EP1350319B1 - Balun - Google Patents
Balun Download PDFInfo
- Publication number
- EP1350319B1 EP1350319B1 EP02711795A EP02711795A EP1350319B1 EP 1350319 B1 EP1350319 B1 EP 1350319B1 EP 02711795 A EP02711795 A EP 02711795A EP 02711795 A EP02711795 A EP 02711795A EP 1350319 B1 EP1350319 B1 EP 1350319B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- loop
- conductor
- balun
- metal part
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000012966 insertion method Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 5
- 230000009466 transformation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2876—Cooling
Definitions
- the invention relates to a balun (balun) for transmitting large high frequency power, for example at the symmetrical output of a transistor power amplifier to the transition to an asymmetrical Output line.
- a balun according to the invention can be very simple and inexpensive in printed circuit technology directly manufactured integrated with the rest of the high-frequency circuit become.
- the additional soldered metal sheet part becomes the thermal conductivity of the symmetrical conductor loop so increased that when transferring the High-frequency power completely generates heat loss a heat sink can be derived.
- this additional Metal sheet metal part can be compared to a known in printed circuit technology Balancing transformer, in which the conductor loops only through the thin circuit board layer are formed, the two to three times the high-frequency power can be transmitted.
- a conductor loop can be an inventive Balancing transformer despite its simple and inexpensive Construction up to a transmission power of 150 watts can be operated.
- the principle according to the invention can with all usual in printed circuit technology trained balun be applied at which the unbalanced conductor loop either on the same or on the opposite side of the Printed circuit board is formed.
- the asymmetrical loop as a double loop is trained and thus acts as a 4: 1 transformer.
- a balun according to the invention is everywhere there can be used where higher frequencies between high-frequency circuits Power must be transferred. This is for example at Radio frequency transmitters when merging or distributing High frequency power the case.
- Has been particularly advantageous it turned out to be an inventive Balancing transformer at the output of push-pull transistor power amplifiers to be used, because then particularly compact and simple overall structure of one Power amplifier with unbalanced output results.
- the only figure shows the section of a push-pull transistor power amplifier, the one in printed Circuit technology on a fragmentary representation Printed circuit board 1 is formed and its symmetrical Output with a conductor loop symmetrical to ground M. 2 of a balun is connected.
- This symmetrical conductor loop 2 has the shape of a opposite sides of the annulus two opposite C-shaped loop halves 3 and 4, the one on one side at 5 in one another pass over and a slot on the opposite side 6 form.
- the two opposite and the slot 6 delimiting ends 7 and 8 of the C-shaped loop halves 3 and 4 form the balanced input of the Balun, they're over Transformation capacitors 9 with conductor tracks 10 and 11 electrically connected, with which the terminal lugs of the shown and in the rectangular recess 12th used high-frequency power transistor contact do.
- the input circuit for the not shown Power transistor which preferably also as Symmetry transformer is not shown in the figure shown, also not the other conductor tracks for the Wiring the transistors.
- the connection point 5 of the two loop halves 3 and 4 compared to the symmetrical Input 7, 8 forms the electrically cold ground point, it is via a conductor track 13 with which the conductor loop 2 surrounding ground area M shown only in fragments connected. All conductor tracks (M, 2, 10, 11, 13 etc.) are in known printed circuit technology on the Top of the circuit board 1 as thin metal layers educated.
- the unbalanced output conductor loop the for example as a double loop Resistance transformation is formed in the Embodiment shown on the back of the PCB 1 directly opposite the conductor loop 2 trained and therefore not visible in the figure.
- the Printed circuit board 1 is placed on a heat sink 14, the below the conductor loop 2 or this opposite not visible asymmetrical Conductor loop has a cutout 15.
