hardened, as described below.
  • FIG. 2 A simplified representation of a production plant for such lightweight chipboard is shown in FIG. 2.
  • fine chips 7 are applied from a reservoir, wherein the carrier tape 5 before, simultaneously or subsequently via a spraying device 8 with glue, glue or the like is acted upon.
  • Fig. 2 generally designated 9, applied, which is indicated by the double arrow 10.
  • the surface of the Balsastirnholzplatten 9 can be sprayed with a further adhesive supply 8a with adhesive. From a further reservoir 6a then trickle on the surface of Balsastirnholzplatten fine chips 7a.
  • the composite sandwich can then be loaded from above via another endless belt 5a, as indicated in FIG. 2, the package consisting of lower endless belt 5 of the lower layer of fine chips, the balsam wood panels and the upper layer of fine chips of a pressure / heating unit, generally designated 11, is fed, which compresses the entire composite and cures the fine chips with adhesive.
  • the endless chipboard 1a produced in this way can be provided with a surface lamination 12, the endless chipboard 1a then being provided with a cutting device, indicated in Fig. 2 and denoted by 13, can be divided into its final plate length.
  • a multilayer board can also be produced, for example with two successive balsa end grain layers separated by a fine layer of chips.
  • a comparable in the load with conventional chipboard light chipboard to 2/3 lighter it is therefore easily used and economically producible for a variety of additional applications.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Laminated Bodies (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

Method involves spreading of layer of fine granulates mixed with glue in width of end product on conveyor belt. A sealing layer of fine granulates mixed with glue is applied on the central layer. The balsa wood slat or balsa wood plate (9) is applied as middle layer to the scattered first lower small layer.

Description

Die Erfindung richtet sich auf ein Verfahren zur Herstellung einer Spanplatte aus wenigstens drei Schichten.The invention is directed to a method for producing a chipboard from at least three layers.

Die kontinuierliche Herstellungsweise von Spanplatten ist seit langem bekannt ( DE-44 34 876-A1 ), wobei, dies als Beispiel, eine untere Schicht in einer Stärke von 2 - 5 mm aus feinen Spänen mit einem Spandurchmesser < 2 mm, eine mittlere Schicht aus Spänen mit einem Spandurchmesser von ca. < 15 mm und eine obere Schicht, die wiederum aus feinen Spänen mit einem Spandurchmesser < 2 mm besteht, gebildet wird, die hohem Druck und Temperatur zur Bildung der Spanplatte ausgesetzt werden.The continuous production of particle board has long been known ( DE-44 34 876-A1 ), taking, as an example, a lower layer in a thickness of 2-5 mm of fine chips with a spall diameter <2 mm, a middle layer of chips with a spud diameter of about <15 mm and an upper layer, which in turn is formed of fine chips with a spall diameter <2 mm, which are exposed to high pressure and temperature to form the chipboard.

Leichtbauplatten, die einen Kern aus Balsastirnholz aufweisen, sind ebenfalls für sich gesehen bekannt. So durch eine Zurschaustellung des Anmelders auf der Nürnberger Spielwarenmesse im Februar 2000, wie auch aus der DE-31 00 094-A oder der DE-20 11 865-B , die eine Stirnholzmittelschicht mit unter- und übergelegten Sperrholzschichten bzw. Deckschichten zeigen. Dies gilt auch für die DE-36 25 534-A oder die DE-39 27 538-A oder die aus 1943 stammende US-2 479 342 . Dabei besteht allerdings ein wesentlicher Nachteil darin, dass zunächst alle Schichten, ob Deckschicht, Mittelschicht oder Unterschicht, getrennt hergestellt und dann miteinander verbunden, z.B. verleimt, werden müssen.Lightweight panels, which have a core of Balsastirnholz are also known per se. So by a display of the applicant at the Nuremberg Toy Fair in February 2000, as well as from the DE-31 00 094-A or the DE-20 11 865-B which show an end-skin middle layer with under- and over-laid plywood layers or cover layers. This also applies to the DE-36 25 534-A or the DE-39 27 538-A or from 1943 originating US-2 479 342 , However, there is a significant disadvantage in that first all layers, whether covering layer, middle layer or lower layer, manufactured separately and then connected to each other, eg glued, must be.

