DE202006010517U1 - Housing component for electronic device e.g. data processing device, has heat conducting plate comprising contact surface and attached to heat conducting wall, such that heat conducting contact is established between hot-spot and component - Google Patents

Abstract

The component has a heat conducting plate (2) comprising a contact surface and attached to a heat conducting wall, such that a heat conducting contact is established between a hot-spot and the housing component, where the hot-spot lies spatially far away from the heat conducting wall in an inner side of a housing. A heat conducting pad is inserted between the hot-spot and the wall, where the component is manufactured from a heat conducting material e.g. aluminum.

Description

The The present invention relates to a housing component for electronic Equipment, preferably data processing equipment.

electronic Components such as processors and switching elements only work under favorable environmental conditions permanently error-free. These environmental conditions are with respect to such devices equipped data processing equipment substantially through the inside of the housing prevailing temperature characterizes. The ever increasing number of switching elements and processors as well as the equally steadily increasing timing of the devices high standards to the cooling.

to cooling of data processing equipment exist side by side a variety of approaches, according to which a cooling feasible is. conventional the components which are strongly heated during operation are assigned a heat sink, which usually consists of a thermally conductive Material such as copper or aluminum is made. The heat sink is usually as a lamellar laminated block, wherein the surface of the heat sink maximized in this way becomes. Cooling air flowing through the heat sink can so much heat, which deliver the components to the heat sink and which are distributed in the heat sinks record and derive.

In a further step is the air, preferably by fans or turbines, kept moving, allowing the absorption capacity of the Airflow for Heat over the Time is further increased. A derivation of the heat absorbed by the air is optionally via a second, heat exchange point achieves which the heat derives from the closed system, or by one complete Exchange of air.

alternative is a cooling of the components by means of water cooling known, which in turn in cooling channels in the interior is embedded by heat sinks. Through a cooling circuit becomes thereby the used coolant on the to be cooled Hot spot passed by for heat take. In the further course of the cooling body are about cooling fins for delivery or heat exchange assigned so that the circulating again in the direction of the hot spot coolant a lower temperature, thus a greater capacity for warmth brings.

Especially Such cooling systems are difficult to realize, especially in the spatial very limited Server racks, in a large number of server blades simultaneously cause large amounts of waste heat. The particularly compact design is an effective cooling system to demand, which is also fail-safe.

The WO 2006/005325 describes in this context a heat exchange system with two separate cooling circuits. The inserted within a housing Secondary cooling circuit takes the heat there and transports them to a contact surface, through which a heat exchange with an external primary cooling circuit takes place. By separating the two circuits is the risk of leakage of the cooling liquid thereby reduced, that the secondary cooling circuit stuck in that envisaged heat sink embedded is and a hose coupling for connection to a pump thus is not required. The required flow movement of the coolant is generated mechanically and / or inductively.

In front In this background, the present invention has the object underlying the efficiency of known cooling methods in terms of a stronger cooling on to improve.

This succeeds with a housing component according to the features of the main claim. Further advantageous embodiments can the dependent claims be removed.

According to the invention is a Computing device in a housing taken, which at least partially made of a thermally conductive material consists. Usually are the electronic components of a data processing device in some Distance from the housing wall situated. However, there is a housing component, such as a housing cover, used, which with housing interior electronic hot spots in heat-conducting contact is. Through this heat-conducting Contact becomes in the components, about processors and switching elements, accumulating heat without heat exchange with a cooling air flow directly to the housing component delivered and thus to the edge of the closed to be considered Systems brought. From there, the heat can be easily dissipated become.

Of the thermally conductive Contact between the housing component and the hot spots can with advantage by means of at least one Wärmeleitblechs done, which is the housing component is formed such that the distance between the housing component and hot spots is bridged. Furthermore, the at least one heat-conducting sheet has suitable folded edges on, making it flat against the hot spots, if necessary, also flat against the housing component is applied and these not only touched punctually.

A Meaningful alternative, it represents when the housing wall inside, ie along the hot spots facing surface, the surface structure is at least largely adapted. This can be done by way of an exact Impression of the to be cooled Surface, but also be realized by a rough image of the same. hereby is a cooling as far as possible all Ensures components resulting in a particularly strong cooling allows becomes.

The thus possibly very solid trained wall can be inside also be constructed of a lattice structure, so that a weight saving takes place. The resulting gaps can in turn with particular thermally conductive gas, a similar liquid, one Foam or the like can be filled more.

With Advantage will be applied to the components surface of the housing component with a thermal pad applied, so that improved heat conduction in the transition between the one to be cooled Component and the housing component given is. In this case, the thermal pad both on the component as well as on the corresponding adjacent area the housing component to be appropriate. Also, a two-sided adhesion is possible, wherein in this case, an opening of the housing, at the housing component and components are separated, to a renewal the said thermal pads to lead would.

Also it is conceivable that between the housing component and the components resulting gaps with a suitable, thermally conductive To shed funds. It goes without saying Make sure that the heat transfer medium is not is simultaneously electrically conductive.

With Advantage is the housing component gehäuseinwendig associated with a heat sink, which with the housing component in thermally conductive contact stands. As far as the case no over Air circulation, It may be useful if the heat sink works on the basis of water cooling.