- Those in the transfer of high High-frequency power in the thickened conductor loop 2, 20 resulting heat, partly from neighboring Capacitors is inserted into the loop evenly distributed through the thickened ring and can over a screw 16 which in a mounting hole 18 one after protruding inside 17 formed and in a Threaded bore 19 can be screwed into the heat sink 14, for Heat sink 14 derived and there, for example in the Cooling elements circulating coolant are degraded.
- a corresponding projection 21 is located on the conductor loop 2 provided with a corresponding mounting hole 22, the latter is plated through and the one on the back of the Printed circuit board 1 formed through this ring Bore 22 lies flat on the in the assembled state Top of the heat sink 14 so that the thermal contact between the conductor loop and the heat sink is reinforced.
- the thickened formation of the symmetrical conductor loop 2, 20 on the top of the circuit board 1 allows that the transformation capacitors 9, via which the High-frequency power from the transistor (connecting tracks 10, 11) passed to the symmetrical input 7, 8 of the transformer be, and possibly another arranged in the gap 6
- Capacitor 23 also with a relatively large area Copper ring 20 can be soldered, so that the Waste heat of such capacitors is dissipated well.
- balun is very simple and inexpensive because the additional copper sheet part 20 like a common component in automatic SMD (Surface Mounted Devices) assembly technology together with the others Components of the transistor circuit on the prepared printed circuit board can be soldered. This is done on the thin copper layer 2 of the conductor loop 2 in a known manner Way, solder paste is applied, then the copper sheet part 20 laid flat on the solder paste and finally the same printed circuit board with the other components in the Hot air oven introduced. Around component 20 during melting to fix the solder paste on the conductor loop 2 the opposite inner edges of the conductor track 2 strip-shaped solder mask 24 applied.
- SMD Surface Mounted Devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microwave Amplifiers (AREA)
- Amplifiers (AREA)
- Coils Or Transformers For Communication (AREA)
Description
Die Erfindung betrifft einen Symmetrierübertrager (Balun) zum Übertragen großer Hochfrequenzleistung, beispielsweise am symmetrischen Ausgang eines Transistor-Leistungsverstärkers zum Übergang auf eine unsymmetrische Ausgangsleitung.The invention relates to a balun (balun) for transmitting large high frequency power, for example at the symmetrical output of a transistor power amplifier to the transition to an asymmetrical Output line.
Symmetrierübertrager für höhere Leistung werden bisher stets in koaxialer Leitungstechnik aufgebaut. Dies ergibt relativ großvolumige Anordnungen, die relativ teuer in Handarbeit hergestellt und als gesonderte Bauelemente mit der übrigen Schaltung verbunden werden müssen. Es ist auch schon bekannt, Symmetrierübertrager in gedruckter Schaltungstechnik herzustellen und dabei die Leiterschleifen des Übertragers entweder nur auf der Oberseite der Leiterplatte (britische Patentschrift GB 2 084 809) oder auf gegenüberliegenden Seiten der Leiterplatte (US Patent US 4,193,048) auszubilden. Letztere in gedruckter Schaltungstechnik ausgebildete Symmetrierübertrager sind jedoch nur zur Übertragung von geringer Hochfrequenzleistung geeignet. Aus US-A-6 144 276 ist ein Übertrager mit spezieller Vorrichtung zur besseren Wärmeableitung bekannt.So far, balancing transformers for higher performance are always constructed in coaxial line technology. This results in relative large volume arrangements that are relatively expensive to craft manufactured and as separate components with the rest Circuit must be connected. It's also beautiful known, balun in printed Manufacture circuit technology and thereby the conductor loops of the transmitter either only on top of the Printed circuit board (British Patent GB 2 084 809) or on opposite sides of the circuit board (US patent US 4,193,048). The latter in printed Circuitry trained balun however only for the transmission of low radio frequency power suitable. From US-A-6 144 276 is a transmitter with a special device known for better heat dissipation.