Aufgabe der Erfindung ist es, die Balsastirnholztechnologie für die Herstellung von Spanplatten nutzbar zu machen, derart, dass ein Endlosprodukt aus einem Kern aus Balsastirnholz mit unter- und aufgelegter Feinschicht in einem einzigen Herstellungsverfahren gebildet wird.The object of the invention is to make the Balsastirnholztechnologie available for the production of particle board, such that an endless product is formed from a core of Balsastirnholz with underlay and on-laid fine layer in a single manufacturing process.

Dies wird mit einem erfindungsgemäßen Verfahren dadurch erreicht, dass auf einem Transportband eine Schicht aus einem Feingranulat gemischt mit Leim in der Breite des Endproduktes aufgestreut, eine weitere Schicht zugeführt und eine Abdeckschicht aus Feingranulat gemischt mit Leim auf die Mittelschicht aufgebracht und der Verbund hohem Druck und Temperatur zur Bildung der Spanplatte ausgesetzt wird, wobei als Mittelschicht auf die aufgestreute erste untere Feinschicht Balsastirnholzbrettchen oder Balsastirnholzplatten aufgebracht werden.This is achieved by a method according to the invention in that on a conveyor belt, a layer of fine granules mixed with glue in the width of the final product scattered, fed a further layer and a cover layer of fine granules mixed with glue applied to the middle layer and the composite high pressure and Temperature is exposed to form the particle board, being applied as a middle layer on the sprinkled first lower layer Balsastirnholzbrettchen or Balsastirnholzplatten.

Erkennbar lassen sich mit dieser Verfahrensweise bereits vorhandene Anlagen zur Herstellung von herkömmlichen Spanplatten, bei denen, wie oben schon angegeben, die Mittelschicht aus Grobspänen gebildet ist, auch Balsaholzleichtspanplatten herstellen, indem mittels einer Zuführeinrichtung die Mittelschicht aus Balsastirnholzbrettchen oder Balsastirnholzplatten gebildet wird. Dadurch, dass die Leichtspanplatte in einem einzigen Arbeitsprozess hergestellt wird, läßt sich Herstellungsgeschwindigkeit, Einsparung von Energie und einfache Steuerung der Produktqualität erreichen.It can be seen with this procedure already existing systems for the production of conventional chipboard, in which, as already stated above, the middle layer is formed from coarse chips, also produce Balsahollese chipboard by means of a feeder, the middle layer of Balsastirnholzbrettchen or Balsastirnholzplatten is formed. The fact that the light chipboard is produced in a single work process, manufacturing speed, energy savings and easy control of product quality can be achieved.

Als zweckmäßig hat sich erwiesen, das Freingranulat, aus dem die Unterschicht und die Deckschicht in einem einzigen Arbeitsschritt gebildet wird, aus je nach Einsatzzweck variablen Materialien zu gestalten. Hierzu sieht die Erfindung vor, dass als schichtbildendes Feingranulat Hackspäne, Sägespäne, Hobelspäne, Schleifspäne, Schleifmehl, Schleiffasern aus Holz oder anderen organischen Stoffen, wie Stroh, Hanf oder dergl., eingesetzt wird. Je nach Art der Oberflächengestaltung bzw. der Anforderung an die Oberfläche können auch Textil-, Glasfasern oder -gewebe eingesetzt werden, wobei es sich von selbst versteht, dass auch Gemische der oben angegebenen Materialien eingesetzt werden können.It has proven to be useful to design the freed granules, from which the lower layer and the outer layer is formed in a single step, depending on the purpose of variable materials. For this purpose, the invention provides that wood chips or sawdust, wood shavings, grinding chips, grinding dust, abrasive fibers made of wood or other organic materials such as straw, hemp or the like., Is used as a layer-forming fine granules. Depending on the type of surface design or the requirement for the surface and textile, glass fibers or fabrics can be used, it goes without saying that even mixtures the above materials can be used.

Je nach Art des gewünschten Endproduktes sieht die Erfindung in Ausgestaltung vor, dass die aufgelegten Balsastirnholzbrettchen und/oder -platten einseitig oder beidseitig beleimt werden (zur Verleimtechnologie s. auch GB-1 439 578 ).Depending on the nature of the desired end product, the invention provides in an embodiment that the applied Balsastirnholzbrettchen and / or plates are glued on one side or both sides (for gluing technology s GB-1 439 578 ).

Nach der Erfindung kann auch vorgesehen werden, dass wenigstens eine der beiden Außenseiten der so hergestellten Endlosspanplatte mit einer weiteren Oberflächenbeschichtung versehen wird. Diese Oberflächenbeschichtung kann beispielsweise aus einer Lackierung bestehen, sie kann aber auch aus anderen aufkaschierten Folien, Furnierhölzern oder dergl. gebildet sein.According to the invention it can also be provided that at least one of the two outer sides of the endless chipboard produced in this way is provided with a further surface coating. This surface coating may for example consist of a coating, but it can also be formed from other laminated films, veneer wood or the like.

Weitere Merkmale, Einzelheiten und Vorteile der Erfindung ergeben sich aufgrund der nachfolgenden Beschreibung sowie anhand der Zeichnung. Diese zeigt in:

Fig. 1
einen vereinfachten Schnitt durch eine erfindungsgemäße Balsaholzspanplatte sowie in
Fig. 2
eine schematische Darstellung des Herstellungsverlaufes einer Endlosspanplatte nach der Erfindung.
Further features, details and advantages of the invention will become apparent from the following description and from the drawing. This shows in:
Fig. 1
a simplified section through a Balsaholzspanplatte invention and in
Fig. 2
a schematic representation of the manufacturing process of a continuous chipboard according to the invention.

Die in Fig. 1 dargestellte, allgemein mit 1 bezeichnete Spanplatte besteht aus einer oberen Feinschicht 2, einer mittleren Balsastirnholzschicht 3 und einer unteren Feinschicht 4, wobei mit Feinschicht ein Gemisch aus feinen Spänen mit einem Spandurchmesser < 2 mm in Verbindung mit Klebstoff gemeint ist, die über eine Druck-/Heizeinrichtung verdichtet und gehärtet worden sind, wie dies weiter unten beschrieben ist.The chipboard shown in Fig. 1, generally designated 1, consists of an upper layer 2, a middle balsam wood layer 3 and a lower layer 4, with a fine layer being a mixture of fine chips having a chip diameter <2 mm in connection with adhesive, via a pressure / heating device compacted and hardened, as described below.

Eine vereinfachte Darstellung einer Herstellungsanlage für derartige Leichtspanplatten zeigt Fig. 2.A simplified representation of a production plant for such lightweight chipboard is shown in FIG. 2.

Auf einem die Breite des Endproduktes vorgebenden Trägerband 5 werden aus einem Reservoir 6 Feinspäne 7 aufgebracht, wobei das Trägerband 5 vorher, gleichzeitig oder nachher über eine Sprüheinrichtung 8 mit Leim, Klebstoff oder dergl. beaufschlagt wird.On a the width of the final product predetermining carrier tape 5 6 fine chips 7 are applied from a reservoir, wherein the carrier tape 5 before, simultaneously or subsequently via a spraying device 8 with glue, glue or the like is acted upon.

Über eine nicht näher dargestellte Fördereinrichtung werden dann auf das so vorbereitete Trägerband 5 mit Feinspanbeschichtung Balsastirnholzbrettchen oder -platten, in Fig. 2 allgemein mit 9 bezeichnet, aufgebracht, was mit dem Doppelpfeil 10 angedeutet ist.About a conveyor not shown are then applied to the thus prepared carrier tape 5 with Feinspanbeschichtung Balsastirnholzbrettchen or plates, in Fig. 2 generally designated 9, applied, which is indicated by the double arrow 10.

