DE202018102765U1 - Surface-mountable electronic component with at least two electrical connection elements - Google Patents

Abstract

Surface-mountable electronic component (6) with at least two electrical connection elements (3; 30) for direct application to a conductively laminated wiring carrier, in particular a copper-clad circuit board (8), wherein at least one of the electrical connection elements (3) is designed to be high-current carrying capacity, thereby in that the high-current carrying connection element (3) has an extended lateral extent, which is embodied such that, in the case of a layout-corresponding arrangement of the electronic component (6) on the wiring carrier, the connection element (3) extends at least to the edge of the wiring carrier (8). ranges, such that the high-current conduction largely takes place outside the current paths of the copper cladding.

Description

The invention relates to a surface-mountable electronic component with at least two electrical connection elements for direct application to a conductively laminated wiring substrate, in particular a copper-clad circuit board, wherein at least one of the electrical connection elements is formed by high-current carrying capacity according to the preamble of claim 1.

From the WO 2011/113867 A1 is a circuit board with additional busbars previously known to withstand a current load occurring.

The busbar is arranged on a circuit board side, which faces the component side for the actual components. The unpopulated surface of the circuit board can be provided with grooves for receiving the busbar.

In a similar solution direction is the EP 2 200 408 B1 , There is referred to electrically conductive bridging rails, contact the sections within the spatial extent of a circuit board current-carrying.

The problem of passing high currents on printed circuit board traces is in the DE 10 2012 008 514 explained. For high-current connections reference is made to metal rails, resulting in a quasi-sandwich structure to the actual circuit board.

In the power semiconductor module according to DE 10 2005 030 247 B4 the load connection between the power semiconductor component and a conductor track is formed over a metal shaped body. This is arranged above the power semiconductor component and has a waveform in this area. This should create a plurality of support points. A power component projecting end of the metal molding leads to a printed circuit board, which in turn creates a support point with this. An electrical connection is made by means of a pressure element.

The EP 1 117 282 B1 shows an electronic module with power components. A printed circuit board serves as a carrier for at least some power components. Connecting means for interconnecting the components with each other and with an external supply comprise bridges of conductive material which are shaped so that each can span a power device with short sections of tracks carrying the power currents interconnected.

Such current bridges are comparable in the EP 0 531 984 A1 disclosed.

The DE 10 2006 004 322 A1 shows a printed circuit board with additional functional elements in the form of a round or rectangular electrical conductor, which is mechanically and electrically and thermally conductively and extensively fixed at least in sections on an electrically conductive interconnect structure by means of ultrasonic or friction welding, resulting in an intermetallic compound. As a result, it is possible to carry higher currents over such a conductive track structure.

Summing up the cited prior art, it is known to upgrade standard circuit boards high current side by additional bridges are used, which may be at least partially already part of an active device or are connectable to this.

As is known, standard printed circuit boards currently have a copper coating in the thickness range of 18 μm or 35 μm. With printed circuit boards as wiring carriers for applications in which high current densities occur, it is difficult to realize the necessary track widths in order to ensure the corresponding current carrying capacity.

High component densities, limited space and an inhomogeneous current density distribution in wide tracks make it difficult or prevent appropriate dimensioning. Therefore, especially in the field of surge protective devices are usually printed circuit boards with a copper coating of 50 microns or more in use. Such thicker copper pads make it possible to make corresponding conductor tracks less wide, so that the above-mentioned requirements are met.

However, there are conflicts with such printed circuit boards reinforced in copper plating, when construction or circuit elements are used on the same printed circuit board, which require very fine structure sizes. Smaller structures in the range of <200 microns require as thin a copper coating of, for example, 35 microns or less, so that the etching process in printed circuit board production provides reproducible and good results. From a copper overlay of 70 microns only structures are feasible, which have a feature width of> 200 microns.

From the foregoing, it is therefore an object of the invention to provide a surface-mountable electronic component having at least two electrical connection elements for direct application to a conductively laminated wiring carrier, Specify in particular a copper-clad circuit board, which makes it possible to implement a high-current conduction outside of the copper cladding. In this regard, a system consisting of an electronic component and a structurally correspondingly structured copper-clad standard printed circuit board is to be created.