Es ist Aufgabe der Erfindung, einen Symmetrierübertrager für die Übertragung hoher Leistung zu schaffen, der einfach und preiswert in gedruckter Schaltungstechnik herstellbar ist, und ein Verfahren zu dessen Herstellung anzugeben.It is an object of the invention to provide a balun for to create the transfer of high power, the simple and is inexpensive to manufacture in printed circuit technology, and to provide a process for its manufacture.
Diese Aufgabe wird ausgehend von einem Symmetrierübertrager
laut Oberbegriff des Anspruchs 1 durch dessen kennzeichnende
Merkmale gelöst. Die Aufgabe wird bezüglich des
Herstellungsverfahrens durch die Merkmale des Anspruchs 8
gelöst. Vorteilhafte Weiterbildungen ergeben sich aus den
Unteransprüchen. This task is based on a balun
according to the preamble of claim 1 by its characterizing
Features solved. The task is regarding the
Manufacturing method by the features of
Ein erfindungsgemäßer Symmetrierübertrager kann sehr einfach und preiswert in gedruckter Schaltungstechnik unmittelbar integriert mit der übrigen Hochfrequenzschaltung hergestellt werden. Durch das zusätzlich aufgelötete Metall-Blechteil wird die Wärmeleitfähigkeit der symmetrischen Leiterschleife so erhöht, daß die bei der Übertragung der Hochfrequenzleistung erzeugte Verlustwärme vollständig zu einem Kühlkörper ableitbar ist. Durch dieses zusätzliche Metall-Blechteil kann also gegenüber einem bekannten in gedruckter Schaltungstechnik ausgebildeten Symmetrierübertrager, bei dem die Leiterschleifen nur durch die dünne Leiterplattenschicht gebildet sind, das zwei- bis dreifache an Hochfrequenzleistung übertragen werden.A balun according to the invention can be very simple and inexpensive in printed circuit technology directly manufactured integrated with the rest of the high-frequency circuit become. Through the additional soldered metal sheet part becomes the thermal conductivity of the symmetrical conductor loop so increased that when transferring the High-frequency power completely generates heat loss a heat sink can be derived. Through this additional Metal sheet metal part can be compared to a known in printed circuit technology Balancing transformer, in which the conductor loops only through the thin circuit board layer are formed, the two to three times the high-frequency power can be transmitted.
Je nach übertragener Frequenz und damit Größe der Leiterschleifen kann ein erfindungsgemäßer Symmetrierübertrager trotz seines einfachen und preiswerten Aufbaus beispielsweise bis zu einer Übertragungsleistung von 150 Watt betrieben werden. Das erfindungsgemäße Prinzip kann bei allen üblichen in gedruckter Schaltungstechnik ausgebildeten Symmetrierübertragern angewendet werden, bei denen die unsymmetrische Leiterschleife entweder auf der gleichen oder auf der gegenüberliegenden Seite der Leiterplatte ausgebildet ist. In gleicher Weise ist das erfindungsgemäße Prinzip auch für Symmetrierübertrager geeignet, deren unsymmetrische Schleife als Doppelschleife ausgebildet ist und der damit als 4:1-Transformator wirkt.Depending on the transmitted frequency and thus the size of the A conductor loop can be an inventive Balancing transformer despite its simple and inexpensive Construction up to a transmission power of 150 watts can be operated. The principle according to the invention can with all usual in printed circuit technology trained balun be applied at which the unbalanced conductor loop either on the same or on the opposite side of the Printed circuit board is formed. In the same way it is Principle according to the invention also for balun suitable, the asymmetrical loop as a double loop is trained and thus acts as a 4: 1 transformer.
