DE212014000251U1 - Module set used in an integrated circuit or a photoelectric element for both heat conduction and heat dissipation - Google Patents

Abstract

A thermal conduction and dissipation module for an integrated circuit or an optoelectronic device, comprising: a block; a heat conducting device; and a heat sink having a through-hole and a through-groove connected to the through-hole, wherein the heat-conducting device is prepositioned inside the through-hole, and the block is then inserted into the through-hole so that the heat-conducting device communicates with both the heat-dissipation device and the block is firmly engaged.

Description

TECHNICAL AREA

The present invention relates to heat conduction and heat dissipation modules for use in integrated circuits or optoelectronic devices and, more particularly, to combined heat conduction and dissipation modules.

BACKGROUND

Driven by technology and new materials, semiconductor IC, optoelectronics, and similar devices being manufactured today are increasingly powerful and miniaturized. However, this is accompanied by their considerable heat generation, which can directly affect the performance and the operating time of such devices. Therefore, thermal management is currently the main concern for the development of the electronics industry.

Heat sinks that use heat pipes are currently the common means of heat dissipation and heat dissipation. Such an architecture basically comprises a heat pipe and a heat sink and realizes heat removal and dissipation by placing one end of the heat pipe in direct or indirect contact with a semiconductor IC or optoelectronic device, such that heat generated by the device is picked up by a working fluid and capillary features provided within the heat pipe and quickly transferred to the heat sink. In the current heat management area, this mechanism is mainly used.

However, voids under the existing arrangement conditions tend to remain between the heat pipe and the heat sink, which can lead to thermal resistance between the heat pipe and the heat sink, significantly deteriorating the heat conduction and dissipation. To solve this problem, existing methods include applying, on the pipe exterior surface, a thermally conductive material, such as heat conductive adhesive, to fill in the gaps created by the heat pipe and heat sink during assembly.

In the prior art, there have been many patents pertaining to heat pipes. The Chinese-Taiwanese Patent No. 1315231 , published October 1, 2009, serves as an illustrative example describing a method of joining a heat sink and a heat pipe and a resulting structure having improved thermal conduction properties. The structure essentially comprises the heat sink and the heat pipe, the heat sink having at its center a groove for inserting the heat pipe through the groove and a number of outwardly extending slots having first ends surrounding the circumference of the groove are arranged. The second ends of the slots are each connected to a through hole. The perimeter of the groove can be widened by inserting a chuck into the slots so that the groove becomes diametrically larger than the heat pipe. After the heat pipe is inserted within the groove, the chuck can be removed, allowing a better fit of an inner surface of the groove with an outer surface of the heat pipe, resulting in good heat conduction between the heat pipe and the heat sink.

However, for this prior art method, an extension of the circumference of the groove by means of the tensioner so as to increase the circumference of the groove beyond the circumference of the diameter of the heat pipe to allow the heat pipe to be inserted into the groove , likely to rupture of the heat sink or to elastic fatigue of its material. Moreover, it would be impossible for the heat sink material to withstand the forces exerted by the chuck for a long period of time. Moreover, the slit spaces remaining after the removal of the chuck cause a reduction in the space for heat conduction, and thus reduce the heat dissipation efficiency.

BRIEF SUMMARY OF THE INVENTION

To solve the problems of the prior art, the present invention provides a module for heat conduction and dissipation for an integrated circuit or an optoelectronic device comprising a block, a heat conducting device and a heat sink. The heat dissipation device has a through-hole and a through-groove connected to the through-hole. In use, the thermal conduction device is prepositioned within the throughbore and the block is then inserted into the throughbore such that the thermal conduction device is firmly engaged with both the heat sink and the block, thus optimizing the heat dissipation efficiency.

Furthermore, the heat conducting device may have a flat end, wherein the heat dissipation device has a first flattened end and the block has a second flattened end. In an assembled configuration of the module, the first end of the heat conducting device, the first flattened end of the Heat dissipation device and the second flattened end of the block together form a common plane on which a heat generating device may be arranged for heat dissipation. The heat generating device may be a light emitting diode (LED) device, a solar cell device, a semiconductor device, or any other electronic device that will generate heat when turned on.

Further, the heat conducting device may be a heat pipe, a heating column or a steam chamber having a vertical thickness. The block can be made of the same material as the heat dissipation device.

Compared with the prior art, the heat conduction and dissipation module according to the present invention enables more efficient heat dissipation by forced crimping of the block, which allows the heat conduction device to be fixed within and in tight engagement with the heat dissipation device. As such, the problem of elastic fatigue of the prior art heat sink material can be avoided.

BRIEF DESCRIPTION OF THE DRAWINGS

1 Figure 10 is an exploded view of a thermal conduction and dissipation module for an integrated circuit (IC) or optoelectronic device in accordance with a preferred embodiment of the present invention.