Additionally or Alternatively to the aforementioned heat sink solution can also the housing component itself, for example, contain a cooling circuit in its wall. To is in the wall a secondary cooling circuit provided, which by means of suitable coolant by heat exchange heat for his part away from the hot spots. The exchange of heat with a primary circuit takes place via defined Contact surfaces over which the heat of coolant the primary circuit can be included.

With Advantage are primary and secondary cooling circuits fluidically applied separated from each other, allowing a transfer of cooling fluid in the area of the housing component, especially about Hose couplings, not required. The aforementioned hose couplings usually make Weak points in the coolant circuit but can omitted when the secondary circuit is closed in itself. The coolant can then by means of inductive or mechanical interference in the secondary circuit to be moved. Penetration of coolant in the area of housing of the data processing device is thus avoided.

to Improving the dissipation of heat can also heatpipes are used, which heat from the cooling circuits, the Housing component, or even direct away from individual components.

With Advantage is the housing component as the lid of the case trained so that in an open State an access to the components contained in the housing allows is.

Further is the housing component Advantageously at least largely made of a thermally conductive material, in particular of aluminum.

The The invention described above will be described below with reference to a embodiment be explained in more detail.

It shows

1 a housing component in the form of a housing cover for use with a data processing device in a perspective view.

1 shows a housing component 1 , which can be used as intended for use as a cover for a data processing device. Within a housing of the data processing device, a large amount of waste heat, their derivative is the task of the housing component 1 is. This is the case component 1 a Wärmeleitblech 2 assigned, which is a contact surface 3 having. As intended, the contact surface is located 3 when using the housing component 1 as a housing cover on the surface of a component to be cooled in the housing, so a so-called "hot spot" surface, so that the costs incurred in the hot spot heat to the heat conduction 2 is derived. About at least one connecting plate 4 is the Wärmeleitblech with the housing component 1 connected so that the over the contact surface 3 absorbed heat to the housing component 1 can be delivered. Between contact surface 3 and a heat-conducting pad can be interposed between the hotspot, which, if appropriate with production of an at least one-sided bond, has a heat-conducting surface with a contact surface 3 and hot-spot is connected.

The in the housing component 1 dissipated heat can first be distributed in an aluminum carcass, but from there again by different measures from the closed system distributed out. This is the case component 1 a heat sink 6 thermally conductively connected, which due to the air flowing through it in the housing component 1 can dissipate accumulating heat. Depending on requirements, the heat sink can be used both inside the housing as well as inside the housing.

Another measure for cooling the housing component 1 represents a water cooling, which initially in the aluminum body 5 the housing component 1 taken in coolant lines 7 is made. The coolant lines 7 are sealed to the outside and provide a self-contained cooling system in which the coolant is moved by inductive or mechanical methods. via defined contact surfaces, the heat to be dissipated by the water cooling is transferred to further heat conductors, such as heat pipes or higher-level water cooling circuits.

above is thus an improved cooling system for data processing equipment described which through a direct, heat-conducting Contact between housing and hot-spot one more effective cooling allows.

1

housing component

2

heat conducting

3

contact area

4

connecting plate

5

aluminum body

6

heatsink

7

Coolant line

Claims (13)

Housing component for electronic devices, preferably data processing equipment, which is at least partially made of thermally conductive material, wherein a housing, lying inside the housing, thermally conductive wall of the housing component ( 1 ) is brought into heat-conducting contact with at least one within the housing spatially remote from the housing wall hot spot. Housing component according to claim 1, characterized in that on the wall of the housing component ( 1 ) at least one Wärmeleitblech ( 2 ) is formed such that the heat-conducting contact between the hot spot and housing component ( 1 ) over the heat conducting plate ( 2 ) is made. Housing component according to claim 1, characterized in that the wall of the housing component ( 1 ) is shaped such that at least parts of the components received in the housing are at least largely positively overlapped by the wall. housing component according to claim 3, characterized in that the form-fitting received in the housing Modular walls not massive, but rather as grid or lamellar structure executed is. housing component according to claim 4, characterized in that the wall as a whole at least largely liquid-tight and with a coolant filled and / or shed. housing component according to one of the preceding claims, characterized in that additionally inserted between the hot spots and the wall, a Wärmeleitpad, preferably with the wall or the hot spot connected is. housing component according to one the claims 3 to 6, characterized in that the heat-conducting pad after closing the Housing through Shed the spaces between between components and wall is made. Housing component according to one of the preceding claims, characterized in that the housing component ( 1 ) inside the housing and / or at least one heat sink inside ( 6 ) associated with the housing component ( 1 ) is in thermally conductive connection. Housing component according to one of the preceding claims, characterized in that the housing component ( 1 ) has at least one secondary cooling circuit which is in thermally conductive connection with at least one primary cooling circuit via at least one contact surface and heat is interchangeable between the cooling circuits via this contact surface. Housing component according to claim 9, characterized in that in the primary cooling circuit coolant is conveyed by means of a flow drive, said flow drive mechanically and / or inductively - ferromagnetically or electromagnetically - is coupled to the at least one secondary cooling circuit such that thereby a passive flow drive for that in the secondary circuit given to be conveyed coolant, wherein the cooling means of the two cooling circuits are distinguishable and fluidically separated from each other. housing component according to one of the preceding claims, characterized in that heat generated in the housing over at least a heat pipe is derived. Housing component according to one of the preceding claims, characterized in that the housing component ( 1 ) is designed as a housing cover. Housing component according to one of the preceding claims, characterized in that the housing component ( 1 ) is made at least largely of aluminum.