EP0048579B1 - Method for the electro-deposition of lead alloys - Google Patents
Method for the electro-deposition of lead alloys Download PDFInfo
- Publication number
- EP0048579B1 EP0048579B1 EP81304194A EP81304194A EP0048579B1 EP 0048579 B1 EP0048579 B1 EP 0048579B1 EP 81304194 A EP81304194 A EP 81304194A EP 81304194 A EP81304194 A EP 81304194A EP 0048579 B1 EP0048579 B1 EP 0048579B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lead
- solution
- tin
- anode
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229910000978 Pb alloy Inorganic materials 0.000 title claims description 5
- 238000004070 electrodeposition Methods 0.000 title abstract description 5
- 238000007747 plating Methods 0.000 claims abstract description 21
- 239000012528 membrane Substances 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 238000007654 immersion Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 238000005341 cation exchange Methods 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- 238000000151 deposition Methods 0.000 claims abstract description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 claims description 3
- 229910002058 ternary alloy Inorganic materials 0.000 abstract description 9
- 229910000906 Bronze Inorganic materials 0.000 abstract description 6
- 239000010974 bronze Substances 0.000 abstract description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- QQHJESKHUUVSIC-UHFFFAOYSA-N antimony lead Chemical compound [Sb].[Pb] QQHJESKHUUVSIC-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 239000001996 bearing alloy Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 22
- 238000000576 coating method Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- -1 copper fluoroborate Chemical compound 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229940021013 electrolyte solution Drugs 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
Definitions
- This invention relates to a method for the electro-deposition of an alloy coating on to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
- Such a bearing may comprise for example a half shell backing member of steel with a bronze substrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-indium or lead-antimony-tin.
- Binary and ternary alloys can be co-deposited electrolytically as is described for example in British Patents 577335 and 628459 and in U.S.A. Patent 2605149. In British Patents 577335 it is stated, and has been verified in tests, that coatings of ternary alloys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead- indium binary alloy coatings as bearing surfaces.
- a method of electro-depositing a lead alloy onto a metal cathode characterised by the steps of immersing the cathode in a first chamber containing a lead based catholyte solution; immersing a soluble lead alloy anode in a second chamber containing a lead based anolyte solution which does not contain ions capable of immersion plating onto the anode; maintaining the anolyte solution and the catholyte solution separate from one another by the medium of a cation exchange membrane; and applying a direct current between the anode and the cathode.
- the second chamber is located wholly within the first chamber.
- the anolyte will not contain elements capable of immersion plating on to the anode.
- the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony.
- the catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper.
- metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode will remain clean. At the end of the plating operation, when the plating potential is disconnected, the animony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) is prevented from entering the anolyte by the physical barrier of the cation exchange membrane. That is to say, metal ions can pass in one direction only, i.e. towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode. Thus the anolyte solution in the second chamber remains free of ions capable of immersion plating on to the anode.
- a further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
- first chamber 10 within which is locatable a member 12 to be plated and which comprises the cathode; such member may comprise a steel backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a ternary alloy as a bearing surface.
- This first chamber 10 is capable of being filled with the catholyte solution.
- a second chamber 14 wholely contained within the first chamber and communicating therewith only through the medium of a cation exchange membrane 16.
- This second chamber 14 is conveniently of box like rectangular configuration having an open top and an open front across which is secured the exchange membrane 16 by means of detachable clamping plates and gaskets.
- a sheet 18 of porous polyethylene may be sealingly located by the gaskets on one or both sides of the membrane 16 the polyethylene sheeting 18 being provided to prevent physical damage to the exchange membrane 16 and also providing support against sag or swelling of the exchange membrane which may occur in use.
- the cation exchange membrane is a proprietary item and may be of the type available from Permutit-Body of Brentford, Middlesex, England.
- the anode 20 is locatable within the second chamber 14 and the chamber 14 is capable of being filled with an anolyte solution to at least the same level as that of the catholyte solution in the first chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte.
- the apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy.
- the anode was a lead-tin anode containing 5% to 25% by weight of tin.
- the cathode comprised a steel backing member on to which was bonded a bronze substrate. It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal of tin into the bronze.
- the catholyte solution in the first chamber was as follows:-
- the temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
- the second chamber was filled with an anolyte solution of the following composition
- the temperature of the anolyte solution was maintained at 40°C
- the temperature of the catholyte solution was maintained at 25°C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25,um thickness.