The object of the invention is achieved by a surface mountable electronic component having at least two electrical connection elements for direct application to a conductively laminated wiring substrate according to the combination of features according to claim 1, wherein the dependent claims represent at least expedient refinements and developments. According to the invention, moreover, the system according to claim 9, consisting of an inventively designed electronic component and a structurally structured copper-clad circuit board or a corresponding wiring carrier.

According to the invention, large currents can be conducted in a realized device to the high-current-carrying component outside the wiring substrate. This allows all technical aspects of a complex assembly on a standard PCB with low copper plating can be realized without the need for a second wiring support, ie a bridge or an adapter solution.

The inventively embodied electronic components can be surface mounted in a classic manner and processed for example by means of a standard SMD reflow process.

In accordance with the invention, at least one high-current-carrying connection element is adapted such that, on the one hand, the component or component can be mounted on the wiring carrier, but, on the other hand, contacting of the high-current-carrying component takes place from the edge of the wiring carrier or directly from terminals or connections.

The inventive solution can be processed in the same way standard printed circuit boards with relatively small thickness of the copper-clad edition. Also, standard assembly and soldering processes can be used. Because large currents are conducted to the corresponding component or component outside the wiring substrate, the current density in the copper cladding of the corresponding printed circuit board remains low.

The formation of a special bend of the high-current carrying connection element results in a degree of freedom such that further components can be arranged directly on the circuit board under the course of the high-current carrying connection element. As a result, the packing density can be increased, without resulting in a planar enlargement of the wiring substrate. Due to the special design of the high current carrying connection element, the required clearances and creepage distances are maintained. Insulation milling or other measures to improve creep resistance become superfluous.

Extra current-carrying lines to the component, which are soldered to the component, for example, can be omitted.

By making it possible to use wiring substrates with a small thickness of the copper cladding, fine structures can be realized by etching on the printed circuit board and, as a result, the packing density can also be optimized. Furthermore, a direct contacting of the high-current-carrying component without detours via secondary contacts is possible, for example plug-in module contacts are directly compatible with a corresponding embodiment of the high current carrying connection element.

As a secondary effect results from the dimensioning and in particular the longer lateral extent of the high-current carrying terminal element, an optimization of the thermal management, since the modified terminals are able to provide an optimization of the heat dissipation.

Thus, the high-current carrying connection element according to the invention has an extended lateral extent, which is designed such that in a layout-appropriate arrangement of the electronic component on the wiring support, the connection element extends at least to the edge of the wiring substrate, such that the high-current conduction largely or completely outside the Current paths of Kupferkaschierung takes place.

In a further development of the invention, the remote from the device, reaching over the edge of the wiring substrate end of the high-current carrying terminal element in a terminal or a connection electrode via.

The high-current-carrying connection element is formed at least over a longitudinal portion of its lateral extent parallel, but spaced from the plane of the wiring substrate. As a result, another, in particular SMD component can be arranged on the circuit board below the corresponding length section.

The high-current carrying connection element has a step-shaped bend, which in one embodiment of the invention runs in the direction of the plane of the wiring support and is oriented over a predetermined section along this plane. In this way, a soldering for fixing the high-current carrying connection element with respect to a corresponding copper-clad surface on the wiring substrate done.

The electronic component is in particular a high-current-carrying component for overvoltage applications, again in particular a gas discharge tube.

The connecting element may have at least one change in direction in its lateral course, in order to allow an optimal arrangement according to the conditions of the printed circuit board without restriction in the assembly or wiring layout.

The second connection element of the electronic component can be formed multiple times and in each case for direct Lötkontaktieren with the Kupferkaschierung.

According to the invention further comprises a system consisting of at least one electronic component described above and a circuit-structured copper-clad circuit board with a standard copper lamination, for example in the range between 35 and 45 microns thick.

The invention will be explained in more detail below with reference to an embodiment and with the aid of figures.

• 1 eine Draufsicht auf eine erfindungsgemäße Anordnung mit einem Ausschnitt einer Leiterplatte und darauf fixierten erfindungsgemäßen oberflächenmontierbaren elektronischen Bauelement mit lateral verlängertem, hochstromtragfähigem Anschlusselement; und
• 2 eine Darstellung ähnlich derjenigen nach 1, jedoch in Seitenansicht.

Hereby show:

• 1 a plan view of an inventive arrangement with a section of a printed circuit board and fixed thereto surface-mountable electronic component according to the invention with laterally extended, hochstromtragfähigem connection element; and
• 2 a representation similar to that after 1 , but in side view.