Ein erfindungsgemäßer Symmetrierübertrager ist überall dort einsetzbar, wo zwischen Hochfrequenzschaltungen höhere Leistung übertragen werden muß. Dies ist beispielsweise bei Hochfrequenzsendern beim Zusammenführen oder Verteilen von Hochfrequenzleistung der Fall. Als besonders vorteilhaft hat es sich erwiesen, einen erfindungsgemäßen Symmetrierübertrager am Ausgang von Gegentakt-Transistor-Leistungsverstärkern einzusetzen, da sich hierbei dann ein besonders gedrungener und einfacher Gesamtaufbau eines Leistungsverstärkers mit unsymmetrischem Ausgang ergibt. A balun according to the invention is everywhere there can be used where higher frequencies between high-frequency circuits Power must be transferred. This is for example at Radio frequency transmitters when merging or distributing High frequency power the case. Has been particularly advantageous it turned out to be an inventive Balancing transformer at the output of push-pull transistor power amplifiers to be used, because then particularly compact and simple overall structure of one Power amplifier with unbalanced output results.
Die Erfindung wird im Folgenden anhand einer schematischen Zeichnung an einem Ausführungsbeispiel näher erläutert.The invention is described below using a schematic Drawing explained in more detail using an exemplary embodiment.
Die einzige Figur zeigt den Ausschnitt eines Gegentakt-Transistor-Leistungsverstärkers,
der in gedruckter
Schaltungstechnik auf einer bruchstückhaft dargestellten
Leiterplatte 1 ausgebildet ist und dessen symmetrischer
Ausgang mit einer gegen Masse M symmetrischen Leiterschleife
2 eines Symmetrierübertragers verbunden ist. Diese
symmetrische Leiterschleife 2 besitzt die Form eines von
gegenüberliegenden Seiten zusammengedrückten Kreisringes mit
zwei gegenüberliegenden C-förmigen Schleifenhälften 3 und 4,
die auf der einen Seite bei 5 einstückig ineinander
übergehen und auf der gegenüberliegenden Seite einen Schlitz
6 bilden. Die beiden gegenüberliegenden und den Schlitz 6
begrenzenden Enden 7 und 8 der C-förmigen Schleifenhälften 3
und 4 bilden den symmetrischen Eingang des
Symmetrierübertragers, sie sind über
Transformationskondensatoren 9 mit Leiterbahnen 10 und 11
elektrisch verbunden, mit denen die Anschlußfahnen des nicht
dargestellten und in der rechteckigen Ausnehmung 12
eingesetzten Hochfrequenz-Leistungstransistors Kontakt
machen.The only figure shows the section of a push-pull transistor power amplifier,
the one in printed
Circuit technology on a fragmentary representation
Printed circuit board 1 is formed and its symmetrical
Output with a conductor loop symmetrical to ground M.
2 of a balun is connected. This
symmetrical conductor loop 2 has the shape of a
opposite sides of the annulus
two opposite C-
Die Eingangsschaltung für den nicht dargestellten
Leistungstransistor, die vorzugsweise ebenfalls als
Symmetrierübertrager ausgebildet ist, ist in der Fig. nicht
dargestellt, ebenso nicht die übrigen Leiterbahnen für die
Beschaltung der Transistoren. Der Verbindungspunkt 5 der
beiden Schleifenhälften 3 und 4 gegenüber dem symmetrischen
Eingang 7, 8 bildet den elektrisch kalten Massepunkt, er ist
über eine Leiterbahn 13 mit der die Leiterschleife 2
umgebenden nur bruchstückhaft dargestellten Massefläche M
verbunden. Sämtliche Leiterbahnen (M, 2, 10, 11, 13 usw. )
sind in bekannter gedruckter Schaltungstechnik auf der
Oberseite der Leiterplatte 1 als dünne Metallschichten
ausgebildet. Die unsymmetrische Ausgangsleiterschleife, die
beispielsweise als Doppelschleife zur
Widerstandstransformation ausgebildet ist, ist in dem