- the anolyte solution was identical in all respects with the catholyte solution with the exception that no copper fluoroborate was present in the anolyte.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Conductive Materials (AREA)
Abstract
Description
- This invention relates to a method for the electro-deposition of an alloy coating on to a backing member, such a process being of particular interest to the coating of a load carrying bearing surface on to the backing member of a plain bearing.
- Such a bearing may comprise for example a half shell backing member of steel with a bronze substrate bonded thereto and on to which is electro-deposited a bearing surface coating of lead-indium or lead-antimony-tin. Binary and ternary alloys can be co-deposited electrolytically as is described for example in British Patents 577335 and 628459 and in U.S.A. Patent 2605149. In British Patents 577335 it is stated, and has been verified in tests, that coatings of ternary alloys such as lead-antimony-tin or lead-tin-copper can replace the more usual lead-tin or lead- indium binary alloy coatings as bearing surfaces.
- However in the electro-deposition of ternary alloys containing antimony or copper, there is a displacement reaction when a soluble metal anode is used. For example in British Patent 628459 it is stated that antimony will immersion plate on to a lead, lead-tin or lead-tin- antimony anode. In Patent 628459 it is stated that this immersion plating is adherent enough so that the anode may be used two or three times and then the antimony may be scrubbed off and reclaimed and, whereas such a procedure may be acceptable for small scale operation, it would not be feasible to operate a continuous production plating process wherein anodes were required to be removed many times during the working operation for scrubbing.
- Similarly if a lead-tin-copper electrolyte is utilised, the copper in the plating solution immersion plates out on to metal anodes such as lead or lead-tin and, although such an electrolyte has been in production used for many years, the removal of all the anodes from the bath during idle periods is required, and the frequent additions of copper fluoroborate are necessary to replace losses from the electrolyte.
- It is the object of the present invention to provide an improved method which will prevent the undesirable immersion plating of a soluble metal anode containing lead by metals from the plating solution which are more noble then lead.
- In accordance with the invention there is provided a method of electro-depositing a lead alloy onto a metal cathode characterised by the steps of immersing the cathode in a first chamber containing a lead based catholyte solution; immersing a soluble lead alloy anode in a second chamber containing a lead based anolyte solution which does not contain ions capable of immersion plating onto the anode; maintaining the anolyte solution and the catholyte solution separate from one another by the medium of a cation exchange membrane; and applying a direct current between the anode and the cathode.
- It is preferred that the second chamber is located wholly within the first chamber.
- In use of the method according to the invention the anolyte will not contain elements capable of immersion plating on to the anode. Thus if the catholyte comprises a lead-antimony-tin plating solution then the anolyte will not contain any antimony. Similarly if the catholyte comprises a lead-tin-copper plating solution then the anolyte will not contain copper.
- According to the method of the invention, metal ions arising from the anode pass through the cation exchange membrane towards the cathode under the influence of the plating potential. Since the anolyte contains no metal capable of immersion plating on to the anode will remain clean. At the end of the plating operation, when the plating potential is disconnected, the animony or copper or arsenic in the catholyte (depending on what alloy is being co-deposited) is prevented from entering the anolyte by the physical barrier of the cation exchange membrane. That is to say, metal ions can pass in one direction only, i.e. towards the cathode, and then only under the influence of the plating potential applied between the anode and cathode. Thus the anolyte solution in the second chamber remains free of ions capable of immersion plating on to the anode.
- A further advantage of the use of a cation exchange membrane to physically separate the catholyte and anolyte solutions is that the composition of the catholyte may be controlled more readily since metal is not lost therefrom by immersion plating which in turn means that the electro-deposited alloys have more consistent compositions.
- Other features of the invention will become apparent from the following description given herein solely by way of example and with reference to the accompanying drawing which shows, in diagrammatic form, a plan view of a plating apparatus for use in the process in accordance with the invention.
