DE69805191D1 - Bleifreies zinnlot - Google Patents

Bleifreies zinnlot

Info

Publication number: DE69805191D1
Authority: DE; Germany
Prior art keywords: lead; tin solder; free tin; free; solder
Prior art date: 1997-01-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69805191T

Other languages

English (en)

Other versions

DE69805191T2 (de

Inventor

Adrianus Oud

Roger Bilham

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Fernox Ltd

Original Assignee

Alpha Fry Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-01-29

Filing date

1998-01-28

Publication date

2002-06-06

1998-01-28 Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd

2002-06-06 Publication of DE69805191D1 publication Critical patent/DE69805191D1/de

2002-10-02 Application granted granted Critical

2002-10-02 Publication of DE69805191T2 publication Critical patent/DE69805191T2/de

2018-01-29 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Conductive Materials (AREA)
Battery Electrode And Active Subsutance (AREA)

DE69805191T 1997-01-29 1998-01-28 Bleifreies zinnlot Expired - Lifetime DE69805191T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
GBGB9701819.6A GB9701819D0 (en)	1997-01-29	1997-01-29	Lead-free tin alloy
PCT/GB1998/000254 WO1998032886A1 (en)	1997-01-29	1998-01-28	Lead-free tin alloy

Publications (2)

Publication Number	Publication Date
DE69805191D1 true DE69805191D1 (de)	2002-06-06
DE69805191T2 DE69805191T2 (de)	2002-10-02

Family

ID=10806765

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69805191T Expired - Lifetime DE69805191T2 (de)	1997-01-29	1998-01-28	Bleifreies zinnlot

Country Status (17)

