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DE19632115C1 - Combination chip module for smart cards allowing both contacting- and contactless communication with external data station - Google Patents

Combination chip module for smart cards allowing both contacting- and contactless communication with external data station

Info

Publication number
DE19632115C1
DE19632115C1 DE19632115A DE19632115A DE19632115C1 DE 19632115 C1 DE19632115 C1 DE 19632115C1 DE 19632115 A DE19632115 A DE 19632115A DE 19632115 A DE19632115 A DE 19632115A DE 19632115 C1 DE19632115 C1 DE 19632115C1
Authority
DE
Germany
Prior art keywords
carrier
chip module
contact surfaces
combination chip
conductor tracks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19632115A
Other languages
German (de)
Inventor
Michael Huber
Peter Stampka
Manfred Fries
Josef Heitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19632115A priority Critical patent/DE19632115C1/en
Priority to PCT/DE1997/001496 priority patent/WO1998007191A1/en
Application granted granted Critical
Publication of DE19632115C1 publication Critical patent/DE19632115C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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Abstract

This invention concerns a combination chip module for transmission of electrical signals or data with or without contact to an external read-write station with an elongation-resistant, electrically insulated substrate (2), on or in which one or more integrated semiconductor circuits are arranged. The circuits are connected, via connecting terminals (6), a) to one or more couplers of an interface circuit which is either separate orin integrated form and provided in the chip module (1), which interface circuit enables contactless bidirectional data communication between the chip module (1) and the external read-write station, and b) to electrically conducting contact surfaces (8) provided on one side of the substrate (2), which contact surfaces (8) enable bidirectional data communication with contact, between the chip module (1) and the external read-write station. The one or more couplers have metal printed conductors which are also formed on the side of the substrate (2) facing the contact surfaces (8).

Description

Die Erfindung bezieht sich auf ein Kombinations-Chipmodul nach dem Oberbegriff des Patentanspruchs 1, ein Verfahren zur Herstellung eines Kombinations-Chipmoduls nach dem Oberbe­ griff des Patentanspruchs 13, sowie die Verwendung derartiger Kombinations-Chipmodule in Chipkarten.The invention relates to a combination chip module according to the preamble of claim 1, a method for Production of a combination chip module according to the Oberbe handle of claim 13, and the use of such Combination chip modules in chip cards.

Chipmodule werden bei der Herstellung von Chipkarten als fer­ tigungstechnisch abgeschlossene Zwischenerzeugnisse produ­ ziert und unabhängig zu Enderzeugnissen weiter verarbeitet. Unter einem Chipmodul wird hierbei eine Anordnung verstanden, bei der auf oder in einem elektrisch isolierenden Träger eine oder mehrere integrierte Halbleiterschaltungen in Form von Chips oder integrierten Schaltkreisen angeordnet sind, die mit einem auf einer Seite oder auf beiden Seiten des Trägers vorgesehenen Leiterbahnsystem über Verwendungsanschlüsse ver­ bunden sind, wobei der Träger in der Regel einen flexiblen Film darstellt, auf dem der eigentliche Halbleiterchip mon­ tiert wird, und auf welchem sich die meist vergoldeten Kon­ taktflächen der Chipkarte befinden. Unter einer Kombinations-Chipkarte bzw. einem Kombinations-Chipmodul wird eine Anord­ nung verstanden, welche sowohl für eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation erlaubt, und welche zu diesem Zweck neben den für eine kontaktbehaftete Übertragung dienenden Kontaktflächen darüber hinaus mit den zur kontakt­ losen Übertragung von Signalen benötigten Bauelementen wie Übertragungsspulen oder Kondensatorplatten ausgestattet sind. Neben den derzeit typischen Anwendungsfeldern solcher Chip­ karten in der Form von Krankenversichertenkarten, Gleitzei­ terfassungskarten, Telefonkarten und dergleichen ergeben sich zukünftig insbesondere Anwendungen im öffentlichen Personen­ nahverkehr, Skilift, Freibad, usw., wo in möglichst kurzer Zeit möglichst viel Personen erfaßt werden müssen. Bei sol­ chen Anwendungen bietet die kontaktlose Übertragung von elek­ trischen Signalen gegenüber der Kontaktbehafteten den Vor­ teil, daß gegenüber der ersteren Möglichkeit die Chipkarte nicht unbedingt in die Lese-Schreibstation eingeführt werden muß, sondern berührungslos über eine Entfernung von bis zu einigen Metern funktioniert. Die kontaktlose Signalübertra­ gung erfordert jedoch aufwendige Schaltungen mit Koppelele­ menten, die eine Signalübertragung ermöglichen, wobei sich wegen der flachen Bauform der Chipkarte am ehesten die kapa­ zitive und die induktive Kopplung eignen. Derzeit erfolgt bei den meisten kontaktlosen Karten die Übertragung auf indukti­ vem Wege, mit dem sich sowohl die Daten wie auch die Energie­ übertragung realisieren lassen. Hierbei sind im Kartenkörper eine oder mehrere Induktionsspulen integriert ausgebildet, die auf geeignete Weise mit der auf dem Halbleiterchip be­ findlichen Schaltung kontaktiert sind. Die Übertragung von elektrischen Signalen erfolgt nach dem Prinzip des lose ge­ koppelten Transformators, wobei die Trägerfrequenz beispiels­ weise im Bereich zwischen 100 und 300 kHz oder bei einigen MHz, insbesondere der Industriefrequenz von 13,56 MHz liegt. Hierfür werden Induktionsspulen mit einem gegenüber der Grundfläche des Halbleiterchips von in der Größenordnung etwa 10 mm² wesentlich größeren Spulenflächen von typischerweise etwa 30 bis 40 cm² benötigt, wobei die Induktionsspule in der Regel nur wenige Windungen aufweist und flach ausgebildet ist. Bei den derzeit auf dem Markt verfügbaren Kombinations-Chipkarten bzw. Kombinations-Chipmodulen ist es bekannt, zum einem geätzte Spulen innerhalb einer Inlettfolie, und zum An­ deren gewickelte Spulen innerhalb einer Inlettfolie oder ge­ wickelte Spulen innerhalb des Kartenkörpers vorzusehen, die durch geeignete Verbindungstechniken mit dem Chipmodul elek­ trisch verbunden werden müssen. Bei einer weiteren bekannten Möglichkeit zur Herstellung einer Kombinations-Chipkarte wer­ den die Windungen der Induktionsspule unmittelbar vom Halb­ leiterchip abgestützt und mit diesem verbunden.Chip modules are used as fer in the production of chip cards Completed intermediate products produc adorned and processed independently to end products. A chip module is understood to mean an arrangement in which on or in an electrically insulating carrier or several semiconductor integrated circuits in the form of Chips or integrated circuits are arranged that with one on one side or on both sides of the carrier provided interconnect system via usage connections ver are bound, the carrier usually a flexible Represents film on which the actual semiconductor chip mon tiert, and on which the mostly gold-plated Kon tact areas of the chip card. Under a combination chip card or a combination chip module becomes an arrangement understood, which for both a contactless as well a contact-based transmission of electrical signals or data to a read / write station, and which to this purpose in addition to that for contact transmission serving contact areas also with those for contact components such as Transmission coils or capacitor plates are equipped. In addition to the currently typical application fields of such chips cards in the form of health insurance cards, floating time acquisition cards, telephone cards and the like arise future applications in particular in public persons Local transport, ski lift, swimming pool, etc., where possible in the shortest possible time  Time as many people as possible must be recorded. With sol Applications are the contactless transmission of elek trical signals to the contact person part that the chip card compared to the former not necessarily be inserted into the read / write station must, but contactlessly over a distance of up to a few meters works. The contactless signal transmission However, supply requires complex circuits with coupling elements elements that enable signal transmission, whereby due to the flat design of the chip card, the kapa is most likely citive and inductive coupling are suitable. Is currently taking place at most contactless cards transfer to indukti vem ways in which both the data and the energy let the transfer be realized. Here are in the card body one or more induction coils are integrated, which be in a suitable manner with that on the semiconductor chip sensitive circuit are contacted. The transfer of electrical signals are based on the principle of loose ge coupled transformer, the carrier frequency for example wise in the range between 100 and 300 kHz or with some MHz, especially the industrial frequency of 13.56 MHz. For this purpose, induction coils are compared with one Base area of the semiconductor chip of about the order of magnitude 10 mm² much larger coil areas of typically needs about 30 to 40 cm², the induction coil in the Usually has only a few turns and is flat is. With the combination chip cards currently available on the market or combination chip modules, it is known to an etched spool inside a ticking foil, and to whose wound coils within a ticking foil or ge provided coils inside the card body to provide the through suitable connection technologies with the chip module elek must be connected trically. Another known one Possibility of producing a combination chip card who the turns of the induction coil directly from the half conductor chip supported and connected to this.