- Referring to the drawings, there is shown a
first chamber 10 within which is locatable amember 12 to be plated and which comprises the cathode; such member may comprise a steel backing member with a bronze substrate bonded thereto and on to which is to be co-deposited a ternary alloy as a bearing surface. Thisfirst chamber 10 is capable of being filled with the catholyte solution. - At the end of the
first chamber 10 remote from thecathode 12 there is provided asecond chamber 14 wholely contained within the first chamber and communicating therewith only through the medium of acation exchange membrane 16. Thissecond chamber 14 is conveniently of box like rectangular configuration having an open top and an open front across which is secured theexchange membrane 16 by means of detachable clamping plates and gaskets. To provide support and protection for the exchange membrane 16 asheet 18 of porous polyethylene may be sealingly located by the gaskets on one or both sides of themembrane 16 thepolyethylene sheeting 18 being provided to prevent physical damage to theexchange membrane 16 and also providing support against sag or swelling of the exchange membrane which may occur in use. - The cation exchange membrane is a proprietary item and may be of the type available from Permutit-Body of Brentford, Middlesex, England.
- The
anode 20 is locatable within thesecond chamber 14 and thechamber 14 is capable of being filled with an anolyte solution to at least the same level as that of the catholyte solution in thefirst chamber 10. It may be preferable for the level of the anolyte solution to be above that of the catholyte solution to provide a slight hydrostatic pressure in favour of the anolyte. - The following examples of use of the apparatus will serve to illustrate the invention:-
- The apparatus was used for the electro-deposition of a ternary alloy of lead-antimony-tin to give a coating having a basis of lead and containing between 9.5% and 10.5% by weight of antimony and between 5.5% and 6.5% by weight of tin in the deposited alloy. The anode was a lead-tin anode containing 5% to 25% by weight of tin.
- The cathode comprised a steel backing member on to which was bonded a bronze substrate. It is preferable to electroplate a base coating of cobalt or nickel on to the bronze substrate thereby to give a better surface for the deposition of the required ternary alloy particularly for the prevention of dispersal of tin into the bronze.
- The catholyte solution in the first chamber was as follows:-
-
- The temperature of the catholyte was maintained at 40°C and a cathode current density of 30 amperes per square foot was utilised for approximately 20 minutes to give a deposited alloy thickness of 25 um.
-
- The temperature of the anolyte solution was maintained at 40°C
- In this example identical constructions of anode and cathode were utilised as in the preceding example but the electrolyte solutions were chosen to give a ternary alloy deposit on the cathode of lead-tin-copper having a basis of lead and containing between 8% and 12% of weight of tin and between 2% and 3% by weight of copper in the deposited alloy.
-
- The temperature of the catholyte solution was maintained at 25°C and cathode current density of 20 amperes per square foot was utilised for approximately 20 minutes to give a deposited ternary alloy of 25,um thickness.
- The anolyte solution was identical in all respects with the catholyte solution with the exception that no copper fluoroborate was present in the anolyte.
- In both examples it was found that the anode remained clean and that the plating elements had been lost from the catholyte to the cathode at a controlled rate.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT81304194T ATE10862T1 (en) | 1980-09-23 | 1981-09-14 | PROCESS FOR ELECTROPLATING OF LEAD ALLOYS. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8030638A GB2084191A (en) | 1980-09-23 | 1980-09-23 | Electro-deposition of alloys |
GB8030638 | 1980-09-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0048579A1 EP0048579A1 (en) | 1982-03-31 |
EP0048579B1 true EP0048579B1 (en) | 1984-12-19 |
Family
ID=10516222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP81304194A Expired EP0048579B1 (en) | 1980-09-23 | 1981-09-14 | Method for the electro-deposition of lead alloys |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0048579B1 (en) |
AT (1) | ATE10862T1 (en) |
BR (1) | BR8106041A (en) |