2 shows the module for heat conduction and dissipation for IC or optoelectronic devices in its assembled configuration according to the preferred embodiment of the present invention.

3 Figure 11 is an exploded schematic of a heat conduction and dissipation module for IC or optoelectronic devices in accordance with another preferred embodiment of the present invention.

4 shows the module for heat conduction and dissipation for IC or optoelectronic devices in its assembled configuration according to the other preferred embodiment of the present invention.

5 shows a module for heat conduction and dissipation for IC or optoelectronic devices, which is composed with a heat generating device, according to another preferred embodiment of the present invention.

6 shows a module for heat conduction and dissipation for IC or optoelectronic devices, which is assembled with another heat generating device, according to another preferred embodiment of the present invention.

7 shows a module for heat conduction and dissipation for IC or optoelectronic devices, which is composed with another heat generating device, according to another preferred embodiment of the present invention.

8th shows a module for heat conduction and dissipation for IC or optoelectronic devices, which is composed with another heat generating device, according to another preferred embodiment of the present invention.

LIST OF REFERENCE NUMBERS

1

 Module for heat conduction and drainage

10

 block

30

 heat conducting

50

 heat sink

70

 Heat generating device

110

 second flattened end

310

 flat end

311

 flat end

312

 flat end

313

 flat end

510

 Through Hole

530

 through groove

550

 first flattened end

DETAILED DESCRIPTION

It should be noted prior to the description that while certain terms are used in the present application (including the claims) to identify particular elements, one of ordinary skill in the art will recognize that some manufacturers may use different terms to refer to the same elements , Therefore, this application (including the claims) should be understood to distinguish the elements by their function rather than by their technical title. In addition, the terms "comprising" and "having" as used herein are both open-ended terms that are understood to mean "including but not limited to".

Heat conduction and dissipation module for integrated circuit (IC) or optoelectronic devices according to the present invention will be described in detail below. Now, reference is made 1 which is an exploded view of a thermal conduction and dissipation module for IC or optoelectronic devices in accordance with a preferred embodiment of the present invention. As in 1 shown includes the module for heat conduction and derivation in the preferred embodiment, a block 10 , a heat conducting device 30 and a heat dissipation device 50 , The heat dissipation device 50 has a through hole 510 and a through-groove 530 that with the through hole 510 is connected. Furthermore, the heat conducting device 30 a flat end 310 on, the heat dissipation device 50 has a first flattened end 550 on and the block 10 has a second flattened end 110 on.

Renewed reference is now on 1 and in addition 2 which shows the heat conduction and dissipation module for IC or optoelectronic devices according to the preferred embodiment of the present invention in an assembled configuration. In practice, the heat conducting device 30 in advance within the through hole 510 the heat dissipation device 50 arranged and the block 10 is then forcedly in a press fit into the through groove 530 the heat dissipation device 50 used, so that the heat conduction device 30 with the heat dissipation device 50 and the block 10 is firmly engaged and the block 10 also with the heat-conducting device 40 heat sink 50 is firmly engaged, whereby the most efficient heat conduction and dissipation is achieved. After a composition in this way puts the flat end 310 the heat conducting device 30 along with the first flattened end 550 the heat dissipation device 50 and the second flattened end 110 of the block 10 a common level ready, as in 2 shown, on which a heat generating device can be arranged and thereby cooled quickly. The heat generating device may be a light emitting diode (LED) device, a solar cell device, a semiconductor device, or any other electronic device that generates heat when turned on. The heat conducting device 30 may be a heat pipe, a heat column or a steam chamber having a vertical thickness. Furthermore, the block 10 either of the same material as the heat sink 50 or made of another material with a higher thermal conductivity.

3 shows an exploded schematic representation of a module for heat conduction and dissipation for IC or optoelectronic devices according to another preferred embodiment of the present invention. As in 3 shown, the module comprises 1 for heat conduction and dissipation, in this preferred embodiment, a block 10 , two heat-conducting devices 30 and a heat dissipation device 50 , The heat dissipation device 50 has two through holes 510 and a through-groove 530 that with both through holes 510 is connected. Furthermore, the heat conducting devices 30 one flat end each 310 on, the heat dissipation device 50 has a first flattened end 550 on and the block 10 has a second flattened end 110 on. It should be noted that the two heat-conducting devices 30 in terms of the block 10 are arranged symmetrically and the two through holes 510 relative to the through groove 30 are arranged symmetrically.