Aus der EP 0710919 A2 ist ein kontaktloses Chipmodul mit einer draht­ gewickelten Spule bekannt geworden, die selbsttragend ist und den Träger für den integrierten Schaltkreis bildet. Allen derzeit verfügbaren Kombinations-Chipkarten bzw. Kombinati­ ons-Chipmodulen gemeinsam sind die auf Grund der relativ kom­ plexen Herstellungsverfahren hohen Kosten, die nicht von al­ len gewünschten Anwendungsbereichen getragen werden können.EP 0710919 A2 describes a contactless chip module with a wire  wound coil became known, which is self-supporting and forms the carrier for the integrated circuit. Everyone Combination chip cards or Kombinati currently available ons chip modules are common due to the relatively com complex manufacturing processes high costs that are not of al len desired areas of application can be worn.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Kombinations-Chipmodul insbesondere zur Verwendung in einer Chipkarte für sowohl eine kontaktlose als auch eine kontakt­ behaftete Übertragung von elektrischen Signalen bzw. Daten an eine Lese-Schreibstation zur Verfügung zu stellen, welche ge­ genüber den bisherigen Kombinations-Chipkarten bzw. Kombina­ tions-Chipkarten-Modulen wesentlich einfacher und damit ko­ stengünstiger hergestellt werden kann.The present invention is based on the object Combination chip module in particular for use in a Chip card for both a contactless and a contact affected transmission of electrical signals or data to provide a read-write station, which ge compared to the previous combination chip cards or Kombina tion chip card modules much easier and therefore ko can be manufactured more cheaply.

Diese Aufgabe wird durch ein Kombinations-Chipmodul gemäß An­ spruch 1 und ein Verfahren zur Herstellung eines Kombinati­ ons-Chipmoduls gemäß Anspruch 13 gelöst.This task is performed by a combination chip module according to An Proverb 1 and a method for producing a Kombinati solved ons chip module according to claim 13.

Erfindungsgemäß ist vorgesehen, daß das oder die mehreren Koppelelemente metallische Leiterbahnen aufweisen, die gleichfalls auf der den Kontaktflächen zugewiesenen Seite des Trägers ausgebildet sind. Dem Prinzip der Erfindung folgend kann hierbei vorgesehen sein, daß die Leiterbahnen des oder der mehreren Koppelelemente und die metallischen Kontaktflä­ chen in der gleichen Ebene angeordnet und aus demselben Mate­ rial bzw. denselben Materialien gefertigt sind.According to the invention it is provided that the one or more Coupling elements have metallic interconnects that likewise on the side of the Carrier are formed. Following the principle of the invention can be provided here that the conductor tracks of the or of the several coupling elements and the metallic contact surface  arranged in the same plane and made of the same mate rial or the same materials are made.

Durch kostenreduzierendes Gestalten bei Erzielung einer Mul­ tifunktionalbauweise werden erfindungsgemäß die Leiterbahnen des Koppelelementes sonach auf die Kontaktseite des Chipkar­ ten-Moduls verlagert. Eine besonders einfach und kostengün­ stig herzustellende Anordnung ergibt sich hierbei, wenn der Träger auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen des oder der mehreren Koppelelemente und die Kontaktflächen durch Strukturierung vorzugsweise vermittels Ätzprozessen un­ ter Verwendung geeigneter Ätzmasken in einem Arbeitsgang ge­ fertigt werden.Through cost-reducing design when achieving a Mul According to the invention, the conductor tracks are tifunctional of the coupling element accordingly on the contact side of the Chipkar ten module. A particularly simple and inexpensive Stig to be produced arrangement results when the Carrier on one side with a thin, continuous Metal coating is provided, from which the conductor tracks of the one or more coupling elements and the contact surfaces by structuring, preferably by means of etching processes ter using suitable etching masks in one operation be manufactured.

Die Erfindungskonzeption bringt folgende wesentliche Vorteile gegenüber dem Stand der Technik mit sich:The concept of the invention brings the following significant advantages compared to the state of the art:

  • - durch die Verlagerung der Leiterbahnen des wenigstens einen Koppelelementes auf die Seite der Kontaktflächen des Chip­ moduls eröffnet sich die Möglichkeit der gleichzeitigen Fertigung dieser beiden Bestandteile und damit eine erheb­ liche Einsparung von Herstellkosten;- By shifting the conductor tracks of the at least one Coupling element on the side of the contact surfaces of the chip module opens up the possibility of simultaneous Manufacturing of these two components and thus a significant saving of manufacturing costs;
  • - es besteht maximale Designfreiheit beim Layout sowohl der metallischen Leiterbahnen, als auch des Kontaktflächenbe­ reiches;- There is maximum design freedom in the layout of both metallic conductor tracks, as well as the contact area rich;
  • - auch relativ große Halbleiterchips bzw. integrierte Schalt­ kreise sind einsetzbar;- Also relatively large semiconductor chips or integrated switching circles can be used;
  • - keine wesentlichen Mehrkosten für die Fertigung der Leiter­ bahnen für das wenigstens eine Koppelelement, da die zur Fertigung der Kontaktflächen benötigte Ätzmaske lediglich hinsichtlich des Layout-Designs geändert werden muß;- No significant additional costs for the manufacture of the ladder lanes for the at least one coupling element, since the to Manufacturing of the contact surfaces only required etching mask changes in layout design;
  • - mit Ausnahme der beiden Zusatzkontaktierungsschritte für den elektrischen Anschluß der metallischen Leiterbahnen des wenigstens einen Koppelelementes an die wenigstens eine integrierte Halbleiterschaltung sind keine Änderungen beim Ablauf des Fertigungsprozesses erforderlich; - with the exception of the two additional contacting steps for the electrical connection of the metallic conductor tracks of the at least one coupling element to the at least one integrated semiconductor circuit are no changes in the Sequence of the manufacturing process required;  
  • - durch die Verlagerung des Koppelelementes an die Außenseite des Chipmoduls kann eine kompakte Anordnung mit minimalster Bauhöhe erzielt werden;- by moving the coupling element to the outside The chip module can have a compact arrangement with minimal Height can be achieved;
  • - vor der endgültigen, abschließenden Formgebung ist ein dy­ namischer und statischer Funktionstest möglich, was beson­ ders bei Verwendung von Endlosfilmen als Träger wichtig ist, da zugleich Handling und Aussondern defekter Chipmodu­ le erleichtert wird.- before the final, final shaping is a dy Named and static function test possible, which particular important when using continuous film as a carrier is because at the same time handling and sorting out defective chip modules le is relieved.

Die Erfindung betrifft ferner auch Chipmodul-Einheiten, die aus mehreren hintereinander und/oder nebeneinander in glei­ chen Abständen angeordneten Chipmodulen mit gemeinsamen Trä­ ger, vorzugsweise einem streifenförmigen Träger, bestehen; derartige Chipmodul-Einheiten zeichnen sich durch besonders erleichtertes Handling und Vorteile beim elektrischen Funkti­ onstest aus.The invention also relates to chip module units which from several in a row and / or side by side in the same Chen intervals arranged chip modules with common Trä ger, preferably a strip-shaped carrier exist; Chip module units of this type are particularly notable easier handling and advantages with the electric radio onstest off.

Die Erfindung erstreckt sich ferner auch auf entsprechende Chipkarten, die erfindungsgemäße Chipmodule bzw. Chipmodul-Einheiten enthalten. Durch Verwendung von natürlichen Werk­ stoffen, beispielsweise Pappe, Papier oder Textilmaterialien für die Herstellung des Kartenkörpers kann im Gegensatz zur Verwendung von Kunststoffmaterialien der Preis pro Chipkarte weiterhin deutlich reduziert werden.The invention also extends to corresponding Chip cards, the chip modules or chip module units according to the invention contain. By using natural work fabrics, for example cardboard, paper or textile materials for the manufacture of the card body, in contrast to Use of plastic materials the price per chip card continue to be significantly reduced.

Für den bevorzugten Anwendungsbereich der erfindungsgemäßen Chipmodule für Chipkarten wird ein Träger verwendet, der in Form eines endlosen Streifens oder entsprechender Streifenab­ stände eingesetzt wird und aus dem die Chipmodule nach der Fertigstellung auf die endgültige Form ausgestanzt werden. Besonders günstig ist hierbei die Verwendung endloser Träger­ filmstreifen, die beiderseits eine Randperforation aufweisen und sich besonders vorteilhaft für die Serienproduktion der Chipmodule eignen, da sie die Positionierung in automatisier­ ten Produktionsvorrichtungen erleichtern. Alternativ dazu kann der Träger auch in Bogenform verwendet werden, wobei dann die Chipmodule gegebenenfalls auch in mehreren paralle­ len Reihen vorgesehen werden, aus denen im letzten Herstel­ lungsschritt einzelne Chipmodule bzw. auch Chipmoduleinheiten mit mehreren Chipmodulen ausgeschnitten oder ausgestanzt wer­ den können.For the preferred field of application of the invention Chip modules for chip cards use a carrier that is in In the form of an endless strip or equivalent strip stands and from which the chip modules after the Completion can be punched out to the final shape. The use of endless carriers is particularly favorable here film strips that have an edge perforation on both sides and is particularly advantageous for series production of the Chip modules are suitable because they are used in automated positioning facilitate production devices. Alternatively the carrier can also be used in the form of an arch, whereby then the chip modules if necessary also in several parallel  len rows are provided, from which in the last manuf individual chip modules or chip module units who cut or punched out with several chip modules that can.

Geeignete Materialien für den Träger sind beispielsweise Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Po­ lyparabansäure (PPA), Polyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial. Der Träger weist, sofern er in Form eines elastischen, flexiblen Trägerfilms eingesetzt wird, günstigerweise eine Dicke im Be­ reich von etwa 25 µm bis etwa 200 µm auf.Suitable materials for the carrier are, for example Epoxy resin, polyimide, polyester, polyethersulfone (PES), Po lyparabanic acid (PPA), polyvinylchloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like high impact thermoplastic material. Of the Carrier points, provided it is in the form of an elastic, flexible Carrier film is used, advantageously a thickness in the loading range from about 25 µm to about 200 µm.

Insbesondere bei der Verwendung von Endlosstreifen (Tapes) für den Träger ist es aus produktionstechnischen Gründen be­ sonders günstig, wenn der Träger auf einer Seite mit einer Metallfolie, insbesondere einer Kupferfolie beschichtet ist, aus welcher durch Strukturierung vermittels an sich bekannter Halbleitertechnologieverfahren sowohl die Leiterbahnen des Koppelelementes, als auch die Kontaktflächen gefertigt wer­ den. Besonders kostengünstig kann dies durch strukturiertes Ätzen der Metallfolie unter Einsatz einer geeignet entworfe­ nen Ätzmaske erfolgen, günstigerweise bereits auf Seiten des Herstellers des Endlosfilm-Trägerbandes.Especially when using endless strips (tapes) for the wearer it is be for production reasons particularly cheap if the carrier on one side with a Metal foil, in particular a copper foil is coated, from which is known per se by structuring Semiconductor technology processes both the conductor tracks of the Coupling element, as well as the contact surfaces who made the. This can be done particularly cost-effectively through structured Etch the metal foil using a suitable design NEN etching mask, advantageously already on the part of the Manufacturer of the continuous film carrier tape.

Aus produktionstechnischen Gründen und im Sinne optimaler elektrischer Eigenschaften sowie möglichst langer Lebensdauer kann die auf der einen Seite des Trägers vorgesehene Metall­ beschichtung auch aus mehreren unterschiedlichen dünnen Me­ tallagen bestehen, wobei wenigstens eine Lage der Beschich­ tung insbesondere Kupfer aufweist. Ein bevorzugter Schicht­ aufbau einer solchen Metallbeschichtung kann, ausgehend von der äußeren Kontaktseite des Chipmoduls bis zur Chipseite, beispielsweise folgendermaßen aussehen: eine dünne, bei­ spielsweise 0,1 µm starke, bondfähige Au-Schicht, eine etwa 3 µm bis 5 µm dünne, als Diffusionsbarriere gegen Kupfer wir­ kende Ni-Schicht, ein strukturgeätztes Kupfer-Band der Stärke von vorzugsweise 15 µm bis 70 µm; der eigentliche Träger in Form eines Kunststoffbandes der Stärke von beispielsweise 100 µm, vorzugsweise aus Epoxialharz, Kapton und dergleichen; so­ wie eine etwa 0,1 µm dünne bondfähige Schicht in den Ausspa­ rungen bzw. Bondlöchern der Kunststoff-Trägerschicht, bei­ spielsweise bestehend aus Au, AuCo, Ag und dergleichen.For technical reasons and in the sense of optimal electrical properties and the longest possible service life can the metal provided on one side of the carrier coating also from several different thin Me tallagen exist, at least one layer of the coating tion particularly copper. A preferred layer Building such a metal coating can, starting from the outer contact side of the chip module to the chip side, for example look like this: a thin, at for example 0.1 µm thick, bondable Au layer, about 3 µm up to 5 µm thin, as a diffusion barrier against copper  Ni layer, a structure-etched copper tape of strength from preferably 15 µm to 70 µm; the actual carrier in Shape of a plastic tape with a thickness of, for example, 100 µm, preferably made of epoxy resin, Kapton and the like; like this like an approximately 0.1 µm thin bondable layer in the recess stanchions or bond holes of the plastic carrier layer, at for example consisting of Au, AuCo, Ag and the like.

Um elektrische Kurzschlüsse beim Auflegen des Chipmoduls auf leitende Oberflächen, beispielsweise Kontaktspitzen der ex­ ternen Lese-Schreibstation zu vermeiden, kann optional wenig­ stens ein Teil der Modulkontaktseite mit elektrisch isolie­ renden Lack durch geeignete Fertigungsschritte überzogen wer­ den. Zweckmäßigerweise sind hierbei insbesondere die Leiter­ bahnen des wenigstens einen Koppelelementes auf ihrer dem Träger abgewandten Oberfläche mit einer elektrisch isolieren­ den Schutzschicht überzogen.To detect electrical short circuits when placing the chip module on conductive surfaces, for example contact tips of the ex Avoiding a remote read / write station can optionally do little at least part of the module contact side with electrical insulation coating is covered by suitable manufacturing steps the. The conductors are particularly expedient here paths of the at least one coupling element on their Electrically isolate the surface facing away from the carrier covered the protective layer.

Der elektrische Anschluß der integrierten Halbleiterschal­ tungen an die Leiterbahnen des Koppelelementes und/oder der Kontaktflächen kann an sich nach beliebigen, bekannten Ver­ fahren erfolgen, insbesondere durch Drahtbonden (Wire-Bon­ ding), durch automatisiertes Filmbonden (TAB, Tape Automated Bonding) oder durch Oberflächenbefestigung von integrierten SMD-(Surface Mounted Device)-Halbleiterschaltungen. Im Sinne einer möglichst kostengünstigen Herstellung wird einer Kon­ taktierung vermittels Bonddrähten mit den Verbindungsan­ schlüssen der integrierten Halbleiterschaltungen der Vorzug gegeben, wobei in diesem Falle im Träger Bondlöcher ausgebil­ det sind, durch welche die Bonddrähte geführt sind.The electrical connection of the integrated semiconductor scarf lines to the conductor tracks of the coupling element and / or Contact areas can in itself according to any known Ver drive, in particular by wire bonding (wire bon thing), through automated film bonding (TAB, Tape Automated Bonding) or by surface mounting of integrated SMD (Surface Mounted Device) semiconductor circuits. For the purpose of the cheapest possible production is a Kon clocking by means of bond wires with the connection prefer the semiconductor integrated circuits given, in which case bond holes are formed in the carrier are det, through which the bond wires are guided.

Bei einer besonders bevorzugten Ausbildung der Erfindung ist vorgesehen, daß das oder die mehreren Koppelelemente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halbleiterschaltun­ gen tragenden Halbleiterchips größeren Spulenumfang aufwei­ sen, und die Leiterbahnen der Induktionsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen angeordnet sind. Besonders günstige geometri­ sche Verhältnisse liegen hierbei vor, wenn die Enden der Lei­ terbahnen zu Kontaktanschlüssen verbreitert sind, welche in­ nerhalb der von den Kontaktflächen beanspruchten Grundfläche liegen.In a particularly preferred embodiment of the invention provided that the one or more coupling elements Induction coil with a compared to the outer dimensions one of the one or more integrated semiconductor circuits against larger semiconductor chips on larger coil size sen, and the strip conductors of the induction coil  side by side, free of crossings and adjacent to the Contact areas are arranged. Particularly favorable geometri cal ratios are present when the ends of the lei tracks are widened to contact connections, which in within the base area occupied by the contact areas lie.

Weitere Merkmale, Vorteile und Zweckmäßigkeiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung eines Ausfüh­ rungsbeispieles der Erfindung anhand der Zeichnung. Es zeigt:Further features, advantages and advantages of the invention result from the following description of an embodiment Example of the invention with reference to the drawing. It shows:

Fig. 1 eine schematische Schnittdarstellung eines Kombinati­ ons-Chipmoduls zur Verwendung in einer Kombinations-Chipkarte gemäß einem Ausführungsbeispiel der Erfin­ dung; Figure 1 is a schematic sectional view of a Kombinati ons chip module for use in a combination chip card according to an embodiment of the inven tion.

Fig. 2 eine vergrößerte Darstellung der Einzelheit X aus Fig. 1; und FIG. 2 shows an enlarged representation of the detail X from FIG. 1; and

Fig. 3 eine schematische Unteransicht eines Kombinations-Chipmoduls nach dem Ausführungsbeispiel der Erfin­ dung. Fig. 3 is a schematic bottom view of a combination chip module according to the embodiment of the inven tion.

Das in den Fig. 1 bis 3 dargestellte Ausführungsbeispiel der Erfindung umfaßt ein Kombinations-Chipmodul 1 für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine (nicht näher dargestellte) externe Lese-Schreibstation, mit einem dehnfe­ sten, elektrisch isolierenden Kunststoffträger 2, auf dem vermittels einer Klebe- bzw. Haftschicht 3 ein vorzugsweise aus Silizium-Grundmaterial bestehender Halbleiterchip 4 befe­ stigt ist, auf dessen Hauptoberfläche 5 wenigstens eine (nicht näher dargestellte) integrierte Halbleiterschaltung ausgebildet ist, die über Verbindungsanschlüsse 6 in der Form von auf der Hauptoberfläche 5 ausgebildeter elektrisch lei­ tender Padflächen und daran befestigter Bonddrähte 7 mit auf einer Seite des Trägers 2 vorgesehenen elektrisch leitenden Kontaktflächen 8 dauerhaft verbunden sind. Die Kontaktflächen 8 sind in ihren Abmessungen und Anordnungen nach vorgegebenen ISO-Standardvorgaben ausgebildet und dienen zur kontaktbehaf­ teten Übertragung von elektrischen Signalen an eine mit Kon­ taktspitzen ausgestattete externe Lese-Schreibstation. Eben­ falls auf der den Kontaktflächen 8 zugewiesenen Seite des Trägers 2 und in der gleichen Ebene angeordnet und aus dem­ selben Material gefertigt sind metallische Leiterbahnen 9, die die Windungen einer Induktionsspule 10 mit einem gegen­ über den äußeren Abmessungen des Halbleiterchips 4 größeren Spulenumfang darstellen, wobei die Leiterbahnen 9 der Induk­ tionsspule 10 streifenförmig nebeneinander liegend, kreu­ zungsfrei und benachbart zu den Kontaktflächen 8 angeordnet sind, wie dies insbesondere aus der Rückansicht gemäß Fig. 3 ersichtlich ist. Die Enden der Leiterbahnen 9 sind zu Kon­ taktanschlüssen 11 (Anschlußpads der Spulen) verbreitert, welche innerhalb der von den Kontaktflächen 8 beanspruchten Grundfläche liegen. Über diese Kontaktanschlüsse 11 ist die Induktionsspule 10 elektrisch mit einer der wenigstens einen auf der Hauptoberfläche 5 des Halbleiterchips 4 ausgebildeten integrierten Halbleiterschaltung verbunden, vorzugsweise ebenfalls über Bonddrähte, welche in den Figuren der Über­ sichtlichkeit halber allerdings nicht näher dargestellt sind.The embodiment of the invention shown in FIGS . 1 to 3 comprises a combination chip module 1 for both a contactless and a contact-based transmission of electrical signals or data to an (not shown) external read / write station, with a dehnfe most, electrically insulating plastic carrier 2 , on which by means of an adhesive or adhesive layer 3 a preferably made of silicon base material semiconductor chip 4 is attached, on the main surface 5 of which at least one (not shown) integrated semiconductor circuit is formed, which via connection connections 6 in the Form of formed on the main surface 5 electrically conductive pad surfaces and attached bonding wires 7 are permanently connected to one side of the carrier 2 provided electrically conductive contact surfaces 8 . The contact surfaces 8 are designed in their dimensions and arrangements according to predetermined ISO standard specifications and are used for the contact-transmitting transmission of electrical signals to an external reader / writer equipped with contact tips. Even if arranged on the contact surfaces 8 side of the carrier 2 and in the same plane and made of the same material are metallic conductor tracks 9 , which represent the turns of an induction coil 10 with a larger than the outer dimensions of the semiconductor chip 4 coil circumference, wherein the conductor tracks 9 of the induction coil 10 are arranged in strips next to one another, cross-free and adjacent to the contact surfaces 8 , as can be seen in particular from the rear view according to FIG. 3. The ends of the conductor tracks 9 are widened to con tact connections 11 (connection pads of the coils), which lie within the base area claimed by the contact surfaces 8 . Via these contact connections 11 , the induction coil 10 is electrically connected to one of the at least one integrated semiconductor circuit formed on the main surface 5 of the semiconductor chip 4 , preferably also via bond wires, which are not shown in the figures for clarity.

Die Fig. 2 zeigt in einer vergrößerten Darstellung die Ein­ zelheit "X" gemäß Fig. 1 nähere Einzelheiten des Schichtauf­ baues von dem Träger 12 und der aus mehreren Einzellagen be­ stehenden Metallbeschichtung. Diese umfaßt etwa 0,1 µm star­ ke Au-, AuCo-, Ag- oder dergleichen Metallagen 12 und 13, eine etwa 15 µm bis etwa 70 µm starke Kupferfolie 14, sowie zu beiden Seiten der Kupferfolie 14 aufgebrachte, jeweils et­ wa 3 bis etwa 5 µm starke Ni-Schichten 15 und 16, welche als Diffusionsbarriere gegen Kupfer wirken. Zusätzlich sind die Leiterbahnen 9 sowie gegebenenfalls die Kontaktanschlüsse 11 der Induktionsspule auf ihrer dem Träger 2 abgewandten Ober­ fläche mit einer elektrisch isolierenden Schutzschicht 17 überzogen, beispielsweise einer Kunststoffschicht mit günsti­ gen tribologischen Eigenschaften. Fig. 2 shows an enlarged view of an individual "X" according to FIG. 1, more details of the layer structure of the carrier 12 and the metal coating consisting of several individual layers. This comprises approximately 0.1 μm thick Au, AuCo, Ag or similar metal layers 12 and 13 , an approximately 15 μm to approximately 70 μm thick copper foil 14 , and applied to both sides of the copper foil 14 , each approximately 3 to about 5 µm thick Ni layers 15 and 16 , which act as a diffusion barrier against copper. In addition, the conductor tracks 9 and, if appropriate, the contact connections 11 of the induction coil are coated on their upper surface facing away from the carrier 2 with an electrically insulating protective layer 17 , for example a plastic layer with favorable tribological properties.

Zum Schutz des mechanisch empfindlichen Halbleiterchips 4 kann ein den Halbleiterchip 4 umgebender Stützrahmen 17 vor­ gesehen sein, der vorzugsweise durch Klebeverbindung mit dem Träger 2 befestigt ist, wobei das Chipmodul 1 des weiteren mit einer den Halbleiterchip 4 und die Bonddrähte 7 überdeckende Verkapselung vorgesehen sein kann, welche schematisch mit dem Bezugszeichen 18 angedeutet ist.For protecting the mechanically sensitive semiconductor chip 4 is a semiconductor chip 4 surrounding support frame 17 can be seen before, which is preferably attached by adhesive bonding to the carrier 2, wherein the chip module 1 can be further provided with the semiconductor chip 4 and the bonding wires 7 covering encapsulation provided , which is indicated schematically by reference numeral 18 .

Claims (27)

1. Kombinations-Chipmodul für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Si­ gnalen bzw. Daten an eine externe Lese-Schreibstation, mit einem dehnfesten, elektrisch isolierenden Träger (2), auf oder in dem eine oder mehrere integrierte Halbleiterschaltun­ gen angeordnet sind, die über Verbindungsanschlüsse (6) zum Einen mit einem oder mehreren Koppelelementen einer separat oder in integrierter Form in dem Chipmodul (1) vorgesehenen Schnittstellenschaltung, welche eine kontaktlose bidirektio­ nale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermöglicht, und zum Anderen mit auf einer Seite des Trägers (2) vorgesehenen elektrisch lei­ tenden Kontaktflächen (8), welche eine kontaktbehaftete bidi­ rektionale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermöglicht, verbunden sind, dadurch gekennzeichnet, daß das oder die mehreren Koppelelemente metallische Leiterbahnen (9) aufweisen, die gleichfalls auf der den Kontaktflächen (8) zu­ gewiesenen Seite des Trägers (2) ausgebildet sind.1. Combination chip module for both a contactless and a contact-based transmission of electrical signals or signals to an external read / write station, with an expandable, electrically insulating carrier ( 2 ), arranged on or in which one or more integrated semiconductor circuits are via connection connections ( 6 ) on the one hand with one or more coupling elements of a separately or in an integrated form in the chip module ( 1 ) provided interface circuit, which enables contactless bidirectional data communication between the chip module ( 1 ) and the external read / write station, and on the other hand with on one side of the carrier ( 2 ) provided electrically conductive contact surfaces ( 8 ), which enables contact-based bidirectional data communication between the chip module ( 1 ) and the external read / write station, characterized in that the or the multiple coupling elements metallic L have pus tracks ( 9 ), which are also formed on the side of the carrier ( 2 ) facing the contact surfaces ( 8 ). 2. Kombinations-Chipmodul nach Anspruch 1, dadurch gekenn­ zeichnet, daß die Leiterbahnen (9) des oder der mehreren Koppelelemente und die metallischen Kontaktflächen (8) in der gleichen Ebene angeordnet und aus demselben Material bzw. denselben Materialien gefertigt sind.2. Combination chip module according to claim 1, characterized in that the conductor tracks ( 9 ) of the one or more coupling elements and the metallic contact surfaces ( 8 ) are arranged in the same plane and are made of the same material or the same materials. 3. Kombinations-Chipmodul nach Anspruch 1 oder 2, dadurch ge­ kennzeichnet, daß der Träger (2) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen ist, aus welcher die Leiterbahnen (9) des oder der mehreren Koppe­ lelemente und die Kontaktflächen (8) durch Strukturierung ge­ fertigt sind.3. Combination chip module according to claim 1 or 2, characterized in that the carrier ( 2 ) is provided on one side with a thin, continuous metal coating, from which the conductor tracks ( 9 ) of the one or more coupling elements and the contact surfaces ( 8 ) are made by structuring. 4. Kombinations-Chipmodul nach Anspruch 3, dadurch gekenn­ zeichnet, daß der auf seiner einen Seite mit der Metallbe­ schichtung versehene Träger (2) als Trägerfilm in Form eines endlosen Streifens oder eines entsprechenden Streifenab­ schnitts ausgebildet ist.4. Combination chip module according to claim 3, characterized in that the coating provided on one side with the metal coating carrier ( 2 ) is formed as a carrier film in the form of an endless strip or a corresponding stripe section. 5. Kombinations-Chipmodul nach einem der Ansprüche 1 oder 4, dadurch gekennzeichnet, daß der Träger (2) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Polyparabansäure (PPA), Polyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylnitril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hochschlagzähes Thermoplastmaterial besteht und gegebenen­ falls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt ist.5. Combination chip module according to one of claims 1 or 4, characterized in that the carrier ( 2 ) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinyl chloride (PVC), polycarbonate, Kapton and / or acrylonitrile-butadiene-styrene copolymer (ABS) or the like high-impact thermoplastic material and, if necessary, with a reinforcing material, in particular consisting of glass fibers. 6. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß der Träger (2) eine Stärke von etwa 25 µm bis etwa 200 µm besitzt.6. Combination chip module according to one of claims 1 to 5, characterized in that the carrier ( 2 ) has a thickness of about 25 microns to about 200 microns. 7. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 6, dadurch gekennzeichnet, daß die auf der einen Seite des Trä­ gers (2) angeordnete Metallbeschichtung Kupfer aufweist.7. Combination chip module according to one of claims 3 to 6, characterized in that on one side of the carrier ( 2 ) arranged metal coating has copper. 8. Kombinations-Chipmodul nach einem der Ansprüche 3 bis 7, dadurch gekennzeichnet, daß die auf der einen Seite des Trä­ gers (2) vorgesehene Metallbeschichtung aus mehreren dünnen Metallagen (12, 13) besteht.8. Combination chip module according to one of claims 3 to 7, characterized in that on one side of the carrier ( 2 ) provided metal coating consists of several thin metal layers ( 12 , 13 ). 9. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die Leiterbahnen (9) des oder der mehreren Koppelelemente auf ihrer dem Träger (2) abge­ wandten Oberfläche mit einer elektrisch isolierenden Schutz­ schicht (17) überzogen sind.9. Combination chip module according to one of claims 1 to 8, characterized in that the conductor tracks ( 9 ) of the one or more coupling elements on their the carrier ( 2 ) abge facing surface with an electrically insulating protective layer ( 17 ) are coated. 10. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß die elektrisch leitenden Kon­ taktflächen (8) und/oder die Leiterbahnen (9) des oder der mehreren Koppelelemente vermittels Bonddrähten mit den Ver­ bindungsanschlüssen (6) der einen oder mehreren integrierten Halbleiterschaltungen kontaktiert sind, wobei im Träger Bond­ löcher ausgebildet sind, durch welche die Bonddrähte geführt sind.10. Combination chip module according to one of claims 1 to 9, characterized in that the electrically conductive contact surfaces ( 8 ) and / or the conductor tracks ( 9 ) of the one or more coupling elements by means of bonding wires with the United connection terminals ( 6 ) of one or a plurality of integrated semiconductor circuits are contacted, wherein holes are formed in the carrier through which the bond wires are guided. 11. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß das oder die mehreren Koppelele­ mente eine Induktionsspule mit einem gegenüber den äußeren Abmessungen eines die eine oder mehreren integrierten Halb­ leiterschaltungen tragenden Halbleiterchips (4) größeren Spu­ lenumfang aufweist, und die Leiterbahnen (9) der Indukti­ onsspule streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen (8) angeordnet sind.11. Combination chip module according to one of claims 1 to 10, characterized in that the one or more Koppelele elements an induction coil with a compared to the outer dimensions of the one or more integrated semiconductor circuits carrying semiconductor chips ( 4 ) larger Spu len circumference, and the conductor tracks ( 9 ) of the induction coil are arranged in strips next to one another, free of crossings and adjacent to the contact surfaces ( 8 ). 12. Kombinations-Chipmodul nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß die Enden der Leiterbahnen (9) zu Kontaktanschlüssen (11) verbreitert sind, welche innerhalb der von den Kontaktflächen (8) beanspruchten Grundfläche lie­ gen.12. Combination chip module according to one of claims 1 to 11, characterized in that the ends of the conductor tracks ( 9 ) are widened to contact connections ( 11 ) which lie within the base area claimed by the contact surfaces ( 8 ). 13. Verfahren zur Herstellung eines Kombinations-Chipmoduls für sowohl eine kontaktlose als auch eine kontaktbehaftete Übertragung von elektrischen Signalen bzw. Daten an eine ex­ terne Lese-Schreibstation, mit den Schritten:
  • - Bestücken eines dehnfesten, elektrisch isolierenden Trägers (2), auf dem auf einer Seite elektrisch leitende Kontakt­ flächen (8) vorgesehen sind, mit einer oder mehreren inte­ grierten Halbleiterschaltungen,
  • - Ausbilden bzw. Anordnen wenigstens eines Koppelelementes einer separat oder in integrierter Form in dem Chipmodul (1) vorgesehenen Schnittstellenschaltung, welche eine kon­ taktlose bidirektionale Datenkommunikation zwischen dem Chipmodul (1) und der externen Lese-Schreibstation ermög­ licht,
  • - elektrisches Verbinden der wenigstens einen integrierten Halbleiterschaltung an die elektrisch leitenden Kontaktflä­ chen (8) und des wenigstens einen Koppelelementes über Ver­ bindungsanschlüsse (6), dadurch gekennzeichnet, daß das oder die mehreren Koppelelemente als metallische Leiter­ bahnen (9) auf der den Kontaktflächen (8) zugewiesenen Seite des Trägers (2) ausgebildet werden.
13. A method for producing a combination chip module for both contactless and contact-based transmission of electrical signals or data to an external read / write station, comprising the steps:
  • - Equipping an expandable, electrically insulating carrier ( 2 ), on the one side electrically conductive contact surfaces ( 8 ) are provided with one or more integrated semiconductor circuits,
  • - Forming or arranging at least one coupling element of an interface circuit provided separately or in an integrated form in the chip module ( 1 ), which enables contactless bidirectional data communication between the chip module ( 1 ) and the external read / write station,
  • - Electrical connection of the at least one integrated semiconductor circuit to the electrically conductive contact surfaces ( 8 ) and the at least one coupling element via Ver connection connections ( 6 ), characterized in that the one or more coupling elements as metallic conductors ( 9 ) on which the contact surfaces ( 8 ) assigned side of the carrier ( 2 ) are formed.
14. Verfahren nach Anspruch 13, dadurch gekennzeichnet, daß die Leiterbahnen (9) des wenigstens einen Koppelelementes und die metallischen Kontaktflächen (8) in der gleichen Ebene an­ geordnet und aus demselben Material bzw. denselben Materiali­ en gefertigt werden.14. The method according to claim 13, characterized in that the conductor tracks ( 9 ) of the at least one coupling element and the metallic contact surfaces ( 8 ) are arranged in the same plane and are made of the same material or the same materials. 15. Verfahren nach Anspruch 13 oder 14, dadurch gekennzeich­ net, daß der Träger (2) auf seiner einen Seite mit einer dünnen, durchgehenden Metallbeschichtung versehen wird, aus welcher die Leiterbahnen (9) des wenigstens einen Koppelele­ mentes und die Kontaktflächen (8) durch Strukturierung gefer­ tigt werden.15. The method according to claim 13 or 14, characterized in that the carrier ( 2 ) is provided on one side with a thin, continuous metal coating, from which the conductor tracks ( 9 ) of the at least one Koppelele element and the contact surfaces ( 8 ) be made by structuring. 16. Verfahren nach einem der Ansprüche 13 bis 15, dadurch ge­ kennzeichnet, daß der auf seiner einen Seite mit der Metall­ beschichtung versehene Träger (2) als Trägerfilm in Form ei­ nes endlosen Streifens oder eines entsprechenden Streifenab­ schnitts ausgebildet wird.16. The method according to any one of claims 13 to 15, characterized in that the on one side with the metal coating provided carrier ( 2 ) is formed as a carrier film in the form of egg nes endless strip or a corresponding stripe section. 17. Verfahren nach einem der Ansprüche 8 bis 11, dadurch ge­ kennzeichnet, daß der Träger (2) aus Epoxy-Harz, Polyimid, Polyester, Polyethersulfon (PES), Polyparabansäure (PPA), Po­ lyvinylclorid (PVC), Polycarbonat, Kapton und/oder Acrylni­ tril-Butadien-Styrol-Copolymer (ABS) oder dergleichen hoch­ schlagzähes Thermoplastmaterial gefertigt und gegebenenfalls mit einem Verstärkungsmaterial, insbesondere bestehend aus Glasfasern verstärkt wird.17. The method according to any one of claims 8 to 11, characterized in that the carrier ( 2 ) made of epoxy resin, polyimide, polyester, polyether sulfone (PES), polyparabanic acid (PPA), polyvinyl chloride (PVC), polycarbonate, Kapton and / or Acrylni tril-butadiene-styrene copolymer (ABS) or the like is made of high impact thermoplastic material and optionally reinforced with a reinforcing material, in particular consisting of glass fibers. 18. Verfahren nach einem der Ansprüche 13 bis 17, dadurch ge­ kennzeichnet, daß der Träger (2) eine Stärke von etwa 25 µm bis etwa 200 µm besitzt. 18. The method according to any one of claims 13 to 17, characterized in that the carrier ( 2 ) has a thickness of about 25 microns to about 200 microns. 19. Verfahren nach einem der Ansprüche 15 bis 18, dadurch ge­ kennzeichnet, daß die auf der einen Seite des Trägers (2) angeordnete Metallbeschichtung Kupfer aufweist.19. The method according to any one of claims 15 to 18, characterized in that the metal coating arranged on one side of the carrier ( 2 ) has copper. 20. Verfahren nach einem der Ansprüche 15 bis 19, dadurch ge­ kennzeichnet, daß die auf der einen Seite des Trägers (2) vorgesehene Metallbeschichtung aus mehreren dünnen Metalla­ gen besteht.20. The method according to any one of claims 15 to 19, characterized in that the metal coating provided on one side of the carrier ( 2 ) consists of a plurality of thin metals. 21. Verfahren nach einem der Ansprüche 13 bis 20, dadurch ge­ kennzeichnet, daß die Leiterbahnen (9) des wenigstens einen Koppelelementes auf der dem Träger (2) abgewandten Oberfläche mit einer elektrisch isolierenden Schutzschicht überzogen werden.21. The method according to any one of claims 13 to 20, characterized in that the conductor tracks ( 9 ) of the at least one coupling element on the surface facing away from the carrier ( 2 ) are coated with an electrically insulating protective layer. 22. Verfahren nach einem der Ansprüche 13 bis 21, dadurch ge­ kennzeichnet, daß die elektrisch leitenden Kontaktflächen (8) und/oder die Leiterbahnen (9) des wenigstens einen Koppelelementes vermittels Bonddrähten mit den Verbindungsan­ schlüssen (6) der einen oder mehreren integrierten Halblei­ terschaltungen kontaktiert werden, wobei im Träger (2) Bond­ löcher ausgebildet werden, durch welche die Bonddrähte (7) geführt werden.22. The method according to any one of claims 13 to 21, characterized in that the electrically conductive contact surfaces ( 8 ) and / or the conductor tracks ( 9 ) of the at least one coupling element by means of bonding wires with the connection terminals ( 6 ) of the one or more integrated semiconductors Terschaltung be contacted, bond holes are formed in the carrier ( 2 ) through which the bond wires ( 7 ) are guided. 23. Verfahren nach einem der Ansprüche 13 bis 22, dadurch ge­ kennzeichnet, daß das wenigstens eine Koppelelement eine In­ duktionsspule (10) mit einem gegenüber den äußeren Abmessun­ gen eines die eine oder mehreren integrierten Halbleiter­ schaltungen tragenden Halbleiterchips (4) größeren Spulenum­ fang aufweist, und die Leiterbahnen (9) der Induktionsspule (10) streifenförmig nebeneinander liegend, kreuzungsfrei und benachbart zu den Kontaktflächen (8) angeordnet werden.23. The method according to any one of claims 13 to 22, characterized in that the at least one coupling element has an induction coil ( 10 ) with a compared to the outer dimensions of one of the one or more integrated semiconductor circuits carrying semiconductor chips ( 4 ) larger coil circumference , and the conductor tracks ( 9 ) of the induction coil ( 10 ) lying in strips next to one another, free of crossings and adjacent to the contact surfaces ( 8 ). 24. Verfahren nach einem der Ansprüche 13 bis 23, dadurch ge­ kennzeichnet, daß die Enden der Leiterbahnen (9) zu Kon­ taktanschlüssen (11) verbreitert werden, welche innerhalb der von den Kontaktflächen (8) beanspruchten Grundfläche liegen. 24. The method according to any one of claims 13 to 23, characterized in that the ends of the conductor tracks ( 9 ) to Kon contact connections ( 11 ) are widened, which lie within the base area claimed by the contact surfaces ( 8 ). 25. Kombinations-Chipmodul-Einheit, gekennzeichnet durch meh­ rere hintereinander angeordnete Kombinations-Chipmodule (1) nach einem der Ansprüche 1 bis 12 mit gemeinsamem, einstücki­ gem Träger (2).25. Combination chip module unit, characterized by several consecutive combination chip modules ( 1 ) according to one of claims 1 to 12 with a common, one-piece carrier ( 2 ). 26. Verwendung der Kombinations-Chipmodule (1) nach einem der Ansprüche 1 bis 12 sowie der Kombinations-Chipmodul-Einheiten nach Anspruch 25 zur Herstellung von Chipkarten oder ähnli­ chen Datenträgern.26. Use of the combination chip modules ( 1 ) according to one of claims 1 to 12 and the combination chip module units according to claim 25 for the production of chip cards or similar data carriers. 27. Chipkarte, gekennzeichnet durch mindestens ein Kombinati­ ons-Chipmodul (1) nach einem der Ansprüche 1 bis 12 oder min­ destens eine Kombinations-Chipmodul-Einheit nach Anspruch 25.27. Chip card, characterized by at least one combination chip module ( 1 ) according to one of claims 1 to 12 or at least one combination chip module unit according to claim 25.
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PCT/DE1997/001496 WO1998007191A1 (en) 1996-08-08 1997-07-15 Combination chip module and process for production of a combination chip module

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