Country	Link
US (1)	US6086687A (de)
EP (1)	EP1012354B1 (de)
JP (1)	JP2001513703A (de)
KR (1)	KR20000070612A (de)
CN (1)	CN1244897A (de)
AU (1)	AU5773898A (de)
BR (1)	BR9807023A (de)
CA (1)	CA2278143A1 (de)
DE (1)	DE69805191T2 (de)
GB (1)	GB9701819D0 (de)
HU (1)	HUP0000872A3 (de)
ID (1)	ID22420A (de)
IL (1)	IL130873A0 (de)
NZ (1)	NZ336586A (de)
PL (1)	PL334729A1 (de)
WO (1)	WO1998032886A1 (de)
ZA (1)	ZA98703B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA2214130C (en) *	1996-09-19	2003-12-02	Northern Telecom Limited	Assemblies of substrates and electronic components
US6503338B1 (en) *	2000-04-28	2003-01-07	Senju Metal Industry Co., Ltd.	Lead-free solder alloys
EP1189252A1 (de) *	2000-09-13	2002-03-20	Siemens Aktiengesellschaft	Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
JP4293500B2 (ja) *	2001-05-07	2009-07-08	第一電子工業株式会社	電子部品の製造方法
US6805974B2 (en)	2002-02-15	2004-10-19	International Business Machines Corporation	Lead-free tin-silver-copper alloy solder composition
SG107581A1 (en) *	2002-03-26	2004-12-29	Inst Of High Performance Compu	Lead free tin based solder composition
US6840434B2 (en) *	2002-04-09	2005-01-11	Ford Motor Company	Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US6649833B1 (en)	2002-08-09	2003-11-18	International Business Machines Corporation	Negative volume expansion lead-free electrical connection
GB0302230D0 (en) *	2003-01-30	2003-03-05	Pilkington Plc	Vehicular glazing panel
GB0605884D0 (en)	2006-03-24	2006-05-03	Pilkington Plc	Electrical connector
GB0605883D0 (en) *	2006-03-24	2006-05-03	Pilkington Plc	Electrical connector
DE102006047764A1 (de) *	2006-10-06	2008-04-10	W.C. Heraeus Gmbh	Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
US20080225490A1 (en) *	2007-03-15	2008-09-18	Daewoong Suh	Thermal interface materials
KR100876646B1 (ko) *	2007-04-27	2009-01-09	한국과학기술원	취성파괴 방지를 위한 무전해 ＮｉＸＰ로 표면처리된전자부품의 접합 방법
ES2330713B2 (es) *	2008-06-11	2010-04-19	Abinash Banerji	Afinador de grano de base aluminio.
DE102013206934A1 (de) *	2013-04-17	2014-10-23	Verein zur Förderung von Innovationen durch Forschung, Entwicklung und Technologietransfer e.V. (Verein INNOVENT e.V.)	Verfahren zur Metallisierung eines Substrats
US10195698B2 (en)	2015-09-03	2019-02-05	AIM Metals & Alloys Inc.	Lead-free high reliability solder alloys
CN112342417B (zh) *	2020-11-17	2022-03-15	昆明理工大学	一种锡基焊料及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2713196C3 (de) *	1977-03-25	1979-11-15	Vereinigte Zinkwerke Gmbh, 5190 Stolberg	Zinnlegierung für Zinngerät sowie Verfahren zur Herstellung der Legierung
JPS56165588A (en) *	1980-05-26	1981-12-19	Aoki Metal:Kk	High temperature solder for copper tube joining
JPS5730598A (en) *	1980-07-31	1982-02-18	Ebara Corp	Method and apparatus for aeration
DE3135847C2 (de) *	1981-09-10	1983-11-03	Eerste Nederlandse Witmetaalfabriek B.V., Naarden	Vorlegierung zur Herstellung feinkörniger Zinnlegierungen
DE3147226A1 (de) *	1981-11-28	1983-06-09	Vereinigte Zinkwerke Gmbh, 5190 Stolberg	Legierung zum impfen zinnhaltiger gleitlagerlegierungen
GB8324353D0 (en) *	1983-09-12	1983-10-12	Darchem Ltd	Materials
GB2171720A (en) *	1985-02-21	1986-09-03	London Scandinavian Metall	Grain refining a solder alloy
JP2667691B2 (ja) *	1988-12-29	1997-10-27	株式会社徳力本店	低融点Ａｇはんだ
US5019336A (en) *	1989-03-13	1991-05-28	Allied-Signal Inc.	Micro-additions to tin alloys
JP2950478B2 (ja) *	1990-04-19	1999-09-20	大豊工業株式会社	滑り軸受合金
EP0612578A1 (de) *	1993-02-22	1994-08-31	AT&T Corp.	Gegenstand, der ein bleifreies Weichlot mit verbesserten mechanischen Eigenschaften enthält
JPH0825050B2 (ja) *	1993-06-08	1996-03-13	日本アルミット株式会社	無含鉛半田合金
NL9401339A (nl) *	1994-08-18	1996-04-01	Billiton Witmetaal	Legering voor een glijlager of dergelijke, en een lager op basis van een zodanige legering.
JP2805595B2 (ja) *	1994-11-02	1998-09-30	三井金属鉱業株式会社	鉛無含有半田合金
DE4443459C2 (de) *	1994-12-07	1996-11-21	Wieland Werke Ag	Bleifreies Weichlot und seine Verwendung