Referring again to 3 and in addition 4 showing the heat conduction and dissipation module for IC and optoelectronic devices according to the preferred embodiment of the present invention in their assembled configuration will become the two thermal conduction devices 30 in practice in advance within the two through holes 510 the heat dissipation device 50 arranged and the block 10 is then forcedly in a press fit into the through groove 530 the heat dissipation device 50 used, so that the heat conduction 30 between the heat dissipation device 50 and the block 10 are firmly engaged and the block 10 also with the heat-conducting device 30 and the heat dissipation device 50 is firmly engaged, whereby the most efficient heat dissipation is achieved. After a composition in this way form the flat ends 310 of the two heat-conducting devices 30 along with the first flattened end 550 the heat dissipation device 50 and the second flattened end 110 of the block 10 a common level, as in 4 shown, on which a heat generating device can be arranged and thereby cooled quickly. The heat generating device may be an LED device, a solar cell device, a semiconductor device, or any other electronic device that will generate heat when turned on. The heat conducting devices 30 may each be a heat pipe, a heating column or a steam chamber having a vertical thickness. Furthermore, the block 10 either of the same material as the heat sink 50 or made of another material with a high thermal conductivity.

It should be noted that block 10 , Thermal Conductors 30 and heat dissipation device 50 in the modules for heat conduction and dissipation of IC or optoelectronic devices 1 according to the present invention not to the in 1 or 2 are shown limited forms. Any form that allows the modules to function in the same manner is within the scope of the appended claims.

With reference to 5 shows this a heat conduction and dissipation module for IC or optoelectronic devices, which is assembled with a heat generating device, according to another preferred embodiment of the present invention. In the arrangement, the heat generating device 70 on a common plane, through the second flattened end 110 , flat finish 310 and first flattened end 550 The heat generated is transferred and dissipated at a higher rate, as in 5 shown.

Furthermore, the heat conducting device 30 according to the present invention, be either an L-shaped or otherwise curved heat pipe. With reference to 6 . 7 and 8th These show a module for heat conduction and dissipation for IC or optoelectronic devices, which are each assembled with another heat generating device according to further preferred embodiments of the present invention. In the compositions, the heat generating device becomes 70 on the flat end 311 . 312 or 313 the heat conducting device 30 attached and thereby an accelerated heat conduction and dissipation is achieved, as shown in the figures. The heat generating device 70 may be an LED device, a solar cell device, a semiconductor device, or any other electronic device that generates heat when turned on.

Compared to the prior art, the heat conduction and dissipation modules for IC and optoelectronic devices according to the present invention enable more efficient heat dissipation by forcefully pressing the block to allow the heat conduction device to be fixed within and in tight engagement with the heat sink to become. As such, the problem of elastic fatigue of the prior art heat sink material can be avoided. Further, the heat conduction and dissipation modules for IC or optoelectronic devices according to the present invention may also be composed to have a common plane formed by the heat conduction device, the heat sink, and the block together, or directly Having a heat conducting device with a flat end on which a device to be cooled can be attached to have a higher heat dissipation rate.

The foregoing detailed description of the preferred embodiments is provided to more fully describe the features and scope of the present disclosure, rather than limiting the scope of the present invention to the disclosed preferred embodiments. It is further intended that all modifications and equivalent arrangements fall within the scope of the appended claims to be protected by this application. Therefore, the scope of the appended claims, which is to be protected by this application, is to be construed in a broad sense and include all possible changes and equivalent arrangements.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• CN 1315231 [0005]

Claims (10)

Module for heat conduction and dissipation for an integrated circuit or an optoelectronic device, comprising: a block; a heat conducting device; and a heat sink having a through-hole and a through-groove connected to the through-hole, wherein the heat conducting device is pre-positioned within the through-hole and the block is then inserted into the through-groove such that the heat-conducting device is firmly engaged with both the heat-dissipating device and the block. The heat conduction and dissipation module according to claim 1, wherein the heat conduction device has a flat end. The heat conduction and dissipation module of claim 2, wherein the heat sink further has a first flattened end, the block having a second flattened end, and wherein, upon tight engagement of the heat conduction device with the heat sink over the block, the flat end is the first flattened end and the second flattened end together to provide a common plane. The heat conduction and dissipation module according to claim 2, wherein a heat generating device is disposed on the flat end of the heat conduction device. The heat conduction and dissipation module according to claim 4, wherein the heat generating device is an electronic device that generates heat when turned on. The heat conduction and dissipation module according to claim 5, wherein the heat generating device is a light emitting diode device, a solar cell device or an integrated circuit device. The heat conduction and dissipation module according to claim 1, wherein the heat conduction device is a heat pipe, a heat column or a steam chamber. A heat conduction and dissipation module according to claim 1, wherein the heat conduction device is columnar and made of a metallic or non-metallic material. The heat conduction and dissipation module according to claim 8, wherein the heat conduction device is a copper pipe or a ceramic column. The heat conduction and dissipation module according to claim 1, wherein the block is made of a same material as the heat dissipation device.

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