DE8801970U1 - Contact device - Google Patents

Description

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Martin Bopp, 6086 Riedstadt 1 Contact device

The invention relates to a contact device. In order to test printed circuits which have sockets for integrated circuits, it is often necessary to connect measuring or testing devices to the contacts of a socket instead of an integrated circuit. For this purpose, an adapter is known which, in addition to a contact device suitable for the socket, has sockets into which plugs from measuring cables can be inserted. In a known adapter, the contact device consists of a ceramic carrier with spring-loaded contacts attached to the edges. These adapters are expensive on the one hand and easy to damage on the other.

The object of the present invention is therefore to create a contact device which is inexpensive to manufacture and durable.

The contact device according to the invention is characterized in that conductor tracks are applied to at least one side of an insulating plate, and that several conductor tracks running perpendicular to the plane of the insulating plate are provided on at least one of the edges of the insulating plate.

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Conductor tracks form contact surfaces.

The contact device according to the invention is not only suitable for adapters, but can also advantageously be connected directly to cables so that it forms a plug-in device that fits two IC sockets. In addition, the contact device according to the invention can be manufactured inexpensively using processes for producing printed circuits.

A further development of the invention, which advantageously enables the connection of the contact surfaces to cables or another contact device, consists in the conductor tracks forming the contact surfaces being connected to conductor tracks applied to at least one side of the insulating plate.

An advantageous embodiment of the invention provides that the insulating plate is rectangular and that contact surfaces are provided on at least two opposite edges. This embodiment is particularly suitable for IC sockets in which spring-loaded contacts are arranged on a frame with the contact surfaces facing inwards.

Another development of the invention enables the use of the contact device in IC sockets between the contact springs in that the edges of the insulating plate have recesses between the contact surfaces. The insulating plate preferably consists of a non-brittle active substance.

Another advantageous development of the invention consists in that the contact device forms part of an adapter which has a further contact device. It can be advantageously provided that the size

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the isolator plate and the number and spacing of the contact surfaces are adapted to a socket for integrated solenoids and that the further contact device has sockets for receiving plugs.

An advantageous embodiment of an adapter with a contact device according to the invention consists in that the conductor tracks applied to at least one of the sides of the insulating plate are contacted with conductors running perpendicular to the plane of the contact device, which in turn are connected to connections of the further contact device.

Embodiments of the invention are shown in the drawing using several figures and explained in more detail in the following description. It shows:

Fig. 1 is a first view of an embodiment,

Fig. 2 shows a second view of two exemplary embodiments,

Fig. 3 shows a detail of Fig. 1 on an enlarged scale, and

Fig. 4 shows an adapter provided with a contact device according to the invention.

identical parts are provided with identical reference symbols in the figures *

In the embodiment according to Fig. 1, a substantially square insulating plate 1 is provided, onto which conductor tracks are applied in a known manner. In the edge areas of the

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The conductor tracks 2 are led around the edges of the insulating material plate 1 so that contact surfaces 3 form running along the surface of the insulating material plate 1. In the insulating material plate 1, the conductor tracks 2 are only completely exposed in the area of the insulating material plate, while the further course of the conductor tracks on the surface of the insulating material plate 1 is only shown as an example on a few conductor tracks. The conductor tracks are in

are provided with soldering points 4, which, depending on the 1m

individual intended purpose for connection to another contact device or for connection to cables. The distance and the width of the contact surfaces ■" of the embodiment shown enlarged in Fig. 1. is connected to a socket for integrated circuits of type PLCC

Between the contact surfaces 3 1 the ' insulating plate 1 is provided with recesses 5 into which

The IC socket has two slots between the Contact springs are arranged.

Depending on the requirements in the individual case, the contact surfaces can be connected to conductor tracks on just one side or on both sides of the insulating plate 1. In the view according to Fig. 2a), the contact surfaces

3 on both sides of the insulating plate 1 «1t conductor tracks. The corresponding conductor tracks including the conductor track forming the contact surface 1 is therefore U-shaped. In the embodiment shown in Fig. 2b), the contact surfaces 3 are only connected to conductor tracks on one side of the insulating plate 1«

In the adapter shown in Fig. 4, the solder pads

4 (Fig. 1) vertical conductors 7 are soldered in, which establish the connection with a further contact device β. This consists of an insulating body 9, in which sockets are inserted/ of which only one socket

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10. Each of the sockets 10 is connected to a conductor track or a contact surface (Fig. 2) via a conductor 7. The entirety of the conductors represents a stable connection between the insulating plate 1 and the insulating body 9. The adapter can thus be easily inserted into an IC socket with the required force. In order to establish the connection between the contacts of the IC socket and the connections of a measuring device, it is then only necessary to insert the plugs of the measuring device into the relevant sockets 10 of the adapter.

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Claims (1)

1464 BM Martin Bopp, 6086 Riedstadt 1 Representative 1. Contact device, characterized in that conductor tracks (2) are applied to at least one side of an insulating plate (1), and that on at least one of the edges of the insulating plate (1) a plurality of conductor tracks running perpendicular to the plane of the insulating plate form contact surfaces (3). 2. Contact device according to claim 1, characterized in that the conductor tracks forming the contact surfaces (3) are connected to conductor tracks (2) applied to at least one side of the insulating plate (1). 3. Contact device according to claim 2, characterized in that the insulating plate (1) is rectangular and that contact surfaces (3) are provided on at least two opposite edges. 4. Contact device according to one of the preceding claims, characterized in that the edges of the solar plate (1) between the contact surfaces (3) widen recesses (5). Il Il Il I Il till I« I Il Il III· · « * · ·' ·· »111·- «&igr; > ■ 1464 BN2 5. Contact device according to one of the preceding claims, characterized in that the insulating plate (1) consists of a non-brittle material. 6. Contact device according to one of the preceding Claims, characterized in that the Contact device forms part of an adapter which a further contact device (8). 7. Contact device according to claim 6, characterized in that the size of the insulating plate (1) and the number and the distance between the contact surfaces (3) are adapted to a socket for integrated circuits and that the further contact device (8) has sockets (10) for accommodating plugs. 8 Contact device according to claim 7, characterized in that the conductor tracks (2) applied to at least one of the sides of the insulating plate (1) are contacted with conductors (7) running perpendicular to the plane of the contact device, which in turn are connected to connections of the further contact device (8). 1 » I I I · V III It« : "S &iacgr;&iacgr;&iacgr;