Anschließend kann die Oberfläche der Balsastirnholzplatten 9 mit einer weiteren Klebstoffzuführung 8a mit Klebstoff besprüht werden. Aus einem weiteren Reservoir 6a rieseln dann auf die Oberfläche der Balsastirnholzplatten Feinspäne 7a. Der Sandwichverbund kann dann über ein weiteres Endlosband 5a von oben beaufschlagt werden, wie dies in Fig. 2 angedeutet ist, wobei das Paket aus unterem Endlosband 5 der unteren Schicht aus Feinspänen, der Balsastirnholzplatten und der oberen Schicht aus Feinspänen einer Druck-/Heizeinheit, allgemein mit 11 bezeichnet, zugeführt wird, die den Gesamtverbund verpresst und die Feinspäne mit Klebstoff aushärtet.Subsequently, the surface of the Balsastirnholzplatten 9 can be sprayed with a further adhesive supply 8a with adhesive. From a further reservoir 6a then trickle on the surface of Balsastirnholzplatten fine chips 7a. The composite sandwich can then be loaded from above via another endless belt 5a, as indicated in FIG. 2, the package consisting of lower endless belt 5 of the lower layer of fine chips, the balsam wood panels and the upper layer of fine chips of a pressure / heating unit, generally designated 11, is fed, which compresses the entire composite and cures the fine chips with adhesive.

Schließlich kann die so hergestellte Endlosspanplatte 1a mit einer Oberflächenkaschierung 12 versehen werden, wobei die Endlosspanplatte 1a dann über eine Schneideinrichtung, in Fig. 2 angedeutet und mit 13 bezeichnet, in seine endgültige Plattenlänge zerteilbar ist.Finally, the endless chipboard 1a produced in this way can be provided with a surface lamination 12, the endless chipboard 1a then being provided with a cutting device, indicated in Fig. 2 and denoted by 13, can be divided into its final plate length.

Natürlich ist das beschriebene Ausführungsbeispiel der Erfindung noch in vielfacher Hinsicht abzuändern, ohne den Grundgedanken zu verlassen. So kann je nach Einsatzzweck auch eine Mehrschichtplatte hergestellt werden, etwa mit zwei aufeinanderfolgenden und durch eine Feinschicht aus Spänen getrennten Balsastirnholzschichten. Mit der Erfindung wird eine in der Belastung mit herkömmlichen Spanplatten vergleichbare Leichtspanplatte um 2/3 leichter, sie ist daher für eine Vielzahl von zusätzlichen Anwendungsfeldern problemlos einsetzbar und wirtschaftlich herstellbar.Of course, the described embodiment of the invention is still to be modified in many ways, without departing from the spirit. Thus, depending on the application, a multilayer board can also be produced, for example with two successive balsa end grain layers separated by a fine layer of chips. With the invention, a comparable in the load with conventional chipboard light chipboard to 2/3 lighter, it is therefore easily used and economically producible for a variety of additional applications.

Claims (4)

Verfahren zur Herstellung einer Spanplatte aus wenigstens drei Schichten,
dadurch gekennzeichnet,
dass auf einem Transportband eine Schicht aus,einem Feingranulat gemischt mit Leim in der Breite des Endproduktes aufgestreut, eine weitere Schicht zugeführt und eine Abdeckschicht aus Feingranulat gemischt mit Leim auf die Mittelschicht aufgebracht und der Verbund hohem Druck und Temperatur zur Bildung der Spanplatte ausgesetzt wird, wobei als Mittelschicht auf die aufgestreute erste untere Feinschicht Balsastirnholzbrettchen oder Balsastirnholzplatten aufgebracht werden.Method for producing a chipboard of at least three layers,
characterized,
that on a conveyor belt a layer of fine granules mixed with glue is spread in the width of the final product, another layer is applied and a covering layer of fine granules mixed with glue is applied to the middle layer and the composite is subjected to high pressure and temperature to form the chipboard, wherein Balsastirnholzbrettchen or Balsastirnholzplatten are applied as a middle layer on the sprinkled first lower fine layer. Verfahren nach Anspruch 1,
dadurch gekennzeichnet,
dass als schichtenbildendes Feingranulat Hackspäne, Sägespäne, Hobelspäne, Schleifspäne, Schleifmehl, Schleiffasern aus Holz oder anderen organischen Stoffen, wie Stroh, Hanf oder dergl., eingesetzt wird.Method according to claim 1,
characterized,
that is used as layers forming fine granules wood chips, sawdust, wood shavings, grinding chips, sanding powder, grinding fibers of wood or other organic substances such as straw, hemp or the like.,. Verfahren nach Anspruch 1 oder 2,
dadurch gekennzeichnet,
dass die aufgelegten Balsastirnholzbrettchen und/oder - platten einseitig oder beidseitig beleimt werden.Method according to claim 1 or 2,
characterized,
that the applied balsa wood boards and / or boards are glued on one or both sides. Verfahren nach Anspruch 1, 2 oder 3,
dadurch gekennzeichnet,
dass nach Durchlaufen der Balsastirnholzschicht mit aufgebrachter unterer und oberer Spandeckschicht wenigstens eine weitere Oberflächenbeschichtung des so entstandenen Leichtbau-Sandwiches vorgenommen wird.Method according to claim 1, 2 or 3,
characterized,
that after passing through the Balsastirnholzschicht with applied lower and upper Spandeckschicht at least one further surface coating of the resulting lightweight sandwich is made.
EP06024363A 2005-12-02 2006-11-24 Method of manufacturing a balsa core chipboard Not-in-force EP1792699B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005057606A DE102005057606A1 (en) 2005-12-02 2005-12-02 Process for producing a balsa wood chipboard

