DE69311024D1 - Verbinder - Google Patents
VerbinderInfo
- Publication number
- DE69311024D1 DE69311024D1 DE69311024T DE69311024T DE69311024D1 DE 69311024 D1 DE69311024 D1 DE 69311024D1 DE 69311024 T DE69311024 T DE 69311024T DE 69311024 T DE69311024 T DE 69311024T DE 69311024 D1 DE69311024 D1 DE 69311024D1
- Authority
- DE
- Germany
- Prior art keywords
- interconnects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/305—Polyamides or polyesteramides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/42—Securing in a demountable manner
- H01R13/422—Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means
- H01R13/4223—Securing in resilient one-piece base or case, e.g. by friction; One-piece base or case formed with resilient locking means comprising integral flexible contact retaining fingers
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22145892 | 1992-08-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69311024D1 true DE69311024D1 (de) | 1997-07-03 |
DE69311024T2 DE69311024T2 (de) | 1997-09-04 |
Family
ID=16767043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993611024 Expired - Fee Related DE69311024T2 (de) | 1992-08-20 | 1993-08-18 | Verbinder |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0583782B1 (de) |
DE (1) | DE69311024T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5852165A (en) * | 1994-05-31 | 1998-12-22 | Ube Industries, Ltd. | Terpolymer polyamide, polyamide resin composition containing the same, and automotive parts obtaining from these |
JP3476037B2 (ja) * | 1995-04-21 | 2003-12-10 | 矢崎総業株式会社 | ポリアミド樹脂組成物 |
US5754643A (en) * | 1995-10-02 | 1998-05-19 | Lucent Technologies Inc. | Weatherable outside electronic device enclosure |
JP5588660B2 (ja) | 2009-11-24 | 2014-09-10 | 矢崎総業株式会社 | 難燃性樹脂組成物 |
CN109593352A (zh) * | 2018-11-13 | 2019-04-09 | 惠州市沃特新材料有限公司 | 超低吸水耐寒耐磨尼龙复合材料及其制备方法和应用 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2682921B2 (ja) * | 1990-11-30 | 1997-11-26 | 三井石油化学工業株式会社 | 熱可塑性樹脂組成物 |
JP2793458B2 (ja) * | 1992-03-19 | 1998-09-03 | 三井化学株式会社 | コネクター用ポリアミド系樹脂組成物およびコネクター |
-
1993
- 1993-08-18 DE DE1993611024 patent/DE69311024T2/de not_active Expired - Fee Related
- 1993-08-18 EP EP19930113236 patent/EP0583782B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0583782B1 (de) | 1997-05-28 |
DE69311024T2 (de) | 1997-09-04 |
EP0583782A1 (de) | 1994-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |