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EP0375179A3 - Copper plating process for difficult to plate metals - Google Patents

Copper plating process for difficult to plate metals Download PDF

Info

Publication number
EP0375179A3
EP0375179A3 EP19890312444 EP89312444A EP0375179A3 EP 0375179 A3 EP0375179 A3 EP 0375179A3 EP 19890312444 EP19890312444 EP 19890312444 EP 89312444 A EP89312444 A EP 89312444A EP 0375179 A3 EP0375179 A3 EP 0375179A3
Authority
EP
European Patent Office
Prior art keywords
copper plating
difficult
plating process
plate metals
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890312444
Other languages
German (de)
French (fr)
Other versions
EP0375179A2 (en
EP0375179B1 (en
Inventor
Issa Said Mahmoud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0375179A2 publication Critical patent/EP0375179A2/en
Publication of EP0375179A3 publication Critical patent/EP0375179A3/en
Application granted granted Critical
Publication of EP0375179B1 publication Critical patent/EP0375179B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

An acid copper plating bath and process for using with electropositive metals such as aluminium and tungsten is described, wherein the bath contains sulphuric acid, copper sulphate, in solution with levelling, wetting and brightening agents.
EP19890312444 1988-12-21 1989-11-29 Copper plating process for difficult to plate metals Expired - Lifetime EP0375179B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28999388A 1988-12-21 1988-12-21
US289993 1988-12-21

Publications (3)

Publication Number Publication Date
EP0375179A2 EP0375179A2 (en) 1990-06-27
EP0375179A3 true EP0375179A3 (en) 1991-01-30
EP0375179B1 EP0375179B1 (en) 1994-05-25

Family

ID=23114070

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890312444 Expired - Lifetime EP0375179B1 (en) 1988-12-21 1989-11-29 Copper plating process for difficult to plate metals

Country Status (3)

Country Link
EP (1) EP0375179B1 (en)
JP (1) JPH02232390A (en)
DE (1) DE68915519T2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818294A1 (en) * 2000-12-15 2002-06-21 Thomson Csf Electrolyte incorporating a basic inhibiting agent with a amine function for depositing anti-corrosion coatings of copper and its alloys on aluminium and its alloys
JP2010150622A (en) * 2008-12-26 2010-07-08 Hitachi Ltd Plating liquid, conductive body substrate having projecting metallic structure and method of manufacturing the same
CN103668355B (en) * 2013-12-06 2016-05-11 南京三乐电子信息产业集团有限公司 The copper electroplating method on a kind of travelling-wave tubes tungsten helix surface
FR3053352A1 (en) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas ANTI-CORROSION PROTECTIVE COMPOSITION
DE102016113641A1 (en) 2016-07-25 2018-01-25 Christian-Albrechts-Universität Zu Kiel Aluminum-copper connector having a heterostructure and method of making the heterostructure
CN107447239B (en) * 2017-08-21 2018-08-28 安徽省含山县兴建铸造厂 A kind of preparation method of corrosion-resistant damper

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU901363A1 (en) * 1980-06-10 1982-01-30 Предприятие П/Я А-7155 Electrolyte for electrolytic precipitating of copper electrolyte for for electrolytic deposition of copper

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, vol. 96, no. 24, 14th June 1982, page 531, abstract no. 207474k, Columbus, Ohio, US; & SU-A-901 363 (V.M. GOLIKOV et al.) 30-01-1982 *
METALOBERFLÄCHE, vol. 33, no. 1, 1979, pages 9-16; M.F.M. EL GHANDOUR et al.: "Einfluss von Harnstoff und anderen Zusätzen, sowie der Herstellungsbedingungen auf die elektrolytische Abscheidung von Kupfer aus Kupfersulfatbädern" *

Also Published As

Publication number Publication date
DE68915519D1 (en) 1994-06-30
JPH02232390A (en) 1990-09-14
EP0375179A2 (en) 1990-06-27
EP0375179B1 (en) 1994-05-25
JPH0317913B2 (en) 1991-03-11
DE68915519T2 (en) 1994-12-01

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