1997
- 1997-01-29 GB GBGB9701819.6A patent/GB9701819D0/en active Pending
1998
- 1998-01-28 KR KR1019997006860A patent/KR20000070612A/ko not_active Application Discontinuation
- 1998-01-28 ZA ZA98703A patent/ZA98703B/xx unknown
- 1998-01-28 BR BR9807023-1A patent/BR9807023A/pt not_active Application Discontinuation
- 1998-01-28 HU HU0000872A patent/HUP0000872A3/hu unknown
- 1998-01-28 JP JP53175798A patent/JP2001513703A/ja not_active Ceased
- 1998-01-28 CA CA002278143A patent/CA2278143A1/en not_active Abandoned
- 1998-01-28 US US09/014,754 patent/US6086687A/en not_active Expired - Lifetime
- 1998-01-28 NZ NZ336586A patent/NZ336586A/xx unknown
- 1998-01-28 IL IL13087398A patent/IL130873A0/xx unknown
- 1998-01-28 DE DE69805191T patent/DE69805191T2/de not_active Expired - Lifetime
- 1998-01-28 PL PL98334729A patent/PL334729A1/xx unknown
- 1998-01-28 AU AU57738/98A patent/AU5773898A/en not_active Abandoned
- 1998-01-28 WO PCT/GB1998/000254 patent/WO1998032886A1/en not_active Application Discontinuation
- 1998-01-28 CN CN98802097A patent/CN1244897A/zh active Pending
- 1998-01-28 EP EP98901406A patent/EP1012354B1/de not_active Expired - Lifetime
- 1998-01-28 ID IDW990739A patent/ID22420A/id unknown

Also Published As

Publication number	Publication date
PL334729A1 (en)	2000-03-13
JP2001513703A (ja)	2001-09-04
KR20000070612A (ko)	2000-11-25
HUP0000872A3 (en)	2001-03-28
BR9807023A (pt)	2000-03-14
AU5773898A (en)	1998-08-18
ZA98703B (en)	1998-07-28
HUP0000872A2 (en)	2000-07-28
WO1998032886A1 (en)	1998-07-30
NZ336586A (en)	2000-04-28
EP1012354A1 (de)	2000-06-28
IL130873A0 (en)	2001-01-28
GB9701819D0 (en)	1997-03-19
US6086687A (en)	2000-07-11
CA2278143A1 (en)	1998-07-30
CN1244897A (zh)	2000-02-16
EP1012354B1 (de)	2002-05-02
ID22420A (id)	1999-10-14
DE69805191T2 (de)	2002-10-02

Publication	Publication Date	Title
AU6055098A (en)	1998-08-26	Lead-free solder
DE69706507D1 (de)	2001-10-11	Bleifreie Weichlotzusammensetzung
DE69431001D1 (de)	2002-08-22	Lötpaste
EP0855242A4 (de)	1998-12-02	Bleifreies lot
DE59706801D1 (de)	2002-05-02	Löt-/entlötvorrichtung
DE69418532D1 (de)	1999-06-24	Bleifreies, Zinn-Antimon-Wismut-Kupfer-Weichlot
DE69918758D1 (de)	2004-08-26	Bleifreies lot
DE69523862D1 (de)	2001-12-20	Bleifreies Weichlot
DE69805191D1 (de)	2002-06-06	Bleifreies zinnlot
DE69731627D1 (de)	2004-12-23	Reflow-lötvorrichtung
DE69418096D1 (de)	1999-06-02	Bleifreie Zinn-Wismut Weichlotlegierungen
IL132555A0 (en)	2001-03-19	Lead-free solder
DE19750586B4 (de)	2007-05-16	Laser-Lötverfahren
SG98429A1 (en)	2003-09-19	Lead-free solders
DE69509299D1 (de)	1999-06-02	Hartlotlegierungspaste
DE69721117D1 (de)	2003-05-28	Lötverfahren
FI960630A (fi)	1996-02-12	Erittäin luja juotoslejeerinki
DE59802213D1 (de)	2002-01-10	Bleifreie Glaszusammensetzungen mit niedrigem Schmelzpunkt
DE59807301D1 (de)	2003-04-03	Leichtmetallbauteil
HUP0004090A3 (en)	2002-01-28	Soldering device
TR27562A (tr)	1995-06-08	Lehim pastasi.
DE69719304D1 (de)	2003-04-03	Bauteilzuführer
DE69812798T2 (de)	2004-01-29	Metallschmelzverfahren
DE69832034D1 (de)	2005-12-01	Lötpaste
DE69713693D1 (de)	2002-08-08	Lotnivellierer

Legal Events

Date	Code	Title	Description
2003-05-28	8364	No opposition during term of opposition