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EP1792699A1 true EP1792699A1 (en) 2007-06-06
EP1792699B1 EP1792699B1 (en) 2010-09-08

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AT (1) ATE480377T1 (en)
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2119540A1 (en) * 2008-05-15 2009-11-18 Alcan Technology &amp; Management Ltd. Mould object with balsa woods and method for its production
EP2119539A1 (en) * 2008-05-15 2009-11-18 Alcan Technology &amp; Management Ltd. Product with balsa wood and method for its production
EP2237936B1 (en) * 2008-01-14 2015-09-09 Amorim Revestimentos, S.A. Process for the production of a multi-layer pressed board, and board so produced

Families Citing this family (2)

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DE102006028392B4 (en) * 2006-06-19 2016-05-25 Dieffenbacher GmbH Maschinen- und Anlagenbau Method, installation and scattering machine for scattering a multilayer pressed material mat in the course of the production of wood-based panels
DE202007007516U1 (en) * 2007-05-08 2007-10-25 Günther Isensee Modellbaubedarf MDF Balsaholzplatte

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EP0573039A1 (en) * 1992-06-04 1993-12-08 LIGNOTOCK GmbH Fibre mats containing a binding agent made from cellulosic and ligno-cellulosic fibres
DE4434876A1 (en) * 1994-09-29 1996-04-04 Dieffenbacher Gmbh Maschf Method for continuous manufacture of multilayer board
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US2479342A (en) * 1943-12-09 1949-08-16 United Aircraft Corp Composite structure for use in aircraft construction
FR1485777A (en) * 1966-05-27 1967-06-23 Laminated wood panel
DE2011865B1 (en) * 1970-03-13 1971-11-04 Goldschmidt Ag Th Laminated composite panel with at least one surface that is offset by pressing together
DE2255712A1 (en) * 1972-11-14 1974-05-30 Siempelkamp Gmbh & Co Chipboard or fibreboard - prodn from semi-finished particle/resin panels for compression moulding to finished panels
GB1439578A (en) * 1973-06-14 1976-06-16 Baltek Corp Machine for making tesselated blankets
DE3100094A1 (en) * 1980-07-11 1982-03-25 Oelkers, Wolfgang, 6531 Laubenheim Reinforcing core panels for a sandwich construction element
DE3625534A1 (en) * 1983-10-10 1988-02-11 Fischer Gmbh BUILDING PLATE
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Cited By (6)

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EP2237936B1 (en) * 2008-01-14 2015-09-09 Amorim Revestimentos, S.A. Process for the production of a multi-layer pressed board, and board so produced
EP2119540A1 (en) * 2008-05-15 2009-11-18 Alcan Technology &amp; Management Ltd. Mould object with balsa woods and method for its production
EP2119539A1 (en) * 2008-05-15 2009-11-18 Alcan Technology &amp; Management Ltd. Product with balsa wood and method for its production
WO2009138197A1 (en) * 2008-05-15 2009-11-19 Alcan Technology & Management Ltd. Shaped articles with balsa wood and method of producing them
EP2351635A3 (en) * 2008-05-15 2012-10-24 3A Technology & Management Ltd. Product with balsa wood and method for its production
US8318319B2 (en) 2008-05-15 2012-11-27 3A Technology & Management Ltd. Shaped articles with balsa wood and method of producing them

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