DE19910500A1 - Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board - Google Patents
Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit boardInfo
- Publication number
- DE19910500A1 DE19910500A1 DE1999110500 DE19910500A DE19910500A1 DE 19910500 A1 DE19910500 A1 DE 19910500A1 DE 1999110500 DE1999110500 DE 1999110500 DE 19910500 A DE19910500 A DE 19910500A DE 19910500 A1 DE19910500 A1 DE 19910500A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- heat sink
- heat
- components
- sink elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 6
- MEKOFIRRDATTAG-UHFFFAOYSA-N 2,2,5,8-tetramethyl-3,4-dihydrochromen-6-ol Chemical compound C1CC(C)(C)OC2=C1C(C)=C(O)C=C2C MEKOFIRRDATTAG-UHFFFAOYSA-N 0.000 claims abstract 5
- 238000001816 cooling Methods 0.000 claims description 13
- 238000005266 casting Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000004382 potting Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Die Erfindung betrifft ein elektrisches Gerät mit den im Oberbegriff des Anspruchs 1 angegebenen Merkmalen.The invention relates to an electrical device with the The preamble of claim 1 features specified.
Ein derartiges Gerät ist beispielsweise aus der DE 195 06 664 A1 bekannt. Bei dem bekannten Gerät ist eine mit wärmeerzeu genden Bauelementen bestückte Leiterplatte im Gehäuse eines elektronischen Steuergerätes angeordnet. Die Bauelemente sind in SMD-Technik (Surface Mounted Device) auf jeweils eine Lei terbahn der Leiterplattenoberseite aufgelötet, welche über Durchkontaktierungen mit einer Leiterbahn auf der Unterseite der Leiterplatte elektrisch und wärmeleitend verbunden ist. Separate Wärmeableitblöcke sind mit einem wärmeleitenden Kle ber direkt unterhalb der wäremerzeugenden Bauelemente auf die Leiterbahnen der Leiterplattenunterseite aufgeklebt. Die von der Leiterplatte abgewandte Seite der Wärmeableitblöcke steht über eine wärmeleitende Kleberschicht mit dem Gehäuseboden in thermischen Kontakt. Nachteilig bei den bekannten Geräten ist, daß die von den Leistungsbauelementen abgegebene Wärme fast ausschließlich über die Durchkontaktierungen auf die Leiterplattenunterseite abgeleitet wird und von dort über den Wärmeleitkleber, den Wärmeableitblock und die weitere Kleber schicht auf das Gehäuse gelangt, von wo die Wärme an die Um gebung abgegeben wird. Die Wärme muß somit immer die Kleber schicht durchdringen. Bei den von modernen Leistungsbauele menten erzeugten großen Wärmemengen reicht die Wärmeleitfä higkeit der Kleberschicht oft nicht aus, so daß ein Wärmestau auf der Unterseite der Leiterplatte die Folge ist, welcher zu einer Überhitzung der Bauelemente führt. Nachteilig ist auch, daß die Wärme eine weitere Kleberschicht überwinden muß, um an die Umgebung des Steuergerätes gelangen zu können. Weiter hin ist nachteilig, daß die Wärmeableitblöcke nach der Be stückung der Leiterplatte mit SMD-Bauelementen in aufwendiger Weise auf die Leiterplattenunterseite aufgeklebt werden müs sen. Es wird somit ein zusätzlicher Herstellungsschritt benö tigt, wodurch sich die Herstellungskosten erhöhen.Such a device is for example from DE 195 06 664 A1 known. In the known device is one with heat-generating components in the housing of a component arranged electronic control unit. The components are in SMD technology (Surface Mounted Device) on one Lei each soldered on the top of the circuit board, which over Vias with a conductor track on the underside the circuit board is connected electrically and thermally. Separate heat dissipation blocks come with a thermally conductive adhesive directly below the heat-generating components Conductor tracks glued to the underside of the circuit board. The of the side of the heat dissipation blocks facing away from the printed circuit board via a heat-conducting adhesive layer with the housing bottom in thermal contact. A disadvantage of the known devices is that the heat given off by the power components almost exclusively through the vias on the PCB bottom is derived and from there on the Thermal adhesive, the heat dissipation block and the other adhesive layer reaches the housing, from where the heat to the um issue is given. The heat must therefore always be the glue penetrate layer. In the case of modern power components large amounts of heat generated are sufficient for the thermal conductivity ability of the adhesive layer is often not sufficient, so that a heat build-up on the underside of the circuit board is the result of which too leads to overheating of the components. Another disadvantage is that the heat has to overcome another layer of adhesive in order to to get to the environment of the control unit. Next it is disadvantageous that the heat dissipation blocks after loading piece of the circuit board with SMD components in complex Way must be glued to the underside of the circuit board sen. An additional manufacturing step is thus required tigt, which increases the manufacturing costs.
Durch das elektrische Gerät mit den kennzeichnenden Merkma len des Anspruchs 1, werden die bekannten Nachteile bei der Wärmeableitung in elektrischen Geräten vermieden. Da die einzelnen Kühlkörperelemente räumlich und elektrisch ge trennt voneinander auf die Leiterplatte aufgebracht werden, ist es nicht erforderlich, die Kühlkörper von den üblicher weise auf unterschiedlichem Betriebspotential liegenden Bau elementen elektrisch zu isolieren. Durch die direkte Auflö tung der Kühlkörperelemente wird der Wärmeübergang erheblich verbessert, da die von den Bauelementen erzeugte Wärme sehr schnell über eine rein metallische Verbindung auf die Kühl körperelemente übertragen wird und ein Wärmedurchgang durch eine teure Isolierfolie oder Kleberschicht nicht erforder lich ist. Vorteilhaft verhindert die elektrisch isolierende Vergußmasse einen versehentlichen Kurzschluß zwischen den mit den elektrischen/elektronischen Bauelementen elektrisch verbundenen Kühlkörperelementen und verbessert gleichzeitig die Wärmeableitung, da die Wärme von den Bauelementen nicht nur über die Durchkontaktierungen abfließt, sondern auch di rekt auf die Vergußmasse übertragen wird und von dort an das Gehäuse abgegeben werden kann. Außerdem wird die Wärme von den Kühlkörperelementen teilweise an die Vergußmasse abgege ben, wodurch die Kühlung der Bauelemente noch weiter verbes sert wird. Besonders vorteilhaft ist, daß durch die Verlö tung der Kühlkörperelemente auf der Leiterplatte die Her stellungskosten des Gerätes reduziert werden können. Die Kühlkörperelementen können zusammen mit den Bauelementen auf die Leiterplatte aufgebracht werden. Ein gesonderter Schritt zu Verklebung der Leiterplatte mit den Kühlkörperelementen entfällt.By the electrical device with the characteristic feature len of claim 1, the known disadvantages in the Heat dissipation in electrical devices avoided. Since the individual heat sink elements spatially and electrically be applied separately to the circuit board, it is not necessary to remove the heat sink from the usual as different operating potential construction isolate elements electrically. Due to the direct resolution heat transfer elements, the heat transfer becomes significant improved because the heat generated by the components very much quickly via a purely metallic connection to the cooling body elements is transferred and heat transfer through an expensive insulating film or adhesive layer is not required is. The electrically insulating advantageously prevents Potting compound an accidental short circuit between the with the electrical / electronic components electrically connected heat sink elements and improved at the same time heat dissipation since the heat from the components is not only flows through the vias, but also di is transferred directly to the sealing compound and from there to the Housing can be delivered. In addition, the warmth of the heat sink elements partially released to the sealing compound ben, which further improves the cooling of the components sert. It is particularly advantageous that the Verlö device of the heat sink elements on the circuit board cost of the device can be reduced. The Heatsink elements can be used together with the components the circuit board can be applied. A separate step for gluing the circuit board to the heat sink elements not applicable.