gezeigtem Ausführungsbeispiel auf der Rückseite der
Leiterplatte 1 unmittelbar gegenüber der Leiterschleife 2
ausgebildet und in der Figur daher nicht sichtbar. Die
Leiterplatte 1 ist auf einem Kühlkörper 14 aufgesetzt, der
unterhalb der Leiterschleife 2 bzw. der dieser
gegenüberliegenden nicht sichtbaren unsymmetrischen
Leiterschleife eine Ausfräsung 15 aufweist.The input circuit for the not shown
Power transistor, which preferably also as
Symmetry transformer is not shown in the figure
shown, also not the other conductor tracks for the
Wiring the transistors. The connection point 5 of the
two
Auf der Oberseite der symmetrischen Leiterschleife 2 ist ein
zusätzliches in gleicher Weise geformtes schleifenförmiges
Kupferblechteil 20 aufgelötet. Dadurch wird die symmetrische
Leiterschleife des Symmetrierübertragers dicker und besser
wärmeleitend. Die bei der Übertragung von hoher
Hochfrequenzleistung in der verdickten Leiterschleife 2, 20
entstehende Wärme, die teilweise auch von benachbarten
Kondensatoren in die Schleife mit eingebracht wird, wird
durch den verdickten Ring gleichmäßig verteilt und kann über
eine Schraube 16, die in eine Montagebohrung 18 eines nach
innen ragenden Vorsprungs 17 ausgebildet und in einer
Gewindebohrung 19 im Kühlkörper 14 einschraubbar ist, zum
Kühlkörper 14 abgeleitet und dort über das beispielsweise im
Kühlkörper zirkulierende Kühlmittel abgebaut werden.On the top of the symmetrical conductor loop 2 is a
additional loop-shaped in the same way
An der Leiterschleife 2 ist ein entsprechender Vorsprung 21
mit einer entsprechenden Montagebohrung 22 vorgesehen,
letztere ist durchkontaktiert und der auf der Rückseite der
Leiterplatte 1 gebildete Durchkontaktierungsring dieser
Bohrung 22 liegt im montierten Zustand flach auf der
Oberseite des Kühlkörpers 14 auf, so daß der Wärmekontakt
zwischen Leiterschleife und Kühlkörper noch verstärkt wird.
Die verdickte Ausbildung der symmetrischen Leiterschleife 2,
20 auf der Oberseite der Leiterplatte 1 ermöglicht es, daß
die Transformationskondensatoren 9, über welche die
Hochfrequenzleistung vom Transistor (Anschlußbahnen 10, 11)
zum symmetrischen Eingang 7, 8 des Übertragers geleitet
werden, und ggf. ein weiterer im Spalt 6 angeordneter
Kondensator 23 ebenfalls relativ großflächig mit dem
Kupferring 20 verlötet werden können, so daß auch die
Verlustwärme solcher Kondensatoren gut abgeleitet wird. A corresponding projection 21 is located on the conductor loop 2
provided with a corresponding mounting hole 22,
the latter is plated through and the one on the back of the
Printed circuit board 1 formed through this ring
Bore 22 lies flat on the in the assembled state
Top of the
Die Herstellung eines solchen Symmetrierübertragers ist sehr
einfach und preiswert, da das zusätzliche Kupferblechteil 20
wie ein übliches Bauteil in automatischer SMD (Surface
Mounted Devices)-Bestückungstechnik zusammen mit den anderen
Bauelementen der Transistorschaltung auf die vorbereitete
gedruckte Leiterplatte aufgelötet werden kann. Dazu wird auf
die dünne Kupferschicht 2 der Leiterschleife 2 in bekannter
Weise Lötpaste aufgebracht, dann wird das Kupferblechteil 20
flach auf die Lötpaste aufgelegt und schließlich die so auch
mit den übrigen Bauelementen bestückte Leiterplatte in den
Heißluftofen eingebracht. Um das Bauteil 20 beim Schmelzen
der Lötpaste auf der Leiterschleife 2 zu fixieren werden an
den gegenüberliegenden Innenrändern der Leiterbahn 2
streifenförmiger Lötstopplack 24 aufgebracht.The manufacture of such a balun is very
simple and inexpensive because the additional
Claims (9)
