EP0558855A3 - Circuit board stack with novel cross-over cells - Google Patents
Circuit board stack with novel cross-over cells Download PDFInfo
- Publication number
- EP0558855A3 EP0558855A3 EP92311248A EP92311248A EP0558855A3 EP 0558855 A3 EP0558855 A3 EP 0558855A3 EP 92311248 A EP92311248 A EP 92311248A EP 92311248 A EP92311248 A EP 92311248A EP 0558855 A3 EP0558855 A3 EP 0558855A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- board stack
- novel cross
- over cells
- cells
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US844099 | 1977-10-20 | ||
US84409992A | 1992-03-02 | 1992-03-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0558855A2 EP0558855A2 (en) | 1993-09-08 |
EP0558855A3 true EP0558855A3 (en) | 1996-05-01 |
Family
ID=25291818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP92311248A Withdrawn EP0558855A3 (en) | 1992-03-02 | 1992-12-10 | Circuit board stack with novel cross-over cells |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0558855A3 (en) |
JP (1) | JP2598212B2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2891875B2 (en) * | 1994-06-09 | 1999-05-17 | 日本電気株式会社 | Liquid crystal display |
US6486528B1 (en) | 1994-06-23 | 2002-11-26 | Vertical Circuits, Inc. | Silicon segment programming apparatus and three terminal fuse configuration |
US5675180A (en) * | 1994-06-23 | 1997-10-07 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments |
US6080596A (en) * | 1994-06-23 | 2000-06-27 | Cubic Memory Inc. | Method for forming vertical interconnect process for silicon segments with dielectric isolation |
US6124633A (en) * | 1994-06-23 | 2000-09-26 | Cubic Memory | Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
US6255726B1 (en) | 1994-06-23 | 2001-07-03 | Cubic Memory, Inc. | Vertical interconnect process for silicon segments with dielectric isolation |
US5698895A (en) | 1994-06-23 | 1997-12-16 | Cubic Memory, Inc. | Silicon segment programming method and apparatus |
US5657206A (en) * | 1994-06-23 | 1997-08-12 | Cubic Memory, Inc. | Conductive epoxy flip-chip package and method |
US5891761A (en) * | 1994-06-23 | 1999-04-06 | Cubic Memory, Inc. | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform |
DE69735253T2 (en) | 1997-07-04 | 2006-07-27 | Agilent Technologies Inc., A Delaware Corp., Palo Alto | Compressible elastomeric contact element and mechanical assembly with such a contact element |
WO2002065588A1 (en) * | 2001-02-09 | 2002-08-22 | Jsr Corporation | Anisotropic conductive connector, its manufacture method and probe member |
FR2845821B1 (en) * | 2002-10-11 | 2005-12-02 | Thales Sa | ELECTRONIC SUBSTRATE OF A THREE-DIMENSIONAL ELECTRONIC MODULE HAVING A HIGH THERMAL DISSIPATION POWER AND ELECTRONIC MODULE |
CN113178421B (en) * | 2021-04-08 | 2022-03-29 | 深圳市磐锋精密技术有限公司 | Multi-chip packaging positioning device and method for mobile phone integrated circuit |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0001897A2 (en) * | 1977-10-21 | 1979-05-16 | The University Of Melbourne | Electrical connector including an elastomeric connecting element |
US4209481A (en) * | 1976-04-19 | 1980-06-24 | Toray Industries, Inc. | Process for producing an anisotropically electroconductive sheet |
EP0116802A1 (en) * | 1982-12-30 | 1984-08-29 | Thomson-Csf | Assembly structure of complex electronic circuits and method of improvement of the reliability of this assembly |
GB2155251A (en) * | 1984-03-02 | 1985-09-18 | Plessey Co Plc | Anisotropic electrical connectors |
US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
WO1990014750A1 (en) * | 1989-05-16 | 1990-11-29 | Labinal Components & Systems, Inc. | Low-loss electrical interconnects |
US5030109A (en) * | 1990-08-24 | 1991-07-09 | Amp Incorporated | Area array connector for substrates |
US5037312A (en) * | 1990-11-15 | 1991-08-06 | Amp Incorporated | Conductive gel area array connector |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0494072A (en) * | 1990-08-10 | 1992-03-26 | Matsushita Electric Ind Co Ltd | Connector for printed substrate |
-
1992
- 1992-12-10 EP EP92311248A patent/EP0558855A3/en not_active Withdrawn
- 1992-12-28 JP JP4358564A patent/JP2598212B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209481A (en) * | 1976-04-19 | 1980-06-24 | Toray Industries, Inc. | Process for producing an anisotropically electroconductive sheet |
EP0001897A2 (en) * | 1977-10-21 | 1979-05-16 | The University Of Melbourne | Electrical connector including an elastomeric connecting element |
EP0116802A1 (en) * | 1982-12-30 | 1984-08-29 | Thomson-Csf | Assembly structure of complex electronic circuits and method of improvement of the reliability of this assembly |
GB2155251A (en) * | 1984-03-02 | 1985-09-18 | Plessey Co Plc | Anisotropic electrical connectors |
US4593961A (en) * | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
WO1990014750A1 (en) * | 1989-05-16 | 1990-11-29 | Labinal Components & Systems, Inc. | Low-loss electrical interconnects |
US5030109A (en) * | 1990-08-24 | 1991-07-09 | Amp Incorporated | Area array connector for substrates |
US5037312A (en) * | 1990-11-15 | 1991-08-06 | Amp Incorporated | Conductive gel area array connector |
Also Published As
Publication number | Publication date |
---|---|
EP0558855A2 (en) | 1993-09-08 |
JPH0684570A (en) | 1994-03-25 |
JP2598212B2 (en) | 1997-04-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB NL |
|
RAP3 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: AT&T CORP. |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB NL |
|
17P | Request for examination filed |
Effective date: 19961018 |
|
17Q | First examination report despatched |
Effective date: 19981125 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19990607 |