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DE602004017035D1 - Abgedichtetes Gehäuse, Dichtung und Verfahren zur Montage und Demontage des abgedichteten Gehäuses - Google Patents

Abgedichtetes Gehäuse, Dichtung und Verfahren zur Montage und Demontage des abgedichteten Gehäuses

Info

Publication number
DE602004017035D1
DE602004017035D1 DE602004017035T DE602004017035T DE602004017035D1 DE 602004017035 D1 DE602004017035 D1 DE 602004017035D1 DE 602004017035 T DE602004017035 T DE 602004017035T DE 602004017035 T DE602004017035 T DE 602004017035T DE 602004017035 D1 DE602004017035 D1 DE 602004017035D1
Authority
DE
Germany
Prior art keywords
sealed housing
parts
light
chassis
dismounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004017035T
Other languages
English (en)
Inventor
Peter Eestlander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Mobile Communications AB
Original Assignee
Sony Ericsson Mobile Communications AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Ericsson Mobile Communications AB filed Critical Sony Ericsson Mobile Communications AB
Publication of DE602004017035D1 publication Critical patent/DE602004017035D1/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • External Artificial Organs (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE602004017035T 2004-12-30 2004-12-30 Abgedichtetes Gehäuse, Dichtung und Verfahren zur Montage und Demontage des abgedichteten Gehäuses Active DE602004017035D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04388097A EP1677587B1 (de) 2004-12-30 2004-12-30 Abgedichtetes Gehäuse, Dichtung und Verfahren zur Montage und Demontage des abgedichteten Gehäuses

Publications (1)

Publication Number Publication Date
DE602004017035D1 true DE602004017035D1 (de) 2008-11-20

Family

ID=34931977

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004017035T Active DE602004017035D1 (de) 2004-12-30 2004-12-30 Abgedichtetes Gehäuse, Dichtung und Verfahren zur Montage und Demontage des abgedichteten Gehäuses

Country Status (10)

Country Link
US (1) US8033418B2 (de)
EP (1) EP1677587B1 (de)
JP (1) JP4456156B2 (de)
CN (1) CN101095383B (de)
AT (1) ATE410913T1 (de)
BR (1) BRPI0519416A2 (de)
DE (1) DE602004017035D1 (de)
MX (1) MX2007007848A (de)
RU (1) RU2374795C2 (de)
WO (1) WO2006069666A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101489365B (zh) * 2008-01-18 2011-12-28 台扬科技股份有限公司 高频通讯装置及其防水结构和防水结构的制作方法
WO2010113535A1 (ja) * 2009-04-02 2010-10-07 株式会社ソニー・コンピュータエンタテインメント 電子機器
US8064194B2 (en) * 2009-06-16 2011-11-22 Western Digital Technologies, Inc. Mechanically decoupled status lens
US20120261066A1 (en) * 2011-04-15 2012-10-18 Covidien Ag Sealed Device and Method of Sealing
NO20111299A1 (no) * 2011-09-23 2012-10-08 Berge Solutions As Kapsling beregnet på å beskytte ømfintlig utstyr
US8403136B1 (en) * 2012-04-16 2013-03-26 Aaeon Technology Inc. Waterproof, shockproof container for handheld electronic device
US8867198B2 (en) * 2012-06-04 2014-10-21 William Steele Protective case for a tablet computer
US9164559B2 (en) * 2013-11-14 2015-10-20 Novasolix, Inc. Low power semi-reflective display
US10908651B2 (en) 2015-09-18 2021-02-02 Toray Industries, Inc. Electronic device housing
US9939006B2 (en) * 2015-10-14 2018-04-10 The Boeing Company Sealing system for fasteners
CN106679190A (zh) * 2017-02-07 2017-05-17 广东万家乐燃气具有限公司 一种新型电热水器防水遥控设备
CN109373109A (zh) * 2018-12-10 2019-02-22 广西玉柴机器股份有限公司 飞轮壳储胶槽结构
JPWO2020230508A1 (de) * 2019-05-16 2020-11-19
US11772546B2 (en) * 2021-11-18 2023-10-03 Valeo North America, Inc. Edge lighting for a continuous illumination appearance
WO2024180761A1 (ja) * 2023-03-02 2024-09-06 三菱電機株式会社 接着部材、接着構造物、接着構造物の製造方法、および接着構造物の解離方法
US12078316B1 (en) 2023-10-06 2024-09-03 Valeo Vision Window for gap lighting
US12129986B1 (en) 2023-10-06 2024-10-29 Valeo Vision Closeout with flexible light guide for gap lighting

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2115084A (en) * 1981-12-23 1983-09-01 Plessey Co Plc A method of sealing a joint
JPH0258398A (ja) * 1988-08-24 1990-02-27 Matsushita Electric Works Ltd オートメパーツ用パツケージ
JPH0411679A (ja) * 1990-04-27 1992-01-16 Sekisui Chem Co Ltd 熱硬化性被覆用シートの製造方法
JPH06318790A (ja) * 1993-05-06 1994-11-15 Nippondenso Co Ltd ケース
US5590787A (en) * 1995-01-04 1997-01-07 Micron Technology, Inc. UV light sensitive die-pac for securing semiconductor dies during transport
US6635354B2 (en) * 1995-01-20 2003-10-21 Parker-Hannifin Corporation Form-in place EMI gaskets
DE19516708B4 (de) * 1995-05-06 2007-07-05 Robert Bosch Gmbh Flexible Dichtung und ein Verfahren zu deren Herstellung
PT1054316E (pt) * 1999-05-15 2007-01-31 Scheidt & Bachmann Gmbh Dispositivo para a protecção de circuitos electrónicos contra acesso não autorizados
US6407925B1 (en) * 1999-09-17 2002-06-18 Denso Corporation Casing for electronic control devices
JP2002251769A (ja) * 2001-02-26 2002-09-06 Asahi Optical Co Ltd 光記録用レンズ組立体及びその製造方法
DE10232947A1 (de) * 2002-07-19 2004-01-29 Siemens Ag Behältnis, insbesondere Gehäuse für ein Telefonmobilteil sowie Verfahren zur Herstellung eines Gehäuseteils
US6852924B2 (en) * 2002-07-30 2005-02-08 Lsi Logic Corporation EMI sealed removable latching cover
KR100720626B1 (ko) * 2003-02-17 2007-05-21 샤프 가부시키가이샤 평면 표시 장치용 섀시, 평면 표시 장치, 액정 표시 장치및 평면 표시 장치용 섀시 유닛
RU2248023C2 (ru) 2003-04-08 2005-03-10 Российская Федерация в лице Министерства Российской Федерации по атомной энергии-Минатом РФ Световод

Also Published As

Publication number Publication date
US8033418B2 (en) 2011-10-11
WO2006069666A1 (en) 2006-07-06
RU2374795C2 (ru) 2009-11-27
BRPI0519416A2 (pt) 2009-01-20
CN101095383B (zh) 2012-03-28
JP2008527686A (ja) 2008-07-24
US20080264956A1 (en) 2008-10-30
JP4456156B2 (ja) 2010-04-28
ATE410913T1 (de) 2008-10-15
RU2007128922A (ru) 2009-02-10
CN101095383A (zh) 2007-12-26
MX2007007848A (es) 2007-08-15
EP1677587B1 (de) 2008-10-08
EP1677587A1 (de) 2006-07-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PATENT- UND RECHTSANWAELTE KRAUS & WEISERT, 80539