- Balun, of which the conductor loop balanced to earth is formed on the upper side of a printed circuit board (1) as a loop-shaped printed conductor (2),
characterised in that,
for the transfer of a large, high-frequency power, a loop-shaped sheet-metal part (20) corresponding to the shape of the loop-shaped printed conductor is soldered onto the loop-shaped printed conductor (2), and that the heat loss is dissipated at the electrically cold earth point (5) of the balanced conductor loop. - Balun according to claim 1,
characterised in that
an assembly borehole (18) for a metallic screw (16) is formed at the electrically cold earth point (5) of the loop-shaped sheet-metal part (20), which screw can be screwed into a cooling element (14) arranged on the rear side of the printed circuit board (1). - Balun according to claim 2,
characterised in that
the assembly borehole (18) is formed in a projection projecting radially inwards from the loop-shaped sheet-metal part (20). - Balun according to claim 3,
characterised in that
a corresponding projection (21) with a through-contacted assembly borehole (22) is also formed on the loop-shaped printed conductor (2) of the printed circuit board (1), which accommodates the sheet metal part. - Balun according to any one of the preceding claims,
characterised in that
the sheet-metal part (20) is made of tin-plated copper. - Balun according to any one of the preceding claims,
characterised in that
condensers (9, 23) arranged at the balanced input of the conductor loop (2, 20) are soldered over a large-area to the sheet-metal part (20). - Balun according to any one of the preceding claims,
characterised in that
the balun is arranged in the immediate proximity to the output of a high-frequency power transistor, and the input (7, 8), which is balanced to earth, of the balanced conductor loop (2, 20) is connected to the balanced output (10, 11) of the amplifier. - Method for manufacturing a balun according to any one of the preceding claims,
characterised in that
solder paste is applied at predetermined soldering points on a printed circuit board (1), on the surface of which, the printed conductors for a high-frequency circuit, especially a transistor power amplifier circuit are formed, together with the loop-shaped printed conductor (2) for the balun, using printed circuit technology; and that the sheet-metal part (20) is then fitted to the loop-shaped printed conductor (2) together with the other components using known automatic insertion methods; and that, finally, the soldering procedure is carried out by heating. - Method according to claim 8,
characterised in that
at the mutually opposite, curved internal edges of the two mutually opposite halves of the loop-shaped printed conductor (2), appropriate solder-resist strips (24) are applied to the printed circuit board (1) in order to fix the attached sheet-metal part (20) during the soldering procedure.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10105696 | 2001-02-08 | ||
| DE10105696A DE10105696A1 (en) | 2001-02-08 | 2001-02-08 | Balun |
| PCT/EP2002/000146 WO2002063762A1 (en) | 2001-02-08 | 2002-01-09 | Balun |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1350319A1 EP1350319A1 (en) | 2003-10-08 |
| EP1350319B1 true EP1350319B1 (en) | 2004-05-19 |
Family
ID=7673263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02711795A Expired - Lifetime EP1350319B1 (en) | 2001-02-08 | 2002-01-09 | Balun |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6917254B2 (en) |
| EP (1) | EP1350319B1 (en) |
| JP (1) | JP4004960B2 (en) |
| DE (2) | DE10105696A1 (en) |
| WO (1) | WO2002063762A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004022185A1 (en) * | 2004-05-05 | 2005-12-01 | Rohde & Schwarz Gmbh & Co. Kg | Broadband balun transformer |
| JP4730233B2 (en) * | 2006-07-11 | 2011-07-20 | 旭硝子株式会社 | Transmission line converter |
| US8441774B2 (en) * | 2007-03-08 | 2013-05-14 | Nec Corporation | Capacitance element, printed circuit board, semiconductor package, and semiconductor circuit |
| US20100301987A1 (en) * | 2009-05-27 | 2010-12-02 | Stmicroelectronics S.A. | Millimeter wave transformer with a high transformation factor and a low insertion loss |
| KR102501517B1 (en) | 2010-06-11 | 2023-02-21 | 가부시키가이샤 리코 | Apparatus and method for preventing an information storage device from falling from a removable device |
| DE102012106135A1 (en) | 2012-07-09 | 2014-05-22 | Cryoelectra Gmbh | Baluns for use in amplifier unit of high frequency amplifier of e.g. base station of radio system, have layered structure provided with underside that is connected to temperature heat sink element directly or indirectly over metallic layer |
| ITMI20121238A1 (en) | 2012-07-17 | 2014-01-18 | St Microelectronics Srl | BALUN PLANAR TRANSFORMER DEVICE |
| WO2016099314A1 (en) * | 2014-12-15 | 2016-06-23 | Siemens Research Center Limited Liability Company | A balun transformer with a cooling mechanism |
| JP2018506842A (en) * | 2014-12-15 | 2018-03-08 | シーメンス アクチエンゲゼルシヤフトＳｉｅｍｅｎｓ Ａｋｔｉｅｎｇｅｓｅｌｌｓｃｈａｆｔ | Fluid cooled balun transformer |
| CN108270407B (en) * | 2016-12-30 | 2023-09-05 | 通用电气公司 | Planar balun and multilayer circuit board |
| EP3605842A1 (en) * | 2018-08-02 | 2020-02-05 | TRUMPF Huettinger Sp. Z o. o. | Balun and amplifier including the balun |
| US12061215B2 (en) * | 2022-05-05 | 2024-08-13 | Applied Materials, Inc. | RF measurement from a transmission line sensor |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1938152B1 (en) * | 1969-07-26 | 1971-01-07 | Hirschmann Radiotechnik | Terminal arrangement with balancing transformer |
| US4186352A (en) * | 1978-03-23 | 1980-01-29 | Rockwell International Corporation | Signal converter apparatus |
| US4193048A (en) * | 1978-06-22 | 1980-03-11 | Rockwell International Corporation | Balun transformer |
| GB2084809B (en) * | 1980-10-01 | 1984-01-18 | Communications Patents Ltd | Printed circuit transformers |
| FR2652197B1 (en) * | 1989-09-18 | 1992-09-18 | Motorola Semiconducteurs Borde | IMPROVED SYMMETRIC-DISSYMMETRIC TRANSFORMERS. |
| US5917386A (en) * | 1997-03-12 | 1999-06-29 | Zenith Electronics Corporation | Printed circuit transformer hybrids for RF mixers |
| US6144276A (en) | 1998-04-02 | 2000-11-07 | Motorola, Inc. | Planar transformer having integrated cooling features |
| US6294965B1 (en) * | 1999-03-11 | 2001-09-25 | Anaren Microwave, Inc. | Stripline balun |
-
2001
- 2001-02-08 DE DE10105696A patent/DE10105696A1/en not_active Withdrawn
-
2002
- 2002-01-09 EP EP02711795A patent/EP1350319B1/en not_active Expired - Lifetime
- 2002-01-09 WO PCT/EP2002/000146 patent/WO2002063762A1/en active IP Right Grant
- 2002-01-09 DE DE50200466T patent/DE50200466D1/en not_active Expired - Lifetime
- 2002-01-09 US US10/416,835 patent/US6917254B2/en not_active Expired - Lifetime
- 2002-01-09 JP JP2002563596A patent/JP4004960B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6917254B2 (en) | 2005-07-12 |
| JP2004518384A (en) | 2004-06-17 |
| WO2002063762A1 (en) | 2002-08-15 |
| DE50200466D1 (en) | 2004-06-24 |
| US20040080376A1 (en) | 2004-04-29 |
| EP1350319A1 (en) | 2003-10-08 |
| JP4004960B2 (en) | 2007-11-07 |
| DE10105696A1 (en) | 2002-08-14 |
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