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DE69932496D1 - Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung - Google Patents

Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung

Info

Publication number
DE69932496D1
DE69932496D1 DE69932496T DE69932496T DE69932496D1 DE 69932496 D1 DE69932496 D1 DE 69932496D1 DE 69932496 T DE69932496 T DE 69932496T DE 69932496 T DE69932496 T DE 69932496T DE 69932496 D1 DE69932496 D1 DE 69932496D1
Authority
DE
Germany
Prior art keywords
adjustable
support plate
mechanical polishing
chemical mechanical
polishing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69932496T
Other languages
English (en)
Other versions
DE69932496T2 (de
Inventor
Steven M Zuniga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE69932496D1 publication Critical patent/DE69932496D1/de
Application granted granted Critical
Publication of DE69932496T2 publication Critical patent/DE69932496T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69932496T 1998-12-30 1999-12-30 Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung Expired - Lifetime DE69932496T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US114182 1980-01-22
US11418298P 1998-12-30 1998-12-30
US09/470,820 US6422927B1 (en) 1998-12-30 1999-12-23 Carrier head with controllable pressure and loading area for chemical mechanical polishing
US470820 1999-12-23

Publications (2)

Publication Number Publication Date
DE69932496D1 true DE69932496D1 (de) 2006-09-07
DE69932496T2 DE69932496T2 (de) 2007-02-01

Family

ID=26811889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69932496T Expired - Lifetime DE69932496T2 (de) 1998-12-30 1999-12-30 Trägerplatte mit einstellbarem Druck und einstellbarer Oberfläche für eine chemisch-mechanische Poliervorrichtung

Country Status (3)

Country Link
US (3) US6422927B1 (de)
EP (1) EP1029633B1 (de)
DE (1) DE69932496T2 (de)

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US6506105B1 (en) 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
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US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
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US7608173B2 (en) * 2004-12-02 2009-10-27 Applied Materials, Inc. Biased retaining ring
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US20070082479A1 (en) * 2005-10-06 2007-04-12 Applied Materials, Inc. Chemical mechanical polishing techniques for integrated circuit fabrication
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JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US10160093B2 (en) * 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
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CN111266993B (zh) * 2018-12-05 2023-06-30 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
KR20210126097A (ko) 2019-02-14 2021-10-19 액서스 테크놀로지, 엘엘씨 기판 캐리어 헤드 및 프로세싱 시스템
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CN113874164B (zh) 2019-05-29 2024-09-03 应用材料公司 用于化学机械研磨系统的蒸气处理站
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US11541506B2 (en) * 2019-09-27 2023-01-03 Systems On Silicon Manufacturing Company Pte Ltd Chemical mechanical polishing (CMP) polishing head with improved vacuum sealing
CN115103738A (zh) 2020-06-29 2022-09-23 应用材料公司 Cmp中的温度和浆体流动速率控制
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Also Published As

Publication number Publication date
US20020151251A1 (en) 2002-10-17
EP1029633A1 (de) 2000-08-23
US20020061720A1 (en) 2002-05-23
EP1029633B1 (de) 2006-07-26
US6645044B2 (en) 2003-11-11
US6422927B1 (en) 2002-07-23
US6872122B2 (en) 2005-03-29
US20040067719A1 (en) 2004-04-08
DE69932496T2 (de) 2007-02-01

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