Weiterbildungen und vorteilhafte Ausgestaltungen der Erfin dung werden durch die in den Unteransprüchen angegebenen Merkmale ermöglicht.Developments and advantageous refinements of the Erfin are determined by those specified in the subclaims Features.
Besonders vorteilhaft ist, die Kühlkörperelemente als SMD- Bauelemente in Oberflächenmontage auf die zweite Seite der Leiterplatte aufzubringen und im Reflow-Lötverfahren mit den Leiterbahnen auf der zweiten Seite der Leiterplatte zu ver löten. Die Kühlkörperelemente können wie die elektrischen/ elektronischen Bauelemente mit einem Bestücker auf die Lei terplatte aufgebracht werden und anschließend im Reflow- Lötverfahren mit Leiterbahnen der Leiterplatte verlötet wer den.It is particularly advantageous to use the heat sink elements as SMD Surface mount devices on the second side of the Apply circuit board and in the reflow soldering process with the Ver conductor tracks on the second side of the circuit board soldering. Like the electrical / electronic components with a placement machine on the lei plate and then in the reflow Who soldered soldering process with conductor tracks of the circuit board the.
Eine besonders gute Kühlung der Bauelemente wird erreicht, wenn der von der Leiterplatte abgewandte Abschnitt der Kühl körperelemente nicht in die wärmeleitende Vergußmasse einge bettet ist und aus ihr herausragt. Dabei kann der nicht in die wärmeleitende Vergußmasse eingebettete Abschnitt der Kühlkörperelemente zwecks besserer Wärmeabgabe durch eine Öffnung oder Ausnehmung der Gehäusewand aus dem Gehäuse her ausgeführt sein. Die Wärmeabgabe an die Umgebung kann noch dadurch verbessert werden, daß der aus dem Gehäuse herausge führte Abschnitt der Kühlkörperelemente mit Kühlrippen ver sehen ist.Particularly good cooling of the components is achieved if the section of the cooling facing away from the circuit board body elements are not inserted into the thermally conductive casting compound bed and protrudes from it. The can not in the thermally conductive potting compound embedded section of the Heatsink elements for better heat dissipation through a Opening or recess of the housing wall from the housing be executed. The heat release to the environment can still be improved in that out of the housing led section of the heat sink elements with cooling fins see is.
Die Kühlkörperelemente lassen sich besonders leicht auf die Leiterplatte auflöten, wenn die den Leiterbahnen zugewandte Seite der Kühlkörperelemente mit Zinn beschichtet ist.The heat sink elements are particularly easy on the Solder the printed circuit board if the one facing the conductor tracks Side of the heat sink elements is coated with tin.
Besonders vorteilhaft ist, daß solche Kühlkörperelemente, die mit Bauelementen elektrisch verbunden sind, welche in dem Gehäuse elektrisch isoliert anzuordnen sind und vor ei ner versehentlichen Berührung oder einem Kurzschluß mit an deren Bauelementen geschützt werden müssen, einfach voll ständig in die elektrisch isolierende Vergußmasse eingebet tet werden. Durch die Wärmeleitfähigkeit der Vergußmasse wird dann immer noch eine gute Wärmeabführung erreicht.It is particularly advantageous that such heat sink elements, which are electrically connected to components which in the housing must be arranged electrically insulated and in front of egg an accidental touch or a short circuit with whose components need to be protected, just full constantly embedded in the electrically insulating casting compound be tested. Due to the thermal conductivity of the potting compound good heat dissipation is then still achieved.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird in der nachfolgenden Beschreibung näher erläutert. Die einzige Figur zeigt einen Querschnitt durch ein erfindungsgemäßes elektronisches Steuergerät.An embodiment of the invention is in the drawing shown and is described in more detail in the following description explained. The only figure shows a cross section through an electronic control device according to the invention.
Die Figur zeigt einen Querschnitt durch das Gehäuse 2 eines elektrischen Gerätes. In diesem Ausführungsbeispiel handelt es sich beispielsweise um ein elektronisches Steuergerät, das in ein Kraftfahrzeug eingebaut werden kann. Ein wannenförmi ges Gerätegehäuse 2 aus Metall, Kunststoff oder einem anderen geeigneten Material weist einen Boden 20 und vier Seitenwände auf, von denen in der Figur die Seitenwände 21, 22 dargestellt sind. An der dem Boden 20 gegenüberliegenden Seite weist das Gehäuse 2 eine Öffnung oder Ausnehmung 24 auf, durch welche eine Leiterplatte 3 in das Gehäuse eingesetzt ist. Die Lei terplatte 3 ist auf ihrer Oberseite 4 mit großflächigen Lei terbahnen 13a, 13b, 13c zur Aufbringung von elektrischen/ elektronischen Bauelementen und mit Anschlußleiterbahnen 19a, 19b, 19c zum elektrischen Anschluß der Bauelemente an weitere auf der Leiterplatte angeordnete elektronische Schaltungstei le versehen. Auf jede der Leiterbahnen 13a, 13b, 13c ist je weils ein elektronisches Leistungsbauelement 10a, 10b, 10c in SMD-Technik (Surface Mounted Divice) aufgebracht. Dabei ist jedes wärmeerzeugende Bauelement 10a, 10b, 10c unmittelbar mit seiner Kühlfahne 11a, 11b, 11c auf die diesem Bauelemente zuge ordnete Leiterbahn 13a, 13b, 13c aufgelötet. Elektrische An schlüsse 16a, 16b, 16c der Bauelemente sind mit den Anschluß leiterbahnen 19a, 19b, 19c auf der Oberseite 4 der Leiterplatte verlötet. Die großflächigen Leiterbahnen 13a, 13b, 13c auf der Leiterplattenoberseite 4 sind jeweils über eine Anzahl von Durchkontaktierungen 17a, 17b, 17c mit großflächigen Leiterbah nen 14a, 14b, 14c auf der Unterseite 5 der Leiterplatte 3 elek trisch verbunden. Die Durchkontaktierungen 17a, 17b, 17c können mit Lotpaste oder in anderer Weise gefüllt sein, um eine mög lichst gute Wärmeableitung auf die Leiterbahnen 14a, 14b, 14c der Leiterplattenunterseite 5 zu gewährleisten. Auf jede der Leiterbahnen 14a, 14b, 14c ist ein Kühlkörperelement 15a, 15b, 15c in SMD-Technik direkt aufgelötet. Die Kühlkörperelemente 15a, 15b, 15c können als Stanzteile, Stanzbiegeteile, Strang preßprofil oder in anderer Weise hergestellt sein. Vorzugs weise sind die Kühlkörperelemente aus Kupfer oder Aluminium gefertigt. Die Herstellung der Leiterplatte kann wie folgt durchgeführt werden.The figure shows a cross section through the housing 2 of an electrical device. This exemplary embodiment is, for example, an electronic control unit that can be installed in a motor vehicle. A trough-shaped device housing 2 made of metal, plastic or another suitable material has a bottom 20 and four side walls, of which the side walls 21 , 22 are shown in the figure. On the side opposite the base 20 , the housing 2 has an opening or recess 24 through which a printed circuit board 3 is inserted into the housing. The Lei terplatte 3 is on its upper side 4 with large Lei terbahnen 13 a, 13 b, 13 c for the application of electrical / electronic components and with connecting tracks 19 a, 19 b, 19 c for electrical connection of the components to other arranged on the circuit board provided electronic circuit parts. An electronic power component 10 a, 10 b, 10 c in SMD technology (Surface Mounted Divice) is applied to each of the conductor tracks 13 a, 13 b, 13 c. Each heat-generating component 10 a, 10 b, 10 c is soldered directly with its cooling lug 11 a, 11 b, 11 c to the conductor track 13 a, 13 b, 13 c assigned to these components. Electrical connections to 16 a, 16 b, 16 c of the components are soldered to the conductor tracks 19 a, 19 b, 19 c on the top 4 of the circuit board. The large-area conductor tracks 13 a, 13 b, 13 c on the circuit board top 4 are each over a number of plated-through holes 17 a, 17 b, 17 c with large-area conductor tracks 14 a, 14 b, 14 c on the underside 5 of the circuit board 3 elek trisch connected. The plated-through holes 17 a, 17 b, 17 c can be filled with solder paste or in some other way in order to ensure the best possible heat dissipation on the conductor tracks 14 a, 14 b, 14 c of the underside 5 of the circuit board. A heat sink element 15 a, 15 b, 15 c in SMD technology is soldered directly onto each of the conductor tracks 14 a, 14 b, 14 c. The heat sink elements 15 a, 15 b, 15 c can be produced as stamped parts, stamped and bent parts, extruded profile or in some other way. The heat sink elements are preferably made of copper or aluminum. The circuit board can be manufactured as follows.
Zunächst wird die Leiterplatte 3 auf den Leiterbahnen 13a, 13b, 13c der Oberseite in bekannter Weise mit einem Lotpasten auftrag versehen. Anschließend werden die elektronischen Lei stungsbauelemente 10a, 10b, 10c und gegebenenfalls noch weitere nicht dargestellte elektrische/elektronische Bauelemente mit einem SMD-Bestücker auf die Lotpaste aufgesetzt und in einem Reflow-Lötofen mit den Leiterbahnen 13a, 13b, 13c verlötet. Da bei können gleichzeitig die Anschlüsse 16a, 16b, 16c mit den Anschlußleiterbahnen 19a, 19b, 19c verlötet werden. Anschlie ßend wird die Leiterplatte gewendet und mit nunmehr nach oben weisender Unterseite 5 auf den großflächigen Leiterbahnen 14a, 14b, 14c mit Lotpaste versehen und dann erneut einem 510- Bestücker zugeführt, welcher nun die Kühlkörperelemente 15a, 15b, 15c als SMD-Bauelemente auf die mit der Lotpaste versehe nen Leiterbahnen 14a, 14b, 14c absetzt. Die den Leiterbahnen 14a, 14b, 14c zugewandte Seite der Kühlkörperelemente ist mit Zinn beschichtet, um eine verbesserte Lötfähigkeit zu erzie len. Anschließend werden die Kühlkörperelemente durch nochma liges Reflow-Löten mit den Leiterbahnen 14a, 14b, 14c verlötet. Um dabei zu verhindern, daß die bereits auf die Leiterplatte aufgelöteten Bauelemente 10a, 10b und 10c auf der bei dem zweiten Reflow-Lötprozeß nach unten weisenden Oberseite 4 der Leiterplatte aufgrund ihrer Gewichtskraft abfallen, können Lotpasten mit verschiedenen Schmelzpunkten für die Oberseite und Unterseite verwandt werden. So ist beispielsweise vorge sehen, die elektrischen/elektronischen Bauelemente 10a, 10b, lQc mit einer hochschmelzenden Lotpaste auf die Oberseite 4 aufzulöten und die Kühlkörperelemente 15a, 15b, 15c mit einer niedrigschmelzenden Lötpaste auf die Unterseite 5 aufzulöten. Beim Reflow-Löten der Kühlkörperelemente wird dann eine Tem peratur oberhalb des Schmelzpunktes der niedrigschmelzenden Lötpaste aber unterhalb des Schmelzpunktes der hochschmelzen den Lotpaste im Reflow-Lötofen eingestellt. Hierdurch wird die Lötverbindung der Bauelemente 10a, 10b, 10c nicht erneut aufgeschmolzen. Gegebenenfalls kann die Oberseite 4 während des zweiten Reflow-Lötverfahrens gekühlt werden, um ein er neutes Aufschmelzen der Lötverbindungen zu vermeiden. Natür lich ist es auch möglich, zuerst die Kühlkörperelemente auf die Leiterplatte zu bestücken und anschließend erst die elek trischen Bauelemente. In diesem Fall wird dann die hoch schmelzende Lotpaste für die Kühlkörperelemente und die nied rigschmelzende Lotpaste für die Bauelemente verwandt.First, the circuit board 3 is provided on the conductor tracks 13 a, 13 b, 13 c of the top in a known manner with a solder paste. Subsequently, the electronic power components 10 a, 10 b, 10 c and possibly other electrical / electronic components, not shown, are placed on the solder paste with an SMD component and placed in a reflow soldering oven with the conductor tracks 13 a, 13 b, 13 c soldered. Since at the same time the connections 16 a, 16 b, 16 c can be soldered to the connecting conductor tracks 19 a, 19 b, 19 c. Subsequently, the circuit board is turned over and now with the underside 5 facing upwards on the large-area conductor tracks 14 a, 14 b, 14 c, provided with solder paste and then fed again to a 510 pick-and-place device, which is now the heat sink elements 15 a, 15 b, 15 c deposits as SMD components on the conductor tracks 14 a, 14 b, 14 c provided with the solder paste. The side of the heat sink elements facing the conductor tracks 14 a, 14 b, 14 c is coated with tin in order to achieve improved solderability. The heat sink elements are then soldered to the conductor tracks 14 a, 14 b, 14 c by reflow reflow soldering. In order to prevent the components 10 a, 10 b and 10 c already soldered onto the circuit board from falling off on the upper side 4 of the circuit board which points downward in the second reflow soldering process due to their weight, solder pastes with different melting points for the upper side and Subpage can be used. For example, it is easily seen that the electrical / electronic components 10 a, 10 b, IQc are soldered onto the upper side 4 with a high-melting solder paste and the heat sink elements 15 a, 15 b, 15 c are soldered onto the lower side 5 with a low-melting solder paste. When reflow soldering the heat sink elements, a temperature is then set above the melting point of the low-melting solder paste but below the melting point of the high-melt solder paste in the reflow soldering furnace. As a result, the solder connection of the components 10 a, 10 b, 10 c is not melted again. If necessary, the upper side 4 can be cooled during the second reflow soldering process in order to avoid re-melting of the soldered connections. Of course, it is also possible to first fit the heat sink elements onto the circuit board and only then the electrical components. In this case, the high-melting solder paste is used for the heat sink elements and the low-melting solder paste for the components.
Nach der Fertigstellung der mit den Bauelementen und Kühlkör perelementen bestückten Leiterplatte 2 wird diese in das wan nenförmige Gehäuse 2 derart eingesetzt, daß die Bauelemente 10a, 10b, 10c der Gehäusewand 20 zugewandt sind und die Kühl körperelemente 15a, 15b, 15c der Ausnehmung 24. Anschließend wird der Gehäuseinnenraum mit einer elektrisch isolierenden und wärmeleitenden Vergußmasse 6 ausgegossen. Als Vergußmasse dient beispielsweise Epoxidharz oder Silikon. Wie in der Fi gur erkennbar ist, wird das mit der Kühlfahne 11b des Bauele mentes 10b elektrisch verbundene Kühlkörperelement 15b dabei vollständig in die Vergußmasse eingebettet, während die mit den Bauelementen 10a und 10c verbundenen Kühlkörperelemente 15a und 15c mit einem Abschnitt 18a bzw. 18c aus der Verguß masse 6 herausragen. Der von der Leiterplatte abgewandte Ab schnitt 18a des Kühlkörperelementes 15a ist als ebene Fläche ausgestaltet, während der Abschnitt 18c des Kühlkörperelemen tes 15c zusätzlich mit Kühlrippen versehen ist, die durch die Öffnung 24 in den Außenraum abstehen. Durch die aus der Ver gußmasse ragenden Abschnitte 18a, 18c der Kühlkörperelemente 15a, 15c wird eine besonders wirksame Wärmeabgabe an die Umge bung des Steuergerätegehäuses erreicht, wobei diese Abgabe im Fall des Kühlkörperelementes 15c durch die Kühlrippen noch etwa effektiver ist. Wie in der Figur erkennbar ist, ist der Kühlkörper 15b des Bauelementes 10b vor einem Kurzschluß mit den Kühlkörperelementen 15a, 15c der Bauelemente 10a, 10c durch die elektrisch isolierende Vergußmasse geschützt. Auf diese Weise können alle Kühlkörperelemente von Bauelementen, die auf unterschiedlichem Potential liegen vollständig in die Vergußmasse eingebettet werden, während die Kühlkörperelemen te von nicht potentialführenden Bauelementen oder solchen Bauelementen, die auf gleichem Potential liegen, aus der Ver gußmasse herausragen können. Abweichend von dem in der Figur gezeigten Ausführungsbeispiel ist es außerdem möglich, auf solche Leiterbahnen der Leiterplattenunterseite, welche be nachbarten Bauelementen zugeordnet sind, deren Gehäuse auf gleichem elektrischen Potential liegt, ein gemeinsames Kühl körperelement aufzulöten.After completion of the circuit board with the components and Kühlkör perelements 2 this is inserted into the tub-shaped housing 2 such that the components 10 a, 10 b, 10 c of the housing wall 20 are facing and the cooling body elements 15 a, 15 b, 15 c of the recess 24 . The interior of the housing is then poured out with an electrically insulating and heat-conductive casting compound 6 . For example, epoxy resin or silicone is used as the potting compound. As can be seen in the fi gure, the heat sink element 15 b electrically connected to the cooling lug 11 b of the component 10 b is completely embedded in the sealing compound, while the heat sink elements 15 a and 15 c connected to the components 10 a and 10 c with a section 18 a or 18 c protrude from the sealing compound 6 . From the circuit board facing away from section 18 a of the heat sink element 15 a is designed as a flat surface, while the section 18 c of the Kühlkörperelemen tes 15 c is additionally provided with cooling fins which protrude through the opening 24 into the outside space. Due to the protruding from the casting compound sections 18 a, 18 c of the heat sink elements 15 a, 15 c, a particularly effective heat emission to the environment surrounding the control unit housing is achieved, this emission being even more effective in the case of the heat sink element 15 c by the cooling fins. As can be seen in the figure, the heat sink 15 b of the component 10 b is protected from a short circuit with the heat sink elements 15 a, 15 c of the components 10 a, 10 c by the electrically insulating casting compound. In this way, all heat sink elements of components that are at different potential can be completely embedded in the sealing compound, while the heat sink elements of non-potential-carrying components or components that are at the same potential can protrude from the casting compound. Deviating from the embodiment shown in the figure, it is also possible to solder a common cooling element to such conductor tracks on the underside of the circuit board, which are assigned to adjacent components whose housing is at the same electrical potential.
Wie in der einzigen Figur zu erkennen ist, erfolgt eine Wär meableitung der von den Bauelementen 10a, 10b, 10c erzeugten Wärme nicht nur über die Durchkontaktierungen 17a, 17b, 17c sondern auch über die Vergußmasse 6, so daß eine wirksame Kühlung der Bauelemente gegeben ist.As can be seen in the single figure, there is a heat dissipation of the heat generated by the components 10 a, 10 b, 10 c not only via the plated-through holes 17 a, 17 b, 17 c but also via the sealing compound 6 , so that a effective cooling of the components is given.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1999110500 DE19910500A1 (en) | 1999-03-10 | 1999-03-10 | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1999110500 DE19910500A1 (en) | 1999-03-10 | 1999-03-10 | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19910500A1 true DE19910500A1 (en) | 2000-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1999110500 Ceased DE19910500A1 (en) | 1999-03-10 | 1999-03-10 | Electrical device such as control device with printed circuit board having heat generating components, has heat sink elements located for easy soldering to printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19910500A1 (en) |
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