DE69314070D1 - Verfahren zur Entfernung Zinn oder Zinn-Bleilegierungen von Kupferoberflächen - Google Patents
Verfahren zur Entfernung Zinn oder Zinn-Bleilegierungen von KupferoberflächenInfo
- Publication number
- DE69314070D1 DE69314070D1 DE69314070T DE69314070T DE69314070D1 DE 69314070 D1 DE69314070 D1 DE 69314070D1 DE 69314070 T DE69314070 T DE 69314070T DE 69314070 T DE69314070 T DE 69314070T DE 69314070 D1 DE69314070 D1 DE 69314070D1
- Authority
- DE
- Germany
- Prior art keywords
- tin
- copper surfaces
- lead alloys
- removing tin
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84651292A | 1992-03-04 | 1992-03-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69314070D1 true DE69314070D1 (de) | 1997-10-30 |
DE69314070T2 DE69314070T2 (de) | 1998-02-26 |
Family
ID=25298142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993614070 Expired - Lifetime DE69314070T2 (de) | 1992-03-04 | 1993-02-25 | Verfahren zur Entfernung Zinn oder Zinn-Bleilegierungen von Kupferoberflächen |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0559379B1 (de) |
JP (1) | JPH0610162A (de) |
CA (1) | CA2090349C (de) |
DE (1) | DE69314070T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1072682A (ja) * | 1996-08-30 | 1998-03-17 | Mec Kk | 錫および錫合金の剥離液 |
US6258294B1 (en) * | 1997-10-01 | 2001-07-10 | Morton International, Inc. | Composition for stripping solder and tin from printed circuit boards |
KR100543639B1 (ko) * | 1998-03-13 | 2006-04-12 | (주)네오팜 | 2-분지쇄-3-히드록시지방산 및 그 염의 제조방법 |
JP2009014525A (ja) * | 2007-07-05 | 2009-01-22 | Yazaki Corp | スズまたはスズ合金めっき層中の水銀定量分析方法 |
JP5481179B2 (ja) * | 2009-12-15 | 2014-04-23 | Dowaメタルテック株式会社 | Cu系材料のSnめっき層の剥離方法 |
CN101962776B (zh) * | 2010-09-01 | 2012-10-31 | 济南德锡科技有限公司 | 退锡剂及其制备方法 |
CN109652828B (zh) * | 2019-02-26 | 2020-05-05 | 中南大学 | 一种pcb板镀锡-退锡体系及应用方法 |
CN112410792B (zh) * | 2019-10-08 | 2023-03-31 | 叶涛 | 一种pcb无铁硝酸型退锡水及其再生回用方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES427394A1 (es) * | 1973-06-18 | 1977-02-01 | Oxy Metal Industries Corp | Mejoras introducidas en un metodo de decapado de depositos de niquel acumulados en los dispositivos de metalizado y si-milares. |
US4302246A (en) * | 1980-01-03 | 1981-11-24 | Enthone, Incorporated | Solution and method for selectively stripping alloys containing nickel with gold, phosphorous or chromium from stainless steel and related nickel base alloys |
US4339282A (en) * | 1981-06-03 | 1982-07-13 | United Technologies Corporation | Method and composition for removing aluminide coatings from nickel superalloys |
JPS5858280A (ja) * | 1981-09-30 | 1983-04-06 | Metsuku Kk | 錫又は錫合金の剥離液 |
US4425185A (en) * | 1982-03-18 | 1984-01-10 | United Technologies Corporation | Method and composition for removing nickel aluminide coatings from nickel superalloys |
US4713144A (en) * | 1986-08-01 | 1987-12-15 | Ardrox Inc. | Composition and method for stripping films from printed circuit boards |
DE3738307A1 (de) * | 1987-11-11 | 1989-05-24 | Ruwel Werke Gmbh | Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen |
GB8829253D0 (en) * | 1988-12-15 | 1989-01-25 | Imasa Ltd | Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein |
JPH0375386A (ja) * | 1989-08-18 | 1991-03-29 | Metsuku Kk | 錫又は錫‐鉛合金の剥離方法 |
-
1993
- 1993-02-25 DE DE1993614070 patent/DE69314070T2/de not_active Expired - Lifetime
- 1993-02-25 EP EP93301422A patent/EP0559379B1/de not_active Expired - Lifetime
- 1993-02-25 CA CA 2090349 patent/CA2090349C/en not_active Expired - Fee Related
- 1993-03-03 JP JP8102993A patent/JPH0610162A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CA2090349C (en) | 1999-08-17 |
CA2090349A1 (en) | 1993-09-05 |
EP0559379A1 (de) | 1993-09-08 |
JPH0610162A (ja) | 1994-01-18 |
DE69314070T2 (de) | 1998-02-26 |
EP0559379B1 (de) | 1997-09-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69516741D1 (de) | Verfahren zum Mikroätzen von Kupfer- oder Kupferlegierungsoberflächen | |
DE59402178D1 (de) | Verfahren zum Durchplattieren von Leiterfolien | |
DE19681602T1 (de) | Verfahren zum Entfernen von Metall | |
DE68926622D1 (de) | Inhibierte zusammensetzung und ein verfahren zum abziehen von zinn, blei oder zinn-blei legierung von kupferflachen | |
DE69325218D1 (de) | Verfahren zum wiederentbindbaren metallischen Verbinden | |
DE69219645D1 (de) | Verfahren zur stromlosen Plattierung von Zinn, Blei oder Zinn-Blei-Legierung | |
DE69311252D1 (de) | Verfahren zum Biegen von metallischen Rohren | |
DE69410329D1 (de) | Verfahren zur Entfernung von Korrosionsmetallverunreinigungen aus flüssigen Zusammensetzungen | |
ZA873843B (en) | Process for stripping tin or tin-lead alloy from copper | |
DE69014789D1 (de) | Zusammensetzung und verfahren zur entfernung von zinn oder zinn-bleilegierungen von kupferflächen. | |
EP0413261A3 (en) | Process for removing tin and tin-lead alloy from copper substrates | |
DE3873409D1 (de) | Verfahren zum korrosionsschutz von kupfer. | |
FI960086A (fi) | Menetelmä metalli-ionien poistamiseksi nesteistä | |
DE69211850D1 (de) | Verfahren zum löten | |
DE69403912D1 (de) | Verfahren zur deaktivierung von übergangsmetallkatalysatoren | |
DE69215019D1 (de) | Verfahren zur Beseitigung von Überzügen von korrosions- oder beschädigungsfähigen Metallsubstraten | |
DE69430541D1 (de) | Verfahren zum raffinieren von metall | |
DE69314070D1 (de) | Verfahren zur Entfernung Zinn oder Zinn-Bleilegierungen von Kupferoberflächen | |
DE69203655D1 (de) | Verfahren zum Schweissen von Kupferteilen. | |
DE69110620D1 (de) | Verfahren zur Korrosionsverhinderung von Aluminiumlegierungen. | |
DE69319496D1 (de) | Verfahren zur Rückgewinnung von verbrauchtem Rhenium | |
DE69322994D1 (de) | Verfahren zum Löten | |
DE69226040D1 (de) | Verfahren zum Schweissen von Aluminiumlegierungen | |
DE69327486D1 (de) | Verfahren zum Extrahieren von Metallen | |
DE3771638D1 (de) | Verfahren zur abtrennung von metall. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R071 | Expiry of right |
Ref document number: 559379 Country of ref document: EP |