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DE10337442A1 - Device for mounting - Google Patents

Device for mounting Download PDF

Info

Publication number
DE10337442A1
DE10337442A1 DE2003137442 DE10337442A DE10337442A1 DE 10337442 A1 DE10337442 A1 DE 10337442A1 DE 2003137442 DE2003137442 DE 2003137442 DE 10337442 A DE10337442 A DE 10337442A DE 10337442 A1 DE10337442 A1 DE 10337442A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
holding element
mounting
dollar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2003137442
Other languages
German (de)
Inventor
Hans-Peter Baur
Ulrich Haenig
Tobias Krips
Raimund Stetter-Alle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE2003137442 priority Critical patent/DE10337442A1/en
Priority to PCT/EP2004/051459 priority patent/WO2005018294A1/en
Priority to TW093122828A priority patent/TW200511909A/en
Publication of DE10337442A1 publication Critical patent/DE10337442A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

Vorrichtung zur Halterung einer Moduleinheit auf einer Leiterplatte (2) eines elektrischen Gerätes mit: DOLLAR A - einem aus der Ebene der Leiterplatte (2) herausragenden und an der Leiterplatte (2) angebrachten Halteelement (5) und DOLLAR A - einer Rastanordnung (16, 18) mit einem am Halteelement (1) vorgesehenen Rastelement (16, 18) und einem an der Moduleinheit vorgesehenen, korrespondierenden Rastelement (18, 16) zur Befestigung der Moduleinheit am Halteelement (5).Device for mounting a module unit on a printed circuit board (2) of an electrical device comprising: DOLLAR A - a holding element (5) projecting from the plane of the printed circuit board (2) and attached to the printed circuit board (2) and DOLLAR A - a latching arrangement (16, 18) with a latching element (16, 18) provided on the holding element (1) and a corresponding latching element (18, 16) provided on the module unit for fastening the modular unit to the holding element (5).

DE2003137442 2003-08-14 2003-08-14 Device for mounting Withdrawn DE10337442A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2003137442 DE10337442A1 (en) 2003-08-14 2003-08-14 Device for mounting
PCT/EP2004/051459 WO2005018294A1 (en) 2003-08-14 2004-07-12 Device for fixing a module to a printed circuit board
TW093122828A TW200511909A (en) 2003-08-14 2004-07-30 Device to hold a module-unit on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003137442 DE10337442A1 (en) 2003-08-14 2003-08-14 Device for mounting

Publications (1)

Publication Number Publication Date
DE10337442A1 true DE10337442A1 (en) 2005-03-10

Family

ID=34177569

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2003137442 Withdrawn DE10337442A1 (en) 2003-08-14 2003-08-14 Device for mounting

Country Status (3)

Country Link
DE (1) DE10337442A1 (en)
TW (1) TW200511909A (en)
WO (1) WO2005018294A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2723201A1 (en) * 1977-05-23 1978-11-30 Siemens Ag ELECTRICAL COMPONENT WITH ANGLE ADAPTER AND METHOD FOR MANUFACTURING IT
EP1121005A1 (en) * 2000-01-25 2001-08-01 TELEFONAKTIEBOLAGET LM ERICSSON (publ) Metal component carrier
EP1168386A1 (en) * 2000-06-20 2002-01-02 Murata Manufacturing Co., Ltd. Coil apparatus and manufacturing method for the same
DE19632413C2 (en) * 1995-08-09 2003-01-30 Mitsubishi Electric Corp Device for fastening a component component
US20030093897A1 (en) * 2001-11-16 2003-05-22 Augustin Thomas J. Method and apparatus for shock and vibration isolation of a circuit component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2031241B1 (en) * 1970-06-24 1971-12-09 Siemens Ag Device for assembling electn see component carriers
TW478716U (en) * 1995-05-30 2002-03-01 Sumitomo Electric Industries Electronic component
JP4405062B2 (en) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ Solid-state imaging device
JP4143304B2 (en) * 2002-01-24 2008-09-03 富士通株式会社 Manufacturing method of camera module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2723201A1 (en) * 1977-05-23 1978-11-30 Siemens Ag ELECTRICAL COMPONENT WITH ANGLE ADAPTER AND METHOD FOR MANUFACTURING IT
DE19632413C2 (en) * 1995-08-09 2003-01-30 Mitsubishi Electric Corp Device for fastening a component component
EP1121005A1 (en) * 2000-01-25 2001-08-01 TELEFONAKTIEBOLAGET LM ERICSSON (publ) Metal component carrier
EP1168386A1 (en) * 2000-06-20 2002-01-02 Murata Manufacturing Co., Ltd. Coil apparatus and manufacturing method for the same
US20030093897A1 (en) * 2001-11-16 2003-05-22 Augustin Thomas J. Method and apparatus for shock and vibration isolation of a circuit component

Also Published As

Publication number Publication date
TW200511909A (en) 2005-03-16
WO2005018294A1 (en) 2005-02-24

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8139 Disposal/non-payment of the annual fee