According to the figurative representations of a copper-clad circuit board 8th assumed, which has a generated by etching or the like circuitry relevant structuring.

On the circuit board 8th That is, on the component side of this is an electronic component, in the example shown, a gas arrester 6 be attached and contacted in accordance with electrical.

The component 6 is first with its bottom with a corresponding soldering island 5 soldered.

A high-current carrying connection element 3 has a clearly recognizable prolonged lateral extent. This extension of the high-current carrying connection element 3 is in the example shown running angularly and over the edge of the circuit board 8th reaching out.

In this regard, this is the component 6 remote end of the high current carrying connection element 3 in a terminal 10 above.

Additionally, at the point 2 by the bending of the high-current carrying connection element 3 (please refer 2 ) a soldering can be realized with an existing there solder island.

The high-current carrying connection element 3 is at least over a length of its lateral extent parallel, but spaced from the plane of the circuit board 8th running, as is the side view after 2 shows.

As a result, there is the possibility that further surface mount components 9 below the corresponding section of the high-current carrying connection element 3 can be arranged. As a result, the packing density is increased and there is virtually a third degree of freedom for the arrangement of corresponding active or passive components 9 ,

About more plains islands 4 ; 7 become further connection elements 30 contacted by soldering. In practical use, a higher total current flows through the formation of the high current carrying connection element 3 no longer over sections of the copper lamination of the circuit board 8th , It can therefore be worked with a thin, for example, 35 micron thick copper coating. The double formation of the other connection elements 30 leads to space savings. The connection elements 30 can be used as a contact bridge for the contacting of subsequent elements.

As shown 1 is the free end of the present invention further developed high current carrying connection element 3 with a slot in the sense of the mentioned terminal 10 realized. But it is also possible to design this end directly as optimized for the particular application plug contact or as a jack. It serves the selective soldering in the area of the soldering island 2 for mechanical stabilization of the electronic component 6 on the circuit board 8th ,

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• WO 2011/113867 A1 [0002]
• EP 2200408 B1 [0004]
• DE 102012008514 [0005]
• DE 102005030247 B4 [0006]
• EP 1117282 B1 [0007]
• EP 0531984 A1 [0008]
• DE 102006004322 A1 [0009]

Claims (9)

Surface-mountable electronic component (6) with at least two electrical connection elements (3; 30) for direct application to a conductively laminated wiring carrier, in particular a copper-clad circuit board (8), wherein at least one of the electrical connection elements (3) is designed to be high-current carrying capacity, thereby in that the high-current carrying connection element (3) has an extended lateral extent, which is embodied such that, in the case of a layout-corresponding arrangement of the electronic component (6) on the wiring carrier, the connection element (3) extends at least to the edge of the wiring carrier (8). ranges, such that the high-current conduction takes place largely outside the current paths of the copper cladding. Surface-mountable electronic component according to Claim 1 , characterized in that the remote from the component (6), over the edge of the wiring substrate (8) reaching the end of the high-current carrying connection element merges into a terminal (10) or terminal electrode. Surface-mountable electronic component according to Claim 1 or 2 , characterized in that the high-current-carrying connection element (3) is formed at least over a length portion of a lateral extension parallel, but spaced from the plane of the wiring substrate (8). Surface-mountable electronic component according to Claim 3 , characterized in that the high-current-carrying connection element (3) has a step-shaped angled which extends in the direction of the plane of the wiring substrate (8) and is oriented over a predetermined portion along this plane. Surface-mountable electronic component according to Claim 4 , characterized in that in the predetermined section a solder connection to a soldering pad (2) is executable. Surface-mountable electronic component according to one of the preceding claims, characterized in that the electronic component (6) is a high-current-carrying component for overvoltage applications, in particular a gas discharge tube. Surface-mountable electronic component according to one of the preceding claims, characterized in that the connecting element (3) has at least one change in direction in its lateral course. Surface-mountable electronic component according to one of the preceding claims, characterized in that the second connection element (30) of the electronic component is formed multiple times and each for direct Lötkontaktieren with the copper cladding of the wiring substrate (8). System consisting of an electronic component according to at least one of the preceding claims and a circuitry-structured copper-clad circuit board (8).

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