CA (1) | CA1172599A (en) |
DE (1) | DE3167841D1 (en) |
GB (1) | GB2084191A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11859300B2 (en) | 2017-11-01 | 2024-01-02 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3335716A1 (en) * | 1983-10-01 | 1985-05-02 | Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden | SLIDING BEARING AND METHOD FOR THE PRODUCTION THEREOF |
DE3430945A1 (en) * | 1984-08-22 | 1986-03-06 | Miba Gleitlager Ag, Laakirchen | Electrodeposited bearing layer for a sliding bearing |
DE4101386C2 (en) * | 1990-01-19 | 2001-04-12 | Honda Motor Co Ltd | Slider |
CA2069988C (en) * | 1991-05-31 | 1997-03-04 | Yoshikazu Fujisawa | Slide member with surface composed of pyramidal microprojections |
CA2070932C (en) * | 1991-06-11 | 1995-11-07 | Yoshikazu Fujisawa | Slide bearing |
CA2074114C (en) * | 1991-07-18 | 1999-01-19 | Yoshikazu Fujisawa | Slide member |
DE19606993C1 (en) * | 1996-02-24 | 1997-04-03 | Glyco Metall Werke | Prodn. of layered material for friction bearing |
GB2324805A (en) * | 1997-04-30 | 1998-11-04 | Platt Electromeck Limited | Electroplating |
US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
WO2003063067A1 (en) | 2002-01-24 | 2003-07-31 | Chatterbox Systems, Inc. | Method and system for locating positions in printed texts and delivering multimedia information |
US7195702B2 (en) | 2003-06-06 | 2007-03-27 | Taskem, Inc. | Tin alloy electroplating system |
FR2864553B1 (en) * | 2003-12-31 | 2006-09-01 | Coventya | INSTALLATION OF ZINC DEPOSITION OR ZINC ALLOYS |
US20110226613A1 (en) | 2010-03-19 | 2011-09-22 | Robert Rash | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
US9404194B2 (en) * | 2010-12-01 | 2016-08-02 | Novellus Systems, Inc. | Electroplating apparatus and process for wafer level packaging |
US9534308B2 (en) | 2012-06-05 | 2017-01-03 | Novellus Systems, Inc. | Protecting anodes from passivation in alloy plating systems |
CN103849915B (en) * | 2012-12-06 | 2016-08-31 | 北大方正集团有限公司 | Electroplanting device and pcb board via copper coating |
CN105350063B (en) * | 2015-11-09 | 2018-10-30 | 科文特亚环保电镀技术(江苏)有限公司 | A kind of anode system of electroplate liquid separation |
JP6750186B1 (en) * | 2019-11-28 | 2020-09-02 | ユケン工業株式会社 | Method for suppressing increase in zinc concentration of plating solution and method for producing zinc-based plated member |
RU2739899C1 (en) * | 2020-07-27 | 2020-12-29 | Алексей Игоревич Буянов | Acid electrolyte for application of antifriction coating with lead-tin-copper alloy |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB577335A (en) * | 1944-02-10 | 1946-05-14 | Vandervell Products Ltd | Improvements in and relating to bearings and bearing surfaces |
GB628459A (en) * | 1945-07-10 | 1949-08-30 | Cleveland Graphite Bronze Co | Electrodeposition of lead-antimony-tin alloys |
GB679947A (en) * | 1950-06-09 | 1952-09-24 | Cleveland Graphite Bronze Co | Improvements in bearings |
GB741864A (en) * | 1952-06-04 | 1955-12-14 | Silvercrown Ltd | Improvements in the electrodeposition of alloys containing copper and tin |
FR1508573A (en) * | 1967-01-18 | 1968-01-05 | Eugene Arbez Ets | Process for depositing a lead coating on solid plates, in particular with a view to their printing by stamping, as well as the plates conforming to those obtained by the present process or similar process |
JPS6015716B2 (en) * | 1977-10-21 | 1985-04-20 | デイツプソ−ル株式会社 | Method for stabilizing tin or tin alloy electroplating baths |
US4217198A (en) * | 1979-03-23 | 1980-08-12 | Olin Corporation | Coated perfluorosulfonic acid resin membranes and a method for their preparation |
-
1980
- 1980-09-23 GB GB8030638A patent/GB2084191A/en not_active Withdrawn
-
1981
- 1981-09-14 DE DE8181304194T patent/DE3167841D1/en not_active Expired
- 1981-09-14 AT AT81304194T patent/ATE10862T1/en not_active IP Right Cessation
- 1981-09-14 EP EP81304194A patent/EP0048579B1/en not_active Expired
- 1981-09-21 CA CA000386328A patent/CA1172599A/en not_active Expired
- 1981-09-22 BR BR8106041A patent/BR8106041A/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11859300B2 (en) | 2017-11-01 | 2024-01-02 | Lam Research Corporation | Controlling plating electrolyte concentration on an electrochemical plating apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP0048579A1 (en) | 1982-03-31 |
ATE10862T1 (en) | 1985-01-15 |
BR8106041A (en) | 1982-06-08 |
CA1172599A (en) | 1984-08-14 |
DE3167841D1 (en) | 1985-01-31 |
GB2084191A (en) | 1982-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0048579B1 (en) | Method for the electro-deposition of lead alloys | |
EP2976447A1 (en) | Apparatus and method for electrolytic deposition of metal layers on workpieces | |
EP0181229A1 (en) | Cathode | |
EP0110463B1 (en) | A process of electroforming a metal product and electroformed metal product | |
US2313371A (en) | Electrodeposition of tin and its alloys | |
US3730853A (en) | Electroplating bath for depositing tin-lead alloy plates | |
US4414064A (en) | Method for preparing low voltage hydrogen cathodes | |
GB2065171A (en) | Low overvoltage hydrogen cathodes | |
US3150065A (en) | Method for plating palladium | |
CA1146115A (en) | Electrodeposited palladium and method of preparation | |
US4250004A (en) | Process for the preparation of low overvoltage electrodes | |
Reid | Electrodeposition of the platinum-group metals | |
US4478692A (en) | Electrodeposition of palladium-silver alloys | |
US3615281A (en) | Corrosion-resistant chromium-plated articles | |
US5820741A (en) | Passification of zinc surfaces | |
US4662998A (en) | Electrodeposition of refractory metal silicides | |
US4345987A (en) | Coated electrode and a method of its production | |
US4465563A (en) | Electrodeposition of palladium-silver alloys | |
US4297179A (en) | Palladium electroplating bath and process | |
US2734025A (en) | Twatktnw att | |
Reid | Platinum Metal Plating—A Process and Applicational Survey | |
US4923573A (en) | Method for the electro-deposition of a zinc-nickel alloy coating on a steel band | |
EP0328128B1 (en) | Process concerning the adhesion between metallic materials and galvanic aluminium layers and the non-aqueous electrolyte used therein | |
Waterman et al. | Electrodeposition of Alloys | |
Narayan et al. | Chloride baths for Pb Sn alloy deposition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH DE FR GB IT NL |
|
17P | Request for examination filed |
Effective date: 19820928 |
|
ITF | It: translation for a ep patent filed | ||
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH DE FR GB IT LI NL |
|
REF | Corresponds to: |
Ref document number: 10862 Country of ref document: AT Date of ref document: 19850115 Kind code of ref document: T |
|
REF | Corresponds to: |
Ref document number: 3167841 Country of ref document: DE Date of ref document: 19850131 |
|
ET | Fr: translation filed | ||
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
ITTA | It: last paid annual fee | ||
REG | Reference to a national code |
Ref country code: GB Ref legal event code: 732E |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20000807 Year of fee payment: 20 Ref country code: AT Payment date: 20000807 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20000811 Year of fee payment: 20 Ref country code: CH Payment date: 20000811 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20000814 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20000823 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20000908 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PUE Owner name: FEDERAL-MOGUL RPB LIMITED TRANSFER- DANA CORPORATI Ref country code: CH Ref legal event code: PFA Free format text: GKN VANDERVELL LIMITED TRANSFER- FEDERAL-MOGUL RPB LIMITED |
|
BECA | Be: change of holder's address |
Free format text: 20001117 *DANA CORP.:4500 DORR STREET, TOLEDO OHIO 43615 |
|
BECH | Be: change of holder |
Free format text: 20001117 *DANA CORP. |
|
BECN | Be: change of holder's name |
Effective date: 20001117 |
|
BE20 | Be: patent expired |
Free format text: 20010914 *DANA CORP. |
|
NLS | Nl: assignments of ep-patents |
Owner name: DANA CORPORATION |
|
NLT1 | Nl: modifications of names registered in virtue of documents presented to the patent office pursuant to art. 16 a, paragraph 1 |
Owner name: - FEDERAL-MOGUL RPB LIMITED;GLACIER VANDERVELL LIM |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20010913 Ref country code: GB Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20010913 Ref country code: CH Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20010913 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20010914 Ref country code: AT Free format text: LAPSE BECAUSE OF EXPIRATION OF PROTECTION Effective date: 20010914 |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: PE20 Effective date: 20010913 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
NLV7 | Nl: ceased due to reaching the maximum lifetime of a patent |
Effective